WO2005006435A1 - Puits de chaleur - Google Patents

Puits de chaleur Download PDF

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Publication number
WO2005006435A1
WO2005006435A1 PCT/SG2004/000193 SG2004000193W WO2005006435A1 WO 2005006435 A1 WO2005006435 A1 WO 2005006435A1 SG 2004000193 W SG2004000193 W SG 2004000193W WO 2005006435 A1 WO2005006435 A1 WO 2005006435A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
base plate
heat
fins
walls
Prior art date
Application number
PCT/SG2004/000193
Other languages
English (en)
Inventor
Cheong Kong Chang
Original Assignee
C C K Innovations Sdn Bhd
Loh, Ean Leng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by C C K Innovations Sdn Bhd, Loh, Ean Leng filed Critical C C K Innovations Sdn Bhd
Publication of WO2005006435A1 publication Critical patent/WO2005006435A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a heat sink for an integrated circuit chip, particularly for a microprocessor of a computer.
  • a heat sink by definition, is a device which receives heat from a heat source. Inevitably, the temperature of any heat sink needs to be colder than the heat source at any time for it to function, and hence itself needs to reject heat to colder sources such as the environment.
  • the rate of heat transfer Q is generally represented by the formula:
  • h is the heat transfer coefficient
  • S is the heat transfer area
  • T is the temperature difference.
  • Most of the heat sinks for-microprocessor are typically metal- plates made of conductive material, for example aluminum and copper. They have plurality of fins to increase the heat transfer area and dissipate heat into the air by convection.
  • An active fan can be designed to mount on top of the heat sink to promote air convection efficiency.
  • a retention mechanism such as a clip is required to secure the heat sink onto microprocessor, or any other electronic packages, across heat dissipation path.
  • the fins of the heat sinks are typically rectangular metal sheets that are arranged parallel to each other as seen in figure 1.
  • a column of moving air on the other hand, on meeting an obstruction such as a flat surface, will naturally spread out in all direction along the surface. This is best visualised when a stream of water from a faucet continuously falls onto the surface of a sink, creating a puddle of water which spreads in all direction. Therefore, such arrangement will not facilitate the air flow out of the heat sink as its natural path collides with the fins.
  • the volume underneath the fan hub often represents a column of stagnant air. Within this column, air either circulates from the bottom to the top and down to the bottom again without leaving the column, or remains still and immobile.
  • the invention is an improved heat sink, which is mounted onto a micro-processor or any other suitable electronic packages, comprising a base plate having a first and a second surface.
  • the first surface is intended to be placed in thermal contact with the micro-processor while a column made of heat conducting material is disposed on the second surface of the said base plate and in thermal contact with the base plate, preferably above the micro-processor.
  • the base plate, together with the conducting column and the attached fins, provide a large surface area in a compact structure allowing heat to be convected away by air current.
  • the fins located in the space between two adjacent wall members are aligned parallel to each other along the radial direction of the heat conducting column, so as to reduce obstruction to the natural path of air flow.
  • the fins may even be curved sideward.
  • the heat conducting column has a hyperbolic vertical cross section to cater for the exceptionally high heat flux within area above the micro-processor by helping to conduct heat away from the area.
  • the conducting column may also have additional fins to improve the rate of heat dissipation.
  • Supporting columns are present near the periphery of the heat sink for mounting a fan on its top and attaching the heat sink to the micro-processor below.
  • the entire structure of the heat sink forms an integral body made of the same heat-conducting material.
  • the conducting material can be copper, aluminium, iron and other heat-conducting alloys.
  • the structure of the heat sink takes on a cuboid.
  • a cylindrical heat sink is also feasible for the invention.
  • Figure 1 a shows the flow of air on a flat plate when air is blown from a fan.
  • Figure 1b shows the flow of air around the body of the invented heat sink along a vertical cross section when the air is blown from a fan which is mounted on top.
  • Figure 2 shows the perspective view of the preferred embodiment of the invention
  • FIG. 2a shows the top view of the preferred embodiment of invention
  • Figure 2b shows a vertical cross section similar to figure 1b of the preferred embodiment
  • Figure 2c shows a side view of the preferred embodiment
  • FIG. 3 shows the plan view of each of the different embodiments of the invention.
  • the heat sink consists of a base plate (20) which is placed adjacent to and in thermal contact with the surface of an electronic package (5), particularly an IC chip or a microprocessor.
  • an electronic package (5) particularly an IC chip or a microprocessor.
  • the heat sink and the chip (5) can be either in direct physical contact, or be separated by a layer of material, provided heat conduction is not hindered.
  • a column (10) of conductive material is disposed in line with the chip on the other surface of the said plate away from the chip.
  • This column (10) is in thermal contact with the chip so that heat can be conducted away from the central part of the base plate (20) along this column (10) without causing overheating to the chip. It is usually located at the center of the base plate (20) where the chip (5) normally lies.
  • the presence of the heat conducting column (10) will also reduce, if not completely eliminate, the volume of air re-circulation underneath the fan hub; no air will be trapped and heated up.
  • the heat conducting column (10) can also reject heat to the air current as the stream of air nearest to the fan hub flows along the surface of the column (10) before reaching the base plate (20). This, inadvertently, also increases the heat transfer area for air convection at the central region as compared to flat surface.
  • the heat conducting column (10) and the base plate (20) form an integral body of the heat sink having a hyperbolic cross section of which column width progressively becomes shorter as one moves away from the base plate to measure it.
  • This shape is designed to match the heat flux profile, which has the same shape as the temperature profile, of a flat plate. This shape also has an advantage of maximising contact time of the air with the heat sink given the same volume of conductive material without disrupting the smooth flow of air.
  • walls (40) extending from the heat conducting column (10) are constructed on the surface of the base plate (20). These walls (40) divide the structure of the heat sink into multiple sections. There will be fins (30) branching out along these walls (40), and these fins (30) will be disposed on the base plate (20) so that they are in thermal contact. Preferably, the fins are perpendicular to the base plate (20). Additional fins may be attached directly to the heat conducting column (10).
  • the base plate (20), the heat conducting column (10), the walls (40) and the fins (30) are thermally integrated, meaning that heat that is absorbed from chip (5) can be conducted to every part of the sink, namely the base plate (20), the heat conducting column (10), the walls (40) and the fins (30).
  • Heat absorbed from the chip (5) is first spread out along the base plate (20), and the same base plate is sometimes referred to as heat-spreader base because of this function. Subsequently, heat may be conducted towards the base of the column (10) and the walls (40), as well as the base portion of a few fins (30), particularly for those fins which are located near the chip (5).
  • the heat conducting column (10) becomes hotter, heat from the column will also be conducted to walls (40) and spread towards the fins (30) which branch from the walls (40). Therefore, the heat sink is able to provide multiple pathways for heat conduction from the base plate towards the fins, which are: 1 ) from the base plate directly to the fins, 2) from the base plate, to the walls and then to the fins, and 3) from the base plate, to the central column, the walls and finally to the fins.
  • fins (30) that are located within the same section between two adjacent dividing walls (40) may be aligned parallel to each other so that the adjacent fins are equidistantly separated from each other. They are best aligned to meet the periphery of the base plate (20) (or the tangent of the periphery if the periphery is curved) that are enclosed within the two adjacent dividing walls (40) at an oblique angle. This is to reduce the obstruction to the natural path of air flow, ensuring the heated air leave at all sides of the heat sink structure.
  • the fins (30) are not limited to flat plates; they may even be curved sidewards, as shown in figure 4a.
  • additional supporting column (50) may be erected for mounting the fan on the top of the heat sink and attaching the heat sink on top of the IC chip (5).
  • the free (unbound) edges of the fins (30) are aligned either along a flat plane or a curvature.
  • the top edges of the fins i.e the free edges which are furthest away from the base plate
  • All the top edges and the top of columns (10,50) lie on a planar surface which is parallel to the base plate (20) and this makes mounting a fan onto the heat sink convenient.
  • the free ends of the fins are aligned to four planar surfaces that are perpendicular with base plate (20). Therefore, the whole heat sink will have a cuboidal shape.
  • the same heat sink may contain more than four dividing walls as shown in figure 4b and 4c.
  • the invention does not have to take on cuboidal shape. It can also be cylindrical in shape with the free ends of the fins aligned to the curved surface of a cylinder, as exemplified in figure 3.
  • the entire structure of the heat sink meaning the base plate (20), the conducting column (10), the walls (40), the fins (30) and the supporting columns (50), forms an integral body made up of a single heat conducting material, though there is no restriction in which the different components of structure cannot be made from different material.
  • the heat sink can be made of copper, aluminium, iron and good heat-conducting alloy. Operation of heat sink
  • the heat sink draws heat from the die surface of the chip (5) to the base plate (20) and subsequently spreads the heat to the conducting column (10), the dividing walls (40) and the fins (30), as described earlier.
  • the fan blows air from the top of the heat sink towards the base plate (20) and the air current continuously extracts heat from every part of the heat sink which it comes into contact with.
  • the fins first partition the flow of air into the space in between the fins (30). The path of flow will generally follow a hyperbolic curve, as the air current flows from the fan to the base plate (20). In a once-through fashion, the air will then leave from all sides of the heat sink. The path and direction of the air flow is as shown in figure 1b.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un puits de chaleur amélioré, monté sur un processeur d'unité centrale, qui comprend une plaque de base (20) en contact avec le processeur (5), une colonne conductrice (10) située au-dessus du processeur (5) à la surface de ladite plaque (20), face tournée du côté opposé à celui du processeur (5), et plusieurs cloisons de séparation (40) qui s'étendent depuis la colonne (10), sachant que les cloisons (40) présentent des ailettes (30) contribuant à la dissipation de la chaleur.
PCT/SG2004/000193 2003-07-09 2004-07-02 Puits de chaleur WO2005006435A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
MYPI20032570 2003-07-09
MYPI20032570 2003-07-09

Publications (1)

Publication Number Publication Date
WO2005006435A1 true WO2005006435A1 (fr) 2005-01-20

Family

ID=34056968

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG2004/000193 WO2005006435A1 (fr) 2003-07-09 2004-07-02 Puits de chaleur

Country Status (1)

Country Link
WO (1) WO2005006435A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009032920A2 (fr) * 2007-09-05 2009-03-12 Skyline Solar, Inc. Récepteur photovoltaïque
EP2230697A1 (fr) * 2009-03-20 2010-09-22 SAVIO S.p.A. Récepteur photovoltaïque ventilé
US7968791B2 (en) 2009-07-30 2011-06-28 Skyline Solar, Inc. Solar energy collection system
US8049150B2 (en) 2009-01-12 2011-11-01 Skyline Solar, Inc. Solar collector with end modifications
US20150296662A1 (en) * 2014-04-10 2015-10-15 Advanced Thermal Solutions, Inc. Multiple Flow Entrance Heat sink
CN108901190A (zh) * 2018-09-18 2018-11-27 成都金洹科科技有限公司 一种电子散热管

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988000393A1 (fr) * 1986-06-30 1988-01-14 Unisys Corporation Puits thermique a reduction de contraintes
US5854739A (en) * 1996-02-20 1998-12-29 International Electronic Research Corp. Long fin omni-directional heat sink
US6199624B1 (en) * 1999-04-30 2001-03-13 Molex Incorporated Folded fin heat sink and a heat exchanger employing the heat sink
US6538888B1 (en) * 2001-09-28 2003-03-25 Intel Corporation Radial base heatsink

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988000393A1 (fr) * 1986-06-30 1988-01-14 Unisys Corporation Puits thermique a reduction de contraintes
US5854739A (en) * 1996-02-20 1998-12-29 International Electronic Research Corp. Long fin omni-directional heat sink
US6199624B1 (en) * 1999-04-30 2001-03-13 Molex Incorporated Folded fin heat sink and a heat exchanger employing the heat sink
US6538888B1 (en) * 2001-09-28 2003-03-25 Intel Corporation Radial base heatsink

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009032920A3 (fr) * 2007-09-05 2009-06-11 Skyline Solar Inc Récepteur photovoltaïque
US7709730B2 (en) 2007-09-05 2010-05-04 Skyline Solar, Inc. Dual trough concentrating solar photovoltaic module
WO2009032920A2 (fr) * 2007-09-05 2009-03-12 Skyline Solar, Inc. Récepteur photovoltaïque
US7820906B2 (en) 2007-09-05 2010-10-26 Skyline Solar, Inc. Photovoltaic receiver
US7825327B2 (en) 2007-09-05 2010-11-02 Skyline Solar, Inc. Concentrating solar collector
US7932461B2 (en) 2007-09-05 2011-04-26 Skyline Solar, Inc. Solar collector framework
US8049150B2 (en) 2009-01-12 2011-11-01 Skyline Solar, Inc. Solar collector with end modifications
EP2230697A1 (fr) * 2009-03-20 2010-09-22 SAVIO S.p.A. Récepteur photovoltaïque ventilé
US8426721B2 (en) 2009-03-20 2013-04-23 Savio S.P.A. Ventilated photovoltaic receiver
US7968791B2 (en) 2009-07-30 2011-06-28 Skyline Solar, Inc. Solar energy collection system
US20150296662A1 (en) * 2014-04-10 2015-10-15 Advanced Thermal Solutions, Inc. Multiple Flow Entrance Heat sink
US10692798B2 (en) * 2014-04-10 2020-06-23 Advanced Thermal Solutions, Inc. Multiple flow entrance heat sink
CN108901190A (zh) * 2018-09-18 2018-11-27 成都金洹科科技有限公司 一种电子散热管

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