WO2005086615A3 - Integrated cryogenic receiver front-end - Google Patents

Integrated cryogenic receiver front-end Download PDF

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Publication number
WO2005086615A3
WO2005086615A3 PCT/US2004/029391 US2004029391W WO2005086615A3 WO 2005086615 A3 WO2005086615 A3 WO 2005086615A3 US 2004029391 W US2004029391 W US 2004029391W WO 2005086615 A3 WO2005086615 A3 WO 2005086615A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
receiver front
rejector
heat sink
cryogenic receiver
Prior art date
Application number
PCT/US2004/029391
Other languages
French (fr)
Other versions
WO2005086615A2 (en
Inventor
Amr Hassan O'baid
Brent James Swartzentruber
Original Assignee
Superconductor Tech
Amr Hassan O'baid
Brent James Swartzentruber
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Superconductor Tech, Amr Hassan O'baid, Brent James Swartzentruber filed Critical Superconductor Tech
Publication of WO2005086615A2 publication Critical patent/WO2005086615A2/en
Publication of WO2005086615A3 publication Critical patent/WO2005086615A3/en

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/06Receivers
    • H04B1/16Circuits
    • H04B1/18Input circuits, e.g. for coupling to an antenna or a transmission line
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/006Thermal coupling structure or interface
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B23/00Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
    • F25B23/006Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02Transmitters
    • H04B1/03Constructional details, e.g. casings, housings
    • H04B1/036Cooling arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A cryogenic receiver front-end includes a heat sink having a mounting surface and a plurality of fins, a cryocooler mounted to the mounting surface of the heat sink, a heat rejector surrounding the cryocooler, the heat rejector including a plurality of pliable c-shaped recesses therein, and a plurality of heat pipes. Each heat pipe has first and second ends, the first ends of the plurality of heat pipes are disposed in respective c-shaped recesses of the heat rejector. A working fluid is contained inside the heat pipes. The second ends of the plurality of heat pipes are thermally coupled to the heat sink. A weather resistant enclosure unit is mounted to the heat sink and encloses the components of the cryogenic receiver front-end.
PCT/US2004/029391 2003-09-17 2004-09-09 Integrated cryogenic receiver front-end WO2005086615A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/666,634 2003-09-17
US10/666,634 US20050056036A1 (en) 2003-09-17 2003-09-17 Integrated cryogenic receiver front-end

Publications (2)

Publication Number Publication Date
WO2005086615A2 WO2005086615A2 (en) 2005-09-22
WO2005086615A3 true WO2005086615A3 (en) 2006-03-02

Family

ID=34274724

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/029391 WO2005086615A2 (en) 2003-09-17 2004-09-09 Integrated cryogenic receiver front-end

Country Status (2)

Country Link
US (1) US20050056036A1 (en)
WO (1) WO2005086615A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7395091B2 (en) * 2004-03-19 2008-07-01 Superconductor Technologies, Inc. Systems and methods for receiver upgrade
US8607560B2 (en) * 2008-02-28 2013-12-17 Superconductor Technologies, Inc. Method for centering reciprocating bodies and structures manufactured therewith
BRPI0924849B1 (en) 2009-06-17 2019-12-31 Huawei Tech Co Ltd heat dissipation device and radio frequency module with the same
CN109041521A (en) * 2012-05-03 2018-12-18 爱立信(中国)通信有限公司 Method and apparatus for cooling down telecommunication apparatus
KR101805075B1 (en) * 2013-04-24 2017-12-05 지멘스 헬스케어 리미티드 An assembly comprising a two-stage cryogenic refrigerator and associated mounting arrangement
CN103607867A (en) * 2013-11-11 2014-02-26 成都市晶林电子技术有限公司 Vehicle-mounted heat dissipation mechanism for wireless transmitter

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4963833A (en) * 1989-06-12 1990-10-16 Motorola, Inc. High powered amplifier and heat sinking apparatus
US6263215B1 (en) * 1995-08-09 2001-07-17 Superconducting Core Technologies, Inc. Cryoelectronically cooled receiver front end for mobile radio systems
US5842514A (en) * 1997-03-05 1998-12-01 Northern Telecom Limited Electronic unit
US6112526A (en) * 1998-12-21 2000-09-05 Superconductor Technologies, Inc. Tower mountable cryocooler and HTSC filter system
US6311498B1 (en) * 1998-12-21 2001-11-06 Superconductor Technologies, Inc. Tower mountable cyrocooler and HTSC filter system
US6310772B1 (en) * 1999-09-02 2001-10-30 Special Product Company Enclosure for telecommunications equipment

Also Published As

Publication number Publication date
US20050056036A1 (en) 2005-03-17
WO2005086615A2 (en) 2005-09-22

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