WO2006008454A1 - Method of forming uniform lines on a substrate - Google Patents
Method of forming uniform lines on a substrate Download PDFInfo
- Publication number
- WO2006008454A1 WO2006008454A1 PCT/GB2005/002703 GB2005002703W WO2006008454A1 WO 2006008454 A1 WO2006008454 A1 WO 2006008454A1 GB 2005002703 W GB2005002703 W GB 2005002703W WO 2006008454 A1 WO2006008454 A1 WO 2006008454A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- contact angle
- liquid
- drop
- substrate
- rivulet
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/30—Processes for applying liquids or other fluent materials performed by gravity only, i.e. flow coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J1/00—Typewriters or selective printing mechanisms characterised by the mounting, arrangement or disposition of the types or dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/572,425 US20070286943A1 (en) | 2004-07-23 | 2005-07-08 | Method of Forming Uniform Lines on a Substrate |
DE602005020468T DE602005020468D1 (en) | 2004-07-23 | 2005-07-08 | METHOD FOR FORMING UNIFORM LINES ON A SUBSTRATE |
JP2007522007A JP2008510597A (en) | 2004-07-23 | 2005-07-08 | Method for forming uniform lines on a substrate |
EP05759857A EP1789205B1 (en) | 2004-07-23 | 2005-07-08 | Method of forming uniform lines on a substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0416434.9 | 2004-07-23 | ||
GBGB0416434.9A GB0416434D0 (en) | 2004-07-23 | 2004-07-23 | Method of forming uniform lines on a substate |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006008454A1 true WO2006008454A1 (en) | 2006-01-26 |
Family
ID=32922658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB2005/002703 WO2006008454A1 (en) | 2004-07-23 | 2005-07-08 | Method of forming uniform lines on a substrate |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070286943A1 (en) |
EP (1) | EP1789205B1 (en) |
JP (1) | JP2008510597A (en) |
DE (1) | DE602005020468D1 (en) |
GB (1) | GB0416434D0 (en) |
WO (1) | WO2006008454A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10927214B2 (en) | 2017-04-04 | 2021-02-23 | Qatar Foundation For Education, Science And Community Development | Method of making a pyrrolo bisthiazole homopolymer |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015083160A2 (en) * | 2013-12-02 | 2015-06-11 | Clearjet Ltd | Process for controlling wettability features |
JP6454453B2 (en) * | 2017-01-16 | 2019-01-16 | 昭和電工株式会社 | Transparent conductive film and method for producing transparent conductive pattern |
EP3846599A4 (en) | 2018-08-27 | 2021-08-11 | Konica Minolta, Inc. | Method for forming conductive thin wire, method for producing transparent conductor, method for producing device, and set of conductive ink and base material |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5674592A (en) * | 1995-05-04 | 1997-10-07 | Minnesota Mining And Manufacturing Company | Functionalized nanostructured films |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69841013D1 (en) * | 1998-08-06 | 2009-09-10 | Air Liquide | Fiber structure and absorbent article made therewith |
GB2373095A (en) * | 2001-03-09 | 2002-09-11 | Seiko Epson Corp | Patterning substrates with evaporation residues |
FI20010503A0 (en) * | 2001-03-13 | 2001-03-13 | Metso Paper Inc | Procedure for coating paper or paperboard and coated paper |
JP2003266669A (en) * | 2002-03-18 | 2003-09-24 | Seiko Epson Corp | Liquid ejector and its writing method, system and method for fabricating device, and device |
-
2004
- 2004-07-23 GB GBGB0416434.9A patent/GB0416434D0/en not_active Ceased
-
2005
- 2005-07-08 EP EP05759857A patent/EP1789205B1/en not_active Expired - Fee Related
- 2005-07-08 DE DE602005020468T patent/DE602005020468D1/en active Active
- 2005-07-08 JP JP2007522007A patent/JP2008510597A/en active Pending
- 2005-07-08 WO PCT/GB2005/002703 patent/WO2006008454A1/en active Application Filing
- 2005-07-08 US US11/572,425 patent/US20070286943A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5674592A (en) * | 1995-05-04 | 1997-10-07 | Minnesota Mining And Manufacturing Company | Functionalized nanostructured films |
Non-Patent Citations (1)
Title |
---|
DUINEVELD P C: "THE STABILITY OF INK-JET PRINTED LINES OF LIQUID WITH ZERO RECEDING CONTACT ANGLE ON A HOMOGENEOUS SUBSTRATE", JOURNAL OF FLUID MECHANICS, CAMBRIDGE UNIVERSITY PRESS, CAMBRIDGE, GB, vol. 477, 25 February 2003 (2003-02-25), pages 175 - 200, XP008041681, ISSN: 0022-1120 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10927214B2 (en) | 2017-04-04 | 2021-02-23 | Qatar Foundation For Education, Science And Community Development | Method of making a pyrrolo bisthiazole homopolymer |
Also Published As
Publication number | Publication date |
---|---|
EP1789205B1 (en) | 2010-04-07 |
JP2008510597A (en) | 2008-04-10 |
US20070286943A1 (en) | 2007-12-13 |
GB0416434D0 (en) | 2004-08-25 |
EP1789205A1 (en) | 2007-05-30 |
DE602005020468D1 (en) | 2010-05-20 |
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