WO2005036098A1 - Procedimiento de metrología óptica para la determinación de la topografía tridimensional de un orificio - Google Patents
Procedimiento de metrología óptica para la determinación de la topografía tridimensional de un orificio Download PDFInfo
- Publication number
- WO2005036098A1 WO2005036098A1 PCT/ES2004/000436 ES2004000436W WO2005036098A1 WO 2005036098 A1 WO2005036098 A1 WO 2005036098A1 ES 2004000436 W ES2004000436 W ES 2004000436W WO 2005036098 A1 WO2005036098 A1 WO 2005036098A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hole
- plane
- analyzed
- pattern
- equipment according
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/2518—Projection by scanning of the object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/08—Measuring arrangements characterised by the use of optical techniques for measuring diameters
- G01B11/12—Measuring arrangements characterised by the use of optical techniques for measuring diameters internal diameters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/954—Inspecting the inner surface of hollow bodies, e.g. bores
Definitions
- OPTICAL METROLOGY PROCEDURE FOR THE DETERMINATION OF THE THREE-DIMENSIONAL TOPOGRAPHY OF A HOLE In particular for the measurement of truncated cone micrometric nozzles and the like, and a measuring equipment for carrying out said procedure whose new features provide numerous advantages as will be described hereafter In the present memory.
- the method and the equipment object of the present invention have particular application, although not exclusively, in the measurement of the icrometric holes of the nozzles of the inkjet printer heads. Inkjet printers essentially base their operation on the ejection of drops of liquid ink through the nozzles of nozzle heads. These small drops impact the paper forming the necessary points for the creation of graphics and texts.
- the print head includes a flexible circuit formed by a thin sheet that has a matrix of said nozzles through which a precise amount of ink is released in a suitable direction towards the printing paper.
- a flexible circuit formed by a thin sheet that has a matrix of said nozzles through which a precise amount of ink is released in a suitable direction towards the printing paper.
- One of the main objectives of the quality control processes currently being applied by manufacturers to the injection printers is the determination of the configuration or topography of the nozzle holes of the heads through which the ink flows to the paper .
- the said thin sheet that forms the flexible circuit of the head can be manufactured in various materials.
- One of the possible materials is the so-called Kapton® from Dupont Corp., formed from flexible polyamide films of great mechanical resistance, and exceptional chemical and electrical properties, with great resistance to extreme temperatures.
- Kapton® from Dupont Corp.
- other materials, both dielectric and semiconductor, are contemplated.
- the holes in the sheet have a truncated conical three-dimensional geometry with very small dimensions, which tend to be smaller and smaller in order to offer greater precision and resolution in printing. These small dimensions necessitate precise placement of the holes in the circuit sheet in order to offer the desired print quality.
- the aforementioned sheet of the flexible circuit which, as indicated, is arranged in the print head, is located at a certain distance from the paper (considerably large compared to the dimensions of the nozzles of the sheet), so that a configuration Incorrectly of any hole could cause the ink drop path from its exit through the nozzle head hole to be incorrect, deviating from its ideal direction perpendicular to the paper, distorting the image or text to be printed.
- Such equipment projects a single point of light focused on the measuring surface using a scanner that scans the surface in a given plane.
- the main drawback of these equipments lies essentially in the fact that, due to the particular three-dimensional configuration of the holes, which must necessarily be frustoconical and with the optically polished inner surface for optimum print quality, they have a high uncertainty derived mainly of the absence of retroreflected light due to the high slope of said surface (the angles of incidence are greater than 70 °) and, as indicated, to the fact that it is optically polished, so, consequently, there is no practically retroreflected or back-diffused light which does not provide any information on the position of the surface to be measured.
- the present invention proposes a method of optical metrology for the determination of three-dimensional topographies. This procedure has particular application in the measurement of the inner surface of the nozzles of the inkjet printer heads, although the invention is not at all limited to this scope. It is an optical system without contact with the object to be analyzed based on the light reflected by said object, as will be detailed below.
- the invention also relates to a device for carrying out the process which will be described in detail hereinafter and which, among others, includes lighting means and observation means that are will detail later.
- an initial calibration is performed, which must be carried out periodically.
- the aim is to verify that the image plane for the lighting means of the equipment coincides with the object plane for the observation means of the equipment.
- the object to be analyzed is arranged on the stage of a microscope with the largest diameter area of the hole oriented towards said lighting means.
- One of the holes of the object to be analyzed focuses on the field of vision of said observation means and is focused, by means of an autofocus procedure using extensive illumination on the area of smaller diameter of the hole to be analyzed.
- the diameter of the hole is measured as well as major defects such as the absence of a hole or a large deformation.
- An axial displacement is then made to a focus plane located inside the hole.
- a pattern representation system which is part of the lighting means, a sequence of patterns is projected on the focus plane, for example patterns of circular configuration of determined and increasing radius.
- the images of the patterns projected inside the hole by the pattern representation system are observed by cameras, for example of the CCD type or CMOS type, which are part of the observation means.
- the measurement of the positions of the hole contour points is carried out at the moment when the images of the pattern are superimposed on the camera circular projection and its reflection in the inner walls of the hole (virtual pattern image).
- the process of the invention provides for the acquisition of a series of images (one for each projected pattern), for example between 10 and 25, to obtain the measured points of the contour of the interior of the hole.
- the focus plane of the hole is changed by changing it to another focus plane, for example by axially moving the object to be analyzed.
- this focus plane the process to measure the contour of the hole of the object being analyzed in a coordinate system is acquired by acquiring a series of images in order to obtain the measured points of the contour of said hole from the acquired images for the different projected patterns.
- the aforementioned modification of the focus plane can be carried out, for example, by moving the object upwards.
- the modification of the focus plane of the object, changing it to another focus plane is repeated as many times as possible. necessary to obtain values in as many planes other than the nozzle, with a preferred distance between focus planes between 1 and 10 ⁇ in.
- the parameters to characterize the topography of the hole are obtained by conveniently processing the results of the measurements (contours in different planes of focus) which can be circles, or ellipses in the case of deviation of the axis of the hole with respect to the optical axis of the measuring system. This is carried out through computer processing means using the corresponding algorithms by means of which a set of values corresponding to said parameters is obtained.
- the equipment object of the invention is adapted to carry out the procedure described above. The procedure makes it possible to determine with extraordinary precision the three-dimensional topography of micrometric boreholes with an optically polished interior surface.
- the equipment of the invention used to carry out said measurement procedure is basically formed by lighting means, observation means and computer processing means.
- the lighting means of the equipment of the invention comprise a microscope objective, a light source, a pattern representation system, an optical system and, if necessary, a mirror that can be adapted to deflect the light at an angle of, for example, 90 °, although other inclinations of the mirror may be used depending on the spatial configuration of the equipment of the invention.
- the observation means of the equipment comprise a microscope objective, an optical system, and at least one CCD or CMOS type camera.
- Said computer processing means comprise a computer and the appropriate software that includes the algorithms necessary for the three-dimensional reconstruction of the object that is analyzed after the application of the method of the invention.
- the aforementioned software calculates the points to build the interior topography of the hole, also presents the user interface
- the objective associated with the lighting means is a 100X SL D objective (super long working distance), while the objective associated with the observation means is a 50X SLWD lens (super long working distance), for a CCD camera with a 1/3 inch shape.
- the increase in the mentioned objectives may vary depending on the format of the CCD camera and the characteristics of the hole to be analyzed.
- a computer controls the pattern representation system. This computer is part of the computer processing means and allows to visualize a wide field illumination and also generate patterns, for example of circular configuration of different diameters. The patterns are projected by means of the aforementioned objectives and optical systems in the inner area of the hole of the body to be analyzed.
- said pattern representation system is a liquid crystal micro display (LCD), although the possibility of said pattern representation system being a liquid crystal micro silicon display (LCOS) with a Associated beam of light splitter that provide a better display quality by not generating in the image of the projected pattern dark areas caused by the electronics included in each pixel in the case of liquid crystal micro visualizers.
- the lighting source emits light with a broadband spectrum, both LEDs and a white light source can be used.
- a laser lighting system and a scanner could be used to generate the pattern inside the hole.
- the equipment and the procedure carried out by said equipment according to the present invention is not limited to the measurement of boreholes of conical configuration.
- the topography of orifices with a partially truncated conical configuration that also presents a structure in the area of greater diameter of the orifice, such as a prismatic recess.
- the determination of this topography is carried out including an additional camera in the equipment, for example of type CCD.
- Figure 1 is a schematic representation of a first embodiment of an optical metrology equipment for the determination of the three-dimensional topography of an orifice according to the invention, in particular for the measurement of micrometric nozzles truncated conical and similar flexible circuits of the inkjet printer heads;
- Figure 2 is a schematic representation of a second embodiment of an optical metrology equipment according to the invention;
- Figure 3 is a schematic representation of a third embodiment of the invention;
- Figures 4 and 5 are partial cross-sectional views of two examples of the variety of possible topographies that the equipment can measure with the method of the invention;
- Figure 6 is a schematic drawing that conceptually illustrates the process of the invention in a situation in which the entire incident beam propagates through the hole without experiencing any reflection on the interior surface thereof.
- Figure 7 is a schematic drawing similar to that of Figure No. ⁇ in which, due to the greater value of the radius of the projected pattern in the focus plane, a part of the incident beam is propagated directly through the hole and another part is reflected in the inner surface of the same, giving rise to two images of the pattern in the plane of the camera.
- Figure 8 is a schematic drawing similar to those of Figures 6 and 7 above in which the radius of the pattern projected in the focus plane coincides with the radius of the contour of the interior of the hole in said plane, giving rise to to a single image of the pattern in the camera plane.
- Figure 9 is a schematic drawing similar to those of Figures 6, 7 and 8 above in which the radius of the pattern projected in the focus plane is greater than the radius of the contour of the interior of the hole analyzed in said plane, also giving rise to a single image of the pattern in the plane of the camera.
- Figure 10 is a graph that illustrates, for a series of images, the value of the radius of the circular pattern projected on the focus plane and also the radius of the virtual circular pattern associated with the part of the incident beam that is reflected in the inner surface of the hole.
- the different references that have been used to describe the preferred embodiments of the equipment of the present invention are listed below: (1) lighting means; (2) means of observation;
- LCD liquid crystal pattern representation system
- the lighting means (1) are formed by a high magnification lens (4) (100X SLWD (super long working distance)), a white light source (5), a pattern representation system (6) located in the position of the field diaphragm, a mirror (7), which in the exemplary embodiment illustrated deviates the light beam 90 °, and an optical system (8).
- a high magnification lens (4) 100X SLWD (super long working distance)
- a white light source (5) located in the position of the field diaphragm
- a mirror (7) which in the exemplary embodiment illustrated deviates the light beam 90 °
- an optical system (8) an optical system
- the observation means (2) comprise a 50X magnification microscope objective (9) SLWD (super long working distance)), an optical system (10) and a CCD camera (11), which may alternatively be of type CMOS
- the computer processing means (3) comprise a computer (12) that manages the appropriate software with the necessary algorithms for measuring the contours in different planes and the three-dimensional reconstruction of the truncated conical nozzle (13) of the object to be analyzed (14) after application of the method of the invention.
- the configuration of the nozzle (13) can be seen in the partial sectional view of Figure 4 of the drawings attached herein. In the example illustrated in the aforementioned figure No.
- the object to be analyzed (14) is a flexible circuit available in the heads of inkjet printers, which includes a plurality of holes or nozzles (13) Of very small size.
- a sheet (14) 50 ⁇ m thick with nozzles (13) having a wall inclination of 17 ° and an outlet diameter of about 25 ⁇ m can be analyzed to eject microdroplets of ink.
- the liquid crystal pattern representation system (6) is controlled by said computer
- the object to be analyzed (14) that is, the flexible flat sheet provided with a plurality of frustoconical nozzles (13), is arranged horizontally fixed at the base of the microscope stage (15) with the wide area of the nozzles (14) oriented towards the lighting means.
- the lighting means (1) and the means of Observation (2) of the measuring equipment is adjusted and calibrated so that the image plane for the lighting means (1) coincides with in the object plane for the observation means (2).
- the position of the points is measured of the contour of the nozzle (13), either in a cylindrical coordinate system or in a Cartesian coordinate system
- a resolution of 360-720 measured points along the contour of the nozzle is preferred (13), which corresponds to an angular sampling of 1-0.5 °, although these parameters may be different depending on the analysis requirements
- the equipment of the invention acquires a series of images (between 10 and 2 5) for different circular patterns of different diameters displayed in the pattern representation system (6) and projected on said plane (z 2 ) by the optical system (8) and the microscope objective (4).
- the images of the patterns inside the nozzle are observed using the CCD camera (11).
- the information contained in these images is processed through the computer (12) with the corresponding algorithms and a set of values corresponding to the aforementioned coordinates is obtained.
- the measurement of the position of the points of the contour of the nozzle (13) is carried out at the moment in which the images of the projected circular pattern and their reflection on the inner walls thereof are superimposed.
- the team then moves the sheet to be analyzed (14) to a next plane (z 3 ) and repeats the process fifty times for the example of the described embodiment (sheet (14) 50 ⁇ m thick), that is, the Sampling of the nozzle structure (13) is carried out in fifty focus or analysis planes (zi, ..., Z50), with a separation between planes (Z ⁇ -Z ⁇ + I) of 1 ⁇ m, although the One skilled in the art will understand that the number of sampling focus planes may vary depending on the thickness of the sheet (14) and the requirements of the analysis parameters. In this way, the equipment acquires, flat to flat (z ⁇ , ... Zi, ... z n ), the topography of the internal profile of the nozzle (13).
- the equipment uses a system of representation of patterns of higher quality of vision. It is a liquid crystal system on silicon (LCOS) (16) associated with a light beam splitter (17) which reaches the light coming from the source (5).
- LCOS liquid crystal system on silicon
- the equipment according to the third embodiment which has been schematically illustrated in Figure 3, allows measuring nozzles (13a) of truncated conical configuration with a recess (19) in a prismatic manner, as shown in the enlarged partial cross-section of figure 5.
- This recess is used to arrange in it the electronics necessary for the operation of the flexible circuit (14a) that is arranged in the head of an inkjet printer.
- the equipment also incorporates a system of representation of liquid crystal patterns on silicon (LCOS) (16) associated with the light beam splitter (17), the rest of the components and operation being essentially the same as in the embodiment of figure 2.
- LCOS liquid crystal patterns on silicon
- the mirror (7) has been replaced by another beam splitter (17 ') to allow observation and topographic measurement of the recess area (19 ) of the nozzle (13a) with an additional chamber (18), for example of type CCD.
- an additional chamber (18) for example of type CCD.
- the pattern representation system (6) of the embodiment of Figure 1 can also be used. Basic aspects of the invention are illustrated in schematic figures 6 to 10 which are included herein.
- a circular pattern (P) defined by the line (0-0) is projected on a focus plane (z ⁇ ) located inside the nozzle (13).
- the beam from the lighting means penetrates into the interior of the nozzle (13) through the area of greatest diameter thereof (lower part of figures 6 to 9).
- the radius (r) of the pattern (P) projected by the lighting means (1) in the focus plane (zi) inside the nozzle (13) It is such that the entire incident beam propagates through the hole without experiencing any reflection on its inner surface.
- an image (II) of the pattern (P) is obtained in the plane of the camera (11), whose radius (R) is equal to the radius of the pattern (r) multiplied by the magnification factor of the lens (9) and the optical system (10).
- Figures 7 to 9 illustrate situations in which the radius (r) of the circular pattern (P) projected on the focus plane (zi) is gradually increasing.
- the radius (r) of the pattern (P) projected by the lighting means (1) in the focus plane (zi) inside the nozzle (13) is such that a part of the incident beam is propagated directly through the hole and another part is reflected on the inner surface of it.
- two images (II) and (I '-I') are obtained in the plane of the camera (11).
- the radio image (II) (R) corresponds to the real circular pattern (0-0) of radio (r), while the radio image (I '-I') (R ') corresponds to the virtual pattern (O' -O ') of radio (r').
- the respective radii (R) and (R ') are equal to the radii of the real pattern (r) and the virtual pattern (r') multiplied respectively by the magnification factor of the objective (9) and the optical system (10). Increasing the value of the radius (r) of the pattern (P) will increase the value of the radius (R) and decrease the value of the radius (R ').
- the radius (r) of the pattern (P) projected by the lighting means (1) in the focus plane (z ⁇ ) inside the nozzle (13) is such that matches the radius of the contour of the nozzle (r 0 ).
- the radius (r) of the pattern (P) projected by the lighting means (1) in the focus plane (z ⁇ ) inside the nozzle (13) is greater than the radius of the contour of the nozzle (r 0 ).
- the entire incident beam is reflected on the inner surface of the nozzle (13) and only a single corresponding image (I '-I') of radio (R ') is observed in the plane of the chamber (11) to the virtual radio pattern (r ').
- the process of the invention is extremely fast, with a data acquisition and processing time close to 1 second being observed to measure the nozzle contour of each plane (zi) and with an extremely effective result when extraordinary precision is achieved.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/568,636 US20060192978A1 (en) | 2003-10-10 | 2004-10-08 | Optical metrology method which is used to determine the three-dimensional topography of a hole |
EP04766974A EP1686348A1 (en) | 2003-10-10 | 2004-10-08 | Optical metrology method which is used to determine the three-dimensional topography of a hole |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES200302355A ES2247890B1 (es) | 2003-10-10 | 2003-10-10 | Procedimiento y equipo de metrologia optica para la determinacion de la topografia tridimensional de un orificio, en particular para la medicion de boquillas micrometricas troncoconicas y similares. |
ESP200302355 | 2003-10-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005036098A1 true WO2005036098A1 (es) | 2005-04-21 |
Family
ID=34429679
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/ES2004/000436 WO2005036098A1 (es) | 2003-10-10 | 2004-10-08 | Procedimiento de metrología óptica para la determinación de la topografía tridimensional de un orificio |
Country Status (4)
Country | Link |
---|---|
US (1) | US20060192978A1 (es) |
EP (1) | EP1686348A1 (es) |
ES (1) | ES2247890B1 (es) |
WO (1) | WO2005036098A1 (es) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2243129B1 (es) * | 2004-04-23 | 2006-08-16 | Universitat Politecnica De Catalunya | Perfilometro optico de tecnologia dual (confocal e interferometrica) para la inspeccion y medicion tridimensional de superficies. |
US9791267B2 (en) | 2014-05-27 | 2017-10-17 | Bourbaki 13, Inc. | Determining three-dimensional information from projections or placement of two-dimensional patterns |
US10198647B2 (en) * | 2015-09-25 | 2019-02-05 | Datalogic IP Tech, S.r.l. | Compact imaging module with range finder |
JP6645868B2 (ja) * | 2016-03-01 | 2020-02-14 | 株式会社東京精密 | 穴径計測装置及びそれを用いた計測方法 |
US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
US10134657B2 (en) | 2016-06-29 | 2018-11-20 | Corning Incorporated | Inorganic wafer having through-holes attached to semiconductor wafer |
US10794679B2 (en) * | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
EP3345723A1 (de) * | 2017-01-10 | 2018-07-11 | Ivoclar Vivadent AG | Verfahren zur steuerung einer werkzeugmaschine |
US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
US11152294B2 (en) | 2018-04-09 | 2021-10-19 | Corning Incorporated | Hermetic metallized via with improved reliability |
AT521298A1 (de) * | 2018-06-04 | 2019-12-15 | Alicona Imaging Gmbh | Verfahren zur optischen Erfassung der Geometrie eines Werkstücks |
CN113474311B (zh) | 2019-02-21 | 2023-12-29 | 康宁股份有限公司 | 具有铜金属化贯穿孔的玻璃或玻璃陶瓷制品及其制造过程 |
TWI710748B (zh) | 2019-04-15 | 2020-11-21 | 財團法人工業技術研究院 | 輪廓精度量測系統及量測方法 |
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EP0362679A2 (en) * | 1988-10-07 | 1990-04-11 | Ball Corporation | Inside surface inspection system and method therefor |
US5440395A (en) * | 1993-02-17 | 1995-08-08 | Mitsubishi Jukogyo Kabushiki Kaisha | Shroud contact wear sensor in a turbo machine |
US5610710A (en) * | 1996-05-28 | 1997-03-11 | International Business Machines Corporation | Dual mode illumination system for optical inspection |
US5909284A (en) * | 1997-04-23 | 1999-06-01 | Mitutoyo Corporation | Method and system for measuring an inner diameter of a hole formed in an object |
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US3806252A (en) * | 1972-07-10 | 1974-04-23 | Eastman Kodak Co | Hole measurer |
US4647208A (en) * | 1985-07-22 | 1987-03-03 | Perceptron, Inc. | Method for spatial measurement of holes |
US5587832A (en) * | 1993-10-20 | 1996-12-24 | Biophysica Technologies, Inc. | Spatially light modulated confocal microscope and method |
US6525875B1 (en) * | 1998-04-15 | 2003-02-25 | Vincent Lauer | Microscope generating a three-dimensional representation of an object and images generated by such a microscope |
JP2001041722A (ja) * | 1999-07-30 | 2001-02-16 | Canon Inc | 形状測定方法および装置 |
-
2003
- 2003-10-10 ES ES200302355A patent/ES2247890B1/es not_active Expired - Fee Related
-
2004
- 2004-10-08 EP EP04766974A patent/EP1686348A1/en not_active Withdrawn
- 2004-10-08 US US10/568,636 patent/US20060192978A1/en not_active Abandoned
- 2004-10-08 WO PCT/ES2004/000436 patent/WO2005036098A1/es active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0362679A2 (en) * | 1988-10-07 | 1990-04-11 | Ball Corporation | Inside surface inspection system and method therefor |
US5440395A (en) * | 1993-02-17 | 1995-08-08 | Mitsubishi Jukogyo Kabushiki Kaisha | Shroud contact wear sensor in a turbo machine |
US5610710A (en) * | 1996-05-28 | 1997-03-11 | International Business Machines Corporation | Dual mode illumination system for optical inspection |
US5909284A (en) * | 1997-04-23 | 1999-06-01 | Mitutoyo Corporation | Method and system for measuring an inner diameter of a hole formed in an object |
Also Published As
Publication number | Publication date |
---|---|
US20060192978A1 (en) | 2006-08-31 |
ES2247890A1 (es) | 2006-03-01 |
EP1686348A1 (en) | 2006-08-02 |
ES2247890B1 (es) | 2006-11-16 |
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