WO2005079154A3 - A method and a system for real-time defects verification - Google Patents

A method and a system for real-time defects verification Download PDF

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Publication number
WO2005079154A3
WO2005079154A3 PCT/IL2005/000202 IL2005000202W WO2005079154A3 WO 2005079154 A3 WO2005079154 A3 WO 2005079154A3 IL 2005000202 W IL2005000202 W IL 2005000202W WO 2005079154 A3 WO2005079154 A3 WO 2005079154A3
Authority
WO
WIPO (PCT)
Prior art keywords
real
time verification
inspector
possible defect
defect
Prior art date
Application number
PCT/IL2005/000202
Other languages
French (fr)
Other versions
WO2005079154A2 (en
Inventor
Noam Rosenshtain
Tal Shalem
Original Assignee
Camtek Ltd
Noam Rosenshtain
Tal Shalem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Camtek Ltd, Noam Rosenshtain, Tal Shalem filed Critical Camtek Ltd
Publication of WO2005079154A2 publication Critical patent/WO2005079154A2/en
Publication of WO2005079154A3 publication Critical patent/WO2005079154A3/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95684Patterns showing highly reflecting parts, e.g. metallic elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A method and a system for real time verification - of AOI systems determinations - is disclosed. The real time verification method is comprised of scanning a surface using an automatic optical inspection (AOI) system for identifying possible defects on the surface; while scanning, when a possible defect is identified, an image of the possible defect is transferred to a real-time verification unit, wherein the real-time verification includes an inspector; the inspector checks the possible defect image and determines whether the identification made by the AOI is correct, and therefore requires additional non real-time verification, or whether said possible defect is false determination or disqualifying and when the inspector determines that the identification is false or disqualifying, the inspector commands to ignore the false possible defect or to disqualify the substance with a disqualifying defect.
PCT/IL2005/000202 2004-02-19 2005-02-17 A method and a system for real-time defects verification WO2005079154A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL160477 2004-02-19
IL16047704A IL160477A0 (en) 2004-02-19 2004-02-19 A method and a system for real-time defects verification

Publications (2)

Publication Number Publication Date
WO2005079154A2 WO2005079154A2 (en) 2005-09-01
WO2005079154A3 true WO2005079154A3 (en) 2007-05-24

Family

ID=34073867

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2005/000202 WO2005079154A2 (en) 2004-02-19 2005-02-17 A method and a system for real-time defects verification

Country Status (2)

Country Link
IL (1) IL160477A0 (en)
WO (1) WO2005079154A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9885671B2 (en) 2014-06-09 2018-02-06 Kla-Tencor Corporation Miniaturized imaging apparatus for wafer edge
US9645097B2 (en) 2014-06-20 2017-05-09 Kla-Tencor Corporation In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning
CN107389689B (en) * 2017-07-26 2020-05-22 武汉精测电子集团股份有限公司 AOI management system and management method for defect detection
CN109633937A (en) * 2018-12-10 2019-04-16 武汉精立电子技术有限公司 It is a kind of to sentence system again online
CN112697813A (en) * 2020-12-24 2021-04-23 江苏汇成光电有限公司 AOI special scanning operation method
CN112712149B (en) * 2020-12-30 2022-12-02 盛泰光电科技股份有限公司 Production information management system based on two-dimensional code recognition
CN113609897A (en) * 2021-06-23 2021-11-05 阿里巴巴新加坡控股有限公司 Defect detection method and defect detection system

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0206709A2 (en) * 1985-06-17 1986-12-30 Visionetics Corporation Automatic optical inspection of printed circuit boards
US6480279B2 (en) * 1998-11-30 2002-11-12 Hitachi, Ltd. Inspection method, apparatus and system for circuit pattern
US20020168099A1 (en) * 2001-05-11 2002-11-14 Orbotech Ltd Image searching defect detector
US20030012407A1 (en) * 2000-03-02 2003-01-16 Walter Rosenbaum Method and apparatus for processing mail pieces
US6597381B1 (en) * 1999-07-24 2003-07-22 Intelligent Reasoning Systems, Inc. User interface for automated optical inspection systems
US20040028267A1 (en) * 2002-08-08 2004-02-12 Applied Materials Israel Ltd Wafer inspection methods and an optical inspection tool
US20040120570A1 (en) * 2002-12-24 2004-06-24 Orbotech Ltd Automatic optical inspection system and method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0206709A2 (en) * 1985-06-17 1986-12-30 Visionetics Corporation Automatic optical inspection of printed circuit boards
US6480279B2 (en) * 1998-11-30 2002-11-12 Hitachi, Ltd. Inspection method, apparatus and system for circuit pattern
US6597381B1 (en) * 1999-07-24 2003-07-22 Intelligent Reasoning Systems, Inc. User interface for automated optical inspection systems
US20030012407A1 (en) * 2000-03-02 2003-01-16 Walter Rosenbaum Method and apparatus for processing mail pieces
US20020168099A1 (en) * 2001-05-11 2002-11-14 Orbotech Ltd Image searching defect detector
US20040028267A1 (en) * 2002-08-08 2004-02-12 Applied Materials Israel Ltd Wafer inspection methods and an optical inspection tool
US20040120570A1 (en) * 2002-12-24 2004-06-24 Orbotech Ltd Automatic optical inspection system and method

Also Published As

Publication number Publication date
IL160477A0 (en) 2004-07-25
WO2005079154A2 (en) 2005-09-01

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