WO2006035490A1 - 通信装置 - Google Patents
通信装置 Download PDFInfo
- Publication number
- WO2006035490A1 WO2006035490A1 PCT/JP2004/014110 JP2004014110W WO2006035490A1 WO 2006035490 A1 WO2006035490 A1 WO 2006035490A1 JP 2004014110 W JP2004014110 W JP 2004014110W WO 2006035490 A1 WO2006035490 A1 WO 2006035490A1
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- WO
- WIPO (PCT)
- Prior art keywords
- sheet
- communication
- communication device
- conductor layer
- sheet conductor
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/25—Arrangements specific to fibre transmission
- H04B10/2581—Multimode transmission
Definitions
- the present invention relates to a sheet-like communication device in which a plurality of communication element units communicate with each other.
- Patent Document 1 Japanese Patent Laid-Open No. 2004-007448
- each communication element is arranged at the apex of a lattice-like, triangular, or honeycomb-like figure on the surface of the sheet-like body.
- Each communication element communicates only with other communication elements arranged in the vicinity by utilizing the fact that the potential change generated by the communication element is strong in the vicinity and attenuated and propagated far away.
- An object of the present invention is to meet such a demand and to provide a sheet-like communication device in which a plurality of communication element units communicate with each other. Means for solving the problem
- the communication device includes a first sheet conductor portion and a second sheet conductor portion.
- a plurality of communication element units are provided and configured as follows.
- the second sheet conductor portion is disposed substantially parallel to the first sheet conductor portion.
- the plurality of communication element units are connected to the first sheet conductor unit and the second sheet conductor unit.
- the plurality of communication element units may be disposed between the first sheet conductor unit and the second sheet conductor unit.
- each of the plurality of communication element units operates using a potential difference between the first sheet conductor unit and the second sheet conductor unit as a power source.
- each of the plurality of communication element units communicates with other communication element units by electromagnetic waves propagating between the first sheet conductor unit and the second sheet conductor unit.
- a sheet-like resistor is connected to a surface of one of the first sheet conductor portion and the second sheet conductor portion that faces the other, and the sheet The resistor is configured to be insulated from the other.
- the communication device of the present invention is configured so that a sheet-like resistor that is insulated by force is disposed between the first sheet conductor portion and the second sheet conductor portion.
- the electromagnetic waves in the frequency band used by the plurality of communication element units out of a predetermined ratio of the surface of the first sheet conductor unit facing the second sheet conductor unit.
- a sheet-like resistor is connected to the highly reflective region.
- the number of the plurality of communication element units arranged per unit area of the surface of the first sheet conductor unit facing the second sheet conductor unit is predetermined.
- a sheet resistance is configured to be connected to a region higher than the threshold value.
- FIG. 1 is a perspective view showing a schematic configuration of a communication apparatus according to a first embodiment of the present invention.
- FIG. 2 is a cross-sectional view showing a schematic configuration of the communication apparatus according to the first embodiment of the present invention.
- FIG. 3 is a cross-sectional view showing a schematic configuration of a communication apparatus according to another embodiment of the present invention.
- FIG. 4 is a cross-sectional view showing a schematic configuration of a communication apparatus according to another embodiment of the present invention.
- FIG. 5 is a cross-sectional view showing a schematic configuration of a communication apparatus according to another embodiment of the present invention.
- FIG. 6 is an explanatory diagram showing a schematic configuration of a communication element that receives power supply.
- FIG. 7 is a circuit diagram showing a schematic configuration of a transmission circuit of a communication element.
- FIG. 8 is a circuit diagram showing a schematic configuration of a receiving circuit of a communication element.
- FIG. 9 is a cross-sectional view showing a schematic configuration of a communication apparatus according to another embodiment of the present invention.
- FIG. 10 is an explanatory diagram for explaining a portion where it is better to provide a resistance layer for a communication device having a special shape.
- FIG. 11 is a cross-sectional view showing a schematic configuration of a communication apparatus according to another embodiment of the present invention.
- FIG. 12 is a cross-sectional view showing the shape of the vicinity of the hole of another embodiment when the communication element and the first conductor layer and the second conductor layer are connected in contact.
- FIG. 1 and FIG. 2 are explanatory diagrams illustrating the communication device according to the first embodiment of the present invention.
- FIG. 1 is a perspective external view of the communication device
- FIG. 2 is a cross-sectional view of the communication device. The following description will be given with reference to this figure.
- the communication device 100 includes two first conductor layers 101 and second conductor layers 102 that are sheet-like (foil-like and film-like) conductors and are opposed to each other substantially in parallel.
- the first conductor layer 101 is provided with a plurality of holes 103.
- a protrusion 104 is disposed on the second conductor layer 102 so as to penetrate each of the holes 103.
- Communication element 105 is coupled to the first conductor layer in the vicinity of hole 103. Further, it is coupled to the second conductor layer 102 via the protrusion 104. The communication elements 105 communicate with each other by propagating electromagnetic waves between the first conductor layer 101 and the second conductor layer 102.
- Each communication element 105 is directly coupled or capacitively coupled to the first conductor layer 101 and the second conductor layer 102.
- an insulating layer 106 filled with an insulator is provided between the first conductor layer 101 and the second conductor layer 102. Insulating layer 106 insulates them.
- the three-component structure of the first conductor layer 101, the second conductor layer 102, and the insulating layer 106 is referred to as a “communication layer”.
- FIG. 2 is a cross-sectional view showing an example of a state in which the first conductor layer 101 and the second conductor layer 102 of the communication device 100 are coupled to the communication element 105.
- the communication element 105 has two electrodes 201 and 202 with power.
- the electrode 201 is directly connected to the periphery of the hole 103 of the first conductor layer 101.
- the electrode 202 is directly connected to the protrusion 104 of the second conductor layer 102.
- a voltage is applied between the first conductor layer 101 and the second conductor layer 102, and the communication element 105 operates upon receiving power supply by this voltage.
- a communication element is located above the first conductor layer 101 (the surface not facing the second conductor layer 102). You may place an insulator with an opening so that the child 105 fits! /.
- FIG. 3 is a cross-sectional view similar to the above but showing an example in which the shape of the protrusion 104 is changed.
- an opening is provided so as to curve from the lower surface of the second conductor layer 102 to the upper side of the first conductor layer 101, and the hole 103 of the first conductor layer 101 is formed in the hole 103.
- the periphery of the corresponding part is also curved upward.
- a curved portion of the second conductor layer 102 corresponds to the protrusion 104.
- An insulator 106 is disposed between the two. For example, all of these are shaped like holes made by applying a force to a metal plate with a cone.
- the electrode 201 has a cap shape that covers this curve, and is directly connected to the first conductor layer 101.
- the electrode 202 is directly connected to the inside of the protrusion of the second conductor layer 102.
- the contact point between the electrode 201 and the electrode 202 is such that the inner and outer forces of the curve are sandwiched between the first conductor layer 101 and the second conductor layer 102 by the panel, thereby ensuring the connection.
- FIG. 4 is a cross-sectional view illustrating another example in which the first conductor layer 101 and the second conductor layer 102 of the communication device 100 are coupled to the communication element 105.
- an insulator 301 is disposed above the first conductor layer 101 (the surface not facing the second conductor layer 102). Therefore, the electrode 201 of the communication element 105 is the first conductor layer 1
- a capacitor is formed with 01, and the electrode 202 is capacitively coupled with the first conductor layer 102 by forming a capacitor.
- the communication element 105 needs to be configured such that it has a power source.
- FIG. 5 is a cross-sectional view showing another example in which the first conductor layer 101 and the second conductor layer 102 of the communication device 100 are coupled to the communication element 105.
- the shape of the communication element 105 serves as a “protrusion”.
- the insulator 301 is arranged so as to cover the first conductor layer 101 and the second conductor layer 102 facing the hole 103.
- the communication element 105 is shaped to fit into the hole 103 covered with the insulator 301.
- the hole 103 has a circular shape
- the electrode 201 has a ring shape
- the electrode 202 has a circular shape. When mated, these centers coincide.
- This figure (b) shows the underside of the communication element 105 and the power The state of the electrode 201 and the electrode 202 is shown.
- FIG. 6 is an explanatory diagram showing a schematic configuration of the communication element 105 that receives power supply. However, the same configuration can be adopted even when power is not supplied. Hereinafter, description will be given with reference to this figure.
- the communication element 105 includes a positive terminal 501, a negative terminal 502, a resistor 503, a diode 504, a capacitor 505, a transmission circuit 506, a reception circuit 507, and a control circuit 508.
- the diode 504 may be omitted depending on the configuration setting.
- the capacitor 505 is charged via a resistor 503.
- the diode 504 enters a state where a current flows when the power supply potential VDD in the communication element 105 falls below the inter-terminal voltage OUT, and is quickly charged. As long as OUT ⁇ VDD, the diode 504 is in a high impedance state, so that transmission of the signal by the transmission circuit 506 is not hindered.
- the operating power is supplied from the capacitor 505 to the transmission circuit 506, the reception circuit 507, and the control circuit 508.
- the projection 104 has a cylindrical shape, and when the radius thereof is sufficiently smaller than the wavelength of the electromagnetic wave of the signal used for communication, the radiation impedance Z when the communication layer is viewed from the communication element 105 is Inductive,
- the radiation impedance Z is finite.
- the layer spacing is about 1 mm, and the protrusion radius is about several mm, a is about 1 ⁇ – 10 ⁇ .
- the communication layer can be regarded as having zero resistance in terms of direct current. In terms of direct current, power can be supplied with sufficiently low impedance.
- signal transmission and power supply can be performed.
- the positive terminal 501 and the negative terminal 502 are connected to either the electrode 201 or the electrode 202. Also, When capacitive coupling is performed (when power is not supplied from the first conductor layer 101 and the second conductor layer 102), the resistor 503 and the diode 504 may be omitted, and the capacitor 505 may be replaced with a power source.
- the control circuit 508 can employ various information processing devices such as a more general logic circuit and a further small computer.
- the control circuit 508 controls the reception circuit 507 and the transmission circuit 506 to communicate with the adjacent communication element 105 to form a network.
- the technique disclosed in the above [Patent Document 1] can be applied, and the technique described later can be adopted.
- FIG. 7 is a circuit diagram showing a schematic configuration of the transmission circuit of the communication element in the present embodiment.
- a description will be given with reference to FIG.
- the transmission circuit 506 includes a pMOS transistor 601, a diode 602, and an nM OS transistor 603.
- Control by the control circuit 508 is performed by changing the gate voltages of the pMOS transistor 601 and the nMOS transistor 603.
- the gate of the nMOS transistor 603 is set to the ground (VSS) potential in the chip, and the gate of the pMOS transistor 601 is set to the VDD potential.
- the impedance between the source and drain is sufficiently high in both cases, and OUT is almost equal to the VDD potential.
- a diode 602 sandwiched between the nMOS transistor 603 and the pMOS transistor 601 is inserted to adjust the amplitude of the output voltage. If the two are short-circuited without providing the diode 602, the H level of OUT will be the power supply potential and the L level will be the ground potential in the chip, but if the diode 602 is inserted, the forward voltage drop Min, L The potential of the level is increased and power consumption can be saved.
- the resistance component ⁇ of the radiation impedance Z described above converges to a constant value when the radius of the protrusion 104 becomes smaller than a certain value.
- the reactance component ⁇ of the radiation impedance ⁇ diverges and increases as the radius of the protrusion 104 decreases.
- the voltage change energy may not be effectively converted into the wave energy of the electromagnetic wave if it is driven as it is.
- a capacitor having an impedance that cancels ⁇ in the output is connected in series between the positive terminal 501 and the transmission circuit 506, or between the negative terminal 502 and the transmission circuit 506.
- the load on the communication layer viewed from the transmission circuit 506 can be a pure resistance.
- the maximum energy can be transmitted with the minimum voltage amplitude, and the energy consumed by the load is directly converted into wave energy of electromagnetic waves.
- the optimum capacitance Copt of the capacitor connected in series between the transmission circuit 506 and either the positive terminal 501 or the negative terminal 502 is determined by numerical calculation or experiment.
- the communication layer may be made to have a pure resistance as described above by connecting an inductance. In this case as well, the value may be obtained by numerical calculation or experiment.
- the depth is defined as the skin depth (the depth at which the current amplitude becomes 1).
- FIG. 8 is a circuit diagram showing a schematic configuration of the receiving circuit of the communication element in the present embodiment.
- a description will be given with reference to FIG.
- the receiving circuit 507 includes a resistor (rl) 701, a resistor (r2) 702, and a comparator 703.
- the signal is received by the voltage dividing ratio of the resistor 701 and the resistor 702. Set the threshold value for whether the potential change is H force L.
- the impedance component of the impedance between the input terminal and VSS determined by the input impedance of the comparator 703 is the same as the resistance component of the radiation impedance Z from the viewpoint of maximizing the energy absorbed by the receiving circuit 507. It is desirable to set the degree.
- a capacitor that cancels the reactance component j8 of the communication layer is connected in series between the positive terminal 501 and the reception circuit 507. As a result, the power flowing into the receiving circuit 507 is maximized.
- the optimum capacitance of the capacitor at this time is Copt if the input circuit routing of the transmission circuit 506 and the reception circuit 507 is the same, but it is actually obtained by numerical calculation or experiment.
- the communication layer may be made to have a pure resistance as described above by connecting the inductances in series instead of further connecting the capacitors in series.
- the value may be obtained by numerical calculation or experiment.
- FIG. 9 shows an example in which a resistance layer is provided in contrast to the example in FIG.
- the resistance layer 801 is connected to the first conductor layer 101 and insulated between the resistance layer 801 and the second conductor layer 102.
- Layer 106 is provided.
- the resistance layer 801 is connected to the second conductor layer 102, and the insulating layer 106 is provided between the resistance layer 801 and the first conductor layer 101.
- the reach distance of the electromagnetic wave is adjusted by providing the resistance layer 801.
- FIG. 10 is an explanatory diagram for explaining a portion where it is better to provide the resistance layer 801 for the communication device 100 having a special shape.
- the sheet-like communication device 100 shown in the figure is shaped such that a bridge connects two large islands.
- the partial force resistance layer 801 indicated by mesh shading is a portion to be disposed, and the conductivity ⁇ remains high in other portions.
- the density of the arrangement of the holes 103 (indicated by circles in the figure) is also different. Therefore, in order to avoid unnecessary signal collision even in places where the communication elements 105 can be arranged at a high density, the resistance layer 801 is arranged to shorten the reach of electromagnetic waves.
- the following method is conceivable. In other words, this is a method in which a simulation experiment or numerical analysis in the absence of the resistance layer 801 is performed, the degree of reflection in each region is examined, and a region whose degree is higher than a predetermined threshold is selected. In addition, it is also possible to examine the number of holes 103 per unit area and select a region that is higher than a predetermined threshold value.
- the provision of the resistance layer 801 makes it possible to prevent the influence of reflection and signal collision.
- FIG. 11 shows a cross-sectional view of a communication apparatus according to such an embodiment.
- the first conductor layer 101 and the second conductor layer 102 are arranged such that the floor and ceiling are the floor, and the communication element 105 is the pillar.
- An insulating layer 106 and a resistance layer 801 depending on the part are prepared.
- the resistance layer 801 is disposed so as to be in contact with the second conductor layer 102. Can be changed.
- the communication element 105 is supplied with power from the first conductor layer 101 and the second conductor layer 102.
- first conductor layer 101 the insulating layer 106, the resistance layer 801, the insulating layer 106, the second conductor layer 10
- a five-layer structure like 2 can also be adopted. Even when such a configuration is adopted, the effect of reducing ⁇ can be obtained, while the short circuit between the first conductor layer 101 and the second conductor layer 102 can be prevented.
- the structure in which the resistance layer is arranged on both surfaces of the conductor layers 101 and 102 that is, the first conductor layer 101, the resistance layer 801, the insulating layer 106, the resistance layer 801, the second conductor layer 102, etc.
- the same effect can be obtained even if a five-layer structure is adopted.
- FIG. 12 is a cross-sectional view showing the shape of the vicinity of the hole of another embodiment when the communication element and the first conductor layer and the second conductor layer are connected in contact with each other.
- a pin-like shape is adopted as the electrode 202, and a recess is provided so that the pin portion of the electrode 202 can be inserted into the projection 104 from the tip. .
- Fig. 7 (b) is a communication element in which the protrusion 104 is not extended from the second conductor layer 102.
- a protrusion-like shape is provided from 105 to the second conductor layer 101, and an electrode 202 is provided at the tip thereof for connection.
- the first conductor layer 101 and the insulating layer 106 are provided with holes that fit into the protruding shape of the communication element 105.
- the communication element 105 including the connector to the external device and the configuration fitted to the communication element 105.
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- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Near-Field Transmission Systems (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2004/014110 WO2006035490A1 (ja) | 2004-09-27 | 2004-09-27 | 通信装置 |
JP2006537584A JPWO2006035490A1 (ja) | 2004-09-27 | 2004-09-27 | 通信装置 |
PCT/JP2005/011773 WO2006035534A1 (ja) | 2004-09-27 | 2005-06-27 | 通信装置 |
JP2006537638A JPWO2006035534A1 (ja) | 2004-09-27 | 2005-06-27 | 通信装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2004/014110 WO2006035490A1 (ja) | 2004-09-27 | 2004-09-27 | 通信装置 |
Publications (1)
Publication Number | Publication Date |
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WO2006035490A1 true WO2006035490A1 (ja) | 2006-04-06 |
Family
ID=36118642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2004/014110 WO2006035490A1 (ja) | 2004-09-27 | 2004-09-27 | 通信装置 |
Country Status (2)
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JP (1) | JPWO2006035490A1 (ja) |
WO (1) | WO2006035490A1 (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0832315A (ja) * | 1994-07-15 | 1996-02-02 | Sony Corp | シート型マイクロストリップ線路 |
JP2004007448A (ja) * | 2001-10-12 | 2004-01-08 | Serukurosu:Kk | 通信装置 |
-
2004
- 2004-09-27 WO PCT/JP2004/014110 patent/WO2006035490A1/ja not_active Application Discontinuation
- 2004-09-27 JP JP2006537584A patent/JPWO2006035490A1/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0832315A (ja) * | 1994-07-15 | 1996-02-02 | Sony Corp | シート型マイクロストリップ線路 |
JP2004007448A (ja) * | 2001-10-12 | 2004-01-08 | Serukurosu:Kk | 通信装置 |
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JPWO2006035490A1 (ja) | 2008-05-15 |
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