WO2005035836B1 - Volume measurement apparatus and method - Google Patents

Volume measurement apparatus and method

Info

Publication number
WO2005035836B1
WO2005035836B1 PCT/US2004/033483 US2004033483W WO2005035836B1 WO 2005035836 B1 WO2005035836 B1 WO 2005035836B1 US 2004033483 W US2004033483 W US 2004033483W WO 2005035836 B1 WO2005035836 B1 WO 2005035836B1
Authority
WO
WIPO (PCT)
Prior art keywords
vessel
electrochemical
cell
substrate
volume
Prior art date
Application number
PCT/US2004/033483
Other languages
French (fr)
Other versions
WO2005035836A1 (en
Inventor
Todd A Balisky
Donald A Cameron
Yevgeniy Rabinovich
Original Assignee
Applied Materials Inc
Todd A Balisky
Donald A Cameron
Yevgeniy Rabinovich
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Todd A Balisky, Donald A Cameron, Yevgeniy Rabinovich filed Critical Applied Materials Inc
Priority to EP04794753A priority Critical patent/EP1682700A1/en
Publication of WO2005035836A1 publication Critical patent/WO2005035836A1/en
Publication of WO2005035836B1 publication Critical patent/WO2005035836B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

Embodiments of the invention generally provide an electrochemical processing system configured to provide selected amounts of electrolyte composition components for plating processes. The selected amounts of components to be added to an electrolyte composition may be achieved by a volume measurement device (312) using an ultrasonic sensor (620) to measure volume levels of components in a vessel.

Claims

AMENDED CLAIMS [received by the International Bureau on 22 March 2005 (22.03.2005); original claims 15 and 22 amended; remaining claims unchanged]
1. An electrochemical processing system, comprising: a system platform having one or more processing cells positioned thereon; at least one robot positioned to transfer substrates between the one or more processing cells; and a fluid delivery system in fluid communication with each of the one or more processing cells, the fluid delivery system comprising: one or more chemical component sources; a metering pump in fluid communication with each of the chemical component sources; an electrolyte source in fluid communication with the metering pump; and a vessel in fluid communication with the metering pump at an input and with the one or more processing cells at an output, the vessel comprising a charging cell, an ultrasonic sensor, and a controller.
2. The electrochemical processing system of claim 1 , wherein the one or more chemical component sources further comprise: a first source for providing an electrochemical plating accelerator; a second source for providing an electrochemical plating leveler; and a third source for providing an electrochemical plating suppressor.
3. The electrochemical processing system of claim 2, wherein the one or more chemical component sources further comprises: at least one bulk chemical component container; and at least one buffer container having a volume less than the bulk chemical component container and being in fluid communication with an associated bulk chemical component container and the metering pump.
4. The electrochemical processing system of claim 1 , wherein at least two of the one or more processing cells comprise electrochemical plating cells, and at
33 least one of the one or more processing cells comprise a spin rinse dry processing cell.
5. The electrochemical processing system of claim 1 , wherein at least one of the one or more processing cells comprise a substrate bevel edge clean processing cell.
6. The electrochemical processing system of claim 1 , further comprising a factory interface in communication with the system platform.
7. The electrochemical processing system of claim 6, further comprising at least one annealing chamber in communication with at least one of the factory interface, the system platform, or both.
8. The electrochemical processing system of claim 7, wherein the at least one annealing chamber comprises at least one heating location and at least one cooling location.
9. The electrochemical processing system of claim 8, wherein the annealing chamber further comprises a substrate transfer robot positioned between the at least one heating position and the at least one cooling position, the substrate transfer robot is configured to transfer substrates between the heating and cooling positions.
10. The electrochemical processing system of claim 1 , wherein the fluid delivery system is further configured to supply an anolyte to an anode channber of at least one plating cell positioned on the system platform.
11. The electrochemical processing system of claim 1 , wherein the vessel further comprises a temperature measuring apparatus.
12. The electrochemical processing system of claim 1 , wherein the system platform comprises:
34 at least two electrochemical plating cells positioned at two of the process cell locations; at least one spin rinse dry cell positioned at one of the process cell locations; at least one substrate bevel clean cell positioned at another one of the process cell locations; and a fluid delivery system in fluid communication with each of the one or more processing cells, the fluid delivery system comprising: one or more chemical component sources; a metering pump in fluid communication with each of the chemical component sources; an electrolyte source in fluid communication with the metering pump; and a vessel in fluid communication with the metering pump at an input and with the one or more processing cells at an output, the vessel comprising a charging cell, an ultrasonic sensor, and a controller.
13. The electrochemical processing system of claim 1 , wherein the metering pump comprises a precise fluid delivery pump having one or more inputs and at least one output, the metering pump being configured to mix a predetermined ratio of fluid components received at the one or more inputs and output the predetermined ratio of fluid components from the at least one output.
14. The electrochemical processing system of claim 1 , wherein the fluid delivery system further comprises a second electrolyte solution source in fluid communication with the metering pump, the second electrolyte solution source being configured to provide a second virgin electrolyte.
15. A method for supplying a fluid to a substrate processing apparatus, the method comprising: measuring a first level in a vessel with a first ultrasonic signal to provide a first volume measurement; delivering at least one chemical comoonent to the vessel; measuring a second level in the vessel with a second ultrasonic signal to provide a second volume measurement; determining a difference in volume between the first volume measurement and the second volume measurement; comparing the difference in volume with a pre-determined value; and discharging chemical components from the vessel to the substrate processing apparatus.
16. The method of claim 15 further comprising delivering a catholyte to the vessel prior to measuring the volume in the vessel with the first ultrasonic signal.
17. The method of claim 16, further comprising purging gas from the vessel prior to measuring the volume in the vessel with the first ultrasonic signal.
18. The method of claim 15, wherein the discharging chemical components from the vessel to the substrate processing apparatus comprises closing a vent, opening a discharge valve, and pressure discharging the chemical components by a material selected from the group of an inert gas, water, or an electrolyte composition.
19. The method of claim 15, wherein the substrate processing apparatus comprises a plating cell, an unitary plating system platform, or a spin-rinse processing cell.
20. The method of claim 15, wherein the measuring the level in the vessel with the first ultrasonic signal further comprises measuring the temperature in the vessel.
21. The method of claim 15, further comprising continuously delivering the at least one chemical component to the vessel and measuring the level in the vessel until the pre-determined value is achieved.
22. The method of claim 15, where the suoolvinα the fluid to a substrate
36 processing apparatus further comprises: positioning a substrate in a plating cell on a unitary system platform for a plating technique; supplying an electrolyte to the plating cell; supplying an amount of one or more chemical components, wherein the amount of one or more chemical components are provided by: measuring the first level of the vessel with a first ultrasonic signal to provide the first volume measurement; delivering at least one chemical component to the vessel; measuring the second level in the vessel with a second ultrasonic signal to provide a second volume measu rement; determining the difference in volume between the first volume measurement and the second volume measurement; comparing the difference in volume with the pre-determined value; and discharging chemical components from the vessel to the plating cell; and depositing a conductive material from the electrolyte composition to the surface of the substrate.
23. The method of claim 22, further comprising rinsing the substrate.
24. The method of claim 22, further comprising spin drying the substrate.
37
PCT/US2004/033483 2003-10-10 2004-10-08 Volume measurement apparatus and method WO2005035836A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP04794753A EP1682700A1 (en) 2003-10-10 2004-10-08 Volume measurement apparatus and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/683,917 US20050077182A1 (en) 2003-10-10 2003-10-10 Volume measurement apparatus and method
US10/683,917 2003-10-10

Publications (2)

Publication Number Publication Date
WO2005035836A1 WO2005035836A1 (en) 2005-04-21
WO2005035836B1 true WO2005035836B1 (en) 2005-05-12

Family

ID=34422868

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/033483 WO2005035836A1 (en) 2003-10-10 2004-10-08 Volume measurement apparatus and method

Country Status (3)

Country Link
US (1) US20050077182A1 (en)
EP (1) EP1682700A1 (en)
WO (1) WO2005035836A1 (en)

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US8210826B2 (en) * 2006-04-15 2012-07-03 William Freeman Controlled liquid injection and blending apparatus
US7523661B2 (en) * 2006-08-02 2009-04-28 Honeywell International Inc. Methods and systems for liquid volumetric measurement
US20080041813A1 (en) * 2006-08-21 2008-02-21 Atmel Corporation Methods and compositions for wet etching
KR20100086490A (en) * 2007-10-24 2010-07-30 오씨 외를리콘 발처스 악티엔게젤샤프트 Method for manufacturing workpieces and apparatus
US8192605B2 (en) * 2009-02-09 2012-06-05 Applied Materials, Inc. Metrology methods and apparatus for nanomaterial characterization of energy storage electrode structures
US9059184B2 (en) * 2011-12-19 2015-06-16 Rkd Engineering Corporation Apparatus and method for decapsulating packaged integrated circuits
US9147018B2 (en) * 2013-01-10 2015-09-29 General Electric Company Method and system for use in controlling a pressure vessel
TWI569349B (en) 2013-09-27 2017-02-01 斯克林集團公司 Substrate processing apparatus and substrate processing method

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Also Published As

Publication number Publication date
WO2005035836A1 (en) 2005-04-21
US20050077182A1 (en) 2005-04-14
EP1682700A1 (en) 2006-07-26

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