WO2005087497A3 - 3d-inkjet-strukturierung von hochtopografischen oberflächen - Google Patents

3d-inkjet-strukturierung von hochtopografischen oberflächen Download PDF

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Publication number
WO2005087497A3
WO2005087497A3 PCT/EP2005/051053 EP2005051053W WO2005087497A3 WO 2005087497 A3 WO2005087497 A3 WO 2005087497A3 EP 2005051053 W EP2005051053 W EP 2005051053W WO 2005087497 A3 WO2005087497 A3 WO 2005087497A3
Authority
WO
WIPO (PCT)
Prior art keywords
ink jet
highly topographic
topographic surfaces
structuring
highly
Prior art date
Application number
PCT/EP2005/051053
Other languages
English (en)
French (fr)
Other versions
WO2005087497A2 (de
Inventor
Michael Kasper
Matthias Rebhan
Karl Weidner
Robert Weinke
Original Assignee
Siemens Ag
Michael Kasper
Matthias Rebhan
Karl Weidner
Robert Weinke
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Michael Kasper, Matthias Rebhan, Karl Weidner, Robert Weinke filed Critical Siemens Ag
Publication of WO2005087497A2 publication Critical patent/WO2005087497A2/de
Publication of WO2005087497A3 publication Critical patent/WO2005087497A3/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
    • B41F17/24—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on flat surfaces of polyhedral articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/221—Changing the shape of the active layer in the devices, e.g. patterning by lift-off techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ink Jet (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

Die hochtopografische Oberfläche (2) eines elektronischen Bauteils (1) wird in einem Tintenstrahl-Druckverfahren mit einer Schicht (8) versehen. Dabei werden einige Bereiche (10) verstärkt bedruckt.
PCT/EP2005/051053 2004-03-12 2005-03-09 3d-inkjet-strukturierung von hochtopografischen oberflächen WO2005087497A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004012251.2 2004-03-12
DE102004012251 2004-03-12

Publications (2)

Publication Number Publication Date
WO2005087497A2 WO2005087497A2 (de) 2005-09-22
WO2005087497A3 true WO2005087497A3 (de) 2006-05-04

Family

ID=34976287

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/051053 WO2005087497A2 (de) 2004-03-12 2005-03-09 3d-inkjet-strukturierung von hochtopografischen oberflächen

Country Status (1)

Country Link
WO (1) WO2005087497A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9059083B2 (en) 2007-09-14 2015-06-16 Infineon Technologies Ag Semiconductor device
DE102009045948A1 (de) 2009-10-23 2011-04-28 Robert Bosch Gmbh Verfahren zur Herstellung eines elektrischen oder elektronischen Bauteils und hieraus erhältliches Bauteil

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3047884A1 (de) * 1980-12-18 1982-07-15 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur automatisierbaren bearbeitung in der halbleitertechnologie, z.b. von leiterplatten
DE3107079A1 (de) * 1981-02-25 1982-09-09 Siemens AG, 1000 Berlin und 8000 München Partielle beschichtung von kontaktbauteilen mit edelmetallen
WO1986001747A1 (en) * 1984-09-19 1986-03-27 Robert Bosch Gmbh Method for applying solid suspensions capable of being fired on ceramic or glass substrates, and device for implementing such method
DE3804483A1 (de) * 1987-02-16 1988-08-25 Crouzet Sa Druckmesswertaufnehmer mit piezomessstreifen
WO2001003183A2 (de) * 1999-07-06 2001-01-11 Ekra Eduard Kraft Gmbh Verfahren zum aufbringen von verbindungsmaterialien für eine verbindung zwischen einem mikrochip und einem substrat sowie verwendung eines nach dem tintendruckprinzip arbeitenden druckkopfes

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3047884A1 (de) * 1980-12-18 1982-07-15 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur automatisierbaren bearbeitung in der halbleitertechnologie, z.b. von leiterplatten
DE3107079A1 (de) * 1981-02-25 1982-09-09 Siemens AG, 1000 Berlin und 8000 München Partielle beschichtung von kontaktbauteilen mit edelmetallen
WO1986001747A1 (en) * 1984-09-19 1986-03-27 Robert Bosch Gmbh Method for applying solid suspensions capable of being fired on ceramic or glass substrates, and device for implementing such method
DE3804483A1 (de) * 1987-02-16 1988-08-25 Crouzet Sa Druckmesswertaufnehmer mit piezomessstreifen
WO2001003183A2 (de) * 1999-07-06 2001-01-11 Ekra Eduard Kraft Gmbh Verfahren zum aufbringen von verbindungsmaterialien für eine verbindung zwischen einem mikrochip und einem substrat sowie verwendung eines nach dem tintendruckprinzip arbeitenden druckkopfes

Also Published As

Publication number Publication date
WO2005087497A2 (de) 2005-09-22

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