WO2006025688A1

WO2006025688A1 - Cooling device for computer using thermoelectric element

Info

Publication number: WO2006025688A1
Application number: PCT/KR2005/002871
Authority: WO
Inventors: Jong Kyu Lee
Original assignee: Jong Kyu Lee
Priority date: 2004-09-01
Filing date: 2005-08-30
Publication date: 2006-03-09
Also published as: KR20060050829A; WO2006025689A1; KR20060050828A

Abstract

The present invention relates to a device for cooling a computer using a thermoelectric element. An air cooling kit comprising a thermoelectric element, a cooling unit and a heat radiating unit is mounted to the upper wall of a case of a computer so that air cooled by the cooling unit can decrease the temperature inside the computer. The cooling unit and the heat radiating unit are constructed to use the Peltier effect of the thermoelectric element to thereby efficiently decrease the temperature inside the computer.

Description

COOLING DEVICE FOR COMPUTER USING THER¬ MOELECTRIC ELEMENT

Technical Field

[1] The present invention relates to a computer cooling device, and more particularly, to a device for cooling a computer using a thermoelectric element, in which an air cooling kit constituted by a thermoelectric element, a cooling unit and a heat radiating unit is mounted to the upper wall of the case of a computer so that air cooled by the cooling unit can decrease the temperature inside the computer, the cooling unit and the heat radiating unit being constructed to use a Peltier effect of the thermoelectric element to thereby efficiently decrease the temperature inside the computer. Background Art

[2] As is well known in the art, a computer for home or industrial use operates in a state in which it is constituted by a combination of a number of semiconductors and other peripheral devices. In order to discharge heat generated by the operation of these numerous component elements, a cooling system such as a fan, etc. which employs forced air circulation is adopted.

[3] Specifically, for those component elements such as a CPU, a graphic card, a power supply, and the like, in which a substantial amount of heat is generated, a cooling device which comprises a combination of a heat radiating plate and a fan is inde¬ pendently provided. Also, for other component elements, a cooling device such as a heat radiating plate, and the like, is provided.

[4] Further, one or more fans for discharging heat generated in component elements which generate a small amount of heat and in the cooling device are installed in the body of a computer.

[5] While this type of air cooling system is widely used throughout the world in view of its simple construction and easy installation, it has a limitation in that its operation depends entirely on the temperature outside the computer.

[6] In connection with this, a water-cooling type cooling device has been suggested in the art as means for improving cooling efficiency. However, the water cooling type cooling device suffers from disadvantages in that, since its size and construction are markedly large and complex when compared to the air cooling type cooling device, the manufacturing cost of a computer increases, and maintenance and repair work for the water cooling type cooling device cannot be easily conducted. Therefore, the water cooling type cooling device is limitedly used in a special industrial application.

[7] Recently, due to the rapid development of computer-related techniques, the minia- turization of computers and an increasing demand for computers having structures dedicated to special industrial applications, the need exists for a cooling system having high efficiency.

[8] In consideration of these aspects, while air circulation type cooling devices, the in¬ stallation of which is less expensive, are mainly used, various configurations of heat radiating plates and fans having a high rotational velocity have been adopted to improve cooling efficiency.

[9] Nevertheless, since the body of a conventional computer has a structure in which inside air and outside air are not separated from each other, the cooling efficiency of the cooling device cannot but depend entirely on the temperature of the air outside the computer.

[10] Hence, in the case that the outside temperature is high, or in a specific place which is warm or enclosed, a problem is caused in that cooling efficiency is degraded. Con¬ sequently, as described above, due to the rapid development of computer-related techniques, the miniaturization of computers and the increasing demand for computers having structures dedicated to special industrial applications, a cooling system having high efficiency has drawn considerable attention.

[11] Also, when the temperature surrounding a computer is remarkably low, in order to ensure reliable operation of the computer, it is necessary to raise the temperature inside the computer. From this point of view, a problem is caused in that a device for raising the temperature inside the computer must be separately provided.

[12]

Disclosure of Invention

Technical Problem

[13] Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide a device for cooling a computer using a thermoelectric element, in which a cooling unit and a heat radiating unit are installed so as to use the Peltier effect of the ther¬ moelectric element to thereby efficiently decrease the temperature inside the computer.

[14] Another object of the present invention is to provide a device for cooling a computer using a thermoelectric element, which can increase the temperature inside the computer using the Peltier effect of the thermoelectric element so that the device can be employed in an environment where the temperature surrounding the computer is remarkably low and it is necessary to raise the temperature inside the computer. Technical Solution

[15] In order to achieve the above object, according to one aspect of the present invention, there is provided a device for cooling a computer, wherein an air cooling kit is mounted to a case of the computer to be perpendicular to add-on cards which are installed in the computer, the air cooling kit comprising temperature sensors for sensing temperatures inside and outside the computer; a thermoelectric element having a heat absorption side and a heat radiation side which respectively perform a heat absorbing operation and a heat radiating operation depending upon inputs from electrodes connected to the heat absorption side and the heat radiation side of the ther¬ moelectric element respectively; a cooling unit positioned inside the case of the computer, the cooling unit comprising a cooling plate which is connected to the heat absorption side of the thermoelectric element and has a plurality of protuberances in a lengthwise direction thereof and one or more cooling fans for circulating air which is conditioned by the cooling plate, within the inside of the computer; a heat radiating unit positioned outside the case of the computer, the heat radiating unit comprising a heat radiating plate which is connected to the heat radiation side of the thermoelectric element and has a plurality of protuberances in a lengthwise direction thereof and one or more heat radiating fans for decreasing a temperature of the heat radiating plate; a control unit for comparing the temperatures sensed by the temperature sensors with a predetermined temperature range and thereby controlling operation of the ther¬ moelectric element, the cooling unit and the heat radiating unit; and a housing for protecting the heat radiating unit and the control unit.

[16] According to another aspect of the present invention, by reversing positive and negative poles (+, -) of power inputted to the thermoelectric element, heat is generated from the cooling unit so that a temperature inside the computer can be increased depending upon environmental conditions around the computer.

[17]

Advantageous Effects

[18] As is apparent from the above descriptions, the device for cooling a computer using a thermoelectric element according to the present invention provides advantages in that a cooling unit and a heat radiating unit are installed so as to use the Peltier effect of the thermoelectric element to thereby efficiently decrease the temperature inside the computer.

[19] Further, the device for cooling a computer using a thermoelectric element according to the present invention provides advantages in that the temperature inside the computer can be increased using the Peltier effect of the thermoelectric element so that the device can be employed in an environment where the temperature surrounding the computer is remarkably low and it is necessary to raise the temperature inside the computer.

Brief Description of the Drawings [20] FlG. 1 is a perspective view illustrating a computer equipped with a device for cooling a computer using a thermoelectric element in accordance with an embodiment of the present invention;

[21] FlG. 2 is a side view illustrating an air cooling kit according to the present invention;

[22] FlG. 3 is an internal plan view illustrating a computer to which the cooling device according to the present invention is mounted;

[23] FlG. 4 is a plan view illustrating the inner surface of a case of the computer to which the cooling device according to the present invention is mounted;

[24] FlG. 5 is a front view illustrating the air cooling kit according to the present invention; and

[25] FlG. 6 is a control flow chart of the cooling device according to the present invention.

[26]

Best Mode for Carrying Out the Invention

[27] Hereafter, a preferred embodiment of the present invention will be described with reference to the accompanying drawings. In the following descriptions of the present invention, detailed descriptions of known functions and configurations incorporated herein will be omitted when it is deemed that they make the subject matter of the present invention rather unclear.

[28] FlG. 1 is a perspective view illustrating a computer equipped with a device for cooling a computer using a thermoelectric element in accordance with an embodiment of the present invention, FlG. 2 is a side view illustrating an air cooling kit according to the present invention, FlG. 3 is an internal plan view illustrating a computer to which the cooling device according to the present invention is mounted, and FlG. 4 is a plan view illustrating the inner surface of a case of the computer to which the cooling device according to the present invention is mounted.

[29] FlG. 5 is a front view illustrating the air cooling kit according to the present invention, and FlG. 6 is a control flow chart of the cooling device according to the present invention.

[30] Referring to FlGs. 1 and 2, a device for cooling a computer using a thermoelectric element in accordance with an embodiment of the present invention comprises an air cooling kit 200 which is mounted to the upper wall of the case 11 of the computer 10 such that the air cooling kit 200 is perpendicular to add-on cards installed in the computer 10. The air cooling kit 200 includes temperature sensors 210, a cooling unit 240, a thermoelectric element 250, a heat radiating unit 230, and a control unit 260.

[31] It is preferred that the inside surfaces of the case 11 of the computer 10 be covered with a heat insulation material 100 to block heat transfer from the outside.

[32] Concretely speaking, the air cooling kit 200 includes the temperature sensors 210 for sensing the temperatures inside and outside the computer 10, the heat radiating unit 230 positioned outside the computer case 11, the cooling unit 240 positioned inside the computer case 11, the thermoelectric element 250 having a heat radiation side which is connected to the heat radiating unit 230 and a heat absorption side which is connected to the cooling unit 240, to perform a heat absorbing operation and a heat radiating operation depending upon the current application thereto, and the control unit 260 for comparing the temperatures sensed by the temperature sensors 210 with a pre¬ determined temperature range and controlling the operation of the thermoelectric element 250, the cooling unit 240 and the heat radiating unit 230.

[33] In particular, as shown in FlG. 3, the heat insulation material 100 covers the inner surfaces of the computer case 11 such that a CPU, add-on cards, I/O devices, and so forth, which are mounted to a main board section 14 of the computer 10, are enclosed by the heat insulation material 100. A power supply section 15, an ODD (optical disk drive) section 17, etc., are separated from the main board section 14 so that heat generated therefrom is not transferred to the main board section 14, to accomplish improved heat insulation effect. In this regard, it can be envisaged that the power supply section 15 and the ODD section 17 are independently covered with the heat insulation material 100.

[34] Referring to FlG. 4, preferably, a plurality of vent holes 16 are defined through the upper wall of the computer case 11 to face the power supply section 15, so that a substantial amount of heat generated from the power supply section 15 can be directly discharged to the outside through the plurality of vent holes 16.

[35] Referring to FlG. 5, the air cooling kit 200 is installed through the upper wall of the computer case 11. In this regard, it is preferred that the air cooling kit 200 be mounted through the upper wall of the computer case 11 to be positioned perpendicularly with respect to the add-on cards installed in the computer 10.

[36] As described above, the air cooling kit 200 includes the temperature sensors 210, the cooling unit 240, the thermoelectric element 250, the heat radiating unit 230, and the control unit 260. Preferably, the cooling unit 240 is positioned inside the case 11, and the heat radiating unit 230 is positioned outside the case 11.

[37] Specifically, as shown in FlGs. 2 and 5, it is preferred that a housing 290 be provided to protect the air cooling kit 200 from external shock. Further, it is preferred that linear and/or circular vent holes 220 for the air cooling kit 200 be defined at regular intervals through the upper wall of the housing 290 to face a heat radiating fan 235 of the heat radiating unit 230 (see HG. 1).

[38] The temperature sensors 210 function to sense the temperatures inside and outside the computer 10 and transmit the sensed temperatures to the control unit 260 which will be described later in detail. It is preferred that the positions and the number of the temperature sensors 210 be determined in consideration of the kind of the computer 10.

[39] The thermoelectric element 250 is used to efficiently decrease the temperature inside the computer 10. As generally known in the art, a thermoelectric element is a generic term for a unit which uses various effects obtained through the interaction of heat and electricity.

[40] Preferably, in the present invention, the thermoelectric element 250 comprises a

Peltier element exhibiting the Peltier effect which causes a phenomenon such that, when the distal ends of two different kinds of metals serving as terminals are connected with each other and current is applied to them, one terminal performs a heat absorbing operation and the other terminal performs a heat radiating operation depending upon the current application direction.

[41] The cooling unit 240 is arranged inside the computer 10 and connected to the heat absorption side of the thermoelectric element 250 so as to dissipate the heat generated in the computer 10 and circulate cooled air.

[42] It is preferred that, in order to ensure efficient air circulation, the cooling unit 240 be composed of a cooling plate 246, which transfers heat through contact with air, and cooling fans 245, which cause forced convection.

[43] The heat radiating unit 230 is arranged outside the computer 10 and is connected to the heat radiation side of the thermoelectric element 250 to dissipate heat generated in the thermoelectric element 250, thereby ensuring efficient operation of the ther¬ moelectric element 250. It is preferred that the heat radiating unit 230 be composed of a heat radiating plate 236, which transfers heat through contact with air, and a heat radiating fan 235, which causes forced convection.

[44] As shown in FlG. 4, a plurality of cooling fans 245 and heat radiating fans 235 may be used to suit the environmental circumstances of the computer 10.

[45] The above described cooling unit 240, thermoelectric element 250 and heat radiating unit 230 are electrically connected with one another to be controlled in their operation by control signals from the control unit 260. The temperature sensors 210 transmit sensed temperature signals to the control unit 260.

[46] As can be readily seen from FlG. 6, the control unit 260 controls the operation of the thermoelectric element 250 depending upon temperatures sensed by the temperature sensors 210. It is preferred that the temperature of the thermoelectric element 250 be controlled through an automatic switching type on/off control method which employs the difference between inside and outside temperatures or a con¬ ventional PWM (pulse width modulation) control method.

[47] If the two poles (+, -) inputted to the thermoelectric element 250 are reversed, heat is generated in the cooling unit 240 and the temperature inside the computer 10 increases.

[48] Due to this fact, when the temperature outside the computer 10 is abnormally low under extraordinary environmental circumstances, by reversing the two poles (+, -) inputted to the thermoelectric element 250, the temperature inside the computer 10 can be increased to ensure reliable operation of the computer 10.

[49] Preferably, the air cooling kit 200 according to the present invention is mounted to the upper wall of the computer case 11 so that the air cooling kit 200 is positioned per¬ pendicularly to the add-on cards which are installed in the computer 10. As a consequence, air cooled by the cooling unit 240 of the air cooling kit 200 can flow through spaces between the add-on cards, whereby efficient cooling is ensured.

[50] Hereinbelow, an air cooling procedure employing the automatic switching type on/ off control method which is implemented by the control unit 260 according to the present invention will be described.

[51] The method comprises a temperature sensing step of sensing the temperatures inside and outside the computer 10 using the temperature sensors 210, and a first comparison step of comparing the inside and outside temperatures sensed in the temperature sensing step.

[52] When it is judged in the first comparison step that the inside temperature is higher than the outside temperature, the method proceeds to an operation step of operating the thermoelectric element 250, cooling unit 240 and heat radiating unit 230 to decrease the temperature inside the computer 10.

[53] When it is judged in the first comparison step that the inside temperature is lower than the outside temperature, the method proceeds to a second comparison step as will be described below, to effect conditional branching once more.

[54] Due to the presence of this step, since the difference between the temperatures inside and outside the computer can be adjusted to be minimal, it is possible to prevent water vapor in the air from condensing and adhering to the inner and outer surfaces of the computer case 11.

[55] In the second comparison step, the difference Tl between the temperatures inside and outside the computer 10 is compared with a predetermined temperature T2. At this time, the predetermined temperature T2 can be changed depending upon the current average humidity.

[56] When it is judged in the second comparison step that the difference Tl between the inside and outside temperatures is greater than the predetermined temperature T2, the method proceeds to an interruption step of interrupting the operation of the ther¬ moelectric element 250, the cooling unit 240 and the heat radiating unit 230.

[57] When it is judged in the second comparison step that the difference Tl between the inside and outside temperatures is smaller than the predetermined temperature T2, the method may proceed to the operation step.

[58] In particular, in the air cooling procedure employing the on/off control method, since the difference between the inside and outside temperatures can be adjusted taking into account the average humidity of the environmental circumstances, it is possible to prevent a dewing phenomenon.

[59] In the air cooling procedure employing the on/off control method, the pre¬ determined temperature T2 is flexibly changed depending upon the average humidity, which basically varies. In a humidity of 80% which is the average humidity in summer of Korea and represents a limit driving humidity for electric appliances, the pre¬ determined temperature T2 is 3-4 °C. Of course, the predetermined temperature T2 can be appropriately changed to conform with environmental circumstances, in particular, humidity.

[60] It is preferred that the difference Tl between the temperatures inside and outside the computer 10 be measured using the variation in electric resistance depending upon temperature.

[61] In the control unit 260, it is possible to drive the computer cooling device using the thermoelectric element 250 and the PWM control method. This PWM control method will be described below.

[62] The PWM control method comprises a temperature sensing step of sensing the temperature inside the computer 10 using the temperature sensor 210 and judging whether or not the sensed temperature is higher than a predetermined temperature. When it is judged in the temperature sensing step that the sensed temperature is higher than the predetermined temperature, the thermoelectric element 250 is operated to a preset limit temperature which is preset in advance for the sensed temperature, and the heat radiating unit 230 and the cooling unit 240 are operated to cool the space inside the computer 10.

[63] In the cooling step, when the temperature inside the computer reaches the preset limit temperature, the operation of the thermoelectric element 250, heat radiating fan and cooling fan is interrupted.

[64] Although preferred embodiments of the present invention have been described for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claim.

[65]

Claims

[1] A device for cooling a computer, wherein an air cooling kit is mounted to a case of the computer to be perpendicular to add-on cards which are installed in the computer, the air cooling kit comprising: temperature sensors for sensing temperatures inside and outside the computer; a thermoelectric element having a heat absorption side and a heat radiation side which respectively perform a heat absorbing operation and a heat radiating operation depending upon inputs from electrodes connected to the heat absorption side and the heat radiation side of the thermoelectric element re¬ spectively; a cooling unit positioned inside the case of the computer, the cooling unit comprising a cooling plate which is connected to the heat absorption side of the thermoelectric element and has a plurality of protuberances in a lengthwise direction thereof and one or more cooling fans for circulating air, which is conditioned by the cooling plate, within the inside of the computer; a heat radiating unit positioned outside the case of the computer, the heat radiating unit comprising a heat radiating plate which is connected to the heat radiation side of the thermoelectric element and has a plurality of protuberances in a lengthwise direction thereof and one or more heat radiating fans for decreasing a temperature of the heat radiating plate; a control unit for comparing the temperatures sensed by the temperature sensors with a predetermined temperature range and thereby controlling operation of the thermoelectric element, the cooling unit and the heat radiating unit; and a housing for protecting the heat radiating unit and the control unit.

[2] The device as set forth in claim 1, wherein, by reversing poles of power inputted to the thermoelectric element, heat is generated from the cooling unit so that a temperature inside the computer can be increased depending upon environmental conditions around the computer.