WO2006023737A3 - Appareil et procede de transfert de chaleur ameliore - Google Patents

Appareil et procede de transfert de chaleur ameliore Download PDF

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Publication number
WO2006023737A3
WO2006023737A3 PCT/US2005/029577 US2005029577W WO2006023737A3 WO 2006023737 A3 WO2006023737 A3 WO 2006023737A3 US 2005029577 W US2005029577 W US 2005029577W WO 2006023737 A3 WO2006023737 A3 WO 2006023737A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat transfer
enhanced heat
pressure vibrations
chamber
heated wall
Prior art date
Application number
PCT/US2005/029577
Other languages
English (en)
Other versions
WO2006023737A2 (fr
Inventor
Ari Glezer
Samuel Neil Heffington
Mark K Smith
Original Assignee
Innovative Fluidics Inc
Ari Glezer
Samuel Neil Heffington
Mark K Smith
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innovative Fluidics Inc, Ari Glezer, Samuel Neil Heffington, Mark K Smith filed Critical Innovative Fluidics Inc
Publication of WO2006023737A2 publication Critical patent/WO2006023737A2/fr
Publication of WO2006023737A3 publication Critical patent/WO2006023737A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/10—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

Dans un mode de réalisation, un système est mis en oeuvre sous forme de dispositif destiné à un transfert de chaleur en deux phases. Ledit dispositif comprend une chambre contenant un fluide dans laquelle une paroi chauffée constitue une partie de la chambre, et un actionneur émettant de vibrations de pression. Ces vibrations permettent de déloger des bulles de vapeur qui se forment au niveau de la paroi chauffée à cause de la chaleur emmagasinée dans ladite paroi.
PCT/US2005/029577 2004-08-20 2005-08-19 Appareil et procede de transfert de chaleur ameliore WO2006023737A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US60343604P 2004-08-20 2004-08-20
US60/603,436 2004-08-20
US11/205,665 US20060060331A1 (en) 2004-08-20 2005-08-17 Apparatus and method for enhanced heat transfer
US11/205,665 2005-08-17

Publications (2)

Publication Number Publication Date
WO2006023737A2 WO2006023737A2 (fr) 2006-03-02
WO2006023737A3 true WO2006023737A3 (fr) 2007-01-25

Family

ID=35968208

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/029577 WO2006023737A2 (fr) 2004-08-20 2005-08-19 Appareil et procede de transfert de chaleur ameliore

Country Status (2)

Country Link
US (1) US20060060331A1 (fr)
WO (1) WO2006023737A2 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090120621A1 (en) * 2005-07-15 2009-05-14 Pulsacool Ltd. Method and apparatus for cooling electronic or other devices
US7228888B2 (en) * 2005-10-13 2007-06-12 International Business Machines Corporation Rotatable liquid reservoir for computer cooling
US20090260783A1 (en) * 2006-03-06 2009-10-22 Tokyo University Of Science Educational Foundation Boil Cooling Method, Boil Cooling Apparatus, Flow Channel Structure and Applied Product Thereof
CN101568732B (zh) * 2006-12-15 2015-10-07 皇家飞利浦电子股份有限公司 具有频率控制的脉动流体冷却
JP5757086B2 (ja) * 2008-10-29 2015-07-29 日本電気株式会社 冷却構造及び電子機器並びに冷却方法
US8240885B2 (en) * 2008-11-18 2012-08-14 Abl Ip Holding Llc Thermal management of LED lighting systems
DE102009050482B4 (de) * 2009-10-23 2011-09-01 Voith Patent Gmbh Wärmeübertragerplatte und Verdampfer mit einer solchen
US8602607B2 (en) 2010-10-21 2013-12-10 General Electric Company Lighting system with thermal management system having point contact synthetic jets
US8529097B2 (en) 2010-10-21 2013-09-10 General Electric Company Lighting system with heat distribution face plate
US20130319639A1 (en) * 2011-02-22 2013-12-05 Nec Corporation Cooling device and method for making the same
GB201220471D0 (en) * 2012-11-14 2012-12-26 Technology Partnership The Pump
US9433132B2 (en) * 2014-08-08 2016-08-30 Intel Corporation Recirculating dielectric fluid cooling
US9629233B2 (en) * 2015-06-08 2017-04-18 Qualcomm Incorporated Techniques for implementing a synthetic jet to cool a device
CN108029221B (zh) * 2015-09-14 2019-11-29 三菱电机株式会社 冷却器、电力转换装置及冷却系统
ITUB20155887A1 (it) * 2015-11-25 2017-05-25 Carlo Bartoli Dissipatore di calore per componenti elettronici
US10267568B2 (en) * 2016-05-11 2019-04-23 Toyota Motor Engineering & Manufacturing North America, Inc. Programmable ultrasonic thermal diodes
US20180103560A1 (en) * 2016-10-12 2018-04-12 Hamilton Sundstrand Corporation Jet impingement immersion cooling with synthetic ejector

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3578072A (en) * 1969-08-11 1971-05-11 Massachusetts Inst Technology Heat exchange apparatus
US3789617A (en) * 1972-01-13 1974-02-05 Thermocycle Inc Thermodynamic system
FR2552536A1 (fr) * 1983-09-28 1985-03-29 Laguilharre Sa Procede de transfert indirect de calories par utilisation d'ondes ultrasonores, et echangeur de chaleur, en particulier evaporateur a flot tombant, pour la mise en oeuvre de ce procede
US5871043A (en) * 1994-09-06 1999-02-16 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant
US5997671A (en) * 1994-11-16 1999-12-07 Ngk Insulators, Ltd. Method for producing ceramic diaphragm structure
US6247525B1 (en) * 1997-03-20 2001-06-19 Georgia Tech Research Corporation Vibration induced atomizers
US20020079089A1 (en) * 2000-11-04 2002-06-27 Korea Institute Of Science & Technology Apparatus for enhancing condensation and boiling of a fluid
US20040251780A1 (en) * 2003-05-09 2004-12-16 Goodson J. Michael Advanced ceramics in ultrasonic transducerized devices
US20050284612A1 (en) * 2004-06-22 2005-12-29 Machiroutu Sridhar V Piezo pumped heat pipe
US7092254B1 (en) * 2004-08-06 2006-08-15 Apple Computer, Inc. Cooling system for electronic devices utilizing fluid flow and agitation

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5040560A (en) * 1990-12-05 1991-08-20 Ari Glezer Method and apparatus for controlled modification of fluid flow
US6123145A (en) * 1995-06-12 2000-09-26 Georgia Tech Research Corporation Synthetic jet actuators for cooling heated bodies and environments
US6457654B1 (en) * 1995-06-12 2002-10-01 Georgia Tech Research Corporation Micromachined synthetic jet actuators and applications thereof
US5758823A (en) * 1995-06-12 1998-06-02 Georgia Tech Research Corporation Synthetic jet actuator and applications thereof
US6059020A (en) * 1997-01-16 2000-05-09 Ford Global Technologies, Inc. Apparatus for acoustic cooling automotive electronics
US6109222A (en) * 1997-11-24 2000-08-29 Georgia Tech Research Corporation Miniature reciprocating combustion-driven machinery
US6412732B1 (en) * 1999-07-06 2002-07-02 Georgia Tech Research Corporation Apparatus and method for enhancement of aerodynamic performance by using pulse excitation control
US6554607B1 (en) * 1999-09-01 2003-04-29 Georgia Tech Research Corporation Combustion-driven jet actuator
WO2002072421A2 (fr) * 2001-03-10 2002-09-19 Georgia Tech Research Corporation Modification de l'ecoulement dun fluide sur des corps et des surfaces par formage aerodynamique virtuel de profils au moyen d'actuateurs de jets synthetiques
US6588497B1 (en) * 2002-04-19 2003-07-08 Georgia Tech Research Corporation System and method for thermal management by synthetic jet ejector channel cooling techniques

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3578072A (en) * 1969-08-11 1971-05-11 Massachusetts Inst Technology Heat exchange apparatus
US3789617A (en) * 1972-01-13 1974-02-05 Thermocycle Inc Thermodynamic system
FR2552536A1 (fr) * 1983-09-28 1985-03-29 Laguilharre Sa Procede de transfert indirect de calories par utilisation d'ondes ultrasonores, et echangeur de chaleur, en particulier evaporateur a flot tombant, pour la mise en oeuvre de ce procede
US5871043A (en) * 1994-09-06 1999-02-16 Nippondenso Co., Ltd. Cooling apparatus using boiling and condensing refrigerant
US5997671A (en) * 1994-11-16 1999-12-07 Ngk Insulators, Ltd. Method for producing ceramic diaphragm structure
US6247525B1 (en) * 1997-03-20 2001-06-19 Georgia Tech Research Corporation Vibration induced atomizers
US20020079089A1 (en) * 2000-11-04 2002-06-27 Korea Institute Of Science & Technology Apparatus for enhancing condensation and boiling of a fluid
US20040251780A1 (en) * 2003-05-09 2004-12-16 Goodson J. Michael Advanced ceramics in ultrasonic transducerized devices
US20050284612A1 (en) * 2004-06-22 2005-12-29 Machiroutu Sridhar V Piezo pumped heat pipe
US7092254B1 (en) * 2004-08-06 2006-08-15 Apple Computer, Inc. Cooling system for electronic devices utilizing fluid flow and agitation

Also Published As

Publication number Publication date
WO2006023737A2 (fr) 2006-03-02
US20060060331A1 (en) 2006-03-23

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