WO2005006002A3 - Verfahren zum einlernen einer wissensbasierten datenbasis für die automatische fehlerklassifikation - Google Patents

Verfahren zum einlernen einer wissensbasierten datenbasis für die automatische fehlerklassifikation

Info

Publication number
WO2005006002A3
WO2005006002A3 PCT/EP2004/051008 EP2004051008W WO2005006002A3 WO 2005006002 A3 WO2005006002 A3 WO 2005006002A3 EP 2004051008 W EP2004051008 W EP 2004051008W WO 2005006002 A3 WO2005006002 A3 WO 2005006002A3
Authority
WO
WIPO (PCT)
Prior art keywords
learning
knowledge
defect classification
database used
based database
Prior art date
Application number
PCT/EP2004/051008
Other languages
English (en)
French (fr)
Other versions
WO2005006002A2 (de
Inventor
Dirk Soenksen
Ralf Friedrich
Andreas Draeger
Detlef Schupp
Luu Thin Van
Wolfgang Langer
Original Assignee
Leica Microsystems
Dirk Soenksen
Ralf Friedrich
Andreas Draeger
Detlef Schupp
Luu Thin Van
Wolfgang Langer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102004022717A external-priority patent/DE102004022717B4/de
Application filed by Leica Microsystems, Dirk Soenksen, Ralf Friedrich, Andreas Draeger, Detlef Schupp, Luu Thin Van, Wolfgang Langer filed Critical Leica Microsystems
Priority to US10/564,454 priority Critical patent/US7623698B2/en
Priority to EP04735896A priority patent/EP1644895A2/de
Publication of WO2005006002A2 publication Critical patent/WO2005006002A2/de
Publication of WO2005006002A3 publication Critical patent/WO2005006002A3/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Analysis (AREA)
  • Information Retrieval, Db Structures And Fs Structures Therefor (AREA)

Abstract

Es ist ein Verfahren zur zum Einlernen einer wissensbasierten Datenbasis für die automatische Fehlerklassifikation offenbart. Den Benutzer werden eine Reihe von Eingaben abgenommen, da das System einen automatischen Lernmodus durchführt, der eine Reduzierte Anzahl von Benutzereingaben
PCT/EP2004/051008 2003-07-12 2004-06-03 Verfahren zum einlernen einer wissensbasierten datenbasis für die automatische fehlerklassifikation WO2005006002A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/564,454 US7623698B2 (en) 2003-07-12 2004-06-03 Method of learning a knowledge-based database used in automatic defect classification
EP04735896A EP1644895A2 (de) 2003-07-12 2004-06-03 Verfahren zum einlernen einer wissensbasierten datenbasis für die automatische fehlerklassifikation

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10331646.9 2003-07-12
DE10331646 2003-07-12
DE102004022717.9 2004-05-07
DE102004022717A DE102004022717B4 (de) 2003-07-12 2004-05-07 Verfahren zum Einlernen einer wissensbasierten Datenbasis für die automatische Fehlerklassifikation

Publications (2)

Publication Number Publication Date
WO2005006002A2 WO2005006002A2 (de) 2005-01-20
WO2005006002A3 true WO2005006002A3 (de) 2005-02-10

Family

ID=34066319

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/051008 WO2005006002A2 (de) 2003-07-12 2004-06-03 Verfahren zum einlernen einer wissensbasierten datenbasis für die automatische fehlerklassifikation

Country Status (3)

Country Link
US (1) US7623698B2 (de)
EP (1) EP1644895A2 (de)
WO (1) WO2005006002A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9613411B2 (en) * 2014-03-17 2017-04-04 Kla-Tencor Corp. Creating defect classifiers and nuisance filters
US9798954B1 (en) * 2016-12-15 2017-10-24 Federal Home Loan Mortgage Corporation System, device, and method for image anomaly detection
WO2019194064A1 (ja) * 2018-04-02 2019-10-10 日本電産株式会社 画像処理装置、画像処理方法、外観検査システムおよび外観検査方法
US12086519B2 (en) * 2020-11-03 2024-09-10 Changxin Memory Technologies, Inc. Method and apparatus for setting wafer script, device and storage medium
US11756186B2 (en) * 2021-09-15 2023-09-12 Mitutoyo Corporation Workpiece inspection and defect detection system utilizing color channels

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020184172A1 (en) * 2001-04-16 2002-12-05 Vladimir Shlain Object class definition for automatic defect classification

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6292582B1 (en) * 1996-05-31 2001-09-18 Lin Youling Method and system for identifying defects in a semiconductor
US6246787B1 (en) * 1996-05-31 2001-06-12 Texas Instruments Incorporated System and method for knowledgebase generation and management
US6104835A (en) * 1997-11-14 2000-08-15 Kla-Tencor Corporation Automatic knowledge database generation for classifying objects and systems therefor
US6408219B2 (en) * 1998-05-11 2002-06-18 Applied Materials, Inc. FAB yield enhancement system
WO2001041068A1 (fr) * 1999-11-29 2001-06-07 Olympus Optical Co., Ltd. Systeme de detection de defaut
US6456899B1 (en) * 1999-12-07 2002-09-24 Ut-Battelle, Llc Context-based automated defect classification system using multiple morphological masks
US6792366B2 (en) * 2001-12-11 2004-09-14 Hitachi, Ltd. Method and apparatus for inspecting defects in a semiconductor wafer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020184172A1 (en) * 2001-04-16 2002-12-05 Vladimir Shlain Object class definition for automatic defect classification

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
BREAUX L ET AL: "Automatic defect classification system for patterned semiconductor wafers", SEMICONDUCTOR MANUFACTURING, 1995., IEEE/UCS/SEMI INTERNATIONAL SYMPOSIUM ON AUSTIN, TX, USA 17-19 SEPT. 1995, NEW YORK, NY, USA,IEEE, US, 17 September 1995 (1995-09-17), pages 68 - 73, XP010193372, ISBN: 0-7803-2928-7 *
JÄHNE B: "Pixelverarbeitung", DIGITALE BILDVERARBEITUNG, June 2001 (2001-06-01), SPRINGER VERLAG, BERLIN, DE, pages 257 - 295, XP002306421, ISBN: 3540412603 *
LI J ET AL: "Production use of an integrated automatic defect classification (ADC) system operating in a laser confocal/white light imaging defect review station", ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP, 1996. ASMC 96 PROCEEDINGS. IEEE/SEMI 1996 CAMBRIDGE, MA, USA 12-14 NOV. 1996, NEW YORK, NY, USA,IEEE, US, 12 November 1996 (1996-11-12), pages 107 - 111, XP010204507, ISBN: 0-7803-3371-3 *
READING I ET AL: "Development of Automated Wafer Bump Inspection Technology", SIMTECH TECHNICAL REPORT, 2001, pages 1 - 6, XP002306422 *

Also Published As

Publication number Publication date
US7623698B2 (en) 2009-11-24
US20060245634A1 (en) 2006-11-02
WO2005006002A2 (de) 2005-01-20
EP1644895A2 (de) 2006-04-12

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