WO2005039259A1

WO2005039259A1 - Ceramic substrates having integrated mechanical structures for direct capture of optical components

Info

Publication number: WO2005039259A1
Application number: PCT/EP2004/011474
Authority: WO
Inventors: Erik Beckert; Christoph Damm; Ramona Eberhardt; Peter Schreiber
Original assignee: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Priority date: 2003-10-13
Filing date: 2004-10-13
Publication date: 2005-04-28
Also published as: DE10347450A1; DE10347450B4

Abstract

The invention relates to an optical-capturing device (6) made from an inorganic non-metal material, preferably ceramic or glass ceramic, comprising integrated spatial structures which are used to directly capture optical components (11), in addition to a corresponding method. Said optical capturing device (6) comprises a stack of single layers of material, through which the spatial single structures penetrate and the single layers are arranged in such a manner that they form a spatial structure (7, 8, 9, 10) for capturing optical and/or electrooptical components in addition to, optionally, additional electronic, mechanical and/or mechatronical components (11).

Description

Ceramic substrates with integrated mechanical structures for direct grasping of optical components

The present invention relates to a platform or a substrate made of an inorganic, non-metallic material, preferably ceramic or glass ceramic, with integrated mechanical or spatial structures for direct grasping of optical components, and to a corresponding method. In particular, the subject of the invention is a new design concept for hybrid optical systems. In the following, such systems are understood to mean assemblies with optical functionality, which are composed of discrete components such as lenses, prisms, laser diodes, etc. (hybrid integration) and, due to increasingly complex functions, increasingly also electro-optical, electronic and / or mechatronic (actuators) ) Components included.

Methods for grasping optical components, optical assemblies or hybrid optical assemblies are already state of the art. The various approaches of the prior art are described below with the respective disadvantages.

In a first approach, such hybrid-optical systems are built by first mechanically grasping the components in a preceding assembly step and then, if necessary, adjustable together with mechanical and electrical components in or on a chassis or substrate adapted to the application, also as referred to as an optical bench. In general, the chassis or the substrate is provided as a system basis, usually made of metal, using conventional and mastered manufacturing technologies. In this case, the components can generally also be adjusted at a later point in time. Disadvantages of this approach are the often time-consuming, iterative adjustment processes and the resulting complex assembly with product-specific devices, the limited miniaturizability due to the always available sockets and the problematic thermal stability and reliability of such systems due to different expansion coefficients of optical and metallic materials.

In a second approach, new construction variants therefore try to miniaturize the sockets for the optical components as far as possible or use the chassis or the substrate not only as a support but also as a socket for the individual components. Such a miniaturized frame technology was developed at the EPF in Lausanne (Switzerland). This TRIMO SMD system (Three Dimensional Mi niaturized Optical Surface Mounted Device, German patent applications DE 198 50 888 AI and DE 197 51 352 AI) uses a universal optical mount that can be adjusted in six degrees of freedom with respect to a flat, glass-ceramic substrate that is metallized in the form of a matrix. The components are added via soldering points and laser beam soldering through the glass ceramic substrate, which leads to a self-centering of the components during the soldering process. For this purpose, the substrate has a metallization that is favorable for the joining process, but no mechanical structures suitable for gripping optical components. Another approach is flat Al ₂ 0 ₃ substrates, as are known from the laser manufacturer Coherent Inc., Santa Clara, USA. The optical components are aligned by individual ceramic stacks to the height of the common optical axis and in the adhesive or. The solder bed, which is located between two stack layers, is adjusted and joined. (US Pat. No. 5,930,600 A "Diode-Laser Module With a Bonded Component and Method For Bonding Same"). In this case, too, the substrate itself has no mechanical structures for holding the optical components. A disadvantage of the two The systems mentioned include the highly asymmetrical design due to the fact that all components are raised to the height of the optical axis far above the substrate level.

Approaches to the integration of frame structures in substrates for optical systems are primarily known from microsystem technology. It is customary to etch V and U grooves for the reception and passive adjustment of glass fibers in the substrates, but other components such as lenses or crystals are also increasingly being held in this way. Passive adjustment means here that the corresponding component is not actively moved during the assimilation. Another approach is structuring using the LIGA technique (abbreviated to lithography and electroforming and molding) to create 2-1 / 2-D structures - these are two-dimensional structures such as circles, rectangles or triangles that are extruded into Result in a quasi three-dimensional structure in the direction of the surface normals - in polymethyl methacrylate PMMA.

The two technologies from microsystem technology are characterized by the highest structuring accuracies in the micrometer range, which often allows passive and therefore inexpensive adjustment of the optical components, provided that they are of the same accuracy. However, due to the high costs, the LIGA process is only suitable for one-off items. For this reason, substrates produced by LIGA are increasingly being molded and used as masters for micro-injection molding processes. However, for cost reasons, these are in turn primarily suitable for mass production. The same applies to silicon micromechanics with the expensive lithography and etching processes. Furthermore, for a large number of optical systems, a structuring accuracy that is approximately one order of magnitude lower would be sufficient.

A further approach for integrating frame structures into a substrate, especially for accommodating optical fibers in the form of V-grooves, is described in the US Pat. No. 6,574,399 B2. Here, however, a silicon master must first be produced, which has the shape desired for accommodating the individual components. The shape of the

Silicon Masters happens here, for example Using conventional etching techniques. Subsequently, a negative of the original form is produced by depositing a metal, for example nickel, copper or zinc. An unsintered ceramic tape, for example an LTCC ceramic tape (Low Temperature Cofired Ceramics), is then pressed onto this negative. The ceramic tape is sintered, which is the only way to obtain the final ceramic platform for receiving the optical systems. In this case too, the structures are obtained through a multi-stage molding process.

The object of the present invention is to provide an optical mounting device for mounting optical and / or electro-optical components, such as lenses, prisms, laser diodes, etc., and for additionally accommodating electronic and / or mechatronic components, i.e. a device for accommodating miniaturized hybrid optical systems , as well as to provide a corresponding assembly method, which has the disadvantages of complex adjustment processes, limited miniaturization, the presence of additional sockets, thermal instabilities, asymmetrical design due to the need to lift components to the height of the optical axis above the substrate level, and costs and avoids complex manufacturing processes. It is also the task to provide a system with which a horizontal structure of an optical system can be realized, i.e. with which the optical axes of individual components can be aligned to a common horizontal optical axis.

This task is accomplished by the devices according to the

Claims 1 and 20, as well as manufacturing processes solved according to claims 25 and 29. Advantageous further developments of the devices according to the invention and of the methods described are described in the respective dependent claims.

A device according to the invention for accommodating miniaturized hybrid optical systems has a flat platform (substrate), preferably made of an inorganic, non-metallic material. The inorganic, non-metallic material is preferably ceramic or glass ceramic. The flat platform advantageously has a small thickness in relation to its side lengths; it then resembles a ceramic printed circuit board substrate. The platform is a stiff and massive in itself

Body. The optical systems are built on the platform with the help of three-dimensional mechanical or spatial structures that are integrated in the platform and serve to mount the optical components. Furthermore, the spatial structures serve to align the optical components on a common optical axis and to provide adhesive traps and solder deposits for joining processes. The optical components are thus inserted into the platform, which enables an approximately symmetrical and direct mounting of the optical components. For this purpose, the spatial individual structures described below are shaped in the individual layers and the individual layers with the individual elements inserted into and removed from them.

Structures stacked one on top of the other in such a way that overall spatial structures are created that allow the individual components to be arranged at different depths with respect to the platform surface. An arrangement at different depths in the platform or in the substrate is necessary, for example, in order to create a horizontal one To achieve the structure in such a way that the individual components with their optical component axes are aligned on a common horizontal optical axis or can be “threaded” on such an axis: The different external contours or external dimensions and sizes of the individual components make the As a rule, the outer contour section held by the substrate must be arranged at different depths in the substrate so that the individual optical component axes come to lie at the same height above the uppermost substrate layer or can be aligned with the common horizontal optical axis.

The three-dimensional spatial structures to be shaped are preferably designed in such a way that they adapt (preferably in the platform or horizontal plane and in the depth direction perpendicular to them) to the outer contours of the components or approximate them, so that by this approximation the

Component outer contours and the associated, almost form-fitting version of the individual components, the components can be aligned both in the horizontal plane (i.e. the plane formed by the upper platform surface) and in the direction of height (i.e. with respect to their perpendicular distance to the horizontal plane). Such a horizontal and vertical alignment and the almost form-fitting mounting of the surface sections of the individual components which are fitted into the substrate then enable a horizontal construction as desired.

If the sizes and / or outer contours of individual components require this, the individual structures introduced into the individual layers can also be introduced and arranged as described below. net that a spatial structure is created that passes through all the individual layers or that the flat platform is completely broken through by the volume released by the overall spatial structure.

If optical components are briefly mentioned here, as follows, then optical or electro-optical components such as lenses, prisms, laser diodes etc. as well as electronic, mechanical or mechatronic components such as actuators used in connection with the optical or electro-optical components Roger that. The three-dimensional spatial structures are produced in the following way. First of all, a spatial structure to be formed or the volume corresponding to it (total volume) is divided into several individual layers (or layer volumes): the individual structures corresponding to the individual layers of the spatial structure thus have individual volumes, their stacking or stacking arrangement then the total volume the spatial structure. The individual volume (layer volume) corresponding to a single layer or the corresponding spatial individual structure is completely extracted from a single layer (individual layer) of a ceramic, for example in the form of a punched-out or a hole, for example by punching, laser cutting, diamond processing or etching. These individual layers can be present as an unsintered ceramic tape (also referred to as “green tape”) or as a sintered area (ceramic plate). The unsintered ceramic tape preferably has thicknesses of 0.1 to about 0.2 mm, the sintered area or the ceramic plate has thicknesses of about 0.5 mm to 2 mm, then at least two of them structured layers combined or connected in a stack. The spatial structure to be formed or its volume thus results from the composition of the individual layers or from the total volume formed from the sum of the volumes of the individual structures. In the case of unsintered ceramic tapes, the individual layers are laminated to one another and then sintered to form a solid substrate. LTCC technology (Low Temperature Cofired Ceramics) is preferred for this purpose. If sintered ceramic plates are used, several layers of these are combined into a stack by gluing or soldering, in the latter case an additional coating of the ceramic is necessary. The mechanical or spatial individual structures each pass completely through a single layer and preferably have vertical or approximately vertical walls. They are completely self-contained and have no “islands” or the like. Otherwise, the contour of the structure is arbitrary. Adjacent layers can have similar structures, which leads to vertical walls over several layers. All of the arranged layers can also have such structures - so that the platform formed from the layers is completely broken through. In the case of structures that differ from layer to layer, a staircase structure results, whereby it should be noted that for ceramic sintered strips and the necessary lamination and sintering process there are no undercuts for the stack structure of below are allowed.

In order to form the desired mechanical or spatial structures, the volume corresponding to the structure is divided into individual parts in the device or method according to the invention Layer volumes disassembled, individual structures corresponding to the individual layer volumes are removed from individual layers of the material or ceramic and the individual layers are then arranged such that the overall composite of the individual layers is a workpiece or a device with the desired mechanical or spatial structure or a Forms object with a recess in the form of a socket for optical components. The essential feature of the invention is thus the arrangement and shape of the mechanical or spatial structures in the stacked platform.

In a first advantageous embodiment of the device according to the invention, the spatial structures contain or consist of vertical walls. Such vertical walls allow the horizontal alignment of components within the plane of the board, e.g. B. as stops along the optical axis.

In a further advantageous embodiment of the device according to the invention, the spatial structures consist of or contain the spatial structures of contact edges. Such support edges define, for example, the vertical position of round optics (lenses), which lie on these edges with their outer diameter. A height alignment of components is achieved by a suitable distance between two edges and / or by a suitable depth of the edges.

In a further advantageous embodiment of the device according to the invention, the spatial structures exist or contain the spatial structures of delimitation planes. Lay out such delimitation levels For example, the height alignment for non-rotationally symmetrical components such as mirrors or prisms.

In a further advantageous embodiment of the device according to the invention, the spatial structures contain or the spatial structures consist of steps. Such steps allow, for example, the approximation of the outer contours of round optics. The smallest step size corresponds to a layer thickness.

In a further advantageous embodiment, the platform consists of glass ceramic, preferably LTCC ceramic, since it can be structured in multiple layers and is simple in the green state.

In a further advantageous embodiment, the optical mount device according to the invention is made of ceramic, preferably Al ₂ O ₃ or A1N, it being possible for this ceramic to be laser-cut and to be used in one or more layers.

In a further, particularly advantageous embodiment, the or the extracted spatial structures are designed in such a way that, due to the arrangement and shape of the individual structures in the individual layers, they relate the components to be arranged or grasped at different depths can be introduced onto the platform level in such a way that a horizontal structure of an optical system or an arrangement of the individual components on a common optical axis is realized. This takes place particularly advantageously in that the shape of the spatial structure or spatial structure formed from the individual structures The outer contour of the respective component is adapted or the outer contour of the component is approximated, so that an almost form-fitting frame and a suitable horizontal and vertical alignment of the individual components with respect to one another is made possible.

The above described optical mount device is characterized by a number of significant advantages:

- Optical components are captured directly and immediately. Indirect frames, these are frame elements that create the connection between the optical component and the platform or substrate, for. B. lens frames, mirror holders, etc. are thereby made superfluous in most cases. The miniaturization is therefore in principle only limited by the smallest structure sizes that can be produced (currently about 10 μm) and structure accuracies (currently about 10 to 50 μm).

- The platform or the substrate can thus serve as a reference for the construction of the optical system. Stepped structures on the platform can serve as a joining aid. The structures in the platform enable height adjustment of the components (vertical mechanical stop) and alignment of the elements along the optical axis (horizontal mechanical stop). It is possible to define the referencing level and the joining level at different heights. As far as their accuracy is sufficient, the spatial structures thus serve as passive Aligning the optical components in relation to the platform. The arrangement of the joint is preferably possible in the symmetrical area of the optical components within the horizontal beam plane. Despite the two-dimensional basis of the platform, the direct mounting of the optical components can thus take place almost symmetrically and in the beam plane.

- The platform is suitable as a hybrid platform for the simultaneous reception of electronic, electromechanical and mechanical components and functional elements.

- With a platform made of ceramic or glass ceramic as the base material, conductor tracks and electronic circuits in thick-film and SMD technology (Surface Mounted Device) can be implemented at the same time. This leads to the hybrid integration of optics and electronics on a substrate.

- With ceramics or glass ceramics as the base material of the platform, silicon-based MEMS (Micro Electromechanical Systems) systems can also be integrated hybrid due to similar thermal expansion coefficients. Such systems can be, for example, V-pits in silicon substrates, V-pits, arrays, micromechanical actuators such as fiber switches or mirrors, etc.

- Heat paths, heat passages, thermal bridges with metal inserts (thermal vias), microfluidic see channels and mechatronic systems such as. B. Pumps can be integrated. thus Integrated structures can serve as thermal shelf sections for tempering opto-electronic components such as laser diodes.

- The invention allows the construction of an optical system and a suitable arrangement of the individual components at different depths of the multi-layer or single-layer substrate. With such a structure, the individual components can be aligned with their optical axes on a common horizontal optical axis. Different external dimensions of the components can be compensated for in this way.

- The structures also allow laser soldering, gluing and / or "snap in" as a joining process, as well as alignment soldering and alignment gluing with the aid of a joining gap. The latter means that there is no mechanical stop, but only the maximum possible approach.

Ceramic substrates according to the invention with integrated mechanical or spatial structures for direct gripping of optical components can be designed or used as described in one of the examples below. The following figures, which belong to the examples, show the same for identical or corresponding components

Reference numerals used.

Show it

1 shows how a ceramic substrate according to the invention is produced using the LTCC technique becomes;

2 shows a ceramic substrate according to the invention with different spatial structures;

3 shows the integration of an optical system into a ceramic substrate according to the invention;

1 shows an illustration of the process, such as a ceramic substrate according to the invention with integrated spatial or mechanical structures for direct grasping of optical components using the LTCC process (Low Temperature Cofired Ceramics) from a plurality of n individual layers of an unsintered ceramic tape can be manufactured. The individual layers are preprocessed in a first process step 1. The preprocessing essentially comprises the shape cutting, punching and drying of the green ceramic tape. In a second process step 2, spatial or mechanical structures are completely cut out of the individual layers of the green ceramic. For this purpose, the figure shows the first ceramic band 2a and the nth ceramic band 2b, which have the same individual structures 2c and 2d in the form of elongated holes with hole widths stepped several times in the longitudinal direction of the hole and with boundary walls which are perpendicular with respect to the ceramic band surface. In a subsequent step, in the example shown, the same conductor structures 3c and 3d are also printed on the individual layers 2a and 2b, so that the same printed ceramic tapes 3a and 3b result. In a subsequent step 4, the n individual layers are suitably arranged on top of one another and laminated to one another, so that the volume of the detached individual structures results in a total of lumen of the overall spatial structure to be formed. The workpiece 5 made of individual ceramic layers laminated on top of one another is thermally transferred into the final ceramic or optical mounting device 6 in a final step. The ceramic can then also be subjected to various post-processing steps, not shown, such as the separation of individual structures from the overall ceramic composite, such as electrical testing and a final inspection.

FIG. 2 shows the final workpiece or the final ceramic from FIG. 1, that is to say an optical mounting device according to the invention with various integrated spatial or mechanical structures for direct mounting of optical components, in an enlarged representation. In the example, the device has four individual layers laminated on top of one another, which result in an upper layer composite or an upper layer 6c, and seven individual layers laminated on one another which result in a lower layer composite or a lower layer 6d. The top and bottom layers are also laminated together. The optical mount device 6 shown has a delimitation level 7. This delimitation plane is designed in the form of a plane 7a located at a lower total height h _x (thickness of the lower layer), which is followed by a plane 7b located at a higher overall height h ₂ (thickness of the lower and upper layer). By the position of those formed by the height offset

The step edge 7c thus defines the size of the boundary plane. At the left end of the elongated individual structure detached from the layer 6d or the hole 2c corresponding to it, the device shows a support edge 8 which is formed by a surface section 8a of the layer 6d and a section of a wall 8b of the hole 2c is formed. Due to the fact that the hole of the layer 6c above it has a larger hole width in sections, a surface section 9a of the layer 6c, a wall section 9b of the hole of the layer 6c, a surface section 9c of the layer 6d and a wall section 9d of the hole 2c layer 6d, a step 9 is formed for approximating the outer contour of lenses of a beam-shaping system or for mounting lenses of a beam-shaping system, the beam-shaping system having an integral diode as a beam source. Due to the sectionally larger hole width of the hole of the layer 6c compared to the hole width of the layer 6d, the vertical wall 10 of the device for the horizontal alignment of the beam-shaping system also results. Furthermore, the optical mount device has a reference mark 6a, identified by a cross, and a solder depot 6b, identified by an ellipse.

FIG. 3 shows the joining together of the ceramic substrate 6 according to the invention from FIG. 2 and the beam-shaping system 11 with the diode to form a hybrid-optical overall system 12. The beam-shaping system here has the following components or components: a collimated beam 11a, two collimating de cylindrical lenses 11b for the fast and slow axes of an elliptically focused beam, a collimation and a focusing lens 11c for an elliptically divergent beam, a laser diode lld with an elliptically divergent beam profile and three pins III for electrical contacting of the laser diode. The height alignment of the beam-shaping system takes place through the delimitation plane 7, the height alignment of the lenses 11b and 11c of the beam-shaping system takes place through the contact edge 8 and the horizontal alignment of the lenses 11b and 11c of the beam-shaping system takes place through the vertical wall 10. The diode 11d floats freely in the hole 2c due to its large external tolerances. As the figure shows, the individual layers with the individual volumes or individual structures detached from them are laminated to one another and the individual structures of the respective layers have such shapes that the collimation and focusing lens 11c and the laser diode lld are approximated in their outer contours and through the described design of the individual layer structures are coordinated with one another in their height (perpendicular to the plane of the plate): the optical axes of the collimation and focusing lens 11c and the optical axis of the laser diode lld are thereby arranged at the same height and on a common optical axis. The individual spatial structures or the individual parts of the spatial structure are suitably arranged side by side in the platform level.

Claims

claims

1. Optical mount device (6) with at least one integrated spatial structure for mounting optical and / or electro-optical and preferably additional electronic, mechanical and / or mechatronic components (11), characterized in that the total volume of the spatial structure is divided into at least two individual layer volumes It can be divided that the optical mount device (6) has a stack of at least two individual layers of a material, that at least two of the individual layers each have a spatial individual structure with an individual volume that corresponds to one of the layer volumes, and that the individual layers are arranged one above the other in this way that the sum of the individual volumes of the individual structures form the total volume of the spatial structure (7, 8, 9, 10).

2. Device according to the preceding claim, characterized in that the shape of the individual structures is formed perpendicular to the stacking direction or within the plane of the platform formed by the individual layers (horizontal plane) and / or that the individual structures are stacked one on top of the other in the stacking direction. which are arranged such that at least one of the spatial structures is designed as a spatial structure that can be directly grasped, the outer contour of the at least one component can be at least partially approximated.

3. Device according to one of the preceding claims, characterized in that by means of at least one of the spatial structures or their shape and / or depth in the stacking direction at least two components with respect to the horizontal plane and / or their height in the direction perpendicular to the horizontal plane or their height above the platform and / or with their optical component axis can be aligned along a common optical axis running parallel to the horizontal plane, in particular above the horizontal plane.

4. Device according to one of the preceding claims, characterized in that each of the individual layers of the stack has an individual structure and that these individual structures are arranged one above the other in the stacking direction in such a way that the spatial structure formed from them completely breaks through the stack in the stacking direction.

5. Device according to the preceding claim, characterized in that the optical mount device (6) consists of an inorganic, non-metallic material and / or is a flat platform with a thickness that is less than 20 percent of the maximum side length of the platform.

6. Device according to one of the preceding claims, characterized in that the individual structures contain or consist of perforations, holes, punchings, cut-outs and / or etchings and / or that the volumes of the individual structures lie by removing the surface area of a single layer which is simply connected. the substrate volume of the individual layer can be produced.

7. Device according to one of the preceding claims, characterized in that the inorganic, non-metallic material contains or consists of ceramic and / or glass ceramic.

8. Device according to the preceding claim, characterized in that the glass ceramic contains or consists of an LTCC ceramic.

9. The device according to claim 7, characterized in that contains or consists of the ceramic Al ₂ 0 ₃ and / or AlN.

10. Device according to one of the preceding claims, characterized in that at least one of the individual layers has an unsintered ceramic band and / or that at least one of the individual layers has a sintered ceramic plate.

11. The device according to the preceding claim, characterized in that at least one of the individual layers has a thickness in the range from 0.1 mm to 0.2 mm.

12. The device according to claim 10, characterized in that at least one of the individual layers has a thickness in the range from 0.5 mm to 2 mm.

13. Device according to one of claims 10 to 12, characterized in that at least two sintered ceramic plates are soldered and / or glued.

14. Device according to one of the preceding claims, characterized in that the volumes of the individual structures form at least one spatial structure such that these as Support edge (8) can be used for the components.

15. Device according to one of the preceding claims, characterized in that the volumes of the individual structures form at least one spatial structure such that it can be used as a delimiting plane (7) for the components.

16. Device according to one of the preceding claims, characterized in that the volumes of the individual structures form at least one spatial structure such that it contains or consists of a wall perpendicular to the surface of the optical mount device and / or at any angle.

17. Device according to one of the preceding claims, characterized in that the volumes of the individual structures form at least one spatial structure in such a way that it contains or consists of a step (9).

18. Device according to one of the preceding claims, characterized in that Conductor tracks and / or electrical circuits are arranged on or on the optical mount device or are integrated therein.

19. Device according to one of the preceding claims, characterized in that

Metal layers as a conductor track and / or as a soldering base for electronic, optical and / or mechanical components (11) are arranged in the optical mount device or are integrated therein.

20. Hybrid optical device, characterized by at least one optical mount device according to one of the preceding claims, wherein at least one of the optical mount devices directly captures at least one component (11).

21. The apparatus according to claim 20, characterized in that the component contains or consists of at least one lens, a prism, a laser diode and / or an actuator.

22. Device according to one of claims 20 or 21, characterized in that silicon-based MEMS systems (Micro electromechanical Systems) are hybrid integrated and / or arranged on the device.

23. The device according to the preceding claim, characterized in that the silicon-based MEMS systems are U- or V-shaped pits, U- or V-shaped pits in silicon substrates, arrays, micromechanical actuators, fiber switches and / or mirrors ,

24. Device according to one of claims 20 to 23, characterized in that

Heat paths, thermal bridges with metal inserts, heat bushings, microfluidic channels, mechatronic systems, pumps and / or thermal control systems are integrated in the device or are arranged on it.

25. Manufacturing method for an optical mounting device for mounting optical and / or electro-optical as well as preferably additional electronic, mechanical and / or mechatronic components (11) with the help of at least one spatial structure integrated in an inorganic, non-metallic material ( 7, 8, 9, 10), characterized in that spatial individual structures are produced in at least two individual layers of the material, so that the individual layers are then arranged one on top of the other in such a way that the individual volumes of at least two spatial individual structures make up the total volume of the spatial structure ( 7, 8, 9, 10), and that the individual layers are then connected to one another.

26. The method according to the preceding claim, characterized in that an optical mount device according to one of claims 1 to 19 is manufactured.

27. The method according to any one of claims 25 or 26, characterized in that the individual structures are completely punched out, etched out, cut out with a laser and / or worked out with a diamond tool.

28. The method according to any one of claims 25 to 27, characterized in that the individual layers are laminated together and then sintered to form a solid substrate or that the individual layers are glued to one another and / or first coated and then soldered together.

29. Manufacturing method for a hybrid optical device, characterized in that in a first step, as in one of claims 25 to 28, an optical mount device is produced and that at least one optical and / or electro-optical and preferably additionally at least one electronic, mechanical and / or mechatronic component (11) is introduced into the spatial structures (7, 8, 9, 10), fitted or arranged on them.

30. The method according to the preceding claim, characterized in that a hybrid optical device according to one of claims 20 to 24 is produced.

31. The method according to any one of claims 29 or 30, characterized in that at least one of the components (11) is aligned with the aid of the spatial structures (7, 8, 9, 10).

32. The method according to any one of claims 29 to 31, characterized in that at least one of the integrated spatial structures or a part thereof (7, 8, 9, 10) as a reference for the construction of an optical system and / or for height adjustment of at least one component (11) and / or for the horizontal alignment of at least one component (11) and / or for the alignment of at least one component (11) along an optical axis.

33. The method according to the preceding claim, characterized in that a stair-shaped spatial structure (9) or a corresponding structural part is used as a reference.

34. The method according to any one of claims 29 to 33, characterized in that at least one of the components (11) is soldered, soldered by laser soldering, glued, clamped, snapped in, snapped in, plugged in and / or welded.