WO2005045527A3 - Method of lacquering semiconductor substrates - Google Patents

Method of lacquering semiconductor substrates Download PDF

Info

Publication number
WO2005045527A3
WO2005045527A3 PCT/EP2004/012552 EP2004012552W WO2005045527A3 WO 2005045527 A3 WO2005045527 A3 WO 2005045527A3 EP 2004012552 W EP2004012552 W EP 2004012552W WO 2005045527 A3 WO2005045527 A3 WO 2005045527A3
Authority
WO
WIPO (PCT)
Prior art keywords
lacquering
semiconductor substrates
substrates
solvent
lacquer layer
Prior art date
Application number
PCT/EP2004/012552
Other languages
French (fr)
Other versions
WO2005045527A2 (en
Inventor
Juergen Hoeppner
Original Assignee
Suess Microtec Lithography
Juergen Hoeppner
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suess Microtec Lithography, Juergen Hoeppner filed Critical Suess Microtec Lithography
Publication of WO2005045527A2 publication Critical patent/WO2005045527A2/en
Publication of WO2005045527A3 publication Critical patent/WO2005045527A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/167—Coating processes; Apparatus therefor from the gas phase, by plasma deposition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The invention provides a method of lacquering substrates, in particular semiconductor substrates, whose surfaces have three-dimensional topographies. For this purpose, the substrate is sprayed with a lacquer that is modified with a solvent, and subsequently the applied lacquer layer is homogenized in a solvent atmosphere. The lacquering process can then be finished by baking the lacquer layer.
PCT/EP2004/012552 2003-11-07 2004-11-05 Method of lacquering semiconductor substrates WO2005045527A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10351963.7 2003-11-07
DE2003151963 DE10351963B4 (en) 2003-11-07 2003-11-07 Process for coating semiconductor substrates

Publications (2)

Publication Number Publication Date
WO2005045527A2 WO2005045527A2 (en) 2005-05-19
WO2005045527A3 true WO2005045527A3 (en) 2006-02-16

Family

ID=34559440

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/012552 WO2005045527A2 (en) 2003-11-07 2004-11-05 Method of lacquering semiconductor substrates

Country Status (3)

Country Link
DE (1) DE10351963B4 (en)
TW (1) TW200534044A (en)
WO (1) WO2005045527A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7056107B2 (en) 2017-12-06 2022-04-19 東京エレクトロン株式会社 Coating film forming method and coating film forming device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005024518B4 (en) * 2005-05-27 2009-12-24 CiS Institut für Mikrosensorik gGmbH Method and device for coating a substrate
DE102014113928B4 (en) * 2014-09-25 2023-10-05 Suss Microtec Lithography Gmbh Method for coating a substrate with a lacquer and device for planarizing a lacquer layer
DE102014113927B4 (en) 2014-09-25 2023-10-05 Suss Microtec Lithography Gmbh Method for coating a substrate and coating system
CN111176074A (en) * 2018-11-13 2020-05-19 北京自动化控制设备研究所 Atomization glue spraying method for three-dimensional hollow structure
DE102020005723A1 (en) 2020-09-18 2022-03-24 Westsächsische Hochschule Zwickau Process for coating three-dimensional substrates with photostructurable resists
DE102021207522A1 (en) 2021-07-15 2023-01-19 Carl Zeiss Smt Gmbh Device and method for coating a component for a projection exposure system and component of a projection exposure system
WO2023154752A1 (en) * 2022-02-09 2023-08-17 Theradep Technologies, Inc. Methods of preparing coatings and related devices and systems

Citations (11)

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Publication number Priority date Publication date Assignee Title
US4290384A (en) * 1979-10-18 1981-09-22 The Perkin-Elmer Corporation Coating apparatus
JPS60145619A (en) * 1984-01-10 1985-08-01 Nec Corp Forming method of photoresist film
US4996080A (en) * 1989-04-05 1991-02-26 Olin Hunt Specialty Products Inc. Process for coating a photoresist composition onto a substrate
EP0540447A1 (en) * 1991-10-29 1993-05-05 International Business Machines Corporation A material-saving resist spinner and process
JPH06151295A (en) * 1992-11-13 1994-05-31 Matsushita Electric Ind Co Ltd Method and device for manufacturing semiconductor device
US5733376A (en) * 1994-04-01 1998-03-31 Argus International Apparatus for spray coating opposing major surfaces of a workpiece
US5871822A (en) * 1996-09-26 1999-02-16 Honeywell Inc. Low emissions method for spray application of conformal coating to electronic assemblies
US6174651B1 (en) * 1999-01-14 2001-01-16 Steag Rtp Systems, Inc. Method for depositing atomized materials onto a substrate utilizing light exposure for heating
US6423380B1 (en) * 1995-07-27 2002-07-23 Micron Technology, Inc. Method of coating a semiconductor wafer
US20020124798A1 (en) * 1999-12-17 2002-09-12 Tokyo Electron Limited Film forming unit
US6485568B1 (en) * 1999-04-22 2002-11-26 Erich Thallner Apparatus for coating substrates with materials, particularly for lacquering si-wafers

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4022932A (en) * 1975-06-09 1977-05-10 International Business Machines Corporation Resist reflow method for making submicron patterned resist masks
JPS5349955A (en) * 1976-10-18 1978-05-06 Fuji Photo Film Co Ltd Spin coating method
DE4228344C2 (en) * 1992-08-26 1999-06-10 Inst Chemo U Biosensorik E V Process for photoresist coating of micromechanically three-dimensionally structured components in microstructure technology and device for carrying out the process
JP3998382B2 (en) * 1999-12-15 2007-10-24 株式会社東芝 Film forming method and film forming apparatus
DE10144874B4 (en) * 2001-09-12 2007-12-06 Robert Bosch Gmbh Method and device for the homogeneous application of a lacquer layer on pre-separated substrates
JP2003188073A (en) * 2001-12-18 2003-07-04 Seiko Epson Corp Resist applying apparatus, resist applying method, and manufacturing method for semiconductor device

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4290384A (en) * 1979-10-18 1981-09-22 The Perkin-Elmer Corporation Coating apparatus
JPS60145619A (en) * 1984-01-10 1985-08-01 Nec Corp Forming method of photoresist film
US4996080A (en) * 1989-04-05 1991-02-26 Olin Hunt Specialty Products Inc. Process for coating a photoresist composition onto a substrate
EP0540447A1 (en) * 1991-10-29 1993-05-05 International Business Machines Corporation A material-saving resist spinner and process
JPH06151295A (en) * 1992-11-13 1994-05-31 Matsushita Electric Ind Co Ltd Method and device for manufacturing semiconductor device
US5733376A (en) * 1994-04-01 1998-03-31 Argus International Apparatus for spray coating opposing major surfaces of a workpiece
US6423380B1 (en) * 1995-07-27 2002-07-23 Micron Technology, Inc. Method of coating a semiconductor wafer
US5871822A (en) * 1996-09-26 1999-02-16 Honeywell Inc. Low emissions method for spray application of conformal coating to electronic assemblies
US6174651B1 (en) * 1999-01-14 2001-01-16 Steag Rtp Systems, Inc. Method for depositing atomized materials onto a substrate utilizing light exposure for heating
US6485568B1 (en) * 1999-04-22 2002-11-26 Erich Thallner Apparatus for coating substrates with materials, particularly for lacquering si-wafers
US20020124798A1 (en) * 1999-12-17 2002-09-12 Tokyo Electron Limited Film forming unit

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
KUMAR SINGH V ET AL: "Technique for preparing defect-free spray coated resist film", TRANSDUCERS '03. 12TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS. DIGEST OF TECHNICAL PAPERS (CAT. NO.03TH8664) IEEE PISCATAWAY, NJ, USA, vol. 1, June 2003 (2003-06-01), pages 817 - 820 vol.1, XP002350981, ISBN: 0-7803-7731-1 *
PATENT ABSTRACTS OF JAPAN vol. 009, no. 310 (E - 364) 6 December 1985 (1985-12-06) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 458 (E - 1596) 25 August 1994 (1994-08-25) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7056107B2 (en) 2017-12-06 2022-04-19 東京エレクトロン株式会社 Coating film forming method and coating film forming device

Also Published As

Publication number Publication date
DE10351963A1 (en) 2005-06-09
TW200534044A (en) 2005-10-16
WO2005045527A2 (en) 2005-05-19
DE10351963B4 (en) 2013-08-22

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