WO2006036820A3 - Procede et appareil de controle d'un traitement dans un systeme de traitement plasma par mesure d'impedance - Google Patents
Procede et appareil de controle d'un traitement dans un systeme de traitement plasma par mesure d'impedance Download PDFInfo
- Publication number
- WO2006036820A3 WO2006036820A3 PCT/US2005/034226 US2005034226W WO2006036820A3 WO 2006036820 A3 WO2006036820 A3 WO 2006036820A3 US 2005034226 W US2005034226 W US 2005034226W WO 2006036820 A3 WO2006036820 A3 WO 2006036820A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plasma processing
- plasma
- value
- processing chamber
- processing system
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/3299—Feedback systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007533668A JP2008515197A (ja) | 2004-09-27 | 2005-09-23 | インピーダンス測定によるプラズマ加工システムの加工工程モニター方法並びに装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/951,548 | 2004-09-27 | ||
US10/951,548 US20060065631A1 (en) | 2004-09-27 | 2004-09-27 | Methods and apparatus for monitoring a process in a plasma processing system by measuring impedance |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006036820A2 WO2006036820A2 (fr) | 2006-04-06 |
WO2006036820A3 true WO2006036820A3 (fr) | 2007-07-05 |
Family
ID=36097837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/034226 WO2006036820A2 (fr) | 2004-09-27 | 2005-09-23 | Procede et appareil de controle d'un traitement dans un systeme de traitement plasma par mesure d'impedance |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060065631A1 (fr) |
JP (1) | JP2008515197A (fr) |
KR (1) | KR20070057983A (fr) |
CN (1) | CN101088148A (fr) |
TW (1) | TW200624599A (fr) |
WO (1) | WO2006036820A2 (fr) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4416569B2 (ja) * | 2004-05-24 | 2010-02-17 | キヤノン株式会社 | 堆積膜形成方法および堆積膜形成装置 |
US7323116B2 (en) * | 2004-09-27 | 2008-01-29 | Lam Research Corporation | Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage |
JP2007081302A (ja) * | 2005-09-16 | 2007-03-29 | Toshiba Corp | 管理システム、管理方法及び電子装置の製造方法 |
US20080084650A1 (en) | 2006-10-04 | 2008-04-10 | Applied Materials, Inc. | Apparatus and method for substrate clamping in a plasma chamber |
JP4623111B2 (ja) | 2008-03-13 | 2011-02-02 | ソニー株式会社 | 画像処理装置、画像処理方法及びプログラム |
US8501631B2 (en) | 2009-11-19 | 2013-08-06 | Lam Research Corporation | Plasma processing system control based on RF voltage |
US20110297088A1 (en) * | 2010-06-04 | 2011-12-08 | Texas Instruments Incorporated | Thin edge carrier ring |
US9114666B2 (en) | 2012-02-22 | 2015-08-25 | Lam Research Corporation | Methods and apparatus for controlling plasma in a plasma processing system |
US9320126B2 (en) | 2012-12-17 | 2016-04-19 | Lam Research Corporation | Determining a value of a variable on an RF transmission model |
US9295148B2 (en) | 2012-12-14 | 2016-03-22 | Lam Research Corporation | Computation of statistics for statistical data decimation |
US9530620B2 (en) * | 2013-03-15 | 2016-12-27 | Lam Research Corporation | Dual control modes |
US10325759B2 (en) | 2012-02-22 | 2019-06-18 | Lam Research Corporation | Multiple control modes |
US10128090B2 (en) | 2012-02-22 | 2018-11-13 | Lam Research Corporation | RF impedance model based fault detection |
US9171699B2 (en) | 2012-02-22 | 2015-10-27 | Lam Research Corporation | Impedance-based adjustment of power and frequency |
US9502216B2 (en) | 2013-01-31 | 2016-11-22 | Lam Research Corporation | Using modeling to determine wafer bias associated with a plasma system |
US9368329B2 (en) | 2012-02-22 | 2016-06-14 | Lam Research Corporation | Methods and apparatus for synchronizing RF pulses in a plasma processing system |
US9197196B2 (en) | 2012-02-22 | 2015-11-24 | Lam Research Corporation | State-based adjustment of power and frequency |
US9390893B2 (en) | 2012-02-22 | 2016-07-12 | Lam Research Corporation | Sub-pulsing during a state |
US10157729B2 (en) | 2012-02-22 | 2018-12-18 | Lam Research Corporation | Soft pulsing |
US9842725B2 (en) | 2013-01-31 | 2017-12-12 | Lam Research Corporation | Using modeling to determine ion energy associated with a plasma system |
US9462672B2 (en) | 2012-02-22 | 2016-10-04 | Lam Research Corporation | Adjustment of power and frequency based on three or more states |
US9408288B2 (en) | 2012-09-14 | 2016-08-02 | Lam Research Corporation | Edge ramping |
US9043525B2 (en) | 2012-12-14 | 2015-05-26 | Lam Research Corporation | Optimizing a rate of transfer of data between an RF generator and a host system within a plasma tool |
US9155182B2 (en) | 2013-01-11 | 2015-10-06 | Lam Research Corporation | Tuning a parameter associated with plasma impedance |
US9620337B2 (en) | 2013-01-31 | 2017-04-11 | Lam Research Corporation | Determining a malfunctioning device in a plasma system |
US9779196B2 (en) | 2013-01-31 | 2017-10-03 | Lam Research Corporation | Segmenting a model within a plasma system |
US9107284B2 (en) | 2013-03-13 | 2015-08-11 | Lam Research Corporation | Chamber matching using voltage control mode |
US9119283B2 (en) | 2013-03-14 | 2015-08-25 | Lam Research Corporation | Chamber matching for power control mode |
US9502221B2 (en) | 2013-07-26 | 2016-11-22 | Lam Research Corporation | Etch rate modeling and use thereof with multiple parameters for in-chamber and chamber-to-chamber matching |
US9594105B2 (en) | 2014-01-10 | 2017-03-14 | Lam Research Corporation | Cable power loss determination for virtual metrology |
US10950421B2 (en) * | 2014-04-21 | 2021-03-16 | Lam Research Corporation | Using modeling for identifying a location of a fault in an RF transmission system for a plasma system |
US9536749B2 (en) | 2014-12-15 | 2017-01-03 | Lam Research Corporation | Ion energy control by RF pulse shape |
KR102043994B1 (ko) | 2017-04-14 | 2019-11-12 | 광운대학교 산학협력단 | 플라즈마 진단 시스템 및 방법 |
US10920320B2 (en) * | 2017-06-16 | 2021-02-16 | Applied Materials, Inc. | Plasma health determination in semiconductor substrate processing reactors |
US20190242838A1 (en) * | 2018-02-07 | 2019-08-08 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Non-Invasive Method for Probing Plasma Impedance |
CN115696709B (zh) * | 2022-12-28 | 2023-03-21 | 江苏奥文仪器科技有限公司 | 监测射频辉光放电光谱仪放电室内等离子体稳定性的装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5414324A (en) * | 1993-05-28 | 1995-05-09 | The University Of Tennessee Research Corporation | One atmosphere, uniform glow discharge plasma |
US6197116B1 (en) * | 1996-08-29 | 2001-03-06 | Fujitsu Limited | Plasma processing system |
US20010025691A1 (en) * | 2000-03-24 | 2001-10-04 | Seiichiro Kanno | Semiconductor manufacturing apparatus and method of processing semiconductor wafer using plasma, and wafer voltage probe |
US20030178140A1 (en) * | 2002-03-25 | 2003-09-25 | Mitsubishi Denki Kabushiki Kaisha | Plasma processing apparatus capable of evaluating process performance |
US20040027209A1 (en) * | 2002-08-09 | 2004-02-12 | Applied Materials, Inc. | Fixed matching network with increased match range capabilities |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5863376A (en) * | 1996-06-05 | 1999-01-26 | Lam Research Corporation | Temperature controlling method and apparatus for a plasma processing chamber |
US6063234A (en) * | 1997-09-10 | 2000-05-16 | Lam Research Corporation | Temperature sensing system for use in a radio frequency environment |
US6123775A (en) * | 1999-06-30 | 2000-09-26 | Lam Research Corporation | Reaction chamber component having improved temperature uniformity |
US6302966B1 (en) * | 1999-11-15 | 2001-10-16 | Lam Research Corporation | Temperature control system for plasma processing apparatus |
-
2004
- 2004-09-27 US US10/951,548 patent/US20060065631A1/en not_active Abandoned
-
2005
- 2005-09-23 WO PCT/US2005/034226 patent/WO2006036820A2/fr active Application Filing
- 2005-09-23 JP JP2007533668A patent/JP2008515197A/ja not_active Withdrawn
- 2005-09-23 KR KR1020077009423A patent/KR20070057983A/ko not_active Application Discontinuation
- 2005-09-23 CN CNA2005800397617A patent/CN101088148A/zh active Pending
- 2005-09-23 TW TW094133153A patent/TW200624599A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5414324A (en) * | 1993-05-28 | 1995-05-09 | The University Of Tennessee Research Corporation | One atmosphere, uniform glow discharge plasma |
US6197116B1 (en) * | 1996-08-29 | 2001-03-06 | Fujitsu Limited | Plasma processing system |
US20010025691A1 (en) * | 2000-03-24 | 2001-10-04 | Seiichiro Kanno | Semiconductor manufacturing apparatus and method of processing semiconductor wafer using plasma, and wafer voltage probe |
US20030178140A1 (en) * | 2002-03-25 | 2003-09-25 | Mitsubishi Denki Kabushiki Kaisha | Plasma processing apparatus capable of evaluating process performance |
US20040027209A1 (en) * | 2002-08-09 | 2004-02-12 | Applied Materials, Inc. | Fixed matching network with increased match range capabilities |
Also Published As
Publication number | Publication date |
---|---|
KR20070057983A (ko) | 2007-06-07 |
US20060065631A1 (en) | 2006-03-30 |
JP2008515197A (ja) | 2008-05-08 |
TW200624599A (en) | 2006-07-16 |
WO2006036820A2 (fr) | 2006-04-06 |
CN101088148A (zh) | 2007-12-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2006036820A3 (fr) | Procede et appareil de controle d'un traitement dans un systeme de traitement plasma par mesure d'impedance | |
WO2006041656A3 (fr) | Procedes et appareil de surveillance d'un procede dans un systeme de traitement au plasma consistant a mesurer une frequence du plasma | |
WO2006036821A3 (fr) | Procede et appareil de controle d'un traitement dans un systeme de traitement plasma par mesure de la tension d'auto-polarisation | |
WO2005045890A3 (fr) | Procede et appareil de detection de point d'achevement de gravure | |
WO2010005930A3 (fr) | Ensemble sonde électrostatique à couplage capacitif (cce) pour détecter une étape d'amorçage dans une chambre de traitement au plasma et procédés associés | |
WO2010005931A3 (fr) | Dispositif sonde électrostatique à couplage capacitif (cce) pour détecter le desserrage dans une chambre de traitement au plasma et procédés associés | |
WO2007109252A3 (fr) | Procede de traitement plasma a controle in situ et procede de reglage de parametres | |
SG196801A1 (en) | Methods and systems for high confidence utilization of datasets | |
WO2004011905A8 (fr) | Assurance de la qualite/controle de la qualite pour processus d'ionisation par electronebulisation | |
WO2005081069A8 (fr) | Procede pour determiner la valeur des parametres de processus sur la base de donnees de spectrometrie | |
WO2007046996A3 (fr) | Procedes de configuration d'acces au reseau dans un reseau ip | |
EP1637616A3 (fr) | Méthode de contrôle d'un système de martelage par chocs laser et dispositif relatif | |
JP2008515198A5 (fr) | ||
WO2007143625A3 (fr) | Méthode et appareillage de surveillance de la pression des pneumatiques | |
WO2008101194A3 (fr) | Détection de capacité sur un actuateur goutte | |
TW200801445A (en) | Method of measuring warpage of rear surface of substrate | |
WO2008092936A3 (fr) | Procédé et appareil pour mesurer des paramètres de traitement d'un procédé de gravure par plasma | |
WO2006011996A3 (fr) | Procedes et appareil pour l'optimisation de la resistance a la gravure dans un systeme de traitement plasma | |
WO2006058169A3 (fr) | Detection et commande de fluctuations d'energie dans des systemes d'implantion ionique | |
TW200611363A (en) | Methods and apparatus for determining endpoint in a plasma processing system | |
WO2007002132A3 (fr) | Outil a resistivite multifrequence ou haute frequence | |
WO2011002811A3 (fr) | Agencement pour identification d'évènements non commandés au niveau du module de traitement et procédés liés | |
AU2001268327A1 (en) | Tire defect detection system and method | |
WO2007001838A3 (fr) | Procedes et appareil d'allumage d'un plasma basse pression | |
WO2003103017A3 (fr) | Procede et systeme permettant de determiner l'etat de conditionnement par emission optique |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV LY MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2007533668 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020077009423 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 200580039761.7 Country of ref document: CN |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 05823327 Country of ref document: EP Kind code of ref document: A2 |