WO2005070605A1 - Solder heating tool and soldering iron bit member used therefor - Google Patents

Solder heating tool and soldering iron bit member used therefor Download PDF

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Publication number
WO2005070605A1
WO2005070605A1 PCT/JP2004/000690 JP2004000690W WO2005070605A1 WO 2005070605 A1 WO2005070605 A1 WO 2005070605A1 JP 2004000690 W JP2004000690 W JP 2004000690W WO 2005070605 A1 WO2005070605 A1 WO 2005070605A1
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WO
WIPO (PCT)
Prior art keywords
tip
ceramic heater
solder
cylindrical member
gas
Prior art date
Application number
PCT/JP2004/000690
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroyuki Masaki
Original Assignee
Hakko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hakko Corporation filed Critical Hakko Corporation
Priority to PCT/JP2004/000690 priority Critical patent/WO2005070605A1/en
Priority to JP2005517188A priority patent/JP4181581B2/en
Priority to PCT/JP2004/009585 priority patent/WO2005070606A1/en
Publication of WO2005070605A1 publication Critical patent/WO2005070605A1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02Soldering irons; Bits
    • B23K3/03Soldering irons; Bits electrically heated
    • B23K3/0338Constructional features of electric soldering irons
    • B23K3/0369Couplings between the heating element housing and the bit or tip

Definitions

  • the present invention relates to a structure of a tip-side portion (a tip-side member) including a tip for a soldering heater represented by a soldering iron.
  • the invention also relates to the structure of a solder heating device using the same.
  • FIG. 9 (a) is a partial front view of a conventional electric soldering iron 90 (solder heating device), and FIG. 9 (b) is an exploded perspective view thereof.
  • a tip 93 stored in a protective pipe 96 is provided at the tip of the electric soldering iron 90.
  • the protection pipe 96 is fixed to the nipple 98 of the casing 91 by a nut 92.
  • a recess 93 d is formed inside the cylindrical body of the tip 93, which is covered by the protective pipe 96.
  • a ceramic heater 94 projecting from the casing 91 is assembled into the recess 93 d so as to fit through an insert pipe 95 made of stainless steel or the like.
  • the tip 93 is made of copper, a copper alloy, or the like, and its tip is iron-plated to prevent erosion by solder. However, since the erosion by the solder proceeds little by little, the tip 93 is usually a replacement part.
  • tip tips 93 having various tip shapes are prepared, and the operator selects the most suitable tip tip 93 according to the part and range to be soldered and replaces it. Work.
  • the present invention has been made in order to solve such problems of the conventional technology, and by increasing the speed of heat transfer from the ceramic ceramic to the tip and suppressing the heat loss, it is possible to improve the above-mentioned rise. It is a first object of the present invention to provide a soldering tip member capable of reducing the time and temperature recovery time and suppressing the temperature drop during soldering, and a solder heating device using the same.
  • solder heating device a device that emits an inert gas such as nitrogen from the vicinity of a soldering iron tip is known. This is done in order to prevent the solder from being oxidized by setting the vicinity of the tip to an oxygen-free atmosphere.
  • an inert gas is introduced into the casing 91, and a gas passage is formed from the inside of the casing 91 near the tip of the tip 93 to guide the inert gas.
  • Japanese Patent Application Laid-Open Publication No. 2001-3474769 states that such a soldering iron has a double pipe structure in which a pipe is further provided outside the protective pipe 96, and between the pipes. The structure that allows inert gas to pass through the gap is shown.
  • a second object of the present invention is to provide a soldering heating device of the type which ejects such an inert gas and which has a simpler structure while achieving the first object. Is to do. Disclosure of the invention
  • the soldering iron tip member for a solder heating device according to the present invention includes a metal tip tip that is brought into direct contact with and melts the solder, and a temperature detecting portion is provided near the tip, and heat is generated on the proximal end side.
  • a ceramic heater having a substantially rod-like shape provided with a concave portion, wherein a concave portion is provided in the inside of the tip where the ceramic heater is adhered in a close contact state, and a depth of the concave portion is the ceramic heater.
  • the section perpendicular to the axis is divided by a plane including the axis of the recess from the opening to the vicinity of the bottom. It is characterized by a notch that makes a cut.
  • the speed of heat transfer from the ceramic heater to the tip can be increased and the heat loss can be suppressed by the close contact between the tip and the ceramic heater.
  • the tip and ceramic heater are slightly deformed by heat due to the high temperature. Since the material of the tip is different from that of the ceramic, the coefficient of thermal expansion is also different. If the tip chip and the ceramic heater are fixed in a completely adhered state, the ceramic heater may be damaged by the difference in expansion.
  • the radial deformation (expansion) of the tip is absorbed by increasing or decreasing the width of the cut, so that a large compressive or tensile force acts on the ceramic heater. Can be effectively prevented.
  • a cylindrical member that covers the base end side of the tip is provided as a structure for achieving close contact between the tip and the ceramic tip while providing the notch, and the tip is provided with:
  • the cylindrical member is press-fitted at a position corresponding to the vicinity of the bottom surface of the concave portion, and a small gap is provided between the outer peripheral surface of the tip and the inner surface of the cylindrical member at other portions.
  • the cylindrical member is provided with a linear reduced diameter portion along the outer peripheral surface at a position corresponding to the vicinity of the base end of the tip.
  • the outer peripheral surface of the tip and the inner surface of the tubular member may be configured to contact with no gap.
  • the tight contact between the tip chip and the ceramic heater is reduced, and the strong contact thereof is minimized to a portion corresponding to the press-fit portion and the reduced-diameter portion. Therefore, even if a difference in thermal expansion occurs, mutual axial displacement is likely to occur, and it is possible to effectively prevent a large compressive or tensile force from acting on the ceramic heater.
  • the location where the tip is pressed into the cylindrical member is preferably a position corresponding to the temperature detecting portion of the ceramic heater inserted.
  • the degree of adhesion at the temperature detecting section is particularly increased, and more accurate temperature detection can be performed. Therefore, even if heat is temporarily removed from the tip of the soldering tip by soldering, the temperature can be detected quickly and accurately by the temperature detection unit, and the supplementary heat can be supplemented from the heating unit. Can be transmitted to the tip of the robot at high speed and with low loss.
  • soldering device in which the soldering tip for a soldering device is detachably attached to the body-side member that supports the soldering device, has a soldering tip having various shapes according to the region and range to be soldered. By preparing the tip side member by hand, it can be appropriately selected and used.
  • an inert gas ejection type solder heating device is provided on the main body side member, and a gas introduction section for introducing an inert gas into the main body side member; A gas ejecting portion provided near the distal end for ejecting the introduced inert gas; and a gas passage for guiding the inert gas from the gas introducing portion to the gas ejecting portion.
  • a part of the gas passage is formed by a gap between the outer peripheral surface and the inner surface of the cylindrical member, and the vicinity of the concave bottom surface of the cut is exposed from the cylindrical member to form the gas ejection portion. It is good to do so. In this way, the gap created by the cut can be used as an inert gas passage for the inert gas, so that there is no need to use a double pipe structure as in the conventional structure, and the structure can be simplified. be able to.
  • FIG. 1 is a front view of a soldering heater (electric soldering iron) according to a first embodiment, where (a) shows a state in which a tip side member is held by a main body side member, and (b) shows a state where a soldering iron is held. This shows a state in which the front member has been removed from the body member.
  • FIG. 2 is a partial cross-sectional view of FIG.
  • FIGS. 3A and 3B are conceptual diagrams showing the configuration of the ceramic heater of the electric soldering iron according to the first embodiment.
  • FIG. 3A shows the circuit configuration of the ceramic heater
  • FIG. This shows a state where the ceramic heater is formed by winding.
  • FIG. 4 is a diagram showing a detailed structure around the tip of an electric soldering iron according to the first embodiment,) is a partial sectional view, (b) is a III-III sectional view of (a), (C) is
  • FIGS. 5A and 5B are explanatory diagrams comparing the temperature characteristics of the electric soldering iron according to the first embodiment with the temperature characteristics of the conventional electric soldering iron.
  • FIG. 5A shows the temperature characteristics of the first embodiment
  • FIG. ) Shows the temperature characteristics of the conventional structure.
  • FIG. 6 is a front cross-sectional view of the solder heating device (gas ejection type electric soldering iron) according to the second embodiment, showing a state in which an inert gas is guided from the main body side member to the iron tip side member.
  • FIG. 7 is a partially enlarged view of FIG.
  • FIG. 8 is a front partial cross-sectional view of the vicinity of the soldering tip of the solder heating device (electric soldering iron) according to the third embodiment, where (a) guides the solder suction tube from outside the ceramic heater, b) shows a ceramic heater passed through a solder suction tube.
  • Fig. 9 shows the structure of a conventional solder heating device, where (a) is a partial front view,
  • FIG. 1 is a front view of an electric soldering iron 10 (solder heating device) according to a first embodiment of the present invention, in which (a) shows a state in which a tip side member 20 is held by a main body side member 25. (B) shows a state where the tip side member 20 is detached from the main body side member 25.
  • FIG. 2 is a partial cross-sectional view of FIG.
  • the structure of the electric soldering iron 10 will be described with reference to FIGS.
  • the basic configuration of the electric soldering iron 10 is such that a detachable iron tip member 20 is attached to the tip (left side in FIG. 1) of the main body member 25.
  • the tip of the tip side member 20 is mainly made of copper (other materials such as copper alloy, silver, or silver alloy may be used) and soldered by direct contact with the solder.
  • a tip 3 is provided. The proximal end of the tip 3 is fitted into a protective pipe 6 (tubular member), and the distal end is exposed from the protective pipe 6 and formed into a shape suitable for soldering.
  • a concave portion is provided inside the tip 3 and has a cylindrical shape with a bottom.
  • a ceramic heater 4 is attached to the concave portion in a closely contacting state.
  • the ceramic heater 4 is provided with a temperature detecting portion 4a near the distal end and a heat generating portion 4b near the proximal end.
  • These wirings are led out to the outside by lead wires 8 (lead wire 8a for the temperature detecting section and lead wire 8b for the heating section), and are connected to the tip side connector 9. Further, the base end side of the ceramic heater 4 is fitted and held by a substantially cylindrical holder 7 made of metal. As shown in FIGS. 1 (b) and 2, the tip 3, the ceramic heater 4, the protection pipe 6, the holder 7, the lead wire 8, and the tip connector 9 are integrally formed.
  • the main body-side member 25 mainly includes a casing 1, a fixing nut 2, and an O-ring 12 (positive member) sandwiched therebetween.
  • the casing 1 is a generally tubular member made of a metal or a hard and heat-resistant synthetic resin, and the surrounding area is provided so that an operator can hold the electric soldering iron 10 and handle it.
  • a synthetic resin having heat insulation and elasticity, such as synthetic rubber, is provided as the grip 1a.
  • Casing 1 Inside a main body side connector 15 to be joined to the iron tip side connector 9 is provided, and an electric cord 1 b is connected. The electric cord 1 b is led out of the casing 1 and connected to a controller (a control device for supplying electric power controlled to maintain the tip temperature to the set value to the ceramic heater 4).
  • the fixed nut 2 is a nut-like member screwed to the outer periphery of the distal end of the casing 1.
  • the outer peripheral portion is subjected to a mouth-letting process so that the operator can easily rotate it manually.
  • the fixing nut 2 By rotating the fixing nut 2, the fixing nut 2 can freely move in the axial direction within the movable range with respect to the casing 1.
  • An O-ring 12 is provided so as to be sandwiched between the step portion on the inner diameter side of the fixing nut 2 and the tip end surface of the casing 1.
  • the O-ring 12 is made of an elastic material such as rubber, and is provided at a position where the holder 7 is inserted when the tip side member 20 is attached.
  • a flathead screw 5 for preventing the fixed nut 2 from completely detaching from the casing 1 is provided.
  • FIG. 3 is a conceptual diagram showing the configuration of the ceramic heater 4.
  • (a) shows the circuit configuration of the ceramic heater 4; and
  • (b) shows a ceramic green sheet 4c wound around a ceramic rod 4d. This shows the state where overnight 4 is formed.
  • the structure of the ceramic capacitor 4 will be described with reference to FIG.
  • the ceramic heater 4 is composed of a ceramic green sheet 4 formed by a pattern of a temperature-sensitive resistor such as tungsten provided in the temperature detecting section 4a and a pattern of a heating resistor such as tungsten provided in the heating section 4b.
  • the product printed at the same time as c is wound around a cylindrical ceramic rod 4d such as alumina / silicon nitride as the base and sintered and integrated.
  • a lead wire 8a for the temperature detecting portion is led out from the temperature detecting portion 4a, and a lead wire 8b for the heat generating portion is led out from the heat generating portion 4b, and connected to the tip side connector 9.
  • FIG. 4A and 4B are views showing a detailed structure around the tip 3.
  • FIG. 4A is a partial cross-sectional view
  • FIG. 4B is a cross-sectional view taken along the line III-III of FIG. Of 4 (Circuit structure is omitted.)
  • (C) is an enlarged view of the vicinity of the P part and the Q part of (a). The detailed structure around the tip 3 will be described with reference to FIG.
  • a recess 3 d is provided inside the tip 3 and has a bottomed cylindrical shape, and the tip side of the ceramic heater 4 is adhered in a tight contact state.
  • the depth of the recess 3d is equal to or greater than the length from the tip of the ceramic window 4 to the heating portion 4b.
  • the temperature detecting section 4 a and the heat generating section 4 b of the ceramic heater 4 are in a state of being covered with the tip 3 around.
  • the outer diameter of the bottom side (tip side) of the bottomed cylindrical portion of the tip 3 is relatively large (large diameter portion 3a).
  • the range of the large-diameter portion 3a is a portion substantially equivalent to the temperature detecting portion 4a when the ceramic heater 4 is attached, and when the ceramic heater 4 is fitted to the protective pipe 6 when the ceramic heater 4 is attached. This is a portion corresponding to the tip portion.
  • the bottomed cylindrical portion closer to the base end than the large diameter portion 3a is a small diameter portion 3b slightly smaller in diameter than the large diameter portion 3a.
  • the portion forming the concave portion 3d (mainly the large-diameter portion 3a and the small-diameter portion 3b) includes, from the opening to the vicinity of the bottom surface, a plane including the axis of the concave portion 3d (see FIG. 4A).
  • a notch 3c is provided that divides a cross section perpendicular to the axis (a cross section shown in Fig. 4 (b)) at a plane passing through the axis of the recess 3d and perpendicular to the paper plane.
  • the notch 3c is deeper than the large-diameter portion 3a, and when inserted into the protective pipe 6, its distal end is exposed to form a notch exposed portion 3e.
  • the large-diameter portion 3a and the small-diameter portion 3b of the tip 3 are easily spread on both sides of the notch 3c. Therefore, when the ceramic heater 4 is attached and there is nothing to restrict the outer circumference (in a state where it is not yet inserted into the protective pipe 6), the outer peripheral surface of the ceramic heater 4 and the large-diameter portion 3a and the small-diameter Although it is in close contact with the inner peripheral surface of part 3b, its adhesion is weak and there is a slight air gap.
  • the inner diameter of the protection pipe 6 when it is free is slightly smaller than the large diameter portion 3a and slightly larger than the small diameter portion 3b. Therefore, when the tip 3 is fitted into the protective pipe 6, the large diameter portion 3a is press-fitted, and a small gap is formed between the small-diameter portion 3b and the protective pipe 6.
  • the position corresponding to the vicinity of the base end of the tip 3 of the protection pipe 6 see FIG. 4 (a) and
  • a linear reduced diameter portion 6a is provided along the outer peripheral surface.
  • the outer peripheral surface of the small diameter portion 3b and the inner surface of the protection pipe 6 abut without any gap. Therefore, when the tip 3 is inserted into the protective pipe 6, the large-diameter portion 3a and the portion of the small-diameter portion 3b that abuts on the reduced-diameter portion 6a extend around the outer periphery of the tip 3. Regulate strongly. For this reason, the degree of adhesion between the ceramic capacitor 4 and the tip 3 is also strong at locations corresponding to these (the first strong contact h and the second strong contact j). As described above, since the ceramic heater 4 is strongly adhered to almost both ends of the portion to be inserted into the tip 3, the overall adhesion is also high.
  • the operation of the electric soldering iron 10 having the above structure will be described.
  • the operator selects a tip-side member 20 having a tip shape that is optimal for the work, and inserts it into the body-side member 25. At this time, loosen the fixing nut 2 and insert the holder 7 into the tip of the casing 1.
  • the fixing nut 2 is tightened to deform the O-ring 12, and the holder 7 is fixed by pressing the holder 7 from the periphery.
  • the operator turns on the power of a controller (not shown) and sets the required tip temperature. Electric power corresponding to the set temperature is supplied from the controller to the heating section 4b of the ceramic heater 4, and the heating section 4b generates heat.
  • the heat generated in the heat-generating portion 4b is transmitted to the tip 3, but the ceramic heater 4 and the large-diameter portion 3a and the small-diameter portion 3b of the tip 3 are in good contact with each other. Its heat conduction is performed at high speed and with low loss.
  • the temperature of the tip of the tip 3 is detected by the temperature detection section 4a of the ceramic heater 4 and transmitted to a controller (not shown). Since the vicinity of the temperature detecting section 4a is the first strong contact point h, the degree of adhesion is particularly high, and more accurate temperature detection is possible. Therefore, heat is temporarily removed from the tip of the tip 3 by soldering. In this case, the temperature can be quickly and accurately detected by the temperature detection section 4a, and the supplementary heat can be transmitted from the heating section 4b to the tip of the tip 3 with high speed and low loss. it can.
  • Fig. 5 is an explanatory diagram comparing the temperature characteristics of the electric soldering iron 10 with the temperature characteristics of the conventional structure of the electric soldering iron 90 (see Fig. 9).
  • (B) shows the temperature characteristics of an electric soldering iron 90 having a conventional structure.
  • the horizontal axis shows time (s) and the vertical axis shows tip temperature CC).
  • the set temperatures were both 350 ° C and the same controller was used. With these temperature characteristics, an operation equivalent to continuous soldering (hereinafter referred to as continuous soldering) is performed in sections where the temperature rises and falls sharply. Continuous soldering was performed with the tip of the solder abutted at intervals of 3 seconds on the lead-filled solder on the copper phenolic board with a 10 mm square cut surface.
  • the rise time and return time of the temperature are greatly reduced, and the temperature drop is drastically reduced.
  • heat was transferred from the heating portion 4b to the tip of the tip 3 with high speed and low loss, and the temperature of the temperature detection portion 4a was high. This is a remarkable effect due to the improvement in detection accuracy.
  • the coefficient of thermal expansion is also different. If the tip 3 and the ceramic heater 4 are fixed in a tightly adhered state, the expansion difference may damage the ceramic heater 4, but in the structure of the present embodiment, the damage is caused by the damage. Is effectively prevented. That is, the deformation (expansion) of the tip 3 in the radial direction is absorbed by the increase or decrease in the width of the notch 3 c, thereby preventing a large compressive or tensile force from acting on the ceramic heater 4. ing. As for the deformation in the axial direction, the strong contacts are minimized to the first strong contact h and the second strong contact j. Compression and tension are not applied.
  • the power is turned off, the fixing nut 2 is loosened, the tip member 20 is pulled out, and a new tip member 20 is inserted and replaced.
  • FIG. 6 is a front sectional view of the soldering device (gas ejection type electric soldering iron 50) according to the second embodiment, in which the tip side member 58 is attached to the main body side member 59. It shows the state that was done.
  • the same portions as those of the first embodiment are denoted by the same reference numerals, and the description thereof will not be repeated.
  • a gas introduction part 52 for introducing an inert gas (nitrogen or the like) into the inside of the casing 51 (body part 59).
  • a connection terminal 55 is connected to the gas introduction section 52, and is connected to an inert gas supply device (not shown) via a gas introduction pipe 57.
  • a gas rectifying cap 53 is attached near the tip of the protection pipe 6.
  • the gas rectifying cap 53 is a substantially cylindrical rectifying plate surrounding the notch exposed portion 3 e (see FIG. 4 (a)) with a gap provided between the notch exposed portion 3 e (see FIG. 4 (a)).
  • the active gas is configured to be guided toward the tip of the tip 3.
  • Other configurations are the same as those of the first embodiment.
  • FIG. 7 is an enlarged view near the tip 3 shown in FIG. However, for explanation The tip 3 is shown rotated 90 ° around the axis. With reference to FIG. 6 and FIG. 7, the operation mainly related to the inert gas will be described.
  • the inert gas introduced into the casing 51 from the gas introduction section 52 passes through the internal gap of the casing 51 as shown by the arrow in FIG. It is guided inside the member 58. At this time, the airtightness of the connection between the tip side member 58 and the main body side member 59 is maintained by the O-ring 12.
  • the inert gas introduced into the inside of the tip side member 58 reaches the tip 3 through a gap between the ceramic heater 4 and the protection pipe 6. Then, the gas is ejected from the cut-out exposed portion 3e through the cut 3c (see FIGS. 7 and 4 (b)) of the tip 3.
  • the spouted inert gas is guided by the gas rectifying cap 53 to the vicinity of the tip of the tip 3 to make the vicinity of the tip an oxygen-free atmosphere. Therefore, oxidation of the solder during soldering is prevented, and good soldering can be performed.
  • the conventional structure a double structure in which a pipe is further provided outside the protection pipe 6 and the space between the pipes is adopted
  • a structure in which an inert gas is passed through the gap may be made detachable by screws or the like.
  • FIG. 8 is a front partial sectional view of a soldering device (electric solder desoldering iron 60, 70) according to the third embodiment.
  • the electric solder desoldering irons 60 and 70 melt and suck and remove the solder, and are equipped with solder suction tubes 61 and 71.
  • FIG. 8 (a) shows that the solder suction tube 61 is guided from the outside of the ceramic heater 4.
  • a cylindrical suction nozzle 62 is screwed to the tip of the tip tip 63 provided at the tip of the protective pipe 66 (the tip tip 6).
  • a solder suction tube 61 is provided so as to penetrate the tip tip 63 and communicate with the inner diameter side of the suction nozzle 62.
  • the other end of the solder suction tube 61 is connected to a vacuum suction device (not shown).
  • the heat generated by the ceramic heater 4 is transmitted to the tip of the suction nozzle 62 via the tip 63 and melts the solder in contact therewith.
  • the molten solder is sucked and removed from the suction port 65 by vacuum suction.
  • FIG. 8 (b) shows the ceramic heater 4 with the solder suction pipe 71 passed through.
  • a through hole 72 penetrating the axis thereof is provided in the tip tip 73 provided at the tip of the protection pipe 76.
  • a solder suction pipe 71 communicating with the through hole 72 passes through the inside of the ceramic heater 4 and is connected to a vacuum suction I device (not shown).
  • the heat generated in the ceramic heater 4 is transmitted to the tip of the tip 73 and melts the solder in contact with the tip.
  • the molten solder is sucked and removed from the suction port 75 by vacuum suction.
  • the structures of the tip side member 68 and the tip side member 78 are the same as those of the first embodiment, so that the rise time and the return time can be shortened and the temperature drop can be suppressed. The effect of can be obtained.
  • the present invention is not limited to these, and may be appropriately modified within the scope of the claims.
  • the method of connecting the tip side member and the main body side member does not need to have the structure using the O-ring as described above, and may be appropriately designed and changed.
  • the soldering tip side member for a solder heating device has a metal tip tip that is brought into direct contact with the solder and melts, and a temperature detecting portion is provided near the tip, and furthermore, It has a substantially bar-shaped ceramic heater with a heat-generating part on the base end side.
  • a recess in which the ceramic heater is attached in close contact with the tip of the tip is formed, and the depth of the recess is equal to or greater than the length from the tip of the ceramic heater to the heating section.
  • a cut is formed in the portion forming the recess from the opening to the vicinity of the bottom so as to divide a cross section perpendicular to the axis with a plane including the axis of the recess.
  • the temperature drop during soldering can be suppressed in a soldering heater using it, and the rise time to the set temperature after turning on the power and the return from the fall temperature to the set temperature after continuous soldering It is possible to shorten the return time before the operation.
  • the structure can be made simpler, especially when used in a solder heating device of a type that ejects an inert gas.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A soldering iron bit member for a solder heating tool characterized by comprising a soldering iron bit (3) of metal for melting a solder by direct contact with the latter, a substantially bar-like ceramic heater (4) provided with a temperature detecting section adjacent the front end and with a heating section disposed on the base end side, the soldering iron bit (3) being internally formed with a recess (3d) in which the ceramic heater (4) is closely inserted, the depth of the recess (3d) being not less than the length from the front end of the ceramic heater (4) to the heating section (4b), the portion where the recess (3d) is formed being provided with a cut (3c) extending from the opening therein to the vicinity of the bottom in such a manner as to divide a section in a plane including the axis of the recess (3d) and normal to the axis; and an electric soldering iron using the same.

Description

はんだ加熱器具及びそれに用いられるこて先側部材 技術分野  Solder heater and iron tip used for it
本発明は、 はんだごてに代表されるはんだ加熱器具用のこて先チップを含む先端 側の部分 (こて先側部材) の構造に関する。 またそれを用いたはんだ加熱器具の構 造に関する。 明 背景技術 書  The present invention relates to a structure of a tip-side portion (a tip-side member) including a tip for a soldering heater represented by a soldering iron. The invention also relates to the structure of a solder heating device using the same. Ming background art book
従来の一般的なはんだ加熱器具のこて先付近の構造は、 例えば図 9に示すように なっている。 図 9 ( a ) は従来の電気はんだごて 9 0 (はんだ加熱器具) の部分正 面図であり、 図 9 ( b ) はその分解斜視図である。 電気はんだごて 9 0の先端には、 保護パイプ 9 6に格納されたこて先チップ 9 3が設けられている。 保護パイプ 9 6 はナツト 9 2によってケーシング 9 1のニップル 9 8に固定されている。 こて先チ ップ 9 3の、 保護パイプ 9 6に覆われた円柱状の胴部の内側には凹部 9 3 dが形成 されている。 その凹部 9 3 dに、 ケ一シング 9 1から突出したセラミックヒータ 9 4が、 ステンレス等からなるインサートパイプ 9 5を介して嵌合するように組み立 てられている。  The structure near the tip of a conventional general solder heating device is, for example, as shown in FIG. FIG. 9 (a) is a partial front view of a conventional electric soldering iron 90 (solder heating device), and FIG. 9 (b) is an exploded perspective view thereof. At the tip of the electric soldering iron 90, a tip 93 stored in a protective pipe 96 is provided. The protection pipe 96 is fixed to the nipple 98 of the casing 91 by a nut 92. A recess 93 d is formed inside the cylindrical body of the tip 93, which is covered by the protective pipe 96. A ceramic heater 94 projecting from the casing 91 is assembled into the recess 93 d so as to fit through an insert pipe 95 made of stainless steel or the like.
こて先チップ 9 3は銅や銅合金等からなり、 その先端部にははんだによる侵食を 防止するための鉄めつきが施されている。 しかし、 それでもはんだによる侵食は僅 かずつ進行するため、 通常、 こて先チップ 9 3は交換部品となっている。  The tip 93 is made of copper, a copper alloy, or the like, and its tip is iron-plated to prevent erosion by solder. However, since the erosion by the solder proceeds little by little, the tip 93 is usually a replacement part.
また、 通常は、 様々な先端形状を有するこて先チップ 9 3が多数用意されており、 操作者ははんだ付けする部位や範囲に応じて最適なこて先チップ 9 3を選択し、 交 換して作業を行うようになっている。  Usually, a large number of tip tips 93 having various tip shapes are prepared, and the operator selects the most suitable tip tip 93 according to the part and range to be soldered and replaces it. Work.
こて先チップ 9 3を交換する際には、 ナット 9 2をケ一シング 9 1から完全に取 外し、 ナット 9 2や保護パイプ 9 6を一旦こて先チップ 9 3から抜き去ってからこ て先チップ 9 3を取外し、 交換する。 When replacing the tip 93, remove the nut 92 completely from the casing 91. Remove the nut 92 and the protection pipe 96 once from the tip 93, then remove the tip 93 and replace it.
しかしながら、 上記のような従来構造では、 セラミックヒー夕 9 4とインサート パイプ 9 5との間や、 インサートパイプ 9 5とこて先チップ 9 3との間に隙間 (ェ ァギャップ) が存在するため、 熱の伝達速度が不十分であり、 また熱損失が大きか つた。 そのため、 電源投入後の設定温度までの立ち上がり時間が長くなつたり、 連 続はんだ付けする際の温度降下が大きくなつたり、 或いは連続はんだ付け後に降下 温度から設定温度まで復帰するまでの復帰時間が長くなる等の問題があった。 本発明は、 このような従来技術の課題を解決すべくなされたものであり、 セラミ ックヒ一夕からこて先チップへの熱の伝達速度を高め、 また熱損失を抑制すること により、 上記立ち上がり時間や温度復帰時間を短縮し、 はんだ付けする際の温度降 下を抑制することができるこて先側部材、 及びそれを用いたはんだ加熱器具を提供 することを第一の目的とする。  However, in the above-described conventional structure, there is a gap (ceramic gap) between the ceramic heater 94 and the insert pipe 95 and between the insert pipe 95 and the tip 93, so that heat is not generated. The heat transfer speed was insufficient and the heat loss was large. Therefore, the rise time to the set temperature after turning on the power is long, the temperature drop during continuous soldering is large, or the return time from the drop temperature to the set temperature after continuous soldering is long. There were problems such as becoming. The present invention has been made in order to solve such problems of the conventional technology, and by increasing the speed of heat transfer from the ceramic ceramic to the tip and suppressing the heat loss, it is possible to improve the above-mentioned rise. It is a first object of the present invention to provide a soldering tip member capable of reducing the time and temperature recovery time and suppressing the temperature drop during soldering, and a solder heating device using the same.
一方、 はんだ加熱器具の一種として、 はんだごて等のこて先付近から窒素等の不 活性ガスを噴出させるものが知られている。 これは、 こて先付近を無酸素状態の雰 囲気にしてはんだの酸化を防止するためになされる。 その場合の従来技術は、 ケー シング 9 1内部に不活性ガスを導き、 ケ一シング 9 1内部からこて先チップ 9 3の 先端付近にガス通路を形成して不活性ガスを導くようにしている。 例えば特開 2 0 0 1 - 3 4 7 3 6 9号公報には、 このようなはんだごてとして、 保護パイプ 9 6の 外側に更にパイプを設けたような二重パイプ構造とし、 そのパイプ間の隙間に不活 性ガスを通す構造が示されている。  On the other hand, as a kind of solder heating device, a device that emits an inert gas such as nitrogen from the vicinity of a soldering iron tip is known. This is done in order to prevent the solder from being oxidized by setting the vicinity of the tip to an oxygen-free atmosphere. In the prior art in that case, an inert gas is introduced into the casing 91, and a gas passage is formed from the inside of the casing 91 near the tip of the tip 93 to guide the inert gas. I have. For example, Japanese Patent Application Laid-Open Publication No. 2001-3474769 states that such a soldering iron has a double pipe structure in which a pipe is further provided outside the protective pipe 96, and between the pipes. The structure that allows inert gas to pass through the gap is shown.
本発明の第二の目的は、 このような不活性ガスを噴出させるタイプのはんだ加熱 器具において、 上記第一の目的を達しつつ、 より簡単な構造にすることができるは んだ加熱器具を提供することにある。 発明の開示 本発明のはんだ加熱器具用こて先側部材は、 はんだに直接接触して溶融させる金 属製のこて先チップと、 先端付近に温度検知部が設けられるとともに、 それより基 端側に発熱部が設けられた略棒状のセラミックヒータとを備え、 上記こて先チップ の内部には上記セラミックヒータが密着状態で揷着される凹部が設けられ、 上記凹 部の深さは、 上記セラミックヒータの先端から上記発熱部までの長さ相当以上であ り、 上記凹部を形成する部分には、 その開口部から底面付近にかけて、 該凹部の軸 心を含む平面で軸心に垂直な断面を分割するような切れ込みが設けられていること を特徴とする。 A second object of the present invention is to provide a soldering heating device of the type which ejects such an inert gas and which has a simpler structure while achieving the first object. Is to do. Disclosure of the invention The soldering iron tip member for a solder heating device according to the present invention includes a metal tip tip that is brought into direct contact with and melts the solder, and a temperature detecting portion is provided near the tip, and heat is generated on the proximal end side. A ceramic heater having a substantially rod-like shape provided with a concave portion, wherein a concave portion is provided in the inside of the tip where the ceramic heater is adhered in a close contact state, and a depth of the concave portion is the ceramic heater. In the portion forming the recess, the section perpendicular to the axis is divided by a plane including the axis of the recess from the opening to the vicinity of the bottom. It is characterized by a notch that makes a cut.
このようにすると、 こて先チップとセラミックヒータとが密着することにより、 セラミックヒータからこて先チップへの熱の伝達速度を高め、 また熱損失を抑制す ることができる。 また、 はんだ加熱器具の使用時には、 高温のためにこて先チップ 及びセラミックヒー夕が熱によつて僅かに熱変形する。 こて先チップとセラミック ヒ一夕とは材質が異なるので、 熱膨張率も異なる。 こて先チップとセラミックヒ一 タとが、 完全に密着状態で固定されていると、 その膨張差によってセラミックヒー 夕が損傷を受ける虞がある。 しかし本発明の構成によると、 こて先チップの径方向 の変形 (膨張) が、 上記切れ込みの幅が増減することによって吸収されるので、 セ ラミックヒータに対して大きな圧縮力や引張り力が作用することを効果的に防止す ることができる。  With this configuration, the speed of heat transfer from the ceramic heater to the tip can be increased and the heat loss can be suppressed by the close contact between the tip and the ceramic heater. Also, when using a soldering heater, the tip and ceramic heater are slightly deformed by heat due to the high temperature. Since the material of the tip is different from that of the ceramic, the coefficient of thermal expansion is also different. If the tip chip and the ceramic heater are fixed in a completely adhered state, the ceramic heater may be damaged by the difference in expansion. However, according to the configuration of the present invention, the radial deformation (expansion) of the tip is absorbed by increasing or decreasing the width of the cut, so that a large compressive or tensile force acts on the ceramic heater. Can be effectively prevented.
また、 上記切れ込みを設けつつ、 こて先チップとセラミックヒ一夕との密着を図 る構造として、 上記こて先チップの基端側を覆う筒状部材を備え、 上記こて先チッ プは、 上記凹部の底面付近に相当する位置で上記筒状部材に圧入されており、 他の 部分では上記こて先チップの外周面と上記筒状部材の内面との間に僅かな隙間が設 けられているようにすれば良く、 更に上記筒状部材には、 上記こて先チップの基端 付近に相当する位置に、 外周面に沿って線状の縮径部が設けられ、 該縮径部におい て、 上記こて先チップの外周面と上記筒状部材との内面とが隙間なく当接するよう に構成すれば良い。 これらのようにすると、 こて先チップとセラミックヒータとの密着を図りつつ、 その強接点が、 上記圧入部及び上記縮径部に相当する箇所という最小限度に抑えら れる。 従って、 熱膨張差が生じても、 相互の軸方向ずれが起こり易くなつており、 セラミックヒータに大きな圧縮力や引張り力が作用することを効果的に防止するこ とができる。 In addition, a cylindrical member that covers the base end side of the tip is provided as a structure for achieving close contact between the tip and the ceramic tip while providing the notch, and the tip is provided with: The cylindrical member is press-fitted at a position corresponding to the vicinity of the bottom surface of the concave portion, and a small gap is provided between the outer peripheral surface of the tip and the inner surface of the cylindrical member at other portions. Further, the cylindrical member is provided with a linear reduced diameter portion along the outer peripheral surface at a position corresponding to the vicinity of the base end of the tip. In this case, the outer peripheral surface of the tip and the inner surface of the tubular member may be configured to contact with no gap. By doing so, the tight contact between the tip chip and the ceramic heater is reduced, and the strong contact thereof is minimized to a portion corresponding to the press-fit portion and the reduced-diameter portion. Therefore, even if a difference in thermal expansion occurs, mutual axial displacement is likely to occur, and it is possible to effectively prevent a large compressive or tensile force from acting on the ceramic heater.
なお、 上記こて先チップが上記筒状部材に圧入されている箇所は、 挿着されたセ ラミックヒータの上記温度検知部に相当する位置となるようにすると良い。 このよ うにすると、 温度検知部における密着度が特に高くなり、 より高精度の温度検知が 可能となる。 従って、 はんだ付けによってこて先チップの先端から一時的に熱が奪 われても、 それを速やか且つ正確に温度検知部で検知することができ、 それを補う 熱を発熱部からこて先チップの先端に、 高速且つ低損失で伝達することができる。 上記はんだ加熱器具用こて先側部材を、 これを支持する本体側部材に着脱自在に 設けたはんだ加熱器具は、 はんだ付けする部位や範囲に応じた様々な形状のこて先 チップを備えたこて先側部材を準備しておくことにより、 適宜選択して使用するこ とができる。  The location where the tip is pressed into the cylindrical member is preferably a position corresponding to the temperature detecting portion of the ceramic heater inserted. In this case, the degree of adhesion at the temperature detecting section is particularly increased, and more accurate temperature detection can be performed. Therefore, even if heat is temporarily removed from the tip of the soldering tip by soldering, the temperature can be detected quickly and accurately by the temperature detection unit, and the supplementary heat can be supplemented from the heating unit. Can be transmitted to the tip of the robot at high speed and with low loss. The above-mentioned soldering device in which the soldering tip for a soldering device is detachably attached to the body-side member that supports the soldering device, has a soldering tip having various shapes according to the region and range to be soldered. By preparing the tip side member by hand, it can be appropriately selected and used.
また、 不活性ガス噴出式のはんだ加熱器具に用いたものは、 上記本体側部材に設 けられ、 不活性ガスを上記本体側部材の内部に導入するガス導入部と、 上記こて先 チップの先端付近に設けられ、 導入された不活性ガスを噴出するガス噴出部と、 不 活性ガスを上記ガス導入部から上記ガス噴出部に導くガス通路とを備え、 上記切れ 込み部における上記セラミックヒータの外周面と上記筒状部材の内面との間の隙間 によって上記ガス通路の一部が形成されるとともに、 上記切れ込みの上記凹部底面 付近が上記筒状部材から露出して上記ガス噴出部を形成するようにすると良い。 このようにすると、 上記切り込みによって生じる隙間を不活性ガスの不活性ガス 通路として利用することができるので、 従来構造のように二重パイプ構造とする必 要がなく、 構造を簡単なものにすることができる。 図面の簡単な説明 In addition, an inert gas ejection type solder heating device is provided on the main body side member, and a gas introduction section for introducing an inert gas into the main body side member; A gas ejecting portion provided near the distal end for ejecting the introduced inert gas; and a gas passage for guiding the inert gas from the gas introducing portion to the gas ejecting portion. A part of the gas passage is formed by a gap between the outer peripheral surface and the inner surface of the cylindrical member, and the vicinity of the concave bottom surface of the cut is exposed from the cylindrical member to form the gas ejection portion. It is good to do so. In this way, the gap created by the cut can be used as an inert gas passage for the inert gas, so that there is no need to use a double pipe structure as in the conventional structure, and the structure can be simplified. be able to. Brief Description of Drawings
図 1は、 第 1実施形態に係るはんだ加熱器具 (電気はんだごて) の正面図であり、 (a) はこて先側部材が本体側部材に保持された状態、 (b) はこて先側部材を本 体側部材から取外した状態を示す。  FIG. 1 is a front view of a soldering heater (electric soldering iron) according to a first embodiment, where (a) shows a state in which a tip side member is held by a main body side member, and (b) shows a state where a soldering iron is held. This shows a state in which the front member has been removed from the body member.
図 2は、 図 1 (a) の部分断面図である。  FIG. 2 is a partial cross-sectional view of FIG.
図 3は、 第 1実施形態に係る電気はんだごてのセラミックヒータの構成を示す概 念図であり、 (a) はセラミックヒータの回路構成を、 (b) はセラミックダリ一 ンシートをセラミック棒に巻き付けてセラミックヒータが形成される状態を示す。 図 4は、 第 1実施形態に係る電気はんだごてのこて先チップ周辺の詳細構造を示 す図であり、 ) は部分断面図、 (b) は (a) の III— III 断面図、 (c) は FIGS. 3A and 3B are conceptual diagrams showing the configuration of the ceramic heater of the electric soldering iron according to the first embodiment. FIG. 3A shows the circuit configuration of the ceramic heater, and FIG. This shows a state where the ceramic heater is formed by winding. FIG. 4 is a diagram showing a detailed structure around the tip of an electric soldering iron according to the first embodiment,) is a partial sectional view, (b) is a III-III sectional view of (a), (C) is
(a) の p部及び q部付近の拡大図である。 It is an enlarged view near p part and q part of (a).
図 5は、 第 1実施形態に係る電気はんだごての温度特性を従来の電気はんだごて の温度特性と比較する説明図であり、 (a) は第 1実施形態の温度特性を、 (b) は従来構造のものの温度特性を示す。  FIGS. 5A and 5B are explanatory diagrams comparing the temperature characteristics of the electric soldering iron according to the first embodiment with the temperature characteristics of the conventional electric soldering iron. FIG. 5A shows the temperature characteristics of the first embodiment, and FIG. ) Shows the temperature characteristics of the conventional structure.
図 6は、 第 2実施形態に係るはんだ加熱器具 (ガス噴出式電気はんだごて) の正 面断面図であり、 不活性ガスが本体側部材からこて先側部材に導かれる状態を示す。 図 7は、 図 6の部分拡大図である。  FIG. 6 is a front cross-sectional view of the solder heating device (gas ejection type electric soldering iron) according to the second embodiment, showing a state in which an inert gas is guided from the main body side member to the iron tip side member. FIG. 7 is a partially enlarged view of FIG.
図 8は、 第 3実施形態に係るはんだ加熱器具 (電気はんだ吸取りごて) のこて先 付近の正面部分断面図であり、 (a) はセラミックヒータの外部からはんだ吸引管 を導くもの、 (b) はセラミックヒータの内部にはんだ吸引管を通したものを示す。 図 9は、 従来のはんだ加熱器具の構造を示し、 (a) は部分正面図であり、  FIG. 8 is a front partial cross-sectional view of the vicinity of the soldering tip of the solder heating device (electric soldering iron) according to the third embodiment, where (a) guides the solder suction tube from outside the ceramic heater, b) shows a ceramic heater passed through a solder suction tube. Fig. 9 shows the structure of a conventional solder heating device, where (a) is a partial front view,
(b) はその分解斜視図である。 発明を実施するための最良の形態  (b) is an exploded perspective view thereof. BEST MODE FOR CARRYING OUT THE INVENTION
以下に、 本発明に係るはんだ加熱器具の実施形態につき具体的に説明する。  Hereinafter, embodiments of the solder heating device according to the present invention will be specifically described.
(第 1実施形態) 図 1は本発明の第 1実施形態である電気はんだごて 1 0 (はんだ加熱器具) の正 面図であり、 (a ) はこて先側部材 2 0が本体側部材 2 5に保持された状態、 ( b ) はこて先側部材 2 0を本体側部材 2 5から取外した状態を示す。 (First Embodiment) FIG. 1 is a front view of an electric soldering iron 10 (solder heating device) according to a first embodiment of the present invention, in which (a) shows a state in which a tip side member 20 is held by a main body side member 25. (B) shows a state where the tip side member 20 is detached from the main body side member 25.
また図 2は、 図 1 ( a ) の部分断面図である。  FIG. 2 is a partial cross-sectional view of FIG.
図 1及び図 2を参照して電気はんだごて 1 0の構造を説明する。 電気はんだごて 1 0の基本的な構成は、 本体側部材 2 5の先端 (図 1で左側) に、 揷脱自在のこて 先側部材 2 0を揷着してなる。  The structure of the electric soldering iron 10 will be described with reference to FIGS. The basic configuration of the electric soldering iron 10 is such that a detachable iron tip member 20 is attached to the tip (left side in FIG. 1) of the main body member 25.
こて先側部材 2 0の先端には、 主に銅 (他に銅合金、 銀、 或いは銀合金など熱伝 導性の高い物質でも良い) からなり、 はんだに直接接触してはんだ付けを行うこて 先チップ 3が設けられている。 こて先チップ 3の基端側は保護パイプ 6 (筒状部 材) に嵌揷され、 先端側は保護パイプ 6から露出してはんだ付けに適した形状に成 形されている。  The tip of the tip side member 20 is mainly made of copper (other materials such as copper alloy, silver, or silver alloy may be used) and soldered by direct contact with the solder. A tip 3 is provided. The proximal end of the tip 3 is fitted into a protective pipe 6 (tubular member), and the distal end is exposed from the protective pipe 6 and formed into a shape suitable for soldering.
こて先チップ 3の内部には凹部が設けられて有底円筒状になっている。 この凹部 には、 セラミックヒータ 4が密着状態で揷着されている。 セラミックヒータ 4は、 先端付近に温度検知部 4 aが設けられるとともに、 それより基端側に発熱部 4 bが 設けられている。 これらの配線はリード線 8 (温度検知部用リード線 8 a及び発熱 部用リード線 8 b ) によって外部に導出され、 こて先側コネクタ 9に接続されてい る。 またセラミックヒータ 4の基端側は、 金属製で略円筒状のホルダ 7に嵌挿され、 保持されている。 図 1 ( b ) 及び図 2に示すように、 こて先チップ 3、 セラミック ヒ一タ 4、 保護パイプ 6、 ホルダ 7、 リード線 8及びこて先側コネクタ 9は一体に 構成されている。  A concave portion is provided inside the tip 3 and has a cylindrical shape with a bottom. A ceramic heater 4 is attached to the concave portion in a closely contacting state. The ceramic heater 4 is provided with a temperature detecting portion 4a near the distal end and a heat generating portion 4b near the proximal end. These wirings are led out to the outside by lead wires 8 (lead wire 8a for the temperature detecting section and lead wire 8b for the heating section), and are connected to the tip side connector 9. Further, the base end side of the ceramic heater 4 is fitted and held by a substantially cylindrical holder 7 made of metal. As shown in FIGS. 1 (b) and 2, the tip 3, the ceramic heater 4, the protection pipe 6, the holder 7, the lead wire 8, and the tip connector 9 are integrally formed.
本体側部材 2 5は、 主にケ一シング 1、 固定ナット 2及びこれらに挟持される O リング 1 2 (弹性部材) からなる。 ケーシング 1は、 金属製もしくは、 硬質、 耐熱 性の合成樹脂からなる概ね円管状の部材であり、 その周囲には、 操作者が電気はん だごて 1 0を握って取り扱うことができるようにするために、 合成ゴムなど、 断熱 性と弾力性を有した合成樹脂が握り部 1 aとして設けられている。 ケーシング 1の 内部にはこて先側コネクタ 9と接合される本体側コネクタ 1 5が設けられ、 電気コ —ド 1 bが接続されている。 電気コード 1 bはケーシング 1の外部に導出され、 図 外のコントローラ (こて先温度を設定値に保つように制御された電力をセラミック ヒータ 4に供給する制御装置) に接続されている。 The main body-side member 25 mainly includes a casing 1, a fixing nut 2, and an O-ring 12 (positive member) sandwiched therebetween. The casing 1 is a generally tubular member made of a metal or a hard and heat-resistant synthetic resin, and the surrounding area is provided so that an operator can hold the electric soldering iron 10 and handle it. For this purpose, a synthetic resin having heat insulation and elasticity, such as synthetic rubber, is provided as the grip 1a. Casing 1 Inside, a main body side connector 15 to be joined to the iron tip side connector 9 is provided, and an electric cord 1 b is connected. The electric cord 1 b is led out of the casing 1 and connected to a controller (a control device for supplying electric power controlled to maintain the tip temperature to the set value to the ceramic heater 4).
固定ナツト 2はケーシング 1の先端外周部に螺着されているナツト状部材である。 その外周部には口一レツト処理が施されて操作者が手動で回転させ易くなつている。 そして、 固定ナット 2を回転させることにより、 固定ナット 2はケーシング 1に対 して可動範囲内で自由に軸方向の移動ができるようになつている。  The fixed nut 2 is a nut-like member screwed to the outer periphery of the distal end of the casing 1. The outer peripheral portion is subjected to a mouth-letting process so that the operator can easily rotate it manually. By rotating the fixing nut 2, the fixing nut 2 can freely move in the axial direction within the movable range with respect to the casing 1.
固定ナット 2の内径側段差部とケ一シング 1の先端面とで挟持されるように 0リ ング 1 2が設けられている。 Oリング 1 2は、 ゴム等の弾性体からなり、 こて先側 部材 2 0の揷着状態でホルダ 7が嵌挿される位置に設けられている。  An O-ring 12 is provided so as to be sandwiched between the step portion on the inner diameter side of the fixing nut 2 and the tip end surface of the casing 1. The O-ring 12 is made of an elastic material such as rubber, and is provided at a position where the holder 7 is inserted when the tip side member 20 is attached.
固定ナツト 2の、 めねじ形成部より後端側には、 固定ナツト 2がケーシング 1か ら完全に離脱することを防止する皿ねじ 5が設けられている。  On the rear end side of the fixed nut 2 from the female screw forming portion, a flathead screw 5 for preventing the fixed nut 2 from completely detaching from the casing 1 is provided.
図 3はセラミックヒータ 4の構成を示す概念図であり、 (a ) は、 セラミックヒ 一夕 4の回路構成を示し、 (b ) は、 セラミックグリーンシート 4 cをセラミック 棒 4 dに巻きつけてセラミツクヒ一夕 4が形成されている状態を示している。 図 3 を参照してセラミックヒ一夕 4の構造について説明する。  FIG. 3 is a conceptual diagram showing the configuration of the ceramic heater 4. (a) shows the circuit configuration of the ceramic heater 4; and (b) shows a ceramic green sheet 4c wound around a ceramic rod 4d. This shows the state where overnight 4 is formed. The structure of the ceramic capacitor 4 will be described with reference to FIG.
セラミックヒ一夕 4は、 温度検知部 4 aに設けられたタングステンなどの感温抵 抗体のパターンと、 発熱部 4 bに設けられたタングステンなどの発熱抵抗体のパタ 一ンとをセラミックグリーンシート 4 cに同時にプリン卜したものを、 ベースとな るアルミナゃ窒化珪素などの円柱状のセラミック棒 4 dに巻きつけ、 焼結一体化し て作製されるものである。 温度検知部 4 aからは温度検知部用リード線 8 aが、 発 熱部 4 bからは発熱部用リード線 8 bが導出され、 こて先側コネクタ 9に結合され ている。  The ceramic heater 4 is composed of a ceramic green sheet 4 formed by a pattern of a temperature-sensitive resistor such as tungsten provided in the temperature detecting section 4a and a pattern of a heating resistor such as tungsten provided in the heating section 4b. The product printed at the same time as c is wound around a cylindrical ceramic rod 4d such as alumina / silicon nitride as the base and sintered and integrated. A lead wire 8a for the temperature detecting portion is led out from the temperature detecting portion 4a, and a lead wire 8b for the heat generating portion is led out from the heat generating portion 4b, and connected to the tip side connector 9.
図 4は、 こて先チップ 3周辺の詳細構造を示す図であり、 (a ) は部分断面図、 ( b ) は (a ) の III一 ΠΙ断面図 (図を簡略化するため、 セラミックヒータ 4の内 部構造は省略している) 、 (c ) は (a ) の P部及び Q部付近の拡大図である。 図 4を参照してこて先チップ 3周辺の詳細構造について説明する。 4A and 4B are views showing a detailed structure around the tip 3. FIG. 4A is a partial cross-sectional view, and FIG. 4B is a cross-sectional view taken along the line III-III of FIG. Of 4 (Circuit structure is omitted.) (C) is an enlarged view of the vicinity of the P part and the Q part of (a). The detailed structure around the tip 3 will be described with reference to FIG.
こて先チップ 3の内部には凹部 3 dが設けられて有底円筒状になっており、 セラ ミックヒ一夕 4の先端側が密着状態で揷着されている。 凹部 3 dの深さは、 セラミ ックヒ一夕 4の先端から、 発熱部 4 bまでの長さ相当以上である。 つまりセラミツ クヒータ 4の温度検知部 4 aや発熱部 4 bは、 周囲をこて先チップ 3に覆われた状 態となつている。 こて先チップ 3の有底円筒部の底面側 (先端側) の外径は比較的 大径となっている (大径部 3 a ) 。 大径部 3 aの範囲は、 セラミックヒータ 4が揷 着された状態で温度検知部 4 aに略相当する部分であり、 力、つ保護パイプ 6に嵌揷 された状態で、 保護パイプ 6の先端部分に相当する部分である。 大径部 3 aよりも 基端側の有底円筒部は、 大径部 3 aよりも僅かに径の小さな小径部 3 bとなってい る。  A recess 3 d is provided inside the tip 3 and has a bottomed cylindrical shape, and the tip side of the ceramic heater 4 is adhered in a tight contact state. The depth of the recess 3d is equal to or greater than the length from the tip of the ceramic window 4 to the heating portion 4b. In other words, the temperature detecting section 4 a and the heat generating section 4 b of the ceramic heater 4 are in a state of being covered with the tip 3 around. The outer diameter of the bottom side (tip side) of the bottomed cylindrical portion of the tip 3 is relatively large (large diameter portion 3a). The range of the large-diameter portion 3a is a portion substantially equivalent to the temperature detecting portion 4a when the ceramic heater 4 is attached, and when the ceramic heater 4 is fitted to the protective pipe 6 when the ceramic heater 4 is attached. This is a portion corresponding to the tip portion. The bottomed cylindrical portion closer to the base end than the large diameter portion 3a is a small diameter portion 3b slightly smaller in diameter than the large diameter portion 3a.
凹部 3 dを形成する部分 (主に大径部 3 a及び小径部 3 b ) には、 その開口部か ら底面付近にかけて、 凹部 3 dの軸心を含む平面 (図 4 ( a ) において、 凹部 3 d の軸心を通り、 紙面に垂直な平面) で軸心に垂直な断面 (図 4 ( b ) に示す断面) を分割するような切れ込み 3 cが設けられている。 切れ込み 3 cは大径部 3 aより も更に深く入っており、 保護パイプ 6に嵌挿された状態で、 その先端側が露出して 切れ込み露出部 3 eとなっている。  The portion forming the concave portion 3d (mainly the large-diameter portion 3a and the small-diameter portion 3b) includes, from the opening to the vicinity of the bottom surface, a plane including the axis of the concave portion 3d (see FIG. 4A). A notch 3c is provided that divides a cross section perpendicular to the axis (a cross section shown in Fig. 4 (b)) at a plane passing through the axis of the recess 3d and perpendicular to the paper plane. The notch 3c is deeper than the large-diameter portion 3a, and when inserted into the protective pipe 6, its distal end is exposed to form a notch exposed portion 3e.
切れ込み 3 cによって、 こて先チップ 3の大径部 3 a及び小径部 3 bは、 切れ込 み 3 cの両側に拡がり易くなつている。 従って、 セラミックヒータ 4が揷着された とき、 その外周を規制するものがないとき (まだ保護パイプ 6に嵌挿されていない 状態) は、 セラミックヒータ 4の外周面と大径部 3 a及び小径部 3 bの内周面とは 密着してはいるものの、 その密着力は弱く、 僅かながらエアギャップが存在してい る。  Due to the notch 3c, the large-diameter portion 3a and the small-diameter portion 3b of the tip 3 are easily spread on both sides of the notch 3c. Therefore, when the ceramic heater 4 is attached and there is nothing to restrict the outer circumference (in a state where it is not yet inserted into the protective pipe 6), the outer peripheral surface of the ceramic heater 4 and the large-diameter portion 3a and the small-diameter Although it is in close contact with the inner peripheral surface of part 3b, its adhesion is weak and there is a slight air gap.
保護パイプ 6の自由時の内径は、 大径部 3 aよりも僅かに小さく、 小径部 3 bよ りも僅かに大きい。 従って、 こて先チップ 3を保護パイプ 6に嵌揷すると、 大径部 3 aでは圧入となり、 小径部 3 bでは保護パイプ 6との間に僅かな隙間が生じる。 保護パイプ 6の、 こて先チップ 3の基端付近に相当する位置 (図 4 ( a ) 及びThe inner diameter of the protection pipe 6 when it is free is slightly smaller than the large diameter portion 3a and slightly larger than the small diameter portion 3b. Therefore, when the tip 3 is fitted into the protective pipe 6, the large diameter portion 3a is press-fitted, and a small gap is formed between the small-diameter portion 3b and the protective pipe 6. The position corresponding to the vicinity of the base end of the tip 3 of the protection pipe 6 (see FIG. 4 (a) and
( c ) の q部) に、 外周面に沿って線状の縮径部 6 aが設けられている。 縮径部 6 aでは、 小径部 3 bの外周面と保護パイプ 6の内面とが隙間なく当接している。 従って、 こて先チップ 3が保護パイプ 6に嵌挿された状態では、 大径部 3 aと、 小径部 3 bの縮径部 6 aに当接する部分とがこて先チップ 3の外周を強く規制する。 このため、 セラミックヒ一夕 4とこて先チップ 3との密着度も、 これらに相当する 箇所 (第 1強接点 h及び第 2強接点 j ) で強くなつている。 このように、 セラミツ クヒータ 4がこて先チップ 3に挿着される部分のほぼ両端部で強く密着させられる ため、 全体の密着度も高くなつている。 In (q) of (c)), a linear reduced diameter portion 6a is provided along the outer peripheral surface. In the reduced diameter portion 6a, the outer peripheral surface of the small diameter portion 3b and the inner surface of the protection pipe 6 abut without any gap. Therefore, when the tip 3 is inserted into the protective pipe 6, the large-diameter portion 3a and the portion of the small-diameter portion 3b that abuts on the reduced-diameter portion 6a extend around the outer periphery of the tip 3. Regulate strongly. For this reason, the degree of adhesion between the ceramic capacitor 4 and the tip 3 is also strong at locations corresponding to these (the first strong contact h and the second strong contact j). As described above, since the ceramic heater 4 is strongly adhered to almost both ends of the portion to be inserted into the tip 3, the overall adhesion is also high.
次に、 上記構造の電気はんだごて 1 0の作用について説明する。 まずはんだ付け を行うにあたり、 操作者は、 作業に最適なこて先形状を有するこて先側部材 2 0を 選択し、 本体側部材 2 5に挿着する。 その際、 固定ナット 2を緩めてホルダ 7をケ 一シング 1の先端部に挿入する。  Next, the operation of the electric soldering iron 10 having the above structure will be described. First, when performing soldering, the operator selects a tip-side member 20 having a tip shape that is optimal for the work, and inserts it into the body-side member 25. At this time, loosen the fixing nut 2 and insert the holder 7 into the tip of the casing 1.
ホルダ 7を挿入したら、 次に固定ナット 2を締め込んで 0リング 1 2を変形させ、 ホルダ 7を周囲から押付けることによって固定する。 こうしてこて先側部材 2 0を 本体側部材 2 5に揷着後、 操作者は図外のコントローラの電源を投入し、 要求され るこて先の温度設定を行う。 コントローラからは設定温度に応じた電力がセラミツ クヒータ 4の発熱部 4 bに供給され、 発熱部 4 bが発熱する。  After the holder 7 is inserted, the fixing nut 2 is tightened to deform the O-ring 12, and the holder 7 is fixed by pressing the holder 7 from the periphery. After attaching the tip side member 20 to the main body side member 25 in this way, the operator turns on the power of a controller (not shown) and sets the required tip temperature. Electric power corresponding to the set temperature is supplied from the controller to the heating section 4b of the ceramic heater 4, and the heating section 4b generates heat.
発熱部 4 bで発生した熱は、 こて先チップ 3に伝達されるが、 セラミックヒー夕 4とこて先チップ 3の大径部 3 a及び小径部 3 bとが良好に密着しているので、 そ の熱伝導は高速かつ低損失でなされる。  The heat generated in the heat-generating portion 4b is transmitted to the tip 3, but the ceramic heater 4 and the large-diameter portion 3a and the small-diameter portion 3b of the tip 3 are in good contact with each other. Its heat conduction is performed at high speed and with low loss.
こて先チップ 3の先端部の温度は、 セラミックヒータ 4の温度検知部 4 aによつ て検知され、 図外のコントローラに信号伝達される。 温度検知部 4 a付近は、 第 1 強接点 hとなっているので、 特に密着度が高く、 より高精度の温度検知が可能とな つている。 従って、 はんだ付けによってこて先チップ 3の先端から一時的に熱が奪 われても、 それを速やか且つ正確に温度検知部 4 aで検知することができ、 それを 補う熱を発熱部 4 bからこて先チップ 3の先端に、 高速且つ低損失で伝達すること ができる。 The temperature of the tip of the tip 3 is detected by the temperature detection section 4a of the ceramic heater 4 and transmitted to a controller (not shown). Since the vicinity of the temperature detecting section 4a is the first strong contact point h, the degree of adhesion is particularly high, and more accurate temperature detection is possible. Therefore, heat is temporarily removed from the tip of the tip 3 by soldering. In this case, the temperature can be quickly and accurately detected by the temperature detection section 4a, and the supplementary heat can be transmitted from the heating section 4b to the tip of the tip 3 with high speed and low loss. it can.
図 5は、 電気はんだごて 10の温度特性を従来構造の電気はんだごて 90 (図 9 参照) の温度特性と比較した説明図であり、 (a) は電気はんだごて 10の温度特 性を、 (b) は従来構造の電気はんだごて 90の温度特性を示す。 それぞれ、 横軸 に時間 (s) 、 縦軸にこて先温度 CC) を示す。  Fig. 5 is an explanatory diagram comparing the temperature characteristics of the electric soldering iron 10 with the temperature characteristics of the conventional structure of the electric soldering iron 90 (see Fig. 9). (B) shows the temperature characteristics of an electric soldering iron 90 having a conventional structure. In each case, the horizontal axis shows time (s) and the vertical axis shows tip temperature CC).
設定温度はともに 350°Cで、 コントローラは同じものを使用した。 これらの温 度特性で、 温度が激しく上下している区間では連続はんだ付けに相当する動作 (以 下連続はんだ付けという) を行っている。 連続はんだ付けは 10mm角カット面の 銅フエノ一ル基板上の鉛入りはんだ盛り部に、 こて先を 3秒間隔で当接させて行つ た。  The set temperatures were both 350 ° C and the same controller was used. With these temperature characteristics, an operation equivalent to continuous soldering (hereinafter referred to as continuous soldering) is performed in sections where the temperature rises and falls sharply. Continuous soldering was performed with the tip of the solder abutted at intervals of 3 seconds on the lead-filled solder on the copper phenolic board with a 10 mm square cut surface.
図 5 (b) を参照して、 従来構造では電源投入からこて先温度が設定温度まで上 昇する立ち上がり時間 t 11が、 t 11=71 sであった。 また、 連続はんだ付け 区間では、 温度降下 Td 11 (1回毎の温度復帰が遅れることにより発生する) が、 Td 1 1=45°Cであった。 そして、 連続はんだ付け後、 再び設定温度に復帰する までの復帰時間 t 12は、 t 12 = 23 sであった。  Referring to Fig. 5 (b), in the conventional structure, the rise time t11 at which the tip temperature rises from the power-on to the set temperature was t11 = 71s. In the continuous soldering section, the temperature drop Td 11 (which occurs due to the delay of each temperature return) was Td 11 = 45 ° C. Then, after continuous soldering, the recovery time t12 before returning to the set temperature again was t12 = 23 s.
これに対して当実施形態の電気はんだごて 10によると、 図 5 (a) を参照して、 それぞれ立ち上がり時間 t 1 = 24 s ( t 1 1の約 1 Z 3 ) 、 温度降下 T d 1 = 5 (Td l lの 1/9) 、 復帰時間 t 2 = s (t 12の約 1/6) であった。 つまり、 温度の立ち上がり時間や復帰時間が大幅に短縮され、 温度降下が激減して いる。 これは、 当実施形態のこて先側部材 20を用いた結果、 発熱部 4 bからこて 先チップ 3の先端に、 高速且つ低損失で熱伝達したことや、 温度検知部 4 aの温度 検知精度が向上したことによる顕著な効果である。  On the other hand, according to the electric soldering iron 10 of this embodiment, referring to FIG. 5A, the rise time t 1 = 24 s (about 1 Z 3 of t 11) and the temperature drop T d 1 = 5 (1/9 of Tdll) and recovery time t2 = s (about 1/6 of t12). In other words, the rise time and return time of the temperature are greatly reduced, and the temperature drop is drastically reduced. This is because, as a result of using the tip member 20 of the present embodiment, heat was transferred from the heating portion 4b to the tip of the tip 3 with high speed and low loss, and the temperature of the temperature detection portion 4a was high. This is a remarkable effect due to the improvement in detection accuracy.
なお、 電気はんだごて 10の使用時には、 高温のためにこて先チップ 3及びセラ ミックヒータ 4が熱によって僅かに熱変形する。 こて先チップ 3とセラミックヒ一  When the electric soldering iron 10 is used, the tip 3 and the ceramic heater 4 are slightly deformed by heat due to high temperature. Tip 3 and ceramic chip
0 夕 4とは材質が異なるので、 熱膨張率も異なる。 こて先チップ 3とセラミックヒー 夕 4とが、 完全に密着状態で固定されていると、 その膨張差によってセラミックヒ —夕 4が損傷を受ける虞があるが、 当実施形態の構造では、 その損傷を効果的に防 止している。 即ち、 こて先チップ 3の径方向の変形 (膨張) は、 切れ込み 3 cの幅 が増減することによって吸収され、 セラミックヒータ 4に対して大きな圧縮力や引 張り力が作用することを防止している。 また軸方向の変形については、 強接点が第 1強接点 hと第 2強接点 jという最小限度に抑えられているため、 密着しつつも相 互の軸方向ずれが起こり易くなつており、 大きな圧縮力や引張り力が作用しないよ うになつている。 0 Since the material is different from that of Evening 4, the coefficient of thermal expansion is also different. If the tip 3 and the ceramic heater 4 are fixed in a tightly adhered state, the expansion difference may damage the ceramic heater 4, but in the structure of the present embodiment, the damage is caused by the damage. Is effectively prevented. That is, the deformation (expansion) of the tip 3 in the radial direction is absorbed by the increase or decrease in the width of the notch 3 c, thereby preventing a large compressive or tensile force from acting on the ceramic heater 4. ing. As for the deformation in the axial direction, the strong contacts are minimized to the first strong contact h and the second strong contact j. Compression and tension are not applied.
こて先チップ 3を交換する必要が生じたときには、 電源を切り、 固定ナット 2を 緩めてこて先側部材 2 0を引き抜き、 新たなこて先側部材 2 0を挿入して交換する。  When it becomes necessary to replace the tip 3, the power is turned off, the fixing nut 2 is loosened, the tip member 20 is pulled out, and a new tip member 20 is inserted and replaced.
(第 2実施形態)  (Second embodiment)
次に、 本発明の第 2実施形態について説明する。 図 6は、 第 2実施形態に係るは んだ加熱器具 (ガス噴出式電気はんだごて 5 0 ) の正面断面図であり、 こて先側部 材 5 8が本体側部材 5 9に揷着された状態を示す。 なお、 以下の実施形態において、 第 1実施形態と同一部分には同一符号を付して示し、 その重複説明を省略する。 ケーシング 5 1の基端部に、 不活性ガス (窒素等) をケーシング 5 1 (本体側部 材 5 9 ) の内部に導入するガス導入部 5 2が設けられている。 ガス導入部 5 2には 接続端子 5 5が接続され、 ガス導入管 5 7を介して図外の不活性ガス供給装置に接 続されている。  Next, a second embodiment of the present invention will be described. FIG. 6 is a front sectional view of the soldering device (gas ejection type electric soldering iron 50) according to the second embodiment, in which the tip side member 58 is attached to the main body side member 59. It shows the state that was done. In the following embodiments, the same portions as those of the first embodiment are denoted by the same reference numerals, and the description thereof will not be repeated. At the base end of the casing 51, there is provided a gas introduction part 52 for introducing an inert gas (nitrogen or the like) into the inside of the casing 51 (body part 59). A connection terminal 55 is connected to the gas introduction section 52, and is connected to an inert gas supply device (not shown) via a gas introduction pipe 57.
一方、 保護パイプ 6の先端付近にはガス整流キャップ 5 3が取り付けられている。 ガス整流キャップ 5 3は、 切れ込み露出部 3 e (図 4 ( a ) 参照) の周囲を隙間を 空けて取り囲む略円筒状の整流板であり、 切れ込み露出部 3 eから径方向に噴出し た不活性ガスをこて先チップ 3の先端方向に導くように構成されている。 他の構成 は第 1実施形態と同様である。  On the other hand, a gas rectifying cap 53 is attached near the tip of the protection pipe 6. The gas rectifying cap 53 is a substantially cylindrical rectifying plate surrounding the notch exposed portion 3 e (see FIG. 4 (a)) with a gap provided between the notch exposed portion 3 e (see FIG. 4 (a)). The active gas is configured to be guided toward the tip of the tip 3. Other configurations are the same as those of the first embodiment.
図 7は、 図 6に示すこて先チップ 3付近の拡大図である。 但し、 説明のためにこ て先チップ 3を軸周りに 9 0 ° 回転させた状態で示している。 図 6及び図 7を参 照して主に不活性ガスに関する作用について説明する。 ガス導入部 5 2からケーシ ング 5 1の内部に導入された不活性ガスは、 図 6の矢印に示すようにケーシング 5 1の内部隙間を経由して、 ホルダ 7の内径側からこて先側部材 5 8の内部に導かれ る。 このとき、 こて先側部材 5 8と本体側部材 5 9との接続部の気密は、 0リング 1 2によって保持されている。 FIG. 7 is an enlarged view near the tip 3 shown in FIG. However, for explanation The tip 3 is shown rotated 90 ° around the axis. With reference to FIG. 6 and FIG. 7, the operation mainly related to the inert gas will be described. The inert gas introduced into the casing 51 from the gas introduction section 52 passes through the internal gap of the casing 51 as shown by the arrow in FIG. It is guided inside the member 58. At this time, the airtightness of the connection between the tip side member 58 and the main body side member 59 is maintained by the O-ring 12.
こて先側部材 5 8の内部に導かれた不活性ガスは、 セラミックヒー夕 4と保護パ ィプ 6との間の隙間を通ってこて先チップ 3に達する。 そして、 こて先チップ 3の 切れ込み 3 c (図 7及び図 4 ( b ) 参照) を通って切れ込み露出部 3 eから噴出す る。 噴出した不活性ガスは、 ガス整流キャップ 5 3によってこて先チップ 3の先端 付近に導かれ、 こて先付近を無酸素雰囲気にする。 従ってはんだ付けの際にはんだ の酸化が防止され、 良好なはんだ付けを行うことができる。  The inert gas introduced into the inside of the tip side member 58 reaches the tip 3 through a gap between the ceramic heater 4 and the protection pipe 6. Then, the gas is ejected from the cut-out exposed portion 3e through the cut 3c (see FIGS. 7 and 4 (b)) of the tip 3. The spouted inert gas is guided by the gas rectifying cap 53 to the vicinity of the tip of the tip 3 to make the vicinity of the tip an oxygen-free atmosphere. Therefore, oxidation of the solder during soldering is prevented, and good soldering can be performed.
以上のように、 切れ込み 3 cを利用して不活性ガスをこて先に導くようにしてい るので、 従来構造 (保護パイプ 6の外側に更にパイプを設けた二重構造とし、 その パイプ間の隙間に不活性ガスを通したような構造) に比べて簡単な構造とすること ができる。 また保護パイプ 6とガス整流キャップ 5 3との接続を、 ねじ等によって 着脱可能としても良い。 不活性ガスを噴出させる必要のないときには、 ガス整流キ ヤップ 5 3を取外した方がはんだ付け時のこて先の視認性が良くなる。  As described above, since the inert gas is guided to the tip using the notch 3 c, the conventional structure (a double structure in which a pipe is further provided outside the protection pipe 6 and the space between the pipes is adopted) (A structure in which an inert gas is passed through the gap). The connection between the protection pipe 6 and the gas rectifying cap 53 may be made detachable by screws or the like. When there is no need to blow out inert gas, removing the gas rectifying cap 53 improves the visibility of the soldering tip during soldering.
(第 3実施形態)  (Third embodiment)
次に、 本発明の第 3実施形態について説明する。 図 8は、 第 3実施形態に係るは んだ加熱器具 (電気はんだ吸取りごて 6 0, 7 0 ) の正面部分断面図である。 電気 はんだ吸取りごて 6 0 , 7 0は、 はんだを溶融して吸引し、 除去するもので、 はん だ吸引管 6 1, 7 1を備えている。  Next, a third embodiment of the present invention will be described. FIG. 8 is a front partial sectional view of a soldering device (electric solder desoldering iron 60, 70) according to the third embodiment. The electric solder desoldering irons 60 and 70 melt and suck and remove the solder, and are equipped with solder suction tubes 61 and 71.
図 8 ( a ) はセラミックヒータ 4の外部からはんだ吸引管 6 1を導くものである。 こて先側部材 6 8の構造として、 保護パイプ 6 6の先端に設けられたこて先チップ 6 3に、 その先端に筒状の吸取りノズル 6 2が螺着されている (こて先チップ 6 3  FIG. 8 (a) shows that the solder suction tube 61 is guided from the outside of the ceramic heater 4. As the structure of the tip side member 68, a cylindrical suction nozzle 62 is screwed to the tip of the tip tip 63 provided at the tip of the protective pipe 66 (the tip tip 6). Three
2 と一体成形しても良い) 。 そしてはんだ吸引管 6 1が、 こて先チップ 6 3を貫通し て吸取りノズル 6 2の内径側と連通するように設けられている。 はんだ吸引管 6 1 の他端は図外の真空吸引装置に接続されている。 2 And may be integrally molded). A solder suction tube 61 is provided so as to penetrate the tip tip 63 and communicate with the inner diameter side of the suction nozzle 62. The other end of the solder suction tube 61 is connected to a vacuum suction device (not shown).
このような構成により、 セラミックヒータ 4で発生した熱がこて先チップ 6 3を 経由して吸取りノズル 6 2の先端に伝達され、 これに当接したはんだを溶融させる。 溶融したはんだは、 真空吸引によって吸取り口 6 5から吸取られ、 除去される。  With such a configuration, the heat generated by the ceramic heater 4 is transmitted to the tip of the suction nozzle 62 via the tip 63 and melts the solder in contact therewith. The molten solder is sucked and removed from the suction port 65 by vacuum suction.
図 8 ( b ) はセラミックヒー夕 4の内部にはんだ吸引管 7 1を通したものである。 こて先側部材 7 8の構造として、 保護パイプ 7 6の先端に設けられたこて先チップ 7 3に、 その軸心を貫通する貫通孔 7 2が設けられている。 その貫通孔 7 2と連通 するはんだ吸引管 7 1が、 セラミックヒータ 4の内部を通って図外の真空吸弓 I装置 に接続されている。  FIG. 8 (b) shows the ceramic heater 4 with the solder suction pipe 71 passed through. As a structure of the tip side member 78, a through hole 72 penetrating the axis thereof is provided in the tip tip 73 provided at the tip of the protection pipe 76. A solder suction pipe 71 communicating with the through hole 72 passes through the inside of the ceramic heater 4 and is connected to a vacuum suction I device (not shown).
このような構成により、 セラミックヒー夕 4で発生した熱がこて先チップ 7 3の 先端に伝達され、 これに当接したはんだを溶融させる。 溶融したはんだは、 真空吸 引によって吸取り口 7 5から吸取られ、 除去される。  With this configuration, the heat generated in the ceramic heater 4 is transmitted to the tip of the tip 73 and melts the solder in contact with the tip. The molten solder is sucked and removed from the suction port 75 by vacuum suction.
これらのはんだ加熱器具においても、 そのこて先側部材 6 8やこて先側部材 7 8 の構造を第 1実施形態と同様とすることにより、 立ち上がり時間や復帰時間の短縮 および温度降下の抑制等の効果を得ることができる。  Also in these soldering heaters, the structures of the tip side member 68 and the tip side member 78 are the same as those of the first embodiment, so that the rise time and the return time can be shortened and the temperature drop can be suppressed. The effect of can be obtained.
以上第 1〜第 3実施形態について説明したが、 本発明はこれらに限定するもので まなく、 特許請求の範囲で適宜変形して良い。 例えば、 こて先側部材と本体側部材 との結合方法は、 上記のような Oリングを用いた構造である必要はなく、 適宜設計 变更して良い。 産業上の利用可能性  Although the first to third embodiments have been described above, the present invention is not limited to these, and may be appropriately modified within the scope of the claims. For example, the method of connecting the tip side member and the main body side member does not need to have the structure using the O-ring as described above, and may be appropriately designed and changed. Industrial applicability
上述したように本発明のはんだ加熱器具用こて先側部材は、 はんだに直接接触し て溶融させる金属製のこて先チップと、 先端付近に温度検知部が設けられるととも に、 それより基端側に発熱部が設けられた略棒状のセラミックヒー夕とを備え、 上 記こて先チップの内部には上記セラミックヒータが密着状態で揷着される凹部が設 けられ、 上記凹部の深さは、 上記セラミックヒータの先端から上記発熱部までの長 さ相当以上であり、 上記凹部を形成する部分には、 その開口部から底面付近にかけ て、 該凹部の軸心を含む平面で軸心に垂直な断面を分割するような切れ込みが設け られていることを特徴とするので、 それを用いたはんだ加熱器具において、 はんだ 付けする際の温度降下を抑制することができ、 電源投入後の設定温度までの立ち上 がり時間や、 連続はんだ付け後に降下温度から設定温度まで復帰するまでの復帰時 間を短縮することができる。 また特に不活性ガスを噴出させるタイプのはんだ加熱 器具に用いたときは、 より簡単な構造にすることができる。 As described above, the soldering tip side member for a solder heating device according to the present invention has a metal tip tip that is brought into direct contact with the solder and melts, and a temperature detecting portion is provided near the tip, and furthermore, It has a substantially bar-shaped ceramic heater with a heat-generating part on the base end side. A recess in which the ceramic heater is attached in close contact with the tip of the tip is formed, and the depth of the recess is equal to or greater than the length from the tip of the ceramic heater to the heating section. A cut is formed in the portion forming the recess from the opening to the vicinity of the bottom so as to divide a cross section perpendicular to the axis with a plane including the axis of the recess. As a result, the temperature drop during soldering can be suppressed in a soldering heater using it, and the rise time to the set temperature after turning on the power and the return from the fall temperature to the set temperature after continuous soldering It is possible to shorten the return time before the operation. In addition, the structure can be made simpler, especially when used in a solder heating device of a type that ejects an inert gas.
4 Four

Claims

請求の範囲 The scope of the claims
1 . はんだに直接接触して溶融させる金属製のこて先チップと、 1. A metal tip that directly contacts and melts the solder,
先端付近に温度検知部が設けられるとともに、 それより基端側に発熱部が設けら れた略棒状のセラミックヒ一夕とを備え、  A temperature detecting section is provided near the distal end, and a substantially bar-shaped ceramic heater having a heating section provided on the proximal end side is provided.
上記こて先チップの内部には上記セラミックヒータが密着状態で挿着される凹部 が設けられ、  A concave portion into which the ceramic heater is inserted in close contact with the inside of the tip is provided,
上記凹部の深さは、 上記セラミックヒータの先端から上記発熱部までの長さ相当 以上であり、  The depth of the concave portion is equal to or greater than the length from the tip of the ceramic heater to the heat generating portion,
上記凹部を形成する部分には、 その開口部から底面付近にかけて、 該凹部の軸心 を含む平面で軸心に垂直な断面を分割するような切れ込みが設けられていることを 特徴とするはんだ加熱器具用こて先側部材。  A cut is formed in the portion forming the recess from the opening to the vicinity of the bottom so as to divide a cross section perpendicular to the axis with a plane including the axis of the recess. Tip side member for appliance.
2 . 上記こて先チップの基端側を覆う筒状部材を備え、  2. A cylindrical member for covering the base end of the tip is provided.
上記こて先チップは、 上記凹部の底面付近に相当する位置で上記筒状部材に圧入 されており、 他の部分では上記こて先チップの外周面と上記筒状部材の内面との間 に僅かな隙間が設けられていることを特徴とする請求項 1記載のはんだ加熱器具用 こて先側部材。  The tip is press-fitted into the cylindrical member at a position corresponding to the vicinity of the bottom surface of the recess. In other portions, the tip is located between the outer peripheral surface of the tip and the inner surface of the cylindrical member. 2. The tip member for a solder heating device according to claim 1, wherein a slight gap is provided.
3 . 上記こて先チップが上記筒状部材に圧入されている箇所は、 揷着されたセラミ ックヒータの上記温度検知部に相当する位置となるように構成されていることを特 徴とする請求項 2記載のはんだ加熱器具用こて先側部材。  3. The point where the tip of the tip is press-fitted into the cylindrical member is configured to be a position corresponding to the temperature detecting portion of the attached ceramic heater. Item 2. A soldering tip member for a solder heating device according to item 2.
4. 上記筒状部材には、 上記こて先チップの基端付近に相当する位置に、 外周面に 沿つて線状の縮径部が設けられ、  4. The cylindrical member is provided with a linear reduced diameter portion along the outer peripheral surface at a position corresponding to the vicinity of the base end of the tip.
該縮径部において、 上記こて先チップの外周面と上記筒状部材との内面とが隙間 なく当接するように構成されていることを特徴とする請求項 2または 3記載のはん だカロ熱器具用こて先側部材。  4. The solder roll according to claim 2, wherein the reduced diameter portion is configured such that an outer peripheral surface of the tip tip and an inner surface of the cylindrical member abut without any gap. Tip member for heating appliances.
5 . 請求項 1乃至 4の何れか 1項に記載のはんだ加熱器具用こて先側部材を、 こ れを支持する本体側部材に着脱自在に設けたことを特徴とするはんだ加熱器具。5. The soldering iron tip member according to any one of claims 1 to 4, A solder heating device, which is detachably provided on a main body side member for supporting the solder heating device.
6 . 上記本体側部材に設けられ、 不活性ガスを上記本体側部材の内部に導入するガ ス導入部と、 6. A gas introduction unit provided on the main body side member for introducing an inert gas into the main body side member;
上記こて先チップの先端付近に設けられ、 導入された不活性ガスを噴出するガス 噴出部と、  A gas jetting portion provided near the tip of the tip and jetting out the introduced inert gas;
不活性ガスを上記ガス導入部から上記ガス噴出部に導くガス通路とを備え、 上記切れ込み部における上記セラミックヒータの外周面と上記筒状部材の内面と の間の隙間によつて上記ガス通路の一部が形成されるとともに、  A gas passage for guiding an inert gas from the gas introduction portion to the gas ejection portion; and a gap between the outer peripheral surface of the ceramic heater and the inner surface of the cylindrical member at the cut portion. Part is formed,
上記切れ込みの上記凹部底面付近が上記筒状部材から露出して上記ガス噴出部を 形成していることを特徴とする請求項 5記載のはんだ加熱器具。  6. The solder heating device according to claim 5, wherein a portion of the cut near the bottom surface of the concave portion is exposed from the cylindrical member to form the gas ejection portion.
PCT/JP2004/000690 2004-01-27 2004-01-27 Solder heating tool and soldering iron bit member used therefor WO2005070605A1 (en)

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JP5308709B2 (en) * 2008-05-02 2013-10-09 太洋電機産業株式会社 Soldering iron, positioning member and method for manufacturing positioning member
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