WO2005074402A3 - An integrated circuit - Google Patents
An integrated circuit Download PDFInfo
- Publication number
- WO2005074402A3 WO2005074402A3 PCT/SG2004/000035 SG2004000035W WO2005074402A3 WO 2005074402 A3 WO2005074402 A3 WO 2005074402A3 SG 2004000035 W SG2004000035 W SG 2004000035W WO 2005074402 A3 WO2005074402 A3 WO 2005074402A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- integrated circuit
- antenna
- guard rings
- circuit
- layers
- Prior art date
Links
- 238000004146 energy storage Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/SG2004/000035 WO2005074402A2 (en) | 2004-02-10 | 2004-02-10 | An integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/SG2004/000035 WO2005074402A2 (en) | 2004-02-10 | 2004-02-10 | An integrated circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005074402A2 WO2005074402A2 (en) | 2005-08-18 |
WO2005074402A3 true WO2005074402A3 (en) | 2006-01-12 |
Family
ID=34836932
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/SG2004/000035 WO2005074402A2 (en) | 2004-02-10 | 2004-02-10 | An integrated circuit |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2005074402A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11848479B2 (en) | 2007-09-06 | 2023-12-19 | Deka Products Limited Partnership | RFID system |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8249500B2 (en) | 2005-02-24 | 2012-08-21 | Innovision Research & Technology Plc | Tuneable NFC device |
GB0505060D0 (en) | 2005-03-11 | 2005-04-20 | Innovision Res & Tech Plc | Gain controlled impedance |
US7751790B2 (en) * | 2006-09-28 | 2010-07-06 | Broadcom Corporation | Hybrid on-chip-off-chip transformer |
US8026818B2 (en) | 2006-12-20 | 2011-09-27 | Checkpoint Systems, Inc. | EAS and UHF combination tag |
EP1978472A3 (en) * | 2007-04-06 | 2015-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
AU2009249061B2 (en) * | 2008-05-20 | 2015-01-22 | Deka Products Limited Partnership | RFID system |
US20100127937A1 (en) * | 2008-11-25 | 2010-05-27 | Qualcomm Incorporated | Antenna Integrated in a Semiconductor Chip |
WO2010076187A2 (en) | 2008-12-30 | 2010-07-08 | Stmicroelectronics S.R.L. | Integrated electronic device with transceiving antenna and magnetic interconnection |
JP2010200309A (en) * | 2009-01-30 | 2010-09-09 | Tdk Corp | Proximity antenna and wireless communication device |
US9112263B2 (en) * | 2010-02-25 | 2015-08-18 | Stmicroelectronics S.R.L. | Electronic communications device with antenna and electromagnetic shield |
BR112012021554A2 (en) | 2010-02-26 | 2016-08-16 | Deka Products Lp | rfid system with eddy current trap |
US20150173380A1 (en) * | 2012-07-06 | 2015-06-25 | Pier RUBESA | Method and apparatus for the amplification of electrical charges in biological systems or bioactive matter using an inductive disk with a fixed geometric trace |
US9577023B2 (en) | 2013-06-04 | 2017-02-21 | Globalfoundries Inc. | Metal wires of a stacked inductor |
US9312927B2 (en) | 2013-11-11 | 2016-04-12 | Qualcomm Incorporated | Tunable guard ring for improved circuit isolation |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1069645A2 (en) * | 1999-07-13 | 2001-01-17 | Shinko Electric Industries Co. Ltd. | Semiconductor device with an antenna and fabrication method therefor |
US20020045295A1 (en) * | 2000-08-23 | 2002-04-18 | Noriaki Hiraga | Semiconductor device and fabrication method thereof |
US6424315B1 (en) * | 2000-08-02 | 2002-07-23 | Amkor Technology, Inc. | Semiconductor chip having a radio-frequency identification transceiver |
US20020145196A1 (en) * | 2001-04-10 | 2002-10-10 | Mu-Chun Wang | Cross guard-ring structure to protect the chip crack in low dielectric constant and copper process |
US20020167071A1 (en) * | 2001-05-10 | 2002-11-14 | Mu-Chun Wang | Guard ring for protecting integrated circuits |
-
2004
- 2004-02-10 WO PCT/SG2004/000035 patent/WO2005074402A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1069645A2 (en) * | 1999-07-13 | 2001-01-17 | Shinko Electric Industries Co. Ltd. | Semiconductor device with an antenna and fabrication method therefor |
US6424315B1 (en) * | 2000-08-02 | 2002-07-23 | Amkor Technology, Inc. | Semiconductor chip having a radio-frequency identification transceiver |
US20020045295A1 (en) * | 2000-08-23 | 2002-04-18 | Noriaki Hiraga | Semiconductor device and fabrication method thereof |
US20020145196A1 (en) * | 2001-04-10 | 2002-10-10 | Mu-Chun Wang | Cross guard-ring structure to protect the chip crack in low dielectric constant and copper process |
US20020167071A1 (en) * | 2001-05-10 | 2002-11-14 | Mu-Chun Wang | Guard ring for protecting integrated circuits |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11848479B2 (en) | 2007-09-06 | 2023-12-19 | Deka Products Limited Partnership | RFID system |
Also Published As
Publication number | Publication date |
---|---|
WO2005074402A2 (en) | 2005-08-18 |
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