WO2005074402A3 - An integrated circuit - Google Patents

An integrated circuit Download PDF

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Publication number
WO2005074402A3
WO2005074402A3 PCT/SG2004/000035 SG2004000035W WO2005074402A3 WO 2005074402 A3 WO2005074402 A3 WO 2005074402A3 SG 2004000035 W SG2004000035 W SG 2004000035W WO 2005074402 A3 WO2005074402 A3 WO 2005074402A3
Authority
WO
WIPO (PCT)
Prior art keywords
integrated circuit
antenna
guard rings
circuit
layers
Prior art date
Application number
PCT/SG2004/000035
Other languages
French (fr)
Other versions
WO2005074402A2 (en
Inventor
Fumio Muto
Jia Jun Zheng
Original Assignee
Cyrips Pte Ltd
Fumio Muto
Jia Jun Zheng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cyrips Pte Ltd, Fumio Muto, Jia Jun Zheng filed Critical Cyrips Pte Ltd
Priority to PCT/SG2004/000035 priority Critical patent/WO2005074402A2/en
Publication of WO2005074402A2 publication Critical patent/WO2005074402A2/en
Publication of WO2005074402A3 publication Critical patent/WO2005074402A3/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07775Antenna details the antenna being on-chip
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227Inductive arrangements or effects of, or between, wiring layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62Protection against overvoltage, e.g. fuses, shunts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00Antennas with active circuits or circuit elements integrated within them or attached to them
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • H01F17/0013Printed inductances with stacked layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64Impedance arrangements
    • H01L2223/66High-frequency adaptations
    • H01L2223/6661High-frequency adaptations for passive devices
    • H01L2223/6677High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

An integrated circuit suitable for use as part of a tag in RFID technology is disclosed. The circuit has an antenna (515) and processing circuitry therefor, the antenna and circuitry being formed on separate layers (513,515) of the integrated circuit and discontinuous electrically connected guard rings (508) protecting layers of the integrated circuit in the IC-portion (501). The guard rings (508) can form an energy storage device which can improve the performance of the antenna.
PCT/SG2004/000035 2004-02-10 2004-02-10 An integrated circuit WO2005074402A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/SG2004/000035 WO2005074402A2 (en) 2004-02-10 2004-02-10 An integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SG2004/000035 WO2005074402A2 (en) 2004-02-10 2004-02-10 An integrated circuit

Publications (2)

Publication Number Publication Date
WO2005074402A2 WO2005074402A2 (en) 2005-08-18
WO2005074402A3 true WO2005074402A3 (en) 2006-01-12

Family

ID=34836932

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG2004/000035 WO2005074402A2 (en) 2004-02-10 2004-02-10 An integrated circuit

Country Status (1)

Country Link
WO (1) WO2005074402A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11848479B2 (en) 2007-09-06 2023-12-19 Deka Products Limited Partnership RFID system

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8249500B2 (en) 2005-02-24 2012-08-21 Innovision Research & Technology Plc Tuneable NFC device
GB0505060D0 (en) 2005-03-11 2005-04-20 Innovision Res & Tech Plc Gain controlled impedance
US7751790B2 (en) * 2006-09-28 2010-07-06 Broadcom Corporation Hybrid on-chip-off-chip transformer
US8026818B2 (en) 2006-12-20 2011-09-27 Checkpoint Systems, Inc. EAS and UHF combination tag
EP1978472A3 (en) * 2007-04-06 2015-04-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
AU2009249061B2 (en) * 2008-05-20 2015-01-22 Deka Products Limited Partnership RFID system
US20100127937A1 (en) * 2008-11-25 2010-05-27 Qualcomm Incorporated Antenna Integrated in a Semiconductor Chip
WO2010076187A2 (en) 2008-12-30 2010-07-08 Stmicroelectronics S.R.L. Integrated electronic device with transceiving antenna and magnetic interconnection
JP2010200309A (en) * 2009-01-30 2010-09-09 Tdk Corp Proximity antenna and wireless communication device
US9112263B2 (en) * 2010-02-25 2015-08-18 Stmicroelectronics S.R.L. Electronic communications device with antenna and electromagnetic shield
BR112012021554A2 (en) 2010-02-26 2016-08-16 Deka Products Lp rfid system with eddy current trap
US20150173380A1 (en) * 2012-07-06 2015-06-25 Pier RUBESA Method and apparatus for the amplification of electrical charges in biological systems or bioactive matter using an inductive disk with a fixed geometric trace
US9577023B2 (en) 2013-06-04 2017-02-21 Globalfoundries Inc. Metal wires of a stacked inductor
US9312927B2 (en) 2013-11-11 2016-04-12 Qualcomm Incorporated Tunable guard ring for improved circuit isolation

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1069645A2 (en) * 1999-07-13 2001-01-17 Shinko Electric Industries Co. Ltd. Semiconductor device with an antenna and fabrication method therefor
US20020045295A1 (en) * 2000-08-23 2002-04-18 Noriaki Hiraga Semiconductor device and fabrication method thereof
US6424315B1 (en) * 2000-08-02 2002-07-23 Amkor Technology, Inc. Semiconductor chip having a radio-frequency identification transceiver
US20020145196A1 (en) * 2001-04-10 2002-10-10 Mu-Chun Wang Cross guard-ring structure to protect the chip crack in low dielectric constant and copper process
US20020167071A1 (en) * 2001-05-10 2002-11-14 Mu-Chun Wang Guard ring for protecting integrated circuits

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1069645A2 (en) * 1999-07-13 2001-01-17 Shinko Electric Industries Co. Ltd. Semiconductor device with an antenna and fabrication method therefor
US6424315B1 (en) * 2000-08-02 2002-07-23 Amkor Technology, Inc. Semiconductor chip having a radio-frequency identification transceiver
US20020045295A1 (en) * 2000-08-23 2002-04-18 Noriaki Hiraga Semiconductor device and fabrication method thereof
US20020145196A1 (en) * 2001-04-10 2002-10-10 Mu-Chun Wang Cross guard-ring structure to protect the chip crack in low dielectric constant and copper process
US20020167071A1 (en) * 2001-05-10 2002-11-14 Mu-Chun Wang Guard ring for protecting integrated circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11848479B2 (en) 2007-09-06 2023-12-19 Deka Products Limited Partnership RFID system

Also Published As

Publication number Publication date
WO2005074402A2 (en) 2005-08-18

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