WO2005006454A1 - 情報処理装置用基板および情報処理装置 - Google Patents
情報処理装置用基板および情報処理装置 Download PDFInfo
- Publication number
- WO2005006454A1 WO2005006454A1 PCT/JP2003/008734 JP0308734W WO2005006454A1 WO 2005006454 A1 WO2005006454 A1 WO 2005006454A1 JP 0308734 W JP0308734 W JP 0308734W WO 2005006454 A1 WO2005006454 A1 WO 2005006454A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- information processing
- processing device
- bio
- passage
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12004—Combinations of two or more optical elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/80—Constructional details
- H10N60/81—Containers; Mountings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
Definitions
- the present invention relates to a substrate for an information processing device that performs calculations and other information processing, and an information processing device provided with the substrate.
- an information processing apparatus As an information processing apparatus, a combination of electric elements operating at room temperature is generally used, and an information processing apparatus called an electronic computer is widely used.
- a path for transporting a substance necessary for maintaining a life activity in the bio-element that is, a bio-element activity maintaining path is required.
- Materials required to maintain life activity in bio devices are supplied to bio devices.
- bio devices There are nutrients, waste products from bio-elements, substances for controlling bio-elements such as certain hormones, and so on.
- piping as the bio-element activity maintenance passage.However, if piping is used, it is difficult to construct a complicated passage as in the case of an optical fiber cable, and even if it can be constructed, the equipment will be large. There is a problem of getting connected.
- the present invention has been made in view of the above circumstances, and an object thereof is to reduce the size of an information processing apparatus including at least one of a superconducting element, an optical element, and a bio element.
- An information processing apparatus substrate and an information processing apparatus are provided.
- the present invention for achieving the above object is a substrate for an information processing device, wherein a part of the substrate is thinned to connect to a refrigerant passage through which a refrigerant for cooling the superconducting element flows and an optical element. It is characterized in that at least one of a light transmission path to be used and a bio-element activity maintaining path for carrying a substance necessary for maintaining the activity of the bio-element is formed.
- the refrigerant passage, the light transmission passage, and the bio element activity maintaining passage is formed by making a part of the substrate thin, if this substrate is used, Becomes smaller.
- the refrigerant passage is formed by making a part of the substrate thin, the superconducting element can be cooled without immersing the entire device in a cryogenic refrigerant, so that the information processing device is compact. If a part of the substrate is thinned to form an optical transmission path or a bio-activity maintaining path, there is no need to route an optical fiber cable or piping, so the information processing device can be used. Become smaller.
- the refrigerant passage, the light transmission passage, and the bio element activity maintaining passage may be formed, but depending on the purpose of the information processing device. Therefore, any two of them are formed (for example, a refrigerant passage and a bio element activity maintaining passage, an optical transmission passage and a bio element activity maintaining passage). Or all three passages may be formed.
- the substrate is formed of a metal foil to be brought into contact with the superconducting element and a metal foil laminated on the metal foil.
- the refrigerant passage is formed by thinning portions of the two metal foils facing each other.
- the information processing apparatus substrate may further be provided with a conductor wiring for electrically connecting the elements.
- the passage is formed by etching. In this way, a complicated path can be formed with high accuracy as in the case of electric circuit wiring.
- FIG. 1 is a plan view of an information processing apparatus according to one embodiment of the present invention.
- FIG. 2 is a cross-sectional view taken along the line II-II of FIG.
- FIG. 3 is a plan view showing the portion shown in FIG. 2 with the superconducting element and the fifth metal foil removed.
- FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG.
- FIG. 5 is a sectional view taken along line VV of FIG. BEST MODE FOR CARRYING OUT THE INVENTION
- FIG. 1 is a plan view of an information processing apparatus 10 according to one embodiment of the present invention.
- the information processing apparatus 10 shown in FIG. 1 has a substrate 6 in which a plurality of superconducting elements 20, a plurality of optoelectronic elements 30, a plurality of bioelements 40, and an electric element 50 operating at room temperature are the same.
- the superconducting element 20, the optoelectronic element 30, the bio element 40, and the electric element 50 execute information processing such as arithmetic operation.
- the superconducting element 20 is an element that is brought into a superconducting state when the temperature is lower than a predetermined critical temperature and operates at a high speed and a high S / N ratio. Also, this superconducting element 20 For example, not only a device including only one device but also a device in which a plurality of devices are integrated and integrated (ie, an integrated circuit) can be used.
- the optoelectronic element 30 functioning as an optical element includes an optical function element, an optical integrated circuit, or an opto-electrical contact element, and an electronic element inside a not shown, and performs internal signal processing. This is an element that inputs and outputs signals to and from the outside using light or light and electricity. Since light is used as a signal, the signal can be propagated with almost no time delay.
- the information processing apparatus 10 of FIG. 1 includes an optoelectronic element 30 a, which operates at room temperature as an optoelectronic element 30, has a predetermined critical temperature, and operates in a superconducting state at or below the critical temperature (that is, superconductivity).
- the superconducting photoelectric element 30b and the photoelectric sensor 30c are provided.
- the bio-element 40 contains, for example, a plurality of biologically-related substances, such as a plurality of biological cells connected to the conductor wiring 62 and connected to each other, in an unillustrated interior, and transmits signals between the biologically-related substances.
- the bioelement 40 is a combination of a nerve cell element 40a, a biosensor 40b, and a photo-sensitive living cell 42 such as a retinal cell and an electric element.
- a bio-optoelectronic device 40c is provided.
- a solid line connecting the elements 20, 30 and 40 is a conductor wiring 62 formed on a substrate 60 by etching from a metal foil in a pattern shown in FIG.
- the conductor wiring 62 is made of, for example, copper, and electrically connects elements of the same type and elements of different types with the conductor wiring 62.
- a refrigerant passage 64 through which a refrigerant for cooling the superconducting element 20 flows, an optical waveguide 66 through which light output from the optoelectronic element 30 propagates (ie, an optical transmission path), a bio element A biodevice activity maintenance channel 68 for transporting substances necessary for maintaining the activity of 40 is formed.
- One end of the refrigerant passage 6 is formed as a refrigerant inlet 70, and a refrigerant is injected into the refrigerant inlet 70 via a pipe (not shown) by a pump (not shown) provided outside the substrate 60. Then, the injected refrigerant flows through the refrigerant passage 64 and is discharged from the refrigerant outlet 72.
- the type of the refrigerant to be used is determined by the critical temperature of the superconducting element 20, but liquid nitrogen or a substance having a boiling point near the liquid nitrogen is preferable.
- the bio element activity maintaining passage 68 includes, for example, a nutrient transfer passage 68 a for transporting a nutrient for nourishing a biological substance to the bio element 40, and a bio matter from the bio element inside the bio element 40. Waste transport passages 6 8 b for transporting waste products, and hormones for controlling the growth of bio-related substances contained inside the bioelement 40, memory and logic learning by changing connections, etc.
- a control substance transport passage 68c for transporting a predetermined control substance is formed.
- a constant temperature device (not shown) is connected to the nutrient substance transport passage 68a and the control substance transport passage 68c so that the temperature of the substance supplied to the bioelement 40 is substantially constant. Is controlled.
- FIGS. 2, 4, and 5 are cross-sectional views taken along lines II-II, IV-IV, and V-V of FIG. 1, respectively. That is, FIG. 2 is a cross-sectional view of a portion where the superconducting element 20 is disposed, FIG. 4 is a cross-sectional view of a portion where the optoelectronic device 30a is disposed, and FIG. 5 is a biosensor 4 Ob (biodevice 40 FIG. 4 is a cross-sectional view of a portion where () is disposed.
- the substrate 60 has three metal foils, that is, a first metal foil 60 c, between the upper resin plate 60 a and the lower resin plate 60 b.
- (2) Basically, a five-layer laminated structure in which a metal foil (60d) and a third metal foil (60e) are sandwiched, but as shown in FIG.
- two metal foils having the same planar shape as the superconducting element 20, namely, the fourth metal foil 60f and the fifth metal foil 60 g are stacked.
- These metal foils 60 c to 60 g are, for example, copper foils, and a predetermined adhesive is used as necessary for bonding the metal foils or the metal foil and the resin plate.
- the elements 20, 30 and 40 are placed on the upper resin plate 60 a or the fifth metal foil 60 g.
- the metal foils 60c to 60g and the conductor wiring 62 are shown thicker than they actually are.
- FIG. 3 is a plan view showing the information processing device 10 shown in FIG. 2 with the superconducting element 20 and the fifth metal foil 60 g in contact with the superconducting element 20 removed.
- the refrigerant passage 64 is a refrigerant supply passage 64 a that guides the refrigerant to the lower part of the superconducting element 20, and a cooling passage 64 that flows under the superconducting element 20 and cools the superconducting element 20.
- Refrigerant discharge path 64c for discharging the refrigerant that has cooled superconducting element 20, c It is composed of a first through hole 64d connecting the supply path 64a and the cooling path 64b, and a second through hole 64e connecting the cooling path 64b and the refrigerant discharge path 64c.
- the coolant supply path 64 a is formed by making the opposed portions of the first metal foil 60 c and the second metal foil 60 d thin, and the cooling path 64 b
- the two metal foils between the upper resin plate 60 a and the superconducting element 20, that is, the opposing portions of the fourth metal foil 60 f and the fifth metal foil 60 g are made thin.
- the refrigerant discharge path 64c is formed by making the opposed portions of the second metal foil 60d and the third metal foil 60e thin, and the second through hole 64e is formed by The upper resin plate 60a and the metal foils 60e and 60f laminated on both sides thereof are formed so as to penetrate therethrough.
- the first throughhorn 64 d passes through four sheets of the second metal foil 60 d, the third metal foil 60 e, the upper resin plate 60 a, and the fourth metal foil 60 f. It is formed.
- the refrigerant flows through the refrigerant passage 64, the superconducting element 20 is cooled via the fifth metal foil 60g.
- the refrigerant supply path 64a, the cooling path 64b, and the refrigerant discharge path 64c are respectively hard fetched (etching controlled so as not to penetrate) in the metal foil 60c to 60g. Is formed locally within the thickness of the substrate 60 by locally applying a predetermined circuit pattern shown in FIG. Next, the optical waveguide 66 will be described. As shown in FIG.
- the optical waveguide 66 in the thickness direction of the third metal foil 60 e is located on the upper resin plate 60 a side in the thickness direction of the third metal foil 60 e. I have.
- the position of the optical waveguide 66 in the thickness direction is set in this manner in order to allow the optical waveguide 66 to three-dimensionally intersect with the coolant passage 64.
- the wave path 66 is formed between the first metal foil 60 c and the second metal foil 60 d and between the second metal foil 60 d as in the refrigerant supply path 64 a and the refrigerant discharge path 64 c.
- the optical waveguide 66 has a small light transmission loss such as quartz glass acryl resin in a concave portion formed by locally half-etching the third metal foil 60 e with the circuit pattern shown in FIG.
- the structure is filled with material. This material is a single
- the optical fiber cable may have a refractive index, or the refractive index may gradually or smoothly decrease or change radially outward as in the case of a clad type optical fiber cable or a graded type optical fiber cable.
- the optoelectronic device 30a is housed in the substrate 60 such that the lower end overlaps the optical waveguide 66 in the thickness direction of the substrate 60 so that light can be transmitted and received to and from the optical waveguide 66. I have.
- the bioelement activity maintenance passage 68 will be described.
- the nutrient substance transport passage 68a has, like the refrigerant supply passage 64a, a portion where the first metal foil 60c and the second metal foil 60d face each other have a thin wall.
- the waste transport passage 68b is formed in the second metal foil 60d and the third metal foil 60e, facing each other, similarly to the refrigerant discharge passage 64c. Is formed within the thickness of the substrate 60 by locally reducing the thickness.
- the bio-element 40 is connected to the bio-element activity maintaining passage 68, and the lower end thereof is connected to the bio-element activity maintaining passage 68 in the thickness direction of the substrate 60 so that a substance can flow therethrough. It is accommodated in the substrate 60 so as to overlap.
- the coolant passage 64, the optical waveguide 66, and the bio-element activity maintaining passage 68 are formed by partially thinning the substrate 60.
- the superconducting element 20 can be cooled without immersing the entire apparatus in a cryogenic refrigerant, and the information processing apparatus 10 can be reduced in size because there is no need to route an optical fiber cable or piping. Become.
- the opposing portions of the fifth metal foil 60 g in contact with the superconducting element 20 and the fourth metal foil 60 f laminated on the fifth metal foil 60 g are thinned. Since the cooling passages 64b are formed, the heat is transmitted between the refrigerant in the cooling passages 64b and the superconducting element 20 via a metal having high thermal conductivity. Thus, superconducting element 20 is cooled.
- the metal passages 60 c to 60 g which are a part of the substrate 60 are made thin (that is, the thickness is left without being penetrated), so that the refrigerant passages 64,
- the optical waveguide 66 and the bio-element activity maintaining passage 68 were formed within the thickness of the substrate 60, but when the substrate 60 was viewed as a whole, a part thereof was made thinner so that the refrigerant passages 64, etc. Is formed, one or more metal foils 60c to 60g may be penetrated.
- the resin plates 60 a and 60 b are made thin.
- the refrigerant passages 64 and the like may be formed.
- the coolant passages 64, the optical waveguides 66, and the bio-element activity maintaining passages 68 are formed by etching, but may be formed by other methods such as laser processing. ,.
- a plurality of superconducting elements 20, optoelectronic elements 30, and bioelements 40 were all provided, but the superconducting element 20, optoelectronic elements 30, and bioelements 40 were all provided. Only one may be provided, and if at least one of the superconducting element 20, the optoelectronic element 30, and the bio element 40 is provided, the other elements 20, 30, 40 are provided. May not be provided.
- the electric element 50 that operates at room temperature is further provided, but the electric element 50 is provided. You do not need to
- the optoelectronic device 30 that uses an electric signal in addition to light is provided as an optical device.
- an element that uses only light as a signal may be provided.
- a resin film such as a fluororesin may be coated in the bio-element activity maintaining passage 68.
- the substrate 60 has a structure in which two resin plates 60 a and 60 b and five metal foils 60 c to 60 g are laminated.
- the number may be other than this.
- the substrate may be composed of only one or a plurality of metal foils, only one or a plurality of resin plates, or a material other than metal and resin may be used.
- the elements 20, 30, 40, and 50 are arranged only on one surface of the substrate 60, but may be arranged on both surfaces.
- the embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and the present invention may be implemented with various modifications without departing from the spirit thereof. Things.
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- Microelectronics & Electronic Packaging (AREA)
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- Containers, Films, And Cooling For Superconductive Devices (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003248261A AU2003248261A1 (en) | 2003-07-09 | 2003-07-09 | Substrate for information processor and information processor |
PCT/JP2003/008734 WO2005006454A1 (ja) | 2003-07-09 | 2003-07-09 | 情報処理装置用基板および情報処理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2003/008734 WO2005006454A1 (ja) | 2003-07-09 | 2003-07-09 | 情報処理装置用基板および情報処理装置 |
Publications (1)
Publication Number | Publication Date |
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WO2005006454A1 true WO2005006454A1 (ja) | 2005-01-20 |
Family
ID=34044600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/008734 WO2005006454A1 (ja) | 2003-07-09 | 2003-07-09 | 情報処理装置用基板および情報処理装置 |
Country Status (2)
Country | Link |
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AU (1) | AU2003248261A1 (ja) |
WO (1) | WO2005006454A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2330873A1 (de) * | 2009-12-03 | 2011-06-08 | Continental Automotive GmbH | Elektronisches Modul |
WO2012011046A1 (en) * | 2010-07-21 | 2012-01-26 | Telefonaktiebolaget L M Ericsson (Publ) | Optical interconnects in cooling substrates |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4392362A (en) * | 1979-03-23 | 1983-07-12 | The Board Of Trustees Of The Leland Stanford Junior University | Micro miniature refrigerators |
JPH05127034A (ja) * | 1991-05-30 | 1993-05-25 | Fujitsu Ltd | 回路配線基板 |
JP2002174610A (ja) * | 2000-12-08 | 2002-06-21 | Nec Corp | バイオセンサ及びバイオセンサを用いた液体試料の測定方法 |
JP2003149480A (ja) * | 2001-11-14 | 2003-05-21 | Hitachi Cable Ltd | 光電気複合基板およびその製造方法 |
-
2003
- 2003-07-09 AU AU2003248261A patent/AU2003248261A1/en not_active Abandoned
- 2003-07-09 WO PCT/JP2003/008734 patent/WO2005006454A1/ja not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4392362A (en) * | 1979-03-23 | 1983-07-12 | The Board Of Trustees Of The Leland Stanford Junior University | Micro miniature refrigerators |
JPH05127034A (ja) * | 1991-05-30 | 1993-05-25 | Fujitsu Ltd | 回路配線基板 |
JP2002174610A (ja) * | 2000-12-08 | 2002-06-21 | Nec Corp | バイオセンサ及びバイオセンサを用いた液体試料の測定方法 |
JP2003149480A (ja) * | 2001-11-14 | 2003-05-21 | Hitachi Cable Ltd | 光電気複合基板およびその製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2330873A1 (de) * | 2009-12-03 | 2011-06-08 | Continental Automotive GmbH | Elektronisches Modul |
WO2012011046A1 (en) * | 2010-07-21 | 2012-01-26 | Telefonaktiebolaget L M Ericsson (Publ) | Optical interconnects in cooling substrates |
US8179676B2 (en) | 2010-07-21 | 2012-05-15 | Telefonaktiebolaget L M Ericsson (Publ) | Optical interconnects in cooling substrates |
Also Published As
Publication number | Publication date |
---|---|
AU2003248261A1 (en) | 2005-01-28 |
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