WO2006041411A1 - Cooling and lubrication system - Google Patents

Cooling and lubrication system Download PDF

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Publication number
WO2006041411A1
WO2006041411A1 PCT/SG2004/000334 SG2004000334W WO2006041411A1 WO 2006041411 A1 WO2006041411 A1 WO 2006041411A1 SG 2004000334 W SG2004000334 W SG 2004000334W WO 2006041411 A1 WO2006041411 A1 WO 2006041411A1
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WO
WIPO (PCT)
Prior art keywords
wave
saw
chamber
charged liquid
directing
Prior art date
Application number
PCT/SG2004/000334
Other languages
French (fr)
Inventor
Fulin Liu
Tay Hock Lau
Hwee Seng Jimmy Chew
Original Assignee
Advanced Systems Automation Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Systems Automation Limited filed Critical Advanced Systems Automation Limited
Priority to PCT/SG2004/000334 priority Critical patent/WO2006041411A1/en
Publication of WO2006041411A1 publication Critical patent/WO2006041411A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/10—Arrangements for cooling or lubricating tools or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels

Definitions

  • the present invention relates generally to cooling and lubrication systems.
  • the invention relates to cooling and lubrication systems using wave- charged liquid.
  • Integrated circuit (IC) chips are fabricated with multiple IC chips being typically arranged on a single supporting substrate.
  • silicon dies are initially bonded on the paddles of a lead frame by die bonding, wire bonding apparatus or flip chip mounting, and subsequently encapsulated in a molding compound to obtain a single substrate and eventually singulated to obtain individually separated IC packages therefrom.
  • the IC packages are separated using a saw, a dicing saw or the like cutting devices.
  • one or more special water nozzles are designed for directing water towards a saw for cooling and lubrication thereof during the dicing process.
  • Quad Flat No-Leads QFN
  • conventional singulation methods utilising conventional cooling and lubrication methods are now facing problems in obtaining quality cuts. Since a saw, for example a dicing saw, rotates at a very high speed, an air curtain or an air layer is formed around the rotating saw. This air curtain prevents cooling water from entering into the cutting zone to effectively cool and lubricate the saw.
  • a cooling and lubrication system comprising: a chamber; a wave generator coupled to the chamber for generating and transmitting ultrasonic waves to liquid supplied through the chamber for obtaining wave-charged liquid therefrom; and a nozzle being in fluid communication with and for receiving the wave- charged liquid from the chamber, the nozzle for directing the wave-charged liquid towards a saw, whereby the saw is substantially enveloped by an air curtain when rotating, the air curtain being substantially liquid deflecting, wherein the wave-charged liquid is for penetrating the air curtain to thereby contact the rotating saw for at least one of cooling and lubrication thereof.
  • a cooling and lubrication method comprising the steps of: generating and transmitting ultrasonic waves by a wave generator to liquid supplied through a chamber for obtaining wave-charged liquid therefrom; and positioning a nozzle for directing the wave-charged liquid towards a saw, the nozzle being in fluid communication with and for receiving the wave-charged liquid from the chamber, whereby the saw is substantially enveloped by an air curtain when rotating, the air curtain being substantially liquid deflecting, wherein the wave-charged liquid is for penetrating the air curtain to thereby contact the rotating saw for at least one of cooling and lubrication thereof.
  • FIG. 1 shows a front sectional elevation of a cooling and lubrication system according to an embodiment of the invention
  • FIG. 2 shows a perspective view of the cooling and lubrication system of FIG. 1 when incorporated with a semiconductor substrate singulation system
  • FIG. 3 shows a side sectional elevation of the cooling and lubrication system according to view 'A' of FIG. 2.
  • FIG. 1 shows a front sectional elevation of the cooling and lubrication system 20, and FIG. 2, which shows a perspective view of the cooling and lubrication system 20.
  • the cooling and lubrication system 20 comprises a wave generator 22, a nozzle 24 and a chamber 26.
  • the chamber 26 is formed within a housing 28 and is in fluid communication with the nozzle 24.
  • the housing 28 and the nozzle 24 are preferably formed as an integral structure.
  • the liquid 30 is at least one of a coolant and a lubricant.
  • the liquid 30 is de-ionised (DI) water.
  • the cooling and lubrication system 20 further comprises a conduit 32 being in fluid communication with the chamber 26.
  • the conduit 32 is formed in a tube 34 coupled to the housing 28.
  • the conduit 32 is for carrying liquid 30 therethrough and directing the liquid 30 into the chamber 26.
  • the wave generator 22 comprises a wave transducer 36 and a wave oscillator 38 electrically communicating with the wave transducer 36.
  • the wave transducer 36 is coupled to the housing 28 with the chamber 26 being ultrasonic wave transparent.
  • the wave oscillator 38 is for generating ultrasonic electrical signals for transmission to the wave transducer 36.
  • the wave transducer 36 is for transducing the ultrasonic electrical signals received from the wave oscillator 38 into ultrasonic waves.
  • an impedance converter 39 electrically interfaces the wave transducer 36 and the wave oscillator 38 for impedance matching therebetween.
  • the ultrasonic wave generated by the wave transducer 36 resonates and converts the liquid 30 into wave- charged liquid 40.
  • the wave-charged liquid 40 is then discharged through the nozzle 24 with the nozzle determining the discharge direction thereof.
  • the cooling and lubrication system 20 is preferably used in conjunction with one of a singulation system and a dicing system.
  • a saw jig with a rubber pad support (both not shown) is used for supporting a work-piece 42.
  • the work-piece 42 is one of a semiconductor package and a semiconductor substrate.
  • the work-piece 42 consists of quad-flat no-lead (QFN) packages. Vacuum generated through vacuum holes formed in the rubber pad further secures the work-piece 42 to the saw jig both during and after sawing of the work-piece 42.
  • QFN quad-flat no-lead
  • a conventional saw 44 is used for sawing the semiconductor substrate 42.
  • the saw 44 is preferably substantially planar, disc ⁇ shaped and has a periphery 50.
  • the saw 44 is coupled to a spindle 46 which transmits rotational displacement thereto.
  • the spindle 46 which is electrically actuated, is housed within a spindle housing 47.
  • the saw 44 rotates at a substantially high rotational speed.
  • This high rotational speed results in an air curtain, also typically known as an air layer, being formed around and substantially enveloping the saw 44.
  • This air curtain is liquid deflecting and is substantially effective in forming a barrier between the saw 44 and any liquid 30, for example coolants and lubricants, directed thereat.
  • converting the liquid 30 into wave-charged liquid 40 enables the wave-charged liquid 40 to effectively penetrate the air curtain for delivery to the saw 44. This enables the wave-charged liquid 40 to contact the rotating saw 44 for at least one of cooling and lubrication thereof.
  • the work-piece 42 has a surface 52 and a cut path 54 along which the saw 44 traverses and interacts with the work-piece 42 for sawing thereof.
  • the saw 44 rotates about an axis which is substantially parallel to the surface 52 of the work-piece 42.
  • the nozzle 24 is positioned for directing the wave-charge liquid 40 towards a portion of the periphery 50 of the saw 44 proximal to an entry point 56 whereat each portion of the periphery 50 enters and cut into the surface 52 of the work-piece 42.
  • the cut path 54 extends from the entry point 56 into the work-piece 42.
  • the wave-charged liquid 40 is directed at the entry point 56 on the surface 52 of the work-piece 42.
  • the wave-charged liquid 40 contacts a portion of the periphery 50 of the saw 44, the wave charged liquid 40 is redirected and guided towards the surface 52, and more specifically, the cut path 54 of the work-piece 42. As heat generated from sawing of the work-piece 42 is concentrated around the cut path 54, having the wave-charged liquid 40 directed thereat effectively lubricates and cools both the saw 44 and the work-piece 42 to produce high quality cutting via one of singulation and dicing.
  • the wave-charged liquid 40 also facilitates flushing and cleaning of both the work-piece 42 and the saw 44 as a by-process.
  • the cooling and lubrication system 20 is also implementable in a multi-saw singulation system wherein more than one saw 44 is attached to the spindle 46, for example, a gang-saw.
  • the nozzle is preferably shaped and dimensioned to enable effective delivery of wave-charged liquid 40 to each of the more than one saw 44 and the cut path 54 corresponding thereto.
  • multiple nozzles 24 extend from a common chamber 36 or from respective chambers 36 for effectively delivering the wave-charged liquid 40 to the more than one saw 44.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

Conventional dicing and singulation systems using conventional cooling and lubrication methods are now facing problems in obtaining quality cuts. Since a saw rotates at a very high speed, an air curtain or an air layer is formed around the rotating saw. This air curtain prevents cooling water from entering into the cutting zone to effectively cool and lubricate the saw. An embodiment of the invention describes use of ultrasonic waves for energizing fluid directed at the saw to enable the fluid to effectively penetrate the air curtain. This enables the fluid to contact the saw and consequently provide cooling thereof and lubrication thereto.

Description

COOLING AND LUBRICATION SYSTEM
Field Of Invention
The present invention relates generally to cooling and lubrication systems. In particular, the invention relates to cooling and lubrication systems using wave- charged liquid.
Background
Integrated circuit (IC) chips are fabricated with multiple IC chips being typically arranged on a single supporting substrate. In a conventional IC packaging process, silicon dies are initially bonded on the paddles of a lead frame by die bonding, wire bonding apparatus or flip chip mounting, and subsequently encapsulated in a molding compound to obtain a single substrate and eventually singulated to obtain individually separated IC packages therefrom.
Generally, the IC packages are separated using a saw, a dicing saw or the like cutting devices. Typically, one or more special water nozzles are designed for directing water towards a saw for cooling and lubrication thereof during the dicing process.
An expanding market for Quad Flat No-Leads (QFN) packages has consequently increased the demand for high throughput singulation of smaller QFN packages. However, conventional singulation methods utilising conventional cooling and lubrication methods are now facing problems in obtaining quality cuts. Since a saw, for example a dicing saw, rotates at a very high speed, an air curtain or an air layer is formed around the rotating saw. This air curtain prevents cooling water from entering into the cutting zone to effectively cool and lubricate the saw.
Additionally, cutting of soft material, for example copper, without suitable cooling and lubrication conditions will result in chips being lodged in the saw which further elevates the temperature at the cutting zone even higher. The product of this temperature elevation at the cutting zone is the visually evident big smearing and burring after dicing. Hence, this clearly affirms a need for an improved cooling and lubrication system for singulating or dicing of semiconductor packages and semiconductor substrates.
Summary In accordance with a first aspect of the invention, there is disclosed a cooling and lubrication system comprising: a chamber; a wave generator coupled to the chamber for generating and transmitting ultrasonic waves to liquid supplied through the chamber for obtaining wave-charged liquid therefrom; and a nozzle being in fluid communication with and for receiving the wave- charged liquid from the chamber, the nozzle for directing the wave-charged liquid towards a saw, whereby the saw is substantially enveloped by an air curtain when rotating, the air curtain being substantially liquid deflecting, wherein the wave-charged liquid is for penetrating the air curtain to thereby contact the rotating saw for at least one of cooling and lubrication thereof.
In accordance with a second aspect of the invention, there is disclosed a cooling and lubrication method comprising the steps of: generating and transmitting ultrasonic waves by a wave generator to liquid supplied through a chamber for obtaining wave-charged liquid therefrom; and positioning a nozzle for directing the wave-charged liquid towards a saw, the nozzle being in fluid communication with and for receiving the wave-charged liquid from the chamber, whereby the saw is substantially enveloped by an air curtain when rotating, the air curtain being substantially liquid deflecting, wherein the wave-charged liquid is for penetrating the air curtain to thereby contact the rotating saw for at least one of cooling and lubrication thereof. Brief Description Of The Drawings
Embodiments of the invention are described hereinafter with reference to the following drawings, in which:
FIG. 1 shows a front sectional elevation of a cooling and lubrication system according to an embodiment of the invention;
FIG. 2 shows a perspective view of the cooling and lubrication system of FIG. 1 when incorporated with a semiconductor substrate singulation system; and
FIG. 3 shows a side sectional elevation of the cooling and lubrication system according to view 'A' of FIG. 2.
Detailed Description A cooling and lubrication system is described hereinafter for addressing the foregoing problems.
An embodiment of the invention, a cooling and lubrication system 20 is described with reference to FIG. 1 , which shows a front sectional elevation of the cooling and lubrication system 20, and FIG. 2, which shows a perspective view of the cooling and lubrication system 20.
As shown in FIG. 1 and FIG. 2, the cooling and lubrication system 20 comprises a wave generator 22, a nozzle 24 and a chamber 26. The chamber 26 is formed within a housing 28 and is in fluid communication with the nozzle 24. The housing 28 and the nozzle 24 are preferably formed as an integral structure. The liquid 30 is at least one of a coolant and a lubricant. Preferably, the liquid 30 is de-ionised (DI) water.
The cooling and lubrication system 20 further comprises a conduit 32 being in fluid communication with the chamber 26. The conduit 32 is formed in a tube 34 coupled to the housing 28. The conduit 32 is for carrying liquid 30 therethrough and directing the liquid 30 into the chamber 26. The wave generator 22 comprises a wave transducer 36 and a wave oscillator 38 electrically communicating with the wave transducer 36. The wave transducer 36 is coupled to the housing 28 with the chamber 26 being ultrasonic wave transparent. The wave oscillator 38 is for generating ultrasonic electrical signals for transmission to the wave transducer 36. The wave transducer 36 is for transducing the ultrasonic electrical signals received from the wave oscillator 38 into ultrasonic waves. Preferably, an impedance converter 39 electrically interfaces the wave transducer 36 and the wave oscillator 38 for impedance matching therebetween.
Therefore, when liquid 30 is supplied through the chamber 26, the ultrasonic wave generated by the wave transducer 36 resonates and converts the liquid 30 into wave- charged liquid 40. The wave-charged liquid 40 is then discharged through the nozzle 24 with the nozzle determining the discharge direction thereof.
The cooling and lubrication system 20 is preferably used in conjunction with one of a singulation system and a dicing system.
In an example, a saw jig with a rubber pad support (both not shown) is used for supporting a work-piece 42. The work-piece 42 is one of a semiconductor package and a semiconductor substrate. For example, the work-piece 42 consists of quad-flat no-lead (QFN) packages. Vacuum generated through vacuum holes formed in the rubber pad further secures the work-piece 42 to the saw jig both during and after sawing of the work-piece 42.
With reference to FIGS. 1, 2 and 3, a conventional saw 44 is used for sawing the semiconductor substrate 42. The saw 44 is preferably substantially planar, disc¬ shaped and has a periphery 50. The saw 44 is coupled to a spindle 46 which transmits rotational displacement thereto. The spindle 46, which is electrically actuated, is housed within a spindle housing 47. During a sawing process, the saw 44 rotates at a substantially high rotational speed. This high rotational speed results in an air curtain, also typically known as an air layer, being formed around and substantially enveloping the saw 44. This air curtain is liquid deflecting and is substantially effective in forming a barrier between the saw 44 and any liquid 30, for example coolants and lubricants, directed thereat. However, converting the liquid 30 into wave-charged liquid 40 enables the wave-charged liquid 40 to effectively penetrate the air curtain for delivery to the saw 44. This enables the wave-charged liquid 40 to contact the rotating saw 44 for at least one of cooling and lubrication thereof.
The work-piece 42 has a surface 52 and a cut path 54 along which the saw 44 traverses and interacts with the work-piece 42 for sawing thereof. The saw 44 rotates about an axis which is substantially parallel to the surface 52 of the work-piece 42. Preferably, the nozzle 24 is positioned for directing the wave-charge liquid 40 towards a portion of the periphery 50 of the saw 44 proximal to an entry point 56 whereat each portion of the periphery 50 enters and cut into the surface 52 of the work-piece 42. The cut path 54 extends from the entry point 56 into the work-piece 42. Alternatively, the wave-charged liquid 40 is directed at the entry point 56 on the surface 52 of the work-piece 42.
Once the wave-charged liquid 40 contacts a portion of the periphery 50 of the saw 44, the wave charged liquid 40 is redirected and guided towards the surface 52, and more specifically, the cut path 54 of the work-piece 42. As heat generated from sawing of the work-piece 42 is concentrated around the cut path 54, having the wave-charged liquid 40 directed thereat effectively lubricates and cools both the saw 44 and the work-piece 42 to produce high quality cutting via one of singulation and dicing.
Additionally, the wave-charged liquid 40 also facilitates flushing and cleaning of both the work-piece 42 and the saw 44 as a by-process.
The cooling and lubrication system 20 is also implementable in a multi-saw singulation system wherein more than one saw 44 is attached to the spindle 46, for example, a gang-saw. For the multi-saw singulation system, the nozzle is preferably shaped and dimensioned to enable effective delivery of wave-charged liquid 40 to each of the more than one saw 44 and the cut path 54 corresponding thereto. Alternatively, multiple nozzles 24 extend from a common chamber 36 or from respective chambers 36 for effectively delivering the wave-charged liquid 40 to the more than one saw 44.
In the foregoing manner, a cooling and lubrication system is described according to one embodiment of the invention for addressing the foregoing disadvantages of conventional cooling methods and systems. Although only one embodiment of the invention is disclosed, it will be apparent to one skilled in the art in view of this disclosure that numerous changes and/or modification can be made without departing from the scope and spirit of the invention.

Claims

Claims
1. A cooling and lubrication system comprising: a chamber; a wave generator coupled to the chamber for generating and transmitting ultrasonic waves to liquid supplied through the chamber for obtaining wave-charged liquid therefrom; and a nozzle being in fluid communication with and for receiving the wave-charged liquid from the chamber, the nozzle for directing the wave- charged liquid towards a saw, whereby the saw is substantially enveloped by an air curtain when rotating, the air curtain being substantially liquid deflecting, wherein the wave-charged liquid is for penetrating the air curtain to thereby contact the rotating saw for at least one of cooling and lubrication thereof.
2. The system as in claim 1, the liquid being deionised water.
3. The system as in claim 1, the nozzle being formed integral with the chamber.
4. The system as in claim 1, the saw for interacting with a work-piece having a surface for cutting thereof along a cut path, the wave-charged liquid being directed at an entry point whereat each portion of the periphery of the saw enters the surface of the work-piece, the cut path extends from the entry point into the work-piece.
5. The system as in claim 4, the rotating saw guides the wave-charged liquid directed thereat towards the entry point and at least a portion of the cut path of the work-piece.
6. The system as in claim 4, the work-piece being one of a semiconductor package and a semiconductor substrate.
7. The system as in claim 4, the work-piece being a quad flat no-lead (QFN) package.
8. The system as in claim 1, the saw being coupled to a spindle and the spindle for imparting rotational displacement to the saw.
9. The system as in claim 1, the saw being substantially planar, disc-shaped and having a periphery.
10. The system as in claim 9, the wave-charged liquid being directed towards at least a portion of the periphery of the saw.
11. The system as in claim 1, further comprising a conduit being in fluid communication with the chamber, the conduit being formed in a tube being coupled to the chamber and the conduit for carrying liquid therethrough and directing the liquid into the chamber.
12. The system as in claim 1, the wave generator comprising: a wave transducer coupled to and being in ultrasonic wave transparent communication with the chamber.
13. The system as in claim 12, the wave generator further comprising: a wave oscillator coupled to and being in electrical communication with the wave transducer, the wave oscillator for generating ultrasonic electrical signals for transmission to the wave transducer, and the wave transducer for transducing the ultrasonic electrical signals into ultrasonic • waves.
14. The system as in claim 13, the wave generator further comprising: an impedance converter electrically interfacing the wave transducer and the wave oscillator.
15. A cooling and lubrication method comprising the steps of: generating and transmitting ultrasonic waves by a wave generator to liquid supplied through a chamber for obtaining wave-charged liquid therefrom; and positioning a nozzle for directing the wave-charged liquid towards a saw, the nozzle being in fluid communication with and for receiving the wave- charged liquid from the chamber, whereby the saw is substantially enveloped by an air curtain when rotating, the air curtain being substantially liquid deflecting, wherein the wave-charged liquid is for penetrating the air curtain to thereby contact the rotating saw for at least one of cooling and lubrication thereof.
16. The method as in claim 15, the step of generating and transmitting ultrasonic waves by a wave generator to liquid supplied through a chamber comprising the step of: generating and transmitting ultrasonic waves by a wave generator to deionised water supplied through a chamber.
17. The method as in claim 15, the step of positioning a nozzle for directing the wave-charged liquid towards a saw comprising the step of: positioning a nozzle formed integral with the chamber.
18. The method as in claim 15, the step of positioning a nozzle for directing the wave-charged liquid towards a saw comprising the step of: directing the wave-charged liquid at an entry point whereat each portion of the periphery of the saw enters a surface of a work-piece, the saw for interacting with the work-piece for cutting thereof along a cut path, and the cut path extends from the entry point into the work-piece.
19. The method as in claim 18, the step of positioning a nozzle for directing the wave-charged liquid towards a saw comprising the step of: guiding the wave-charged liquid directed at the saw towards the entry point and at least a portion of the cut path of the work-piece.
20. The method as in claim 18, the step of directing the wave-charged liquid at an entry point whereat each portion of the periphery of the saw enters a surface of a work-piece comprising the step of: providing a work-piece being one of a semiconductor package and a semiconductor substrate.
21. The method as in claim 18, the step of directing the wave-charged liquid at an entry point whereat each portion of the periphery of the saw enters a surface of a work-piece comprising the step of: providing a work-piece being a quad flat no-lead (QFN) package.
22. The method as in claim 15, the step of positioning a nozzle for directing the wave-charged liquid towards a saw comprising the step of: positioning a nozzle for directing the wave-charged liquid towards a saw being coupled to a spindle and the spindle for imparting rotational displacement to the saw.
23. The method as in claim 15, the step of positioning a nozzle for directing the wave-charged liquid towards a saw comprising the step of: positioning a nozzle for directing the wave-charged liquid towards a saw being substantially planar, disc-shaped and having a periphery.
24. The method as in claim 23, the step of positioning a nozzle for directing the wave-charged liquid towards a saw comprising the step of: directing the wave-charged liquid towards at least a portion of the periphery of the saw.
25. The method as in claim 15, further comprising the step of: fluid communicating a conduit with the chamber, the conduit being formed in a tube being coupled to the chamber and the conduit for carrying liquid therethrough and directing the liquid into the chamber.
26. The method as in claim 15, the step of generating and transmitting ultrasonic waves by a wave generator comprising the step of: providing a wave transducer coupled to and being in ultrasonic wave transparent communication with the chamber.
27. The method as in claim 26, the step of generating and transmitting ultrasonic waves by a wave generator further comprising the step of: providing a wave oscillator coupled to and being in electrical communication with the wave transducer, the wave oscillator for generating ultrasonic electrical signals for transmission to the wave transducer, and the wave transducer for transducing the ultrasonic electrical signals into ultrasonic waves.
28. The method as in claim 27, the step of generating and transmitting ultrasonic waves by a wave generator further comprising the step of: providing an impedance converter electrically interfacing the wave transducer and the wave oscillator.
PCT/SG2004/000334 2004-10-13 2004-10-13 Cooling and lubrication system WO2006041411A1 (en)

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PCT/SG2004/000334 WO2006041411A1 (en) 2004-10-13 2004-10-13 Cooling and lubrication system

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Application Number Priority Date Filing Date Title
PCT/SG2004/000334 WO2006041411A1 (en) 2004-10-13 2004-10-13 Cooling and lubrication system

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101966661A (en) * 2010-07-08 2011-02-09 苏州科技学院 Ultrasonic focused vapor fog cooler
CN103084981A (en) * 2013-01-27 2013-05-08 苏州科技学院 Split type ultrasonic focusing steam fog cooling device
JP2014075558A (en) * 2012-10-05 2014-04-24 Disco Abrasive Syst Ltd Cutting device
JP2017094455A (en) * 2015-11-25 2017-06-01 株式会社ディスコ Cutting device
CN111438385A (en) * 2020-04-16 2020-07-24 深圳丰发一诺科技有限公司 Precise numerical control equipment with high safety factor for machining workshop

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WO1992004151A1 (en) * 1990-08-31 1992-03-19 Productivity Xperts, Inc. Method and apparatus of machining with improved chip control
RU2188113C1 (en) * 2001-01-23 2002-08-27 Ульяновский государственный технический университет Method for feeding cutting fluid at working small diameter holes
RU2203792C1 (en) * 2002-01-08 2003-05-10 Ульяновский государственный технический университет Apparatus for feeding cutting fluids at working small-diameter openings
RU2203791C1 (en) * 2002-01-08 2003-05-10 Ульяновский государственный технический университет Apparatus for feeding cutting fluids
JP2003136365A (en) * 2001-11-05 2003-05-14 Nomura Seiki Kk Lubricating and cooling device
JP2003170332A (en) * 2001-12-06 2003-06-17 Nomura Seiki Kk Lubricating cooling system

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JP2003136365A (en) * 2001-11-05 2003-05-14 Nomura Seiki Kk Lubricating and cooling device
JP2003170332A (en) * 2001-12-06 2003-06-17 Nomura Seiki Kk Lubricating cooling system
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RU2203791C1 (en) * 2002-01-08 2003-05-10 Ульяновский государственный технический университет Apparatus for feeding cutting fluids

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101966661A (en) * 2010-07-08 2011-02-09 苏州科技学院 Ultrasonic focused vapor fog cooler
JP2014075558A (en) * 2012-10-05 2014-04-24 Disco Abrasive Syst Ltd Cutting device
CN103084981A (en) * 2013-01-27 2013-05-08 苏州科技学院 Split type ultrasonic focusing steam fog cooling device
JP2017094455A (en) * 2015-11-25 2017-06-01 株式会社ディスコ Cutting device
CN111438385A (en) * 2020-04-16 2020-07-24 深圳丰发一诺科技有限公司 Precise numerical control equipment with high safety factor for machining workshop

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