WO2006029824A3 - Monitoring element for lithographic projection systems - Google Patents

Monitoring element for lithographic projection systems Download PDF

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Publication number
WO2006029824A3
WO2006029824A3 PCT/EP2005/009841 EP2005009841W WO2006029824A3 WO 2006029824 A3 WO2006029824 A3 WO 2006029824A3 EP 2005009841 W EP2005009841 W EP 2005009841W WO 2006029824 A3 WO2006029824 A3 WO 2006029824A3
Authority
WO
Grant status
Application
Patent type
Prior art keywords
lithographic projection
monitoring element
projection systems
element
projection system
Prior art date
Application number
PCT/EP2005/009841
Other languages
French (fr)
Other versions
WO2006029824A2 (en )
Inventor
Stephan Back
Joachim Buechele
Guido Soyez
Original Assignee
Stephan Back
Joachim Buechele
Guido Soyez
Zeiss Carl Smt Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70483Information management, control, testing, and wafer monitoring, e.g. pattern monitoring
    • G03F7/7055Exposure light control, in all parts of the microlithographic apparatus, e.g. pulse length control, light interruption
    • G03F7/70558Dose control, i.e. achievement of a desired dose
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70216Systems for imaging mask onto workpiece
    • G03F7/70341Immersion
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/708Construction of apparatus, e.g. environment, hygiene aspects or materials
    • G03F7/70908Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution, removing pollutants from apparatus; electromagnetic and electrostatic-charge pollution
    • G03F7/70916Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps

Abstract

A monitoring element for use in a lithographic projection system is provided, comprising a sensor element for detecting at least one chemical compound present in a fluid present in said projection system and a data collection element collecting data from said sensor element.
PCT/EP2005/009841 2004-09-16 2005-09-14 Monitoring element for lithographic projection systems WO2006029824A3 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US61057804 true 2004-09-16 2004-09-16
US60/610,578 2004-09-16

Publications (2)

Publication Number Publication Date
WO2006029824A2 true WO2006029824A2 (en) 2006-03-23
WO2006029824A3 true true WO2006029824A3 (en) 2006-09-08

Family

ID=36046628

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/009841 WO2006029824A3 (en) 2004-09-16 2005-09-14 Monitoring element for lithographic projection systems

Country Status (1)

Country Link
WO (1) WO2006029824A3 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7733459B2 (en) 2003-08-29 2010-06-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4752473B2 (en) * 2004-12-09 2011-08-17 株式会社ニコン Exposure apparatus, exposure method and device manufacturing method

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4396579A (en) * 1981-08-06 1983-08-02 Miles Laboratories, Inc. Luminescence detection device
JPS61115326A (en) * 1984-11-12 1986-06-02 Oki Electric Ind Co Ltd Etching of semiconductor substrate
US5065140A (en) * 1991-03-08 1991-11-12 Bell Communications Research, Inc. Early warning reactive gas detection system
US5685895A (en) * 1994-08-10 1997-11-11 Nikon Corporation Air cleaning apparatus used for an exposure apparatus
US6096267A (en) * 1997-02-28 2000-08-01 Extraction Systems, Inc. System for detecting base contaminants in air
US20020018189A1 (en) * 2000-06-01 2002-02-14 Johannes Catharinus Hubertus Mulkens Lithographic apparatus, device manufacturing method, and device manufactured thereby
EP1220038A1 (en) * 2000-12-22 2002-07-03 Asm Lithography B.V. Lithographic apparatus and device manufacturing method
US20030035087A1 (en) * 1996-03-27 2003-02-20 Nikon Corporation Exposure apparatus and air-conditioning apparatus for use with exposure apparatus
WO2004044656A2 (en) * 2002-11-14 2004-05-27 Infineon Technologies Ag Method for washing an optical lens
WO2004053958A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Exposure apparatus and method for manufacturing device
WO2005006026A2 (en) * 2003-07-01 2005-01-20 Nikon Corporation Using isotopically specified fluids as optical elements
EP1522894A2 (en) * 2003-10-06 2005-04-13 Matsushita Electric Industrial Co., Ltd. Semiconductor fabrication apparatus and pattern formation method using the same
US20050185155A1 (en) * 2004-02-19 2005-08-25 Yasuhiro Kishikawa Exposure apparatus and method

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4396579A (en) * 1981-08-06 1983-08-02 Miles Laboratories, Inc. Luminescence detection device
JPS61115326A (en) * 1984-11-12 1986-06-02 Oki Electric Ind Co Ltd Etching of semiconductor substrate
US5065140A (en) * 1991-03-08 1991-11-12 Bell Communications Research, Inc. Early warning reactive gas detection system
US5685895A (en) * 1994-08-10 1997-11-11 Nikon Corporation Air cleaning apparatus used for an exposure apparatus
US20030035087A1 (en) * 1996-03-27 2003-02-20 Nikon Corporation Exposure apparatus and air-conditioning apparatus for use with exposure apparatus
US6096267A (en) * 1997-02-28 2000-08-01 Extraction Systems, Inc. System for detecting base contaminants in air
US20020018189A1 (en) * 2000-06-01 2002-02-14 Johannes Catharinus Hubertus Mulkens Lithographic apparatus, device manufacturing method, and device manufactured thereby
EP1220038A1 (en) * 2000-12-22 2002-07-03 Asm Lithography B.V. Lithographic apparatus and device manufacturing method
WO2004044656A2 (en) * 2002-11-14 2004-05-27 Infineon Technologies Ag Method for washing an optical lens
WO2004053958A1 (en) * 2002-12-10 2004-06-24 Nikon Corporation Exposure apparatus and method for manufacturing device
EP1571699A1 (en) * 2002-12-10 2005-09-07 Nikon Corporation Exposure apparatus and method for manufacturing device
WO2005006026A2 (en) * 2003-07-01 2005-01-20 Nikon Corporation Using isotopically specified fluids as optical elements
EP1522894A2 (en) * 2003-10-06 2005-04-13 Matsushita Electric Industrial Co., Ltd. Semiconductor fabrication apparatus and pattern formation method using the same
US20050185155A1 (en) * 2004-02-19 2005-08-25 Yasuhiro Kishikawa Exposure apparatus and method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 010, no. 302 (E - 445) 15 October 1986 (1986-10-15) *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7733459B2 (en) 2003-08-29 2010-06-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8629971B2 (en) 2003-08-29 2014-01-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8953144B2 (en) 2003-08-29 2015-02-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9025127B2 (en) 2003-08-29 2015-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9581914B2 (en) 2003-08-29 2017-02-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date Type
WO2006029824A2 (en) 2006-03-23 application

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