WO2005085974A1

WO2005085974A1 - Information processing device

Info

Publication number: WO2005085974A1
Application number: PCT/JP2004/002762
Authority: WO
Inventors: Tomohiro Nakamura
Original assignee: Hitachi, Ltd.
Priority date: 2004-03-04
Filing date: 2004-03-04
Publication date: 2005-09-15

Abstract

Information processing device boxes (9) are installed on a floor surface (5) in juxtaposed relation to wiring/ piping boxes (14), etc. The upper surfaces of the information processing device boxes (9), wiring/piping box (14), etc. are made of a material usable as a floor panel. These upper surfaces with them arranged thereon are utilized as a floor surface (15) after the installation of the information processing device. This makes it possible to lighten load-bearing capacity restriction per unit floor area, to save exclusive space for installation of the information processing system, and to make effective use of the installation space.

Description

Description Information processing equipment Technical field

The present invention relates to an installation technology in an information processing device, and more particularly to a technology that is effective when applied to reduce costs in system construction of a large-scale information processing device. Background art

Information processing devices, such as server storage and network switches, usually have a rectangular shape and a table-top or tower-type housing structure. In the past, information processing devices of this shape were often used individually and distributed in many cases. In the case of a large-scale information processing device, a dedicated installation location was prepared and large-sized housings were arranged. Having a special structure according to each case.

However, recently, in order to facilitate the scale expansion according to the processing demand, information processing devices having a standardized rectangular housing structure called a rack mount type have been increasing.

Normally, a rack-mounted information processing device is constructed by inserting the required number of rack-mounted information processing devices into a frame called a rack.

Racks are often placed on the floor, and have a structure that can provide a mechanism to support a rack-mounted information processing device in units of about 4.5 centimeters, usually called 1 U, Some racks are about 2 meters high.

Due to recent improvements in network technology, systems that connect multiple information processing devices via a network have been widely used. The information processing device connected via the network can be operated from a remote location, and the user can use his or her desk. It has become common to use information processing devices located elsewhere. In addition, there is a business form in which a large number of information processing devices are collectively held and their processing capabilities are sold.

In such a system construction, it is common practice to prepare a dedicated room (machine room) for the installation of the green information processor, especially for large systems.

The machine room is often equipped with an air conditioning system for cooling the power of the information processing equipment and the heat released from it, and has a space under the floor for wiring between the information processing equipments. When constructing the system, it is necessary to arrange the air-conditioning and equipment in consideration of the air flow in the machine room, and it is necessary to arrange the equipment so that wiring under the floor can be performed efficiently.

In addition to the method of cooling the information processing device by taking in air from the front of the case and discharging it from the back, and taking air from the bottom of the case and discharging it from the top, cooling liquid is circulated inside the case. There is a way to cool. Cooling air is blown up from under the floor from the flow of heat, especially in machine rooms that store large-scale systems.

Underfloor wiring is widely used, although it takes a lot of time to pull the wiring, but it can eliminate the danger of stumbling and improve the appearance of the machine room. However, studies on the use of wireless communication are being conducted due to the problem of maintainability.

As the mounting density of information processing equipment has been increasing, the weight of large information processing equipment with a tower-type or rack-mount type housing structure has increased, and the floor load capacity of the installation location has become a problem. For this reason, countermeasures such as strengthening the load bearing capacity of the floor surface and using a steel plate to disperse the load are being considered.

As described above, the conventional information processing device housing structure and installation method require a dedicated machine room when constructing a large-scale system, and study cooling efficiency, layout and wiring, and floor space. It is necessary to determine the configuration in consideration of various factors such as load consideration. In particular, the problem of floor load resistance due to the increase in mounting density and the problem of the cost of securing a dedicated machine room have become major problems. In addition, man-hours during system construction are also problems such as underfloor wiring and equipment layout taking into account the combination of various information processing devices.

Japanese Patent Application Laid-Open No. 05-011883 discloses a method in which an electronic device is installed under the floor of a free access, and a switch or the like that requires user operation is set on a desktop. Although this method is effective for small electronic devices, it is not suitable for large systems in terms of installation efficiency. Information processing equipment, such as computer servers, storage, and network switches, are becoming indispensable facilities in offices, and their scale is expanding as the number of information processing dogs is increased. In addition, businesses that collect information processing equipment as represented by data centers and sell the processing capacity have come to be seen.

When constructing such an information processing system, a dedicated machine room is often prepared as an installation location. It is necessary to determine the configuration in consideration of various factors, such as studying countermeasures against the increase in floor load requirements due to the increased density.

In particular, the problem of floor load resistance due to the increase in mounting density and the problem of the cost of securing a dedicated machine room have become major problems. In addition, the man-hours required to build information processing systems, such as underfloor wiring and equipment layout, are increasing with the increase in scale.

It is an object of the present invention to provide a technology that significantly reduces costs related to the construction and operation of an information processing system by installing the entire information processing system on a floor where the load is distributed over a large floor area. .

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings. Disclosure of the invention

The following is a brief description of an outline of typical inventions disclosed in the present application.

The information processing apparatus of the present invention includes a housing having a housing structure whose upper surface can be used as a floor.

An outline of another invention of the present application will be briefly described.

In the present invention, a floor is constituted by arranging a plurality of the housings on a floor surface.

Further, according to the present invention, the housing includes at least one of an electrical wiring, an optical wiring, and a cooling pipe for connecting the housings.

Further, the present invention has a device for creating a flow of air between a pair of opposed side surfaces of the housing, an electronic circuit board is installed on a bottom surface inside the housing, and an auxiliary electronic circuit board is mounted on an electronic device on the bottom surface. It is provided perpendicular to the circuit board and parallel to the air flow.

Further, the present invention has a dustproof structure for preventing dust from entering from above the housing.

Further, the present invention has a configuration in which the casings are provided with a wiring connecting part for coupling wiring between the casings, and are independent of vibration of the casing connected to the wiring connecting part. is there.

Further, according to the present invention, the housing has a dustproof structure for preventing dust from entering from a boundary portion between the housings.

Further, according to the present invention, a plurality of routes are prepared for a plurality of information processing devices, and one or more routes exist even when some of the information processing devices are lost.

Further, the present invention includes a communication path for transmitting the commands and a control device for executing the commands, wherein the internal configuration of the plurality of information processing devices can be changed by an external command.

Furthermore, the present invention provides the electric wiring, the optical wiring, or the cooling wiring. The connecting portion for coupling between any one or more of the tubes has a configuration independent of the vibration of the housing.

Further, according to the present invention, at least one of the electric wiring, the optical wiring, and the cooling pipe has a dust-proof structure for preventing dust from entering. As described above, by arranging the housings of the information processing devices side by side on the floor, it is possible to easily establish the wiring such as the communication path and the power supply between the adjacent information processing devices and the wiring between the information processing devices. Related man-hours can be reduced.

In addition, for cooling systems that are important in the construction of information processing systems, cooling piping such as air conditioning and cooling fluid is provided in the information processing system housing, and the information processing equipment housings are arranged side by side on the floor. A cooling system can be easily constructed.

Furthermore, for the wiring of the communication path and the piping of the cooling system, not only the housing of the information processing equipment but also the housing for connecting the communication path to the power supply and cooling pipe between them is prepared. It is possible to build the entire system.

In addition, by configuring the information processing system using the information processing device, it is possible to use the information processing system for a long time without replacement from the viewpoint of maintenance and improvement. Brief Description of Drawings

FIG. 1 is a diagram showing an information processing system according to a housing structure and an installation method of an information processing device according to an embodiment of the present invention. FIG. FIG. 3 is a diagram showing an installation method of the information processing system of FIG. 2, and FIG. 4 is a diagram showing an example of an installation method of the information processing system according to an embodiment of the present invention. FIG. 5 is a diagram illustrating details of an example of a housing structure of the information processing apparatus according to an embodiment of the present invention. FIG. 6 is a diagram illustrating a connection between baskets of the information processing apparatus according to an embodiment of the present invention. FIG. 7 is a diagram showing an example of a method and an installation method in detail. It is a figure showing an example of a redundant configuration of connection. BEST MODE FOR CARRYING OUT THE INVENTION

The present invention will be described in detail with reference to the accompanying drawings. In all the drawings for explaining the embodiments, parts having identical functions are given same symbols and their repeated explanation is omitted.

FIG. 1 shows an embodiment of a housing structure of an information processing apparatus and a method of installing the same in the present embodiment. As shown in the figure, the information processing device housing 9 is installed on the floor surface 5 and is arranged side by side with the wiring and the piping housing 14.

The upper surfaces of the information processing device housing 9 and the wiring and piping housings 14 are made of a material that can be used as floor panels, and the upper surface where these are arranged is used as the floor surface 15 after installing the information processing device. .

Hereinafter, the present embodiment and its effects will be described in detail after showing the housing structure and installation method of a typical information processing device studied by the present inventors. The information processing device in the present embodiment is a computer server, a storage, a network switch, and the like.If the typical housing structure of these devices is a large-scale device, it is shown in FIG. 2 examined by the present inventors. However, it is often a tower type enclosure 1 or a rack mount type enclosure 2.

In the case of the tower-type housing 1, when replacing or adjusting the internal equipment, open the doors and lids of the housing and work. The tower-type housing 1 has a bottom area of about 1 to 2 square meters and a height of about 1 to 2 meters in many cases. Due to the increasing density of information processing equipment, there are some tower-type computers that weigh more than 1 ton.

The rack mount type housing 2 has a structure capable of providing a mechanism for supporting the rack mount type information processing device 3 in a unit of thickness of about 4.5 cm, usually called 1 U. The volume and weight of the rack-mount type enclosure 2 are almost the same as those of the tower type enclosure 1.

When replacing or adjusting the internal equipment, pull out the rack-mount type information processing device 3 and perform the work. Rack-mountable enclosure 2 Since information processing devices 3 having a standardized size can be easily installed, not only computers but also various information processing devices such as network devices are manufactured in a rack-mount type.

FIG. 3 is a diagram showing a typical installation method of a large-scale information processing system using the turn-type housing 1 and the rack-type housing 2 examined by the present inventors.

In FIG. 3, a free-access floor panel 4 is placed on a floor surface 5, and a tower-type housing 1 and a rack-mount-type housing 2 are installed thereon. The wiring between these enclosures is laid in the space between the free access door panel 4 and the floor 5, and there is almost no wiring on the floor panel.

Cooling of the information processing device in the tower type enclosure 1 and the rack mount type enclosure 2 is performed by sending cooled air from the air conditioner 8 into the space below the floor panel 4 and blowing out from the outlet 7 provided in the floor panel 4. This is done by the information processing device inhaling this cooled air. The outlet 7 is often provided beside or directly below the information processing device, and the exhaust is performed in the room. In particular, in the case of a large-scale information processing system, it is necessary to arrange the information processing apparatus and install the outlet 7 in consideration of the air flow in the entire room.

As shown in Fig. 1, the tower-type enclosure 1 and rack-mount enclosure 2 are installed with a sufficient space between them to open and close the doors and to insert and remove the rack-mount-type incense treatment equipment 3. There is a need to.

In addition, it may be necessary to install them at intervals due to the limitation of the load capacity of the front panel 4 and the floor 5. In particular, when installing a heavy-weight tower-type housing 1 マウント rack-mounting-type housing 2, to disperse the load, place it under the tower-type housing 1 or the rack-mounting-type housing 2 below its bottom area. Sometimes a large iron plate, etc. is laid on top of it.

Normally, the information processing system shown in Fig. 3 is set up with a dedicated space, so in an office building or the like, it costs much to secure one span as a dedicated machine room. As shown in Fig. 3, this space is equipped with a tower-type casing 1 and a rack-mounting casing 2 and has a cooled air outlet 7, so this space can be used for other purposes. It is difficult to utilize.

In addition, to lay the wiring 6 between the information processing devices in the tower-type housing 1 and the rack-mount-type housing 2, it is necessary to work under the floor panel 4. In addition, in order to perform replacement or maintenance after laying the wiring 6, it is necessary to open the floor panel 4 and then perform confirmation work, which is not easy.

In the present invention, the information processing apparatus housing structure and installation method are performed as shown in FIG. 1 so that the load-bearing capacity per floor area can be reduced as compared with the tower type housing 1 and the rack mount type housing 2 studied by the present invention. Reduce restrictions, reduce the dedicated installation space for installing the information processing system, and make effective use of the installation space. In addition, it can be installed on floors such as corridors and activities.

In addition, the present invention provides a housing structure that can reduce the man-hours required for arrangement and wiring when building an information processing system, and a structure that enables maintenance and improvement without replacing the information processing system for a long time. This is realized by a method of constructing an information processing system.

In FIG. 1, an information processing device housing 9 is a housing that houses information processing devices such as a computer server, storage, and a network switch. The information processing device housing 9 is made of a material whose upper surface can be used as a floor panel, and has a beam strength that can be crushed even when a person or an object is placed on the upper portion thereof. By arranging the information processing device housings 9 on the floor surface 5, a new floor surface 15 raised from the floor surface 5 on their upper surfaces is formed. The new floor 15 is equivalent to a floor with tight floor panels, so it can be used as an office.

In order to use the new floor surface 15 as described above, the height of the information processing device housing 9 needs to be uniform and level. Therefore, the information processing device housing 9 is provided with an adjusting leg 13 capable of adjusting the height and the horizontal. Note that the adjusting legs 13 do not necessarily need to be pinched into the information processing device housing 9 and leveled. After being placed on the surface 5, the information processing device housing 9 can be placed on the top.

Normally, information processing devices require power supply and wiring for communication. It is also necessary to cool the heat generated from the information processing device. For this reason, the information processing apparatus housing 9 is provided with a cooling facility 12 that enables external cooling.

Examples of the cooling equipment 12 include a fan that takes in air for cooling from the outside, a pipe that draws liquid for cooling, and a heat conductor that conducts heat generated inside to the outside. FIG. 1 shows an example in which the information processing apparatus housing 9 is air-cooled, and the cooling equipment 12 shows a fan for flowing cooled air into the information processing apparatus housing 9.

Wiring · Piping housing 14 is communication wiring for communication between information processing equipment housing 9 and supplying power to them · Power supply wiring 10 and cooling piping 1 1 for flowing air and coolant for cooling It is a housing with.

Since this housing constitutes a new floor surface 15 by being arranged side by side with the information processing device housing 9, the height is set to be the same as that of the information processing device housing 9. From the viewpoint of securing the degree of freedom of installation of the entire information processing system,

9 and wiring · It is good to make the size of the piping housing 14 equal.

Wiring · Plumbing enclosure 14 has communication wiring and power supply wiring 10 for connecting adjacent enclosures, but a network switch that can adjust and specify the communication path and power supply can also be installed. A control line is also provided to enable this switch from outside.

In the case of air cooling, the cooling pipes 14 flow cooled air or exhaust gas discharged from the information processing apparatus housing 9. In the case of a liquid example, a cooling liquid is supplied. It can also be made of a heat conductor.

Wiring / Piping case 14 constitutes a communication path between the information processing device case 9 and supplies power to the information processing device case 9 only by being installed side by side with the information processing device body 9. The cooling system can be configured.

In Fig. 4, the information processing equipment housing 9 shown in Fig. 1 is shown in more detail according to the application. An example is shown in which an information processing system including a wiring and piping housing 14 is constructed. Here, the wiring / pipe housing 14 is the same as that described in FIG.

The console housing 21 is a housing in which devices for controlling the entire information processing system are stored. In order to see the display for control and to operate switches, Fig. 4 shows the case where the height of the housing is higher than the wiring / pipe housing 14 and the computer housing 22.

The computer housing 22 is a housing for the computer, and usually has wiring and piping housings arranged side by side to supply power.Ensure communication paths with other devices.Cools the inside of the computer housing 22. Do. Figure 4 shows a state in which one computer housing is lifted up. When replacing the computer housing 22, lift it up and out like this.

The air-conditioning housing 19 is a housing for storing equipment for cooling the computer housing 22 and the like through the wiring and piping housing 14. Although the case of cooling by air cooling is shown in FIG. 4, the housing for storing the heat exchange equipment is generally the air-conditioning housing 19.

The equipment for recovering exhaust heat is also one type of the air-conditioning enclosure 19. The air-conditioning enclosure 19 builds a cooling system through wiring and piping enclosures 14. The air-conditioning housing 19 has the same structure as the other housings, so that it can be a housing that forms a new floor surface. Note that the control can be performed by the air-conditioning housing 19, but the control can be concentrated on the console housing 21 or the like. The communication housing 16 is a housing that stores equipment that controls and monitors communication of the entire information processing system and equipment that connects to an external network. Wiring · Control communication between the computer housings 22 through the piping housings 14. If a display device that displays the communication status, a switch for control, or an interface for connection to an external network is provided, the wiring consists of a piping housing 14 and a computer housing 22. In some cases, it is more convenient to have those devices above the floor where the equipment is located.Figure 4 shows the case where the height of the housing is higher than the wiring / piping housing 14 or the computer housing 22. ing. Communication status Display and control are performed by the console housing 21 and so on, and the communication housing 16 is wired.The horizontal floor area is expanded by making it the same as the piping housing 14 and the computer housing 22. It is also possible.

The I / O enclosure 18 is an enclosure that houses a storage device, an extended I / O device, and a rugged interface for connecting external devices. Wiring 'Piping Handles various I / O requests through enclosures 14 etc. If you need to store or remove a hard disk drive that does not normally require operations such as removing and inserting the cable, wiring is required. The area can be expanded. On the other hand, when connecting a tape drive or an external device, it is better to increase the height of the housing to facilitate operation. The power supply housing 17 is a body that stores equipment that supplies power to the information processing system and controls power supply. In Fig. 4, the height of the housing is higher than that of the wiring / pipe housing 14 and the computer housing 22 to control the power supply.However, this control should be performed by the console body 21 or the like. For example, it is possible to increase the horizontal floor area by adopting the same structure as the wiring / pipe housing 14 and the computer housing 22. -Install the dummy housing 20 in a place where there is no haze to store each device described above, and expand the floor surface consisting of the wiring, the upper surface of the housing 14 and the housing 22 of the computer, etc. It is a housing. Therefore, the structure of the dummy housing 20 is set to the same size as the wiring / piping housing 14 and the computer housing 22.

The present invention provides a housing structure that enables equipment necessary for constructing an information processing system to be installed side by side on the floor surface 5 and that the upper surface thereof be aligned to be used as a new floor surface. As for the installation method, it may be better to make the height of the top surface higher than the new floor surface depending on the use of those devices.

In FIG. 4, the arrow line extending from the air-conditioning enclosure 19 indicates the flow of air for cooling. The cooled air exits the air-conditioning enclosure 19, enters the computer enclosure 22 through the wiring and piping enclosure 14, and transfers the heat generated in the computer enclosure 22 to the wiring and piping enclosure 1 4 To cool.

In Fig. 4, only the cooling of the enclosure of the decomputing machine 22 is shown, but the cooling of other enclosures is also the same. It is possible to perform with the configuration of. Further, in FIG. 4, a wiring example of the communication wiring and the power wiring 10 is indicated by a dotted line on the wiring / pipe housing 14.

In Fig. 4, the communication path that connects the computer housings 2 and 2 that are adjacent to each other or wiring Control lines between the piping housings 14 and the console housing 21 are also wired.

In the information processing system shown in Fig. 4, it is not only possible to construct an information processing system by simply arranging the wiring and piping housings 14 and the computer housings 22 and the like on the floor 5, but also to construct a new top surface. It can be used as a floor. Wiring · Power supply using piping housing 14 · Securing communication path · Cooling method: power, data, control signals, cooling air and flow of cooling liquid can be controlled.

Not only can this control be changed by changing the arrangement of the housings described above, but also by installing devices that can adjust the route to the wiring and piping housings 14 physically The control can be changed without changing the arrangement. For example, if a network / routing device is mounted on the wiring / pipe housing 14 and controllable from the communication housing 16 and console housing 21, the communication path between the computer housing 22 and the like Can be controlled, and it can be divided into multiple network groups.

FIG. 5 is a diagram showing an example of mounting the computer housing 22 in detail.

As described above, the housing structure of the computer housing 22 includes cooling equipment 1 2 that exchanges heat with the outside to cool the heat generated inside, and the upper surface of the computer housing 22 In addition to the adjustment feet 13 for horizontal adjustment between the two, as shown in Fig. 4, a housing handle 2 5 for lifting the computer housing 2 2 and for maintaining the inside of the computer housing 2 2 There is a housing lid 24 that can be opened and closed. There is a power supply for receiving power supply from the outside and communication with the outside. There is a connector 26 for connecting the communication wiring 27 and the housing. The connector 26 between the housings and the power supply / communication wiring 27 must have play so that connection errors do not occur due to installation errors between the housings or vibrations of the housings. This will be described later with reference to FIG. Inside the computer housing 2 2 Adjusters 2 3 for adjusting the flatness and height of the housing using the adjusting feet 1 3 inside, the pack plane of the computer main body 2 9, blade pod riser 1 board 2 8 There is.

The pack plane 29 and the blade board riser port 28 are equipped with a processor, memory, and control circuits. The pack plane 29 is powerful to be installed on the bottom of the computer housing 22 from the viewpoint of ease of maintenance such as insertion and removal of the pre-board / driver / board 28.

The blade board riser board 28 stands in the vertical direction in order to reach the pack plane 29, but the cooling air from the cooling equipment 12 is used to increase the cooling efficiency. It is good to make it easy to flow. It is also conceivable that the pack plane 29 is attached to the side of the computer housing 22 where the cooling system 12 is not provided, and the blade board riser port 28 is inserted in the horizontal direction. In this method, the cooling efficiency is almost the same as that of the installation method such as the puncture plane 29 shown in FIG. 5, but it may be difficult to insert and remove the blade board riser 1 port 28.

Figure 6 shows a mounting example of the structure of the connection part between the computer housing 22 and the wiring / piping housing 14.

If there is an error in the horizontality of the floor surface 5 on which each housing is installed, an error due to insufficient adjustment of the adjusting feet 13, a dimensional error of the housing structure itself, and use the upper surface of each housing as a new floor surface Due to vibrations, the way of sticking between the housings may change.

For this reason, there is a need for play at the connector 26 between the housings so that the connection is not defective due to vibration. In Fig. 6, the wiring 27 connected to the inter-chassis connector has slack to prevent poor connection due to vibration and the like.

Next, FIG. 6 shows an implementation example of a dust-proof structure that poses a problem in the construction of the information system according to the present embodiment. In FIG. 6, the force par 30 between casings is a force par made of a resilient material to be placed on the boundary line of each casing.

Enhances the dust-proof effect of the inter-chassis force par 30 so that the inter-chassis force- In order to avoid this, a groove is provided on the boundary side of each housing, and a part of the housing power part fits into the groove for 5 minutes.

FIG. 6 merely shows an example of a method of connecting and installing the casings of the information processing system according to the present invention. In the housing shown in the present invention, the connection method specified in the present invention is to connect the wiring between the housings by a connection method that does not cause a wiring connection failure due to vibration between the vibrating housings. There are other implementation methods than those shown in FIG. The same applies to dust-proofing by applying a force at the boundary between the housings.

In the information processing system of the present invention, as shown in FIG. 4, the wiring and piping housings 14 and the calculation housings 22 are arranged side by side on the floor 5 and constructed. Therefore, it is necessary to prevent the entire wiring and piping from being cut when replacing one wiring and piping housing.

Another advantage of the present invention is that it can be effectively used on a new floor constituted by the upper surfaces of the wiring / pipe housing 14 and the calculation housing 22. There is a possibility that objects may be installed on the top, and it may not be possible to easily perform wiring and piping housings 14 and calculation housings 22. For the above reasons, it is important to provide redundancy at each location and make the system switchable from the console housing 21 or the like.

FIG. 7 is a diagram schematically illustrating a connection relationship between the wiring / pipe housing 14 and the calculation housing 22.

In FIG. 7, only the network wiring of the wiring / pipe housing 14 is shown. Wiring ・ Piping enclosures 14 are equipped with wiring switches to provide multiple communication paths between computer enclosures, enabling one or more communication paths to be maintained even if some enclosures are removed. .

As for the computer itself, the structure inside the computer housing 22 is made a redundant system, and even if a part of the computer is broken, the computer housing 22 can be replaced by switching from the console housing 21 etc. to the standby system. The structure may be acceptable.

A redundant configuration is similarly prepared for the power supply system and the cooling equipment. If there is enough space, install the computer housing 22 in place of the dummy housing. It is also effective to install redundantly in advance.

As described above, the invention made by the inventor has been specifically described based on the embodiment of the invention. However, the invention is not limited to the embodiment, and various changes can be made without departing from the gist of the invention. Needless to say, Industrial applicability

As described above, the information processing apparatus according to the present invention is suitable for a technique for constructing a large-scale information processing system in a place where it is difficult to prepare a dedicated machine room.

Claims

The scope of the claims

1. An information processing device characterized by having a housing with a housing structure that can be used as a floor on the upper surface.

2. The information processing apparatus according to claim 1,

The information processing apparatus, wherein the housing forms a floor by arranging a plurality of the housings on a floor surface.

3. The information processing apparatus according to claim 1,

An information processing apparatus, wherein the housing includes at least one of electrical wiring, optical wiring, and cooling piping for connecting the housings.

4. The information processing apparatus according to claim 1,

Having a device that creates an air flow between a pair of 'sides' facing each other of the housing, installing an electronic circuit board on a bottom surface inside the housing, and attaching an auxiliary electronic circuit board perpendicular to an electronic circuit closing plate on the bottom surface; An information processing apparatus characterized by being provided in a direction parallel to the flow of air.

5. The information processing apparatus according to claim 1,

A housing structure having a dustproof structure for preventing dust from entering from an upper force of the housing.

6. The information processing apparatus according to claim 2,

An information processing apparatus comprising: a wiring connection unit for connecting wiring between the housings between the housings; and a configuration independent of the wiring connection unit and vibration of the housing to be connected. .

7. The information processing apparatus according to claim 2,

The information processing apparatus, wherein the housing has a dustproof structure for preventing dust from entering from a boundary between the housings.

8. The information processing apparatus according to claim 2,

A wiring method, wherein a plurality of routes are provided between a plurality of the information processing devices, and one or more routes exist even when some of the information processing devices are lost.

9. The information processing apparatus according to claim 2,

An information processing apparatus comprising: a plurality of information processing apparatuses having an internal configuration that can be changed by an external command; a communication path for transmitting the command; and a control device for executing the command.

10. The information processing apparatus according to claim 3,

Any one or more of the electric wiring, the optical wiring, and the cooling pipe provided between the housings may be connected to a connecting portion for performing coupling between the housings. An information processing apparatus characterized in that it is independent of the information processing system.

11. The information processing apparatus according to claim 3,

Any one or more of the electric wiring, the optical wiring, and the cooling pipe provided between the housings may be any one or more of the electric wiring, the light pipe, or the cooling pipe. An information processing apparatus having a dust-proof structure for preventing dust from entering the apparatus.