WO2005121681A3 - Counter flow micro heat exchanger for optimal performance - Google Patents

Counter flow micro heat exchanger for optimal performance Download PDF

Info

Publication number
WO2005121681A3
WO2005121681A3 PCT/US2005/016875 US2005016875W WO2005121681A3 WO 2005121681 A3 WO2005121681 A3 WO 2005121681A3 US 2005016875 W US2005016875 W US 2005016875W WO 2005121681 A3 WO2005121681 A3 WO 2005121681A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat exchanger
micro heat
integrated circuit
directional
counter flow
Prior art date
Application number
PCT/US2005/016875
Other languages
French (fr)
Other versions
WO2005121681B1 (en
WO2005121681A2 (en
Inventor
Mark Munch
Girish Upadhya
Original Assignee
Cooligy Inc
Mark Munch
Girish Upadhya
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooligy Inc, Mark Munch, Girish Upadhya filed Critical Cooligy Inc
Priority to DE112005001322T priority Critical patent/DE112005001322T5/en
Priority to JP2007515163A priority patent/JP2008502137A/en
Publication of WO2005121681A2 publication Critical patent/WO2005121681A2/en
Publication of WO2005121681A3 publication Critical patent/WO2005121681A3/en
Publication of WO2005121681B1 publication Critical patent/WO2005121681B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

A micro heat exchanger and an integrated circuit are oriented according to a counter flow orientation. To determine this orientation, a temperature gradient of the integrated circuit is determined. The temperature gradient is used to determine a temperature vector that preferably indicates a directional orientation from a hot portion of the integrated circuit to a cold portion. The micro heat exchanger circulates a cooling fluid to receive heat transferred from the integrated circuit. A directional flow of this cooling liquid is determined. The directional flow is measured as a directional vector from an inlet of the micro heat exchanger to an outlet. The counter flow orientation is defined as the temperature vector oriented opposite that of the directional flow.
PCT/US2005/016875 2004-06-04 2005-05-12 Counter flow micro heat exchanger for optimal performance WO2005121681A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE112005001322T DE112005001322T5 (en) 2004-06-04 2005-05-12 Countercurrent micro heat exchanger with optimum effectiveness
JP2007515163A JP2008502137A (en) 2004-06-04 2005-05-12 Cooling method and assembly

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US57726204P 2004-06-04 2004-06-04
US60/577,262 2004-06-04
US10/950,330 2004-09-23
US10/950,330 US20050269691A1 (en) 2004-06-04 2004-09-23 Counter flow micro heat exchanger for optimal performance

Publications (3)

Publication Number Publication Date
WO2005121681A2 WO2005121681A2 (en) 2005-12-22
WO2005121681A3 true WO2005121681A3 (en) 2008-06-05
WO2005121681B1 WO2005121681B1 (en) 2008-07-31

Family

ID=35446781

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/016875 WO2005121681A2 (en) 2004-06-04 2005-05-12 Counter flow micro heat exchanger for optimal performance

Country Status (5)

Country Link
US (1) US20050269691A1 (en)
JP (1) JP2008502137A (en)
DE (1) DE112005001322T5 (en)
TW (1) TW200541444A (en)
WO (1) WO2005121681A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8986303B2 (en) 2010-11-09 2015-03-24 Biosense Webster, Inc. Catheter with liquid-cooled control handle
WO2013147240A1 (en) * 2012-03-30 2013-10-03 京セラ株式会社 Flow path member, and heat exchanger and semiconductor device using same
JP6439326B2 (en) 2014-08-29 2018-12-19 株式会社Ihi Reactor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6351384B1 (en) * 1999-08-11 2002-02-26 Hitachi, Ltd. Device and method for cooling multi-chip modules
US6397932B1 (en) * 2000-12-11 2002-06-04 Douglas P. Calaman Liquid-cooled heat sink with thermal jacket
US20040112585A1 (en) * 2002-11-01 2004-06-17 Cooligy Inc. Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device

Family Cites Families (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US656266A (en) * 1899-07-10 1900-08-21 Harry F Roach System of electrical distribution.
US3524497A (en) * 1968-04-04 1970-08-18 Ibm Heat transfer in a liquid cooling system
US3904262A (en) * 1974-09-27 1975-09-09 John M Cutchaw Connector for leadless integrated circuit packages
US3993123A (en) * 1975-10-28 1976-11-23 International Business Machines Corporation Gas encapsulated cooling module
JPS52117074A (en) * 1976-03-27 1977-10-01 Nippon Intaanashiyonaru Seiriy Cooling circuit for semiconductor device
US4296455A (en) * 1979-11-23 1981-10-20 International Business Machines Corporation Slotted heat sinks for high powered air cooled modules
US4332291A (en) * 1979-12-21 1982-06-01 D. Mulock-Bentley And Associates (Proprietary) Limited Heat exchanger with slotted fin strips
US4474172A (en) * 1982-10-25 1984-10-02 Chevron Research Company Solar water heating panel
FR2538617B1 (en) * 1982-12-28 1986-02-28 Thomson Csf ENCAPSULATION BOX FOR POWER SEMICONDUCTOR WITH IMPROVED INPUT-OUTPUT ISOLATION
US4568431A (en) * 1984-11-13 1986-02-04 Olin Corporation Process for producing electroplated and/or treated metal foil
JPH02213910A (en) * 1989-02-15 1990-08-27 Toshiba Corp Temperature gradient compensating device
US4987996A (en) * 1990-03-15 1991-01-29 Atco Rubber Products, Inc. Flexible duct and carton
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
US5105430A (en) * 1991-04-09 1992-04-14 The United States Of America As Represented By The United States Department Of Energy Thin planar package for cooling an array of edge-emitting laser diodes
US5199487A (en) * 1991-05-31 1993-04-06 Hughes Aircraft Company Electroformed high efficiency heat exchanger and method for making
FR2679729B1 (en) * 1991-07-23 1994-04-29 Alcatel Telspace HEATSINK.
US5239200A (en) * 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
EP0560259B1 (en) * 1992-03-09 1996-10-30 Sumitomo Metal Industries, Ltd. Heat sink having good heat dissipating characteristics and process for producing the same
US5247800A (en) * 1992-06-03 1993-09-28 General Electric Company Thermal connector with an embossed contact for a cryogenic apparatus
US5275237A (en) * 1992-06-12 1994-01-04 Micron Technology, Inc. Liquid filled hot plate for precise temperature control
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US5520244A (en) * 1992-12-16 1996-05-28 Sdl, Inc. Micropost waste heat removal system
KR100353020B1 (en) * 1993-12-28 2003-01-10 쇼와 덴코 가부시키가이샤 Multilayer Heat Exchanger
US5424918A (en) * 1994-03-31 1995-06-13 Hewlett-Packard Company Universal hybrid mounting system
JPH07312495A (en) * 1994-05-17 1995-11-28 Hitachi Ltd Cooler for semiconductor
US5811062A (en) * 1994-07-29 1998-09-22 Battelle Memorial Institute Microcomponent chemical process sheet architecture
US5526875A (en) * 1994-10-14 1996-06-18 Lin; Shih-Jen Cooling device for CPU
JP3355824B2 (en) * 1994-11-04 2002-12-09 株式会社デンソー Corrugated fin heat exchanger
DE19514548C1 (en) * 1995-04-20 1996-10-02 Daimler Benz Ag Method of manufacturing a micro cooler
US5761037A (en) * 1996-02-12 1998-06-02 International Business Machines Corporation Orientation independent evaporator
JP3506166B2 (en) * 1996-04-15 2004-03-15 株式会社デンソー Cooling system
US5927390A (en) * 1996-12-13 1999-07-27 Caterpillar Inc. Radiator arrangement with offset modular cores
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US6049040A (en) * 1997-09-17 2000-04-11 Biles; Scott Douglas Universal cable guide
US5909057A (en) * 1997-09-23 1999-06-01 Lsi Logic Corporation Integrated heat spreader/stiffener with apertures for semiconductor package
US5893726A (en) * 1997-12-15 1999-04-13 Micron Technology, Inc. Semiconductor package with pre-fabricated cover and method of fabrication
US6084178A (en) * 1998-02-27 2000-07-04 Hewlett-Packard Company Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
JPH11325764A (en) * 1998-05-08 1999-11-26 Fujikura Ltd Cooling device for electron element
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
US6086330A (en) * 1998-12-21 2000-07-11 Motorola, Inc. Low-noise, high-performance fan
US6675875B1 (en) * 1999-08-06 2004-01-13 The Ohio State University Multi-layered micro-channel heat sink, devices and systems incorporating same
US6729383B1 (en) * 1999-12-16 2004-05-04 The United States Of America As Represented By The Secretary Of The Navy Fluid-cooled heat sink with turbulence-enhancing support pins
JP2001185306A (en) * 1999-12-28 2001-07-06 Jst Mfg Co Ltd Connector for module
US6570764B2 (en) * 1999-12-29 2003-05-27 Intel Corporation Low thermal resistance interface for attachment of thermal materials to a processor die
US6407916B1 (en) * 2000-06-12 2002-06-18 Intel Corporation Computer assembly for cooling high powered microprocessors
US6787052B1 (en) * 2000-06-19 2004-09-07 Vladimir Vaganov Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers
US6366462B1 (en) * 2000-07-18 2002-04-02 International Business Machines Corporation Electronic module with integral refrigerant evaporator assembly and control system therefore
US6469893B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Direct heatpipe attachment to die using center point loading
US6578626B1 (en) * 2000-11-21 2003-06-17 Thermal Corp. Liquid cooled heat exchanger with enhanced flow
JP3607608B2 (en) * 2000-12-19 2005-01-05 株式会社日立製作所 Liquid cooling system for notebook computers
US6459581B1 (en) * 2000-12-19 2002-10-01 Harris Corporation Electronic device using evaporative micro-cooling and associated methods
US6698924B2 (en) * 2000-12-21 2004-03-02 Tank, Inc. Cooling system comprising a circular venturi
US6484521B2 (en) * 2001-02-22 2002-11-26 Hewlett-Packard Company Spray cooling with local control of nozzles
US6449162B1 (en) * 2001-06-07 2002-09-10 International Business Machines Corporation Removable land grid array cooling solution
WO2002102124A2 (en) * 2001-06-12 2002-12-19 Liebert Corporation Single or dual buss thermal transfer system
US6536510B2 (en) * 2001-07-10 2003-03-25 Thermal Corp. Thermal bus for cabinets housing high power electronics equipment
US6385044B1 (en) * 2001-07-27 2002-05-07 International Business Machines Corporation Heat pipe heat sink assembly for cooling semiconductor chips
JP3636118B2 (en) * 2001-09-04 2005-04-06 株式会社日立製作所 Water cooling device for electronic equipment
US6942018B2 (en) * 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
US6581388B2 (en) * 2001-11-27 2003-06-24 Sun Microsystems, Inc. Active temperature gradient reducer
US6527835B1 (en) * 2001-12-21 2003-03-04 Sandia Corporation Chemical preconcentrator with integral thermal flow sensor
US6700785B2 (en) * 2002-01-04 2004-03-02 Intel Corporation Computer system which locks a server unit subassembly in a selected position in a support frame
US6787899B2 (en) * 2002-03-12 2004-09-07 Intel Corporation Electronic assemblies with solidified thixotropic thermal interface material
US7209355B2 (en) * 2002-05-15 2007-04-24 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
TWI234063B (en) * 2002-05-15 2005-06-11 Matsushita Electric Ind Co Ltd Cooling apparatus for electronic equipment
US6674642B1 (en) * 2002-06-27 2004-01-06 International Business Machines Corporation Liquid-to-air cooling system for portable electronic and computer devices
US20040008483A1 (en) * 2002-07-13 2004-01-15 Kioan Cheon Water cooling type cooling system for electronic device
CA2496520C (en) * 2002-08-28 2012-01-17 Federal-Mogul Powertrain, Inc. Cable guide sleeving structure
TW578992U (en) * 2002-09-09 2004-03-01 Hon Hai Prec Ind Co Ltd Heat sink assembly
DE10243026B3 (en) * 2002-09-13 2004-06-03 Oliver Laing Device for local cooling or heating of an object
US6894899B2 (en) * 2002-09-13 2005-05-17 Hong Kong Cheung Tat Electrical Co. Ltd. Integrated fluid cooling system for electronic components
US6807056B2 (en) * 2002-09-24 2004-10-19 Hitachi, Ltd. Electronic equipment
DE10246990A1 (en) * 2002-10-02 2004-04-22 Atotech Deutschland Gmbh Microstructure cooler and its use
US6986382B2 (en) * 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
AU2003286821A1 (en) * 2002-11-01 2004-06-07 Cooligy, Inc. Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange
US7000684B2 (en) * 2002-11-01 2006-02-21 Cooligy, Inc. Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US7210227B2 (en) * 2002-11-26 2007-05-01 Intel Corporation Decreasing thermal contact resistance at a material interface
KR20040065626A (en) * 2003-01-15 2004-07-23 엘지전자 주식회사 Heat exchanger
US6903929B2 (en) * 2003-03-31 2005-06-07 Intel Corporation Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink
US6934154B2 (en) * 2003-03-31 2005-08-23 Intel Corporation Micro-channel heat exchangers and spreaders
US6992891B2 (en) * 2003-04-02 2006-01-31 Intel Corporation Metal ball attachment of heat dissipation devices
US6763880B1 (en) * 2003-06-26 2004-07-20 Evserv Tech Corporation Liquid cooled radiation module for servers
JP4561632B2 (en) * 2003-06-27 2010-10-13 日本電気株式会社 Electronic equipment cooling device
US7508672B2 (en) * 2003-09-10 2009-03-24 Qnx Cooling Systems Inc. Cooling system
TWM248227U (en) * 2003-10-17 2004-10-21 Hon Hai Prec Ind Co Ltd Liquid cooling apparatus
US7273088B2 (en) * 2003-12-17 2007-09-25 Hewlett-Packard Development Company, L.P. One or more heat exchanger components in major part operably locatable outside computer chassis
US6980435B2 (en) * 2004-01-28 2005-12-27 Hewlett-Packard Development Company, L.P. Modular electronic enclosure with cooling design
US6955212B1 (en) * 2004-04-20 2005-10-18 Adda Corporation Water-cooler radiator module
JP4056504B2 (en) * 2004-08-18 2008-03-05 Ｎｅｃディスプレイソリューションズ株式会社 COOLING DEVICE AND ELECTRONIC DEVICE HAVING THE SAME
US7239516B2 (en) * 2004-09-10 2007-07-03 International Business Machines Corporation Flexure plate for maintaining contact between a cooling plate/heat sink and a microchip
US20060067052A1 (en) * 2004-09-30 2006-03-30 Llapitan David J Liquid cooling system
US7243704B2 (en) * 2004-11-18 2007-07-17 Delta Design, Inc. Mechanical assembly for regulating the temperature of an electronic device, having a spring with one slideable end
US7184269B2 (en) * 2004-12-09 2007-02-27 International Business Machines Company Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly
US7327570B2 (en) * 2004-12-22 2008-02-05 Hewlett-Packard Development Company, L.P. Fluid cooled integrated circuit module
US7280363B2 (en) * 2005-01-21 2007-10-09 Delphi Technologies, Inc. Apparatus for controlling thermal interface between cold plate and integrated circuit chip
US7254957B2 (en) * 2005-02-15 2007-08-14 Raytheon Company Method and apparatus for cooling with coolant at a subambient pressure
US20060187639A1 (en) * 2005-02-23 2006-08-24 Lytron, Inc. Electronic component cooling and interface system
US7719837B2 (en) * 2005-08-22 2010-05-18 Shan Ping Wu Method and apparatus for cooling a blade server
US20080013283A1 (en) * 2006-07-17 2008-01-17 Gilbert Gary L Mechanism for cooling electronic components

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6351384B1 (en) * 1999-08-11 2002-02-26 Hitachi, Ltd. Device and method for cooling multi-chip modules
US6397932B1 (en) * 2000-12-11 2002-06-04 Douglas P. Calaman Liquid-cooled heat sink with thermal jacket
US20040112585A1 (en) * 2002-11-01 2004-06-17 Cooligy Inc. Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device

Also Published As

Publication number Publication date
TW200541444A (en) 2005-12-16
JP2008502137A (en) 2008-01-24
US20050269691A1 (en) 2005-12-08
DE112005001322T5 (en) 2007-04-26
WO2005121681B1 (en) 2008-07-31
WO2005121681A2 (en) 2005-12-22

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