WO2005081610A3 - Method for placing components on a circuit carrier - Google Patents

Method for placing components on a circuit carrier Download PDF

Info

Publication number
WO2005081610A3
WO2005081610A3 PCT/EP2005/050675 EP2005050675W WO2005081610A3 WO 2005081610 A3 WO2005081610 A3 WO 2005081610A3 EP 2005050675 W EP2005050675 W EP 2005050675W WO 2005081610 A3 WO2005081610 A3 WO 2005081610A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit carrier
component
placing components
manipulating device
placing
Prior art date
Application number
PCT/EP2005/050675
Other languages
French (fr)
Other versions
WO2005081610A2 (en
Inventor
Willibald Konrath
Haiko Schmelcher
Original Assignee
Marconi Comm Gmbh
Willibald Konrath
Haiko Schmelcher
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Comm Gmbh, Willibald Konrath, Haiko Schmelcher filed Critical Marconi Comm Gmbh
Publication of WO2005081610A2 publication Critical patent/WO2005081610A2/en
Publication of WO2005081610A3 publication Critical patent/WO2005081610A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

For placing circuit components on a circuit carrier: a) the location of a component (1) to be placed is determined; b) a manipulating device (6) for seizing the component (1) is placed at the determined location; C) the manipulating device (6) is operated for seizing the component (1); and d) it is verified using a camera (12) that the component (1) has been seized by the manipulating device (6), and e) the manipulating device is moved to the circuit carrier for placing the component.
PCT/EP2005/050675 2004-02-19 2005-02-16 Method for placing components on a circuit carrier WO2005081610A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004008082.8 2004-02-19
DE102004008082A DE102004008082A1 (en) 2004-02-19 2004-02-19 Method for populating a circuit carrier

Publications (2)

Publication Number Publication Date
WO2005081610A2 WO2005081610A2 (en) 2005-09-01
WO2005081610A3 true WO2005081610A3 (en) 2005-12-29

Family

ID=34832815

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/050675 WO2005081610A2 (en) 2004-02-19 2005-02-16 Method for placing components on a circuit carrier

Country Status (2)

Country Link
DE (1) DE102004008082A1 (en)
WO (1) WO2005081610A2 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04199600A (en) * 1990-11-29 1992-07-20 Juki Corp Component mounting apparatus
US5177864A (en) * 1989-09-06 1993-01-12 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and method of mounting electronic component
EP0552419A1 (en) * 1992-01-22 1993-07-28 Sumitomo Electric Industries, Limited Apparatus and method for manufacturing optical module
US5231753A (en) * 1991-03-12 1993-08-03 Ando Electric Co., Ltd. IC contact mechanism
US5314223A (en) * 1993-02-26 1994-05-24 The Whitaker Corporation Vacuum placement system and method, and tool for use therein
US6154957A (en) * 1996-10-11 2000-12-05 Matsushita Electric Industrial Co., Ltd. Method of and apparatus for mounting electronic parts
US20030029032A1 (en) * 2001-08-08 2003-02-13 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting electronic parts

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6802279A (en) * 1968-02-16 1969-08-19
JPS57164310A (en) * 1981-04-03 1982-10-08 Hitachi Ltd Automatic assembling device
US5067762A (en) * 1985-06-18 1991-11-26 Hiroshi Akashi Non-contact conveying device
DE3823836A1 (en) * 1988-07-14 1990-01-18 Fraunhofer Ges Forschung METHOD FOR MEASURING THE EQUIPMENT OF CONSTRUCTION ELEMENTS, AND DEVICE FOR IMPLEMENTING THE METHOD
US5023426A (en) * 1989-06-21 1991-06-11 Honeywell Inc. Robotic laser soldering apparatus for automated surface assembly of microscopic components
DE69116709T2 (en) * 1990-03-19 1997-02-06 Hitachi Ltd Device and method for transporting components
US5172468A (en) * 1990-08-22 1992-12-22 Sony Corporation Mounting apparatus for electronic parts
JP3222334B2 (en) * 1994-10-19 2001-10-29 ヤマハ発動機株式会社 Method and apparatus for adjusting height of recognition nozzle in surface mounter
JPH1068759A (en) * 1996-05-31 1998-03-10 Advantest Corp Attracted matter detecting device attracted mater detecting method using the same, dislocation detecting method using the device and cleaning method using the device
DE19801978A1 (en) * 1998-01-20 1999-07-29 Sensor Instr Gmbh Unit for inspecting correct loading of spinning arm carrying SMD component to be mounted on circuit board
DE19849720A1 (en) * 1998-10-28 2000-05-04 Bosch Gmbh Robert Precision positioning of component in assembly position in grip-feed system makes position correction using coarse and fine positioning devices
DE19934619A1 (en) * 1999-07-23 2001-01-25 Merten Kg Pulsotronic Component inspection device has optical deflection device that feeds image produced from direction different from first image to video camera
JP3398109B2 (en) * 2000-01-27 2003-04-21 三洋電機株式会社 Electronic component mounting device
CN1223258C (en) * 2000-03-28 2005-10-12 西门子公司 Method and device for monitoring electric component in pick-and-place device for substrates
JP3967120B2 (en) * 2001-12-07 2007-08-29 株式会社日立ハイテクインスツルメンツ Recognition processing device for electronic component mounting device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5177864A (en) * 1989-09-06 1993-01-12 Matsushita Electric Industrial Co., Ltd. Electronic component mounting apparatus and method of mounting electronic component
JPH04199600A (en) * 1990-11-29 1992-07-20 Juki Corp Component mounting apparatus
US5231753A (en) * 1991-03-12 1993-08-03 Ando Electric Co., Ltd. IC contact mechanism
EP0552419A1 (en) * 1992-01-22 1993-07-28 Sumitomo Electric Industries, Limited Apparatus and method for manufacturing optical module
US5314223A (en) * 1993-02-26 1994-05-24 The Whitaker Corporation Vacuum placement system and method, and tool for use therein
US6154957A (en) * 1996-10-11 2000-12-05 Matsushita Electric Industrial Co., Ltd. Method of and apparatus for mounting electronic parts
US20030029032A1 (en) * 2001-08-08 2003-02-13 Matsushita Electric Industrial Co., Ltd. Apparatus and method for mounting electronic parts

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 016, no. 530 (E - 1287) 30 October 1992 (1992-10-30) *

Also Published As

Publication number Publication date
WO2005081610A2 (en) 2005-09-01
DE102004008082A1 (en) 2005-09-08

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