WO2005024611A3 - Cooling system for electronic devices, especially computers - Google Patents

Cooling system for electronic devices, especially computers Download PDF

Info

Publication number
WO2005024611A3
WO2005024611A3 PCT/DE2004/001933 DE2004001933W WO2005024611A3 WO 2005024611 A3 WO2005024611 A3 WO 2005024611A3 DE 2004001933 W DE2004001933 W DE 2004001933W WO 2005024611 A3 WO2005024611 A3 WO 2005024611A3
Authority
WO
WIPO (PCT)
Prior art keywords
air
housing
cooling system
conducting apparatus
electronic devices
Prior art date
Application number
PCT/DE2004/001933
Other languages
German (de)
French (fr)
Other versions
WO2005024611A2 (en
Inventor
Eberhard Guenther
Original Assignee
Lg Thermo Technologies Gmbh
Eberhard Guenther
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Thermo Technologies Gmbh, Eberhard Guenther filed Critical Lg Thermo Technologies Gmbh
Publication of WO2005024611A2 publication Critical patent/WO2005024611A2/en
Publication of WO2005024611A3 publication Critical patent/WO2005024611A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Sustainable Development (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a cooling system for electronic devices comprising heat-generating electrical and electronic components, especially for computers. The aim of the invention is to provide improved cooling. Said aim is achieved by a cooling system for electronic devices, comprising a housing (1), an air-conducting apparatus (2) that is disposed inside said housing (1), and a fan (8) which is located in or on the air-conducting apparatus (2) and is used for cooling electronic components (9) by means of a heat pipe (5), said heat pipe (5) being provided with an evaporator (6) that is arranged on an electronic component (9) and a condenser (7). The air-conducting apparatus (2) is provided with an air inlet (3) inside the housing (1) while an air outlet (4) is disposed on the housing (1). The inventive cooling system is characterized in that the condenser (7) is placed in the air-conducting apparatus (2) while the air-conducting apparatus (2) is made of a poorly heat-conducting material having a K-value λ < 0.5 W/mK at 20 °C. In addition, the air heated by electronic components (9) is evacuated from the interior of the housing (1) via the air-conducting apparatus (2) and directly out of the housing (1) after cooling the condenser (7).
PCT/DE2004/001933 2003-09-01 2004-08-24 Cooling system for electronic devices, especially computers WO2005024611A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10341246.8 2003-09-01
DE2003141246 DE10341246B3 (en) 2003-09-01 2003-09-01 Cooling system for use with electronic equipment uses closed circuit fluid system having evaporator and condenser

Publications (2)

Publication Number Publication Date
WO2005024611A2 WO2005024611A2 (en) 2005-03-17
WO2005024611A3 true WO2005024611A3 (en) 2005-09-09

Family

ID=34072089

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2004/001933 WO2005024611A2 (en) 2003-09-01 2004-08-24 Cooling system for electronic devices, especially computers

Country Status (3)

Country Link
DE (1) DE10341246B3 (en)
TW (1) TW200510996A (en)
WO (1) WO2005024611A2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5323847A (en) * 1990-08-01 1994-06-28 Hitachi, Ltd. Electronic apparatus and method of cooling the same
JPH10111735A (en) * 1996-10-04 1998-04-28 Diamond Electric Mfg Co Ltd Cooler
US5917698A (en) * 1998-02-10 1999-06-29 Hewlett-Packard Company Computer unit having duct-mounted fan
US6113485A (en) * 1997-11-26 2000-09-05 Advanced Micro Devices, Inc. Duct processor cooling for personal computer
DE10053258A1 (en) * 2000-10-26 2002-05-16 Guenther Engineering Gmbh Heat sink for electronic device has evaporator and condenser heat exchangers connected in hermetically sealed heat sink circuit
US20020097557A1 (en) * 2001-01-25 2002-07-25 Carr Daniel Shawn Acoustic encapsulating system for hard drives

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6288895B1 (en) * 1996-09-30 2001-09-11 Intel Corporation Apparatus for cooling electronic components within a computer system enclosure
US20020053421A1 (en) * 1997-09-10 2002-05-09 Kabushiki Kaisha Toshiba Heat dissipating structure for electronic apparatus
US6621698B2 (en) * 2001-05-29 2003-09-16 Intel Corporation Computer assembly providing cooling for more than one electronic component

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5323847A (en) * 1990-08-01 1994-06-28 Hitachi, Ltd. Electronic apparatus and method of cooling the same
JPH10111735A (en) * 1996-10-04 1998-04-28 Diamond Electric Mfg Co Ltd Cooler
US6113485A (en) * 1997-11-26 2000-09-05 Advanced Micro Devices, Inc. Duct processor cooling for personal computer
US5917698A (en) * 1998-02-10 1999-06-29 Hewlett-Packard Company Computer unit having duct-mounted fan
DE10053258A1 (en) * 2000-10-26 2002-05-16 Guenther Engineering Gmbh Heat sink for electronic device has evaporator and condenser heat exchangers connected in hermetically sealed heat sink circuit
US20020097557A1 (en) * 2001-01-25 2002-07-25 Carr Daniel Shawn Acoustic encapsulating system for hard drives

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 09 31 July 1998 (1998-07-31) *

Also Published As

Publication number Publication date
TW200510996A (en) 2005-03-16
WO2005024611A2 (en) 2005-03-17
DE10341246B3 (en) 2005-02-17

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