WO2004100473A2 - Signal isolators using micro-transformers - Google Patents
Signal isolators using micro-transformers Download PDFInfo
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- WO2004100473A2 WO2004100473A2 PCT/US2004/013806 US2004013806W WO2004100473A2 WO 2004100473 A2 WO2004100473 A2 WO 2004100473A2 US 2004013806 W US2004013806 W US 2004013806W WO 2004100473 A2 WO2004100473 A2 WO 2004100473A2
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- winding
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- transformer
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F19/00—Fixed transformers or mutual inductances of the signal type
- H01F19/04—Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range
- H01F19/08—Transformers having magnetic bias, e.g. for handling pulses
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K5/00—Manipulating of pulses not covered by one of the other main groups of this subclass
- H03K5/125—Discriminating pulses
- H03K5/1252—Suppression or limitation of noise or interference
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L25/00—Baseband systems
- H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
- H04L25/0264—Arrangements for coupling to transmission lines
- H04L25/0266—Arrangements for providing Galvanic isolation, e.g. by means of magnetic or capacitive coupling
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F2017/0093—Common mode choke coil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F19/00—Fixed transformers or mutual inductances of the signal type
- H01F19/04—Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range
- H01F19/08—Transformers having magnetic bias, e.g. for handling pulses
- H01F2019/085—Transformer for galvanic isolation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
- H01F2038/143—Inductive couplings for signals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
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- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
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- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
Definitions
- This invention relates to signal isolators, more particularly digital signal isolators, and even more particularly to digital signal isolators employing transformers to establish an isolation barrier.
- signals In a variety of environments, signals must be transmitted between diverse sources and circuitry using those signals, while maintaining electrical (i.e., galvanic) isolation between the sources and the using circuitry. Isolation may be needed, for example, between microcontrollers, on the one hand, and devices or transducers which use microcontroller output signals, on the other hand. Electrical isolation is intended, ter alia, to prevent extraneous transient signals, including common-mode transients, from inadvertently being processed as status or control information, or to protect the equipment from shock hazards or to permit the equipment on each side of an isolation barrier to be operated at a different supply voltage, among other known objectives and uses.
- isolation techniques including the use of optical isolators that convert input electrical signals to light levels or pulses generated by light emitting diodes, and then to receive and convert the light signals back into electrical signals.
- Isolators also exist which are based upon the use of Hall effect devices, magneto-resistive sensors, capacitive isolators and coil- or transformer-based isolators.
- Optical isolators which are probably the most prevalent, present certain well-known limitations Among other limitations, they require significant space on a card or circuit board, they draw a large current, they do not operate well at high frequencies, and they are very inefficient. They also provide somewhat limited levels of isolation. To achieve greater isolation, optical-electronic isolators have been made with some attempts at providing an electrostatic shield between the optical transmitter and the optical receiver. However, a conductive shield which provides a significant degree of isolation is not sufficiently transparent for use in this application.
- U.S. Patent No. 4,748,419 to Somerville shows the differentiation of an input data signal to create a pair of differential signals that are each transmitted across high- voltage capacitors to create differentiated spike signals for the differential input pair.
- Circuitry on the other side of the capacitor barrier has a differential amplifier, a pair of converters for comparing the amplified signal against high and low thresholds, and a set/reset flip-flop to restore the spikes created by the capacitors into a logic signal.
- the capacitors couple high, common-mode energy into the receiving circuit.
- a logic signal isolator comprising, in a first aspect, a transformer having a primary winding and a secondary winding; a transmitter circuit which drives said primary winding in response to a received logic signal, such that in response to a first type of edge in the logic signal, a signal of a first predetermined type is supplied to the primary winding and in response to a second type of edge in the logic signal, a signal of a second predetermined type is supplied to said primary winding, the primary winding and the transmitter being referenced to a first ground; and the secondary winding being referenced to a second ground which is galvanically (i.e., electrically) isolated from the first ground and said secondary winding supplying to a receiver circuit signals received in correspondence to the signals provided to the primary winding, the receiver reconstructing the received logic signal from the received signals.
- the isolator's receiver may include circuitry for distinguishing between the received signals corresponding to the transmitted signals of the first type and second type and using the distinguished received signals to reconstitute the received logic signal.
- the signals of the first type may, for example, comprise multiple pulses in a predetermined pattern and the signals of the second type comprise one or more pulses in a different pattern.
- the signals of the first type also may comprise pulses of a first duration and the signals of the second type may comprise pulses of a second, distinguishable duration. At least one of the signals of the first or the second type also may comprise at least one burst. If both comprise bursts, they may be at different frequencies or be for different durations.
- the transmitter circuit may be on a first substrate and the receiver may be on a second substrate electrically isolated from the first substrate.
- the primary winding and the secondary winding desirably may be substantially planar windings arrange in a stacked arrangement with at least one of the windings substantially in or on one of the substrates.
- the primary winding then may be a bottom winding (closer to the substrate) and the secondary winding may be a top winding (further from the substrate).
- the isolator may further include a compensation network connected to the top winding for damping its response.
- the primary winding may be a top winding and the secondary winding may be a bottom winding.
- a bi-directional isolator is provided by including a second transmitter connected to drive said secondary winding in response to a second received logic signal, such that in response to a first type of edge in the second received logic signal, a signal of a third predetermined type is supplied to the secondary winding and in response to a second type of edge in the second received logic signal, a signal of a fourth predetermined type is supplied to said secondary winding, the secondary winding and the second transmitter being referenced to the second ground; and the primary winding being referenced to the first ground and said primary winding supplying to a second receiver circuit signals received in correspondence to the signals provided to the secondary winding, the second receiver reconstructing the second received logic signal.
- the isolator's second receiver may include circuitry for distinguishing between the signals received from the primary winding and using the distinguished received signals to reconstitute the second received logic signal.
- the signals from the first transmitter and the second transmitter may be similar or different.
- a digital logic isolator comprises a transformer having a primary winding referenced to a first ground and a secondary winding referenced to a second ground isolated from the first ground, means for providing to the primary winding signals of a first type in response to transitions of a first type in an input logic signal, means for providing to the primary winding signals of a second type different from the signals of the first type in response to transitions of a second type in the input logic signal, and means for receiving from the secondary winding signals corresponding to the signals of the first and second types and for reconstituting the input logic signal from them.
- a method of providing an isolated logic signal output in response to a logic signal input comprises providing a transformer having a primary winding referenced to a first ground and a secondary winding referenced to a second ground isolated from the first ground, providing to the primary winding signals of a first type in response to transitions of a first type in the input logic signal, providing to the primary winding signals of a second type different from the signals of the first type in response to transitions of a second type in the input logic signal, and receiving from the secondary winding signals corresponding to the signals of the first and second types and reconstituting the input logic signal from them.
- the signals of a first type may comprise multiple pulses
- the signals of the second type may comprise a single pulse and reconstituting the input logic signal may comprise distinguishing between the signals corresponding to said multiple pulses and the signals corresponding to said single pulses so as to provide an output signal reconstituting the transitions in the input logic signal.
- the signals of a first type or the signals of a second type comprise a burst. If both the signals of a first type and the signals of a second type comprise bursts, they may be distinguishable from each other by frequency, duration or other characteristic.
- a signal of the first type alternatively may comprise a pulse of a first duration and a signal of the second type may comprise a pulse of a second duration different from the first duration and distinguishable therefrom; and reconstituting the input logic signal may comprise distinguishing between received signals corresponding to the pulses of a first duration and the pulses of a second duration so as to provide an output signal reconstituting the transitions in the input logic signal.
- a logic isolator comprises a micro- transformer comprising, on a substrate, vertically stacked, a bottom winding and a top winding disposed over and insulated from the bottom winding, with a damping network connected across the top winding.
- a transmitter circuit receives a logic input signal and drives a signal to said bottom winding; and a receiving circuit is connected to receive from the top winding a signal corresponding to the signal driving the bottom winding and generates an output comprising a reconstituted logic input signal.
- a logic isolator comprises a micro-transformer having, on a substrate, vertically stacked, a bottom winding and a top winding disposed over and insulated from the bottom winding; a damping network connected across the top winding; a transmitter circuit receiving a logic input signal and providing a transformer driving signal; a receiving circuit connected to receive from the transformer a signal corresponding to the driving signal and generating an output comprising a reconstituted logic input signal; and means for programming the isolator by coupling the driving signal to a selected one of the windings and coupling the receiving circuit to the other one of the windings.
- the means for programming may comprise a fusible connection(s) programmed by blowing open a conductive path(s).
- the means for programming alternatively may comprise bond wires provided between the transformer windings on the one hand and the transmitter and receiving circuits, on the other hand.
- the means for programming comprises programmable circuitry configurable to connect the transmitter circuit to either the top winding or the bottom winding and to connect the receiving circuit to the other winding.
- the programmable circuitry may include programmable switching circuits and a memory containing programming to control the switching circuits.
- the memory may be read-only memory.
- a logic isolator comprises a micro-transformer comprising, on a substrate, vertically stacked, a bottom winding and a top winding disposed over and insulated from the bottom winding; a damping network connected across the top winding; a first module coupled to the top winding capable of either receiving a logic input signal and providing a transformer driving signal or receiving from the transformer a signal corresponding to the driving signal and generating an output comprising a reconstituted logic input signal; a second module coupled to the bottom winding capable of either receiving a logic input signal and providing a transformer driving signal or receiving from the transformer a signal corresponding to the driving signal and generating an output comprising a reconstituted logic input signal; and means for programming the isolator such that the first module operates in the transformer drive mode while the second circuit operates in the receive mode or that the first module operates in the receive mode while the second module operates in the transformer drive mode.
- Such means may comprise, for example, at least one fusible connection programmed by blowing open at least one conductive path.
- the means for programming may comprise one or more bond wires provided between the transformer windings on the one hand and the first and second modules, on the other hand.
- the means for programming also may comprise programmable circuitry configurable to connect the first module to either the top winding or the bottom winding and to connect the second module to the other winding.
- Such programmable circuitry may include programmable switching circuits and a memory containing programming to control the switching circuits.
- the memory may include a read-only memory.
- a dual-channel, bi-directional isolator comprises first and second micro-transformers arranged on a first substrate, each transformer having a top winding and a bottom winding.
- a first transmitter circuit is connected to drive the bottom winding of the first transformer; a second transmitter circuit is connected to drive the top winding of the second transformer.
- a first receiver circuit is connected to receive signals from the bottom winding of the second transformer.
- a second receiver circuit is connected to receive signals from the top winding of the first transformer.
- the first transmitter circuit and first receiver circuit are on the first substrate, and the second transmitter circuit and second receiver circuit are on a second substrate which is electrically isolated from the first substrate.
- Yet another aspect of the invention is a single channel bi-directional isolator comprising a micro-transformer arranged on a first substrate, the transformer having a top winding and a bottom winding; a first transmitter circuit connected to drive the bottom winding; a second transmitter circuit connected to drive the top winding; a first receiver circuit connected to receive signals from the top winding; a second receiver circuit connected to receive signals from the bottom winding; and the first and second transmitter circuits transmitting so as to avoid interfering with each other.
- the first transmitter circuit and the second receiver circuit are on the first substrate and the second transmitter circuit and the first receiver circuit are on a second substrate which is electrically isolated from the first substrate.
- a delay element for use in pulse generating circuits for generating pulses usable, for example, to drive a transformer as above- described.
- the delay element is useful for generating a delay interval, and therefore a pulse duration, of a length that is substantially independent of the supply voltage - i.e., is insensitive to variations in supply voltage.
- the delay element comprises first and second current sources which supply currents II and 12, respectively, in parallel, and a switching element. The sum of currents II and 12 is directly proportional to the supply voltage, and a threshold of the switching element is a predetermined portion of the supply voltage.
- the delay element may further include a capacitor of capacitance C, connected to a node in common with the input of the switching element and the current sources, chargeable by the current sources.
- the first current source comprises a single transistor and a resistor, the resistor, of resistance value R, having one end connected to the supply voltage and the other end connected to said transistor.
- the delay interval is then approximately 0.5RC if the switching threshold of the switching element is set to be NDD/2, and is relatively insensitive to changes in NDD.
- Such a delay element may be used in conventional pulse generating circuits that rely upon use of a delay element.
- Fig. 1 is a simplified schematic circuit diagram of a transformer-based isolator according to the prior art
- Fig. 2 is a simplified schematic circuit diagram of a glitch filter for use in an isolator according to the invention
- Fig. 3 is a set of waveforms for the circuit of Fig. 2;
- Fig. 4 is a simplified schematic circuit diagram of a first embodiment of a transformer-based isolator embodying aspects taught herein;
- Fig. 5 is a set of waveforms for the circuit of Fig. 4;
- Fig. 6 is a simplified schematic circuit diagram of a second embodiment of a transformer-based isolator embodying aspects taught herein.
- Fig. 7 is a waveform depicting two distinguishable pulses of different pulse width, such as may be used in an alternative embodiment of an isolator as taught herein;
- Fig. 8 is a diagrammatic illustration of an isolator according to some aspects of the invention, wherein the primary winding is a top winding;
- Fig. 9 is an illustration of input and output waveforms when driving a micro- transformer of the type preferably employed in implementing embodiments of the isolators taught herein, particularly illustrating the difference between driving top and bottom transformer windings;
- Fig. 10 is a diagrammatic illustration of an isolator according to some aspects of the invention, wherein the primary winding is a bottom winding;
- Fig. 11 is a diagrammatic illustration of a bi-directional dual channel isolator such as may be implemented using the teachings herein;
- Fig. 12 is a simplified schematic circuit diagram for a supply-independent delay element for use in a pulse generator (transmitter) in isolators such as are taught herein; and Figs. 13 and 14 are simplified schematic circuit diagrams for current sources for use in the delay element of Fig. 12.
- the transmission methods employed in these micro-transformer based digital isolators fall into two main categories.
- the first category is based on edge detection; the second, on level detection.
- Those designs that are based on edge detection have the advantage of lower power, lower pulse width distortion and higher common mode transient immunity over those based on level detection.
- implementations based on edge detection require two transmitters, two receivers and two transformers to make a single channel isolator. A need exists for a less expensive design.
- a digital isolator may be formed, which is based on a micro- transformer-created isolation barrier, using only a single transmitter, a single receiver and a single transmitter.
- This approach dramatically reduces the die cost while still preserving the merits of edge detection.
- the present invention enables bi-directional signal transfer. That is, the signal can be transferred from the top coil to the bottom coil or from the bottom coil to the top coil. This capability can be leveraged to make bi-directional, multi-channel signal isolators or to program the channel direction of a single data channel.
- This invention preserves the main advantages of high speed, low power, high common-mode immunity and adds to them a reduction in size and enhanced ease of integration.
- micro-transformer there is meant transformer formed in, partially in, or on, a semiconductor substrate of flat, parallel conductive windings and having no magnetic core. These transformers are also referred to as “air-core” transformers though there actually will be more than air between the windings, typically one or more layers of dielectric materials.
- FIG. 1 A block diagram of a typical prior art example of a transformer-based isolator for digital signals is shown in Fig. 1.
- the isolator 100 comprises (after an optional, though preferable, glitch filter 101), a pair of edge detectors 102 and 104, edge detector 104 being driven by the logical complement to the signal driving edge detector 102, by means of inverter 106.
- the output of edge detector 102 provides a pulse, the SETJHI signal to the primary winding of transformer 108 responsive to detection of a low-to-high transition (i.e., a leading edge) in the output of the glitch filter 101.
- the secondary winding of transformer 108 is connected to the set input of a flip-flop 110.
- the output of edge detector 104 is a pulse named the SETJLO signal which is supplied to the primary winding 120 A of transformer 120 responsive to detection of a high-to-low transition (i.e., a falling edge) in the output of the glitch filter 101.
- the secondary winding of transformer 120 is supplied to the reset input of flip-flop 110.
- the connection from each transformer secondary winding to the flip-flop 110 is not direct, but is made through a Schmitt trigger or other waveform-shaping circuitry intended to provide clean, fast transitions to the flip-flop.
- transformers 108 and 120 are connected (referenced) to a first electrical ground, GNDA, while the secondary windings 108A and 120B, together with the flip-flop 110, are referenced to a second electrical ground, GNDB, which is isolated from the first ground.
- the outputs of the edge detectors 102 and 104 comprise encoded leading edge and falling edge indicators. These indicators may be in the form of pulses, short bursts, or any periodic signal. So, the edge detectors may be monostable multivibrators, differentiators or other suitable circuits. In the illustration, a single pulse of about Ins duration is shown as an edge indicator signal.
- Glitch filter 101 may be of any suitable design.
- a brick wall filter is typical. Typically, it should have a bandwidth larger than that to which the edge detectors respond.
- Fig. 2 provides a schematic circuit diagram for a usable filter, corresponding timing diagrams showing the waveforms at the input, nodes A-D and the filter output being provided in Fig. 3.
- the filtered pulse width is given approximately by CNthreshold/t, where Nthreshold is the threshold voltage of the Schmitt triggers 22 and 24 and / is the current from current sources 26, 28.
- FIG. 4 illustrates a logic signal isolator 200 in which encoded leading and falling edge indicators from a pair of edge detectors 202 and 204 (corresponding to edge detectors 102 and 104 of Fig. 1) are sent to a single transformer 210.
- the leading edge and falling edge indicators are encoded as different, distinguishable signals. That is, the SET HI signal output from leading edge detector 202 is distinct from the SET_LO signal output from falling edge detector 204.
- the receiving side circuitry connected to the secondary winding 210B of transformer 210 (again, typically via a Schmitt trigger or other suitable wave-shaping circuit, not show) then reconstructs the logic edges based on distinguishing between those two signals.
- edge detector 202 produces two consecutive short pulses 232 and 234 as a leading edge indicator and edge detector 204 produces only a single pulse 236 as a falling edge indicator.
- the pulses 232 and 234 preferably have a known, fixed spacing between them. If transformer 210 is a high bandwidth micro-transformer, the pulse widths may be as narrow as 1 ns or even less.
- the outputs of edge detectors 202 and 204 are combined by and OR gate 240, to drive the primary winding 210A of the transformer. The pulses cannot be so short or weak in amplitude that the OR gate will not respond properly.
- the concept is to use two different, distinguishable signals. They need not be a single pulse and a double pulse. For example, a narrow pulse (e.g., 1 ns) could be used as one edge indicator and a wider pulse (e.g., 2 ns) could be used as the other edge indicator. It is only necessary that the receiver be able to distinguish the two signals.
- the concept lends itself to the use of other distinguishable signals but at the same time, one would not wish to use an unnecessarily complicated arrangement or one which would add any significant delay in signal processing. For signals other than those illustrated, it might be necessary to replace OR gate 240 with other elements that would effectively combine the outputs of the edge detectors into a single signal for driving the transformer.
- the two pulses in the SETJHI signal have a known, fixed spacing between them.
- the total duration of the two pulses and the intervening gap between them in the SET-HI signal if sufficiently short with respect to the shortest interval between two leading edges in the input signal, will permit resolution between the SET-HI and SET_LO pulses.
- a receiver circuit 250 connected to secondary winding 210B, recovers the output of transformer 210, distinguishes between the SET_HI and SET_LO pulses, and reconstructs the input logic signal as a data out signal. More specifically, the received pulses at node 252 clock a D-type flip-flop 254 and also act as the input to a non-retriggerable edge-triggered mono-stable multivibrator 256. The multivibrator 256 puts out a pulse on line 258 that is of duration at least as long as the combination of pulse 232 and the interval between pulse 232 and pulse 234 in the SET_HI signal.
- the pulse on line 258 should be at least about 2 ns long; 3ns is used in this example to allow some "hold” time to facilitate clocking of flip-flop 254.
- Line 258 connects to the D input of flip-flop 254, to the reset input of that flip-flop and to the input of inverter 262.
- the output of inverter 262 is connected to the input of an edge detector 264 and the QB output (the complementary output) of flip-flop 254 is connected to the input of another edge detector 266.
- the output of edge detector 264 is connected to one input of each of AND gates 272 and 274.
- edge detector 266 is connected to the second input of AND gate 272 and through inverter 276 to the second input of AND gate 274.
- the output of AND gate 272 is connected to the set input of set/reset flip-flop 278 and the output of AND gate 274 is connected to the reset input of flip-flop 278.
- the DATA OUT signal corresponding to an isolated and slightly delayed version of the DATA IN signal received by the glitch filter, appears at the Q output of flip-flop 278.
- the operation of this circuit will now be explained with reference to the waveforms of Fig 5.
- the COIL signal is received.
- Pulses 232 and 234 have been generated by edge detector (i.e., transmitter) 202 in response to the leading, positive-going edge of the input signal and pulse 236 has been generated by edge detector 204 in response to the negative-going, trailing edge of the input signal.
- the edge-triggered mono-stable (ETMS) multivibrator 256 generates an output waveform on line 258 as shown at ETMS. In the ETMS signal, the leading edge of pulse 232 causes the pulse 304 to be generated.
- ETMS edge-triggered mono-stable
- the multivibrator 256 does not do anything in response to the falling edge of pulse 232 or to either edge of the second pulse 234. Only after pulse 304 has been output is the multivibrator 256 able to respond to a new input, which it does when it receives the leading edge of pulse 236. Detection of the leading edge of pulse 236 causes the outputting of pulse 306.
- the second of the two initial pulses, pulse 234, is detected and the output signal is formed as follows.
- the first pulse 232 clocks the flip-flop 254
- the D input of the flip- flop still sees a low output from the edge-triggered mono-stable multivibrator on line 258. That means the QB output of the flip-flop 254 is set to a high value and the Q output is set to a low value.
- the second pulse 234 is received and clocks flip-flop 254, the output of the edge-triggered mono-stable is now high and the QB output of flip-flop 254 transitions to a low value, meaning that the Q output of flip-flop 254 goes high as at the leading edge of the pulse 308 in the "2 Pulse Detect" signal on Fig. 5.
- edge detector 266 This H-L edge is sensed by edge detector 266, which produces a pulse 310 to the second (bottom) input of AND gate 272.
- the output of the edge-triggered mono-stable is also supplied to the input of inverter 262. So, after the propagation delay through inverter 262, edge detector 264 sees a high-to-low transition (edge) at the output of inverter 262 and responsively generates a positive-going pulse 312 to the first (top) input of AND gate 272 and to a first (top) input of AND gate 274.
- Inverter 262 is designed to have a propagation delay that is substantially equal to that from the D input to the QB output of flip-flop 254.
- edge detectors 264 and 266 produce substantially concurrent output pulses 310 and 312 to AND gate 272.
- the output 314 of AND gate 272 goes from low to high at the same time and sets the set (S) input of the SR flip-flop 278; and the Q output thereof, being the DATA OUT signal, goes high.
- the second (bottom) input of AND gate 274 is responsive to the output of edge detector 266 through inverter 276, the first and second pulses have no impact on the output of AND gate 274 and do not affect the output of flip-flop 278.
- third pulse 236 triggers edge- triggered mono-stable 256, to produce its second output pulse 306, this results as stated above, in the generation of a pulse at the output of edge detector 264 upon the falling edge of the mono-stable output pulse.
- the second input of AND gate 274 from inverter 276 will be high at this time because the only time it is low is when the output of edge detector 266 generates the second pulse detection signal 308. Therefore, the reset (R) input of flip-flop 278 sees the output pulse 316 from AND gate 274 upon the falling edge of the output pulse from edge detector 264 (plus propagation delay), and flip-flop 278 is reset and the DATA OUT signal goes low.
- FIG. 2 An alternative embodiment 200' for the pulse receiver circuitry is shown in Fig: 6.
- Edge detectors 264, 266 and gates 272, 274 and 276 have been eliminated and the output flip- flop 278' is changed from a set-reset flip-flop to a D-type flip-flop.
- the first pulse 232 clocks flip-flop 254 before the edge-triggered mono-stable 256 has generated an output pulse on the D input of flip-flop 278'. Therefore, the Q output of flip-flop 254 assumes a low state.
- the second pulse 234 clocks flip-flop 254
- the D input thereof now sees the output pulse 304 from the edge-triggered mono-stable and the Q output of flip-flop 254 transitions to a high value.
- the falling edge of the mono-stable pulse 304 is coupled to the clock input of flip-flop 278' through inverter 262, and clocks flip-flop 278'; as a result, the high value from the Q output of flip-flop 254 supplies a high value on the Q output of flip-flop 278', and the DATA OUT signal.
- the falling edge of the mono-stable output pulses also reset flip-flop 254 via its RB (i.e., R complement) input.
- the output flip-flop278' is next clocked, again, by the falling edge of the output pulse from the mono-stable, being edge 306B, of pulse 306 generated in response to the third pulse, 236, on the transformer.
- edge 306B flip-flop 254 has been reset to have a low output and the output of flip-flop 278' accordingly goes low.
- a reset signal termed PWResetJB is supplied to the reset (complement) input of flip-flop 278' and causes flip-flop 278' to be reset whenever device power is reset.
- a double- width pulse 350 is used to indicate a rising edge and a single- width pulse 360 is used to indicate a falling edge.
- a single- width pulse 360 is used to indicate a falling edge.
- FIG. 8 An exemplary physical implementation for an isolator according to the present invention, capable of being packaged in an integrated circuit form, is shown in Fig. 8.
- a transmitter (or driver) circuit 802 is formed on a first substrate 804.
- a transformer comprising a first winding 806A and a second winding 806B is formed on a second substrate 808, along with a receiver circuit 810.
- Wire leads 812A, 812B from bond pads 814A and 814B on substrate 804 connect the driver output to the primary winding 806A of the transformer.
- the primary (driving) coil winding is the top coil 806A and the secondary (receiving) coil winding is the bottom coil 806B.
- the two coils even if made in the same dimensions and geometry, will exhibit different quality factor Q, because the bottom coil has higher capacitance to substrate 808.
- Fig. 9A when an idealized square voltage pulse 902 drives the top winding 904 of such a transformer, the voltage received at the bottom winding 906 will exhibit a waveform something like 908.
- the bottom coil 906 is driven by the idealized pulse 912 as shown in Fig. 9B, then the received voltage waveform at the top coil 904 will typically be as shown at 914, exhibiting ringing due to the fact that the top coil has a higher Q than the bottom coil. This undesired ringing makes it difficult to use the transformer for bi-directional signal transfer.
- a damping network 916 on the receiving top coil.
- the damping network consists of a resistor 922 and a capacitor 924 in series. Damping with a resistor only would dramatically reduce the received signal and typically would not be acceptable.
- the capacitor 924 has very low impedance at high frequencies and blocks DC current through the damping resistor, providing the desired response characteristics. Note that with the damping network, the received waveform 926 from the top coil is substantially the same as the received waveform from the bottom coil as shown at 908 in Fig. 9 A.
- the edge-detection based isolator above described can be implemented as pictured in Fig. 10.
- the primary coil is the bottom coil 906 instead of the top coil 904.
- a bi-directional dual isolator arrangement as shown in Fig. 11 is thus enabled.
- This bi-directional isolator has a pair of stacked transformers arranged side by side. A first transformer is formed by the windings 1102A and 1102B, while a second transformer is formed by the windings 1104 A and 1104B. Only one substrate 1106 carries the transformer structure because the primary winding now can be the top coil or bottom coil of a transformer. Absent this possibility, each of the two substrates 1106 and 1108 would need to have an isolated transformer structure thereon and the product would be considerably more expensive to make.
- signals can be transmitted bi-directionally concurrently through a single transformer.
- single- and multiple-channel isolators can be manufactured so that the selection of configuration (i.e., which channels transmit in which directions) can be made in final assembly and test steps of production. That lowers product cost by allowing one product core to be made and sold for multiple configurations.
- configuration i.e., which channels transmit in which directions
- the designs shown above lend themselves to this approach in one of two ways.
- a logic isolator comprises a micro-transformer having, on a substrate, vertically stacked, a bottom winding and a top winding disposed over and insulated from the bottom winding; a damping network connected across the top winding; a transmitter circuit receiving a logic input signal and providing a transformer driving signal; a receiving circuit connected to receive from the transformer a signal corresponding to the driving signal and generating an output comprising a reconstituted logic input signal; and means for programming the isolator by coupling the driving signal to a selected one of the windings and coupling the receiving circuit to the other one of the windings.
- the programming would have to be effected before final testing of the isolator in order to maintain isolation between input and output.
- the means for programming may, for example, comprise a fusible connection(s) programmed by blowing open a conductive path(s).
- the means for programming alternatively may comprise bond wires provided between the transformer windings on the one hand and the transmitter and receiving circuits, on the other hand. In either instance, the isolator cannot be tested until isolation-destroying paths are blown open or isolation- destroying bond wires are removed (if there had been any); of course, bond wires could selectively be installed as the last step in manufacture, before testing.
- the means for programming may comprise programmable circuitry configurable to connect the transmitter circuit to either the top winding or the bottom winding and to connect the receiving circuit to the other winding. Again, however, only one set of valid connections can be established if input-output isolation is to be maintained.
- the programmable circuitry may include programmable switching circuits and a memory containing programming to control the switching circuits. The memory may be read-only memory.
- a second approach may be based on providing modules, each having both a transformer-driving circuit (i.e., transmitter) and a receiver circuit, such that the module is configured to operate only as a driving circuit or only as a receiving circuit, configuring done at final assembly or by the user.
- a logic isolator comprises a micro- transformer having, on a substrate, vertically stacked, a bottom winding and a top winding disposed over and insulated from the bottom winding; a damping network connected across the top winding; a first module coupled to the top winding capable of either receiving a logic input signal and providing a transformer driving signal or receiving from the transformer a signal corresponding to the driving signal and generating an output comprising a reconstituted logic input signal; a second module coupled to the bottom winding capable of either receiving a logic input signal and providing a transformer driving signal or receiving from the transformer a signal corresponding to the driving signal and generating an output comprising a reconstituted logic input signal; and means for programming the isolator such that the first module operates in the transformer drive mode while the second circuit operates in the receive mode or that the first module operates in the receive mode while the second module operates in the transformer drive mode.
- Such means may comprise, for example, at least one fusible connection programmed by blowing open at least one conductive path.
- the means for programming may comprise one or more bond wires provided between the transformer windings on the one hand and the first and second modules, on the other hand.
- the means for programming also may comprise programmable circuitry configurable to connect the first module to either the top winding or the bottom winding and to connect the second module to the other winding.
- Such programmable circuitry may include programmable switching circuits and a memory containing programming to control the switching circuits.
- the memoiy may include a read-only memory.
- a dual-channel, bi-directional isolator comprises first and second micro-transformers arranged on a first substrate, each transformer having a top winding and a bottom winding.
- a first transmitter circuit is connected to drive the bottom winding of the first transformer; a second transmitter circuit is connected to drive the top winding of the second transformer.
- a first receiver circuit is connected to receive signals from the bottom winding of the second transformer.
- a second receiver circuit is connected to receive signals from the top winding of the first transformer.
- the first transmitter circuit and first receiver circuit are on the first substrate, and the second transmitter circuit and second receiver circuit are on a second substrate which is electrically isolated from the first substrate.
- a single channel bi-directional isolator comprising a micro-transformer arranged on a first substrate, the transformer having a top winding and a bottom winding; a first transmitter circuit connected to drive the bottom winding; a second transmitter circuit connected to drive the top winding; a first receiver circuit connected to receive signals from the top winding; a second receiver circuit connected to receive signals from the bottom winding; and the first and second transmitter circuits transmitting so as to avoid interfering with each other.
- the first transmitter circuit and the second receiver circuit are on the first substrate and the second transmitter circuit and the first receiver circuit are on a second substrate which is electrically isolated from the first substrate.
- a delay element typically is required in such pulse generators.
- a delay element 1200 comprises two current sources 1202 and 1204 which supply currents II and 12, respectively, one capacitor, C, and one switching element such as an inverter or a Schmitt trigger 1206.
- current source 1202 for generating current II is shown in Fig. 13.
- current source 1202 comprises a single transistor 1212 and a resistor R.
- the resistor R has one end connected to the supply voltage VDD and the other end connected to the drain of transistor 1212.
- Current II (VDD - VT)/R, where NT is the threshold voltage of the MOS transistor 1212.
- Current source 1204 for generating current 12 can be easily implemented. For example, a simplified schematic circuit diagram for such a current source is shown in Fig. 14. Transistor 1214 imposes the voltage VT across resistor R, inducing current 12 and that current is mirrored in the drain path of transistor 1214.
- the delay element 1200 can be easily used to generate pulses whose width is independent of the supply voltage.
- the illustrated design need not be used to form the required current source. Any design can be used that will produce a supply-independent pulse width. In the examples shown, this is achieved by adding a first current that is proportional to the supply voltage to a second current that is inversely proportional to the supply voltage. Other approaches are not ruled out.
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Abstract
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Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7622887B2 (en) | 2006-03-16 | 2009-11-24 | Fuji Electric Device Technology Co., Ltd. | Power electronics equipments |
JP2010056593A (en) * | 2008-08-26 | 2010-03-11 | Keio Gijuku | Electronic circuit |
US8288894B2 (en) | 2006-03-16 | 2012-10-16 | Fuji Electric Co., Ltd. | Power electronics equipment for transmitting signals to switching devices through air-cored insulating transformer |
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US20160080182A1 (en) * | 2014-09-15 | 2016-03-17 | Analog Devices, Inc. | Demodulation of on-off-key modulated signals in signal isolator systems |
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US9998301B2 (en) | 2014-11-03 | 2018-06-12 | Analog Devices, Inc. | Signal isolator system with protection for common mode transients |
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US10536309B2 (en) | 2014-09-15 | 2020-01-14 | Analog Devices, Inc. | Demodulation of on-off-key modulated signals in signal isolator systems |
US11018660B2 (en) | 2018-09-07 | 2021-05-25 | Analog Devices Global Unlimited Company | Multi-mode feedback control through digital isolator |
Families Citing this family (195)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030042571A1 (en) * | 1997-10-23 | 2003-03-06 | Baoxing Chen | Chip-scale coils and isolators based thereon |
DE10262239B4 (en) * | 2002-09-18 | 2011-04-28 | Infineon Technologies Ag | Digital signal transmission method |
EP1618712A2 (en) * | 2003-04-30 | 2006-01-25 | Analog Devices, Inc. | Signal isolators using micro-transformers |
US7738568B2 (en) | 2004-06-03 | 2010-06-15 | Silicon Laboratories Inc. | Multiplexed RF isolator |
US7902627B2 (en) | 2004-06-03 | 2011-03-08 | Silicon Laboratories Inc. | Capacitive isolation circuitry with improved common mode detector |
US8441325B2 (en) | 2004-06-03 | 2013-05-14 | Silicon Laboratories Inc. | Isolator with complementary configurable memory |
US7737871B2 (en) | 2004-06-03 | 2010-06-15 | Silicon Laboratories Inc. | MCU with integrated voltage isolator to provide a galvanic isolation between input and output |
US8049573B2 (en) * | 2004-06-03 | 2011-11-01 | Silicon Laboratories Inc. | Bidirectional multiplexed RF isolator |
US7376212B2 (en) | 2004-06-03 | 2008-05-20 | Silicon Laboratories Inc. | RF isolator with differential input/output |
US7821428B2 (en) * | 2004-06-03 | 2010-10-26 | Silicon Laboratories Inc. | MCU with integrated voltage isolator and integrated galvanically isolated asynchronous serial data link |
US7302247B2 (en) | 2004-06-03 | 2007-11-27 | Silicon Laboratories Inc. | Spread spectrum isolator |
US7447492B2 (en) * | 2004-06-03 | 2008-11-04 | Silicon Laboratories Inc. | On chip transformer isolator |
US8198951B2 (en) * | 2004-06-03 | 2012-06-12 | Silicon Laboratories Inc. | Capacitive isolation circuitry |
US8169108B2 (en) * | 2004-06-03 | 2012-05-01 | Silicon Laboratories Inc. | Capacitive isolator |
US7558080B2 (en) * | 2004-08-20 | 2009-07-07 | Analog Devices, Inc. | Power converter system |
US7489526B2 (en) * | 2004-08-20 | 2009-02-10 | Analog Devices, Inc. | Power and information signal transfer using micro-transformers |
US20070077783A1 (en) * | 2005-09-30 | 2007-04-05 | Trw Automotive U.S. Llc | Rotary connector system |
US7586392B2 (en) * | 2006-01-23 | 2009-09-08 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Dual path acoustic data coupling system and method |
US7514844B2 (en) * | 2006-01-23 | 2009-04-07 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Acoustic data coupling system and method |
EP1996955A4 (en) * | 2006-03-07 | 2011-10-19 | Scanimetrics Inc | Method and apparatus for interrogating an electronic component |
US8373429B2 (en) * | 2006-03-07 | 2013-02-12 | Steven Slupsky | Method and apparatus for interrogating an electronic component |
US7719305B2 (en) * | 2006-07-06 | 2010-05-18 | Analog Devices, Inc. | Signal isolator using micro-transformers |
US9019057B2 (en) | 2006-08-28 | 2015-04-28 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Galvanic isolators and coil transducers |
US9105391B2 (en) * | 2006-08-28 | 2015-08-11 | Avago Technologies General Ip (Singapore) Pte. Ltd. | High voltage hold-off coil transducer |
US8093983B2 (en) * | 2006-08-28 | 2012-01-10 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Narrowbody coil isolator |
US8385043B2 (en) * | 2006-08-28 | 2013-02-26 | Avago Technologies ECBU IP (Singapoare) Pte. Ltd. | Galvanic isolator |
US20080278275A1 (en) * | 2007-05-10 | 2008-11-13 | Fouquet Julie E | Miniature Transformers Adapted for use in Galvanic Isolators and the Like |
US8427844B2 (en) * | 2006-08-28 | 2013-04-23 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Widebody coil isolators |
US8061017B2 (en) * | 2006-08-28 | 2011-11-22 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Methods of making coil transducers |
US7948067B2 (en) * | 2009-06-30 | 2011-05-24 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Coil transducer isolator packages |
US7791900B2 (en) * | 2006-08-28 | 2010-09-07 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Galvanic isolator |
US7852186B2 (en) * | 2006-08-28 | 2010-12-14 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Coil transducer with reduced arcing and improved high voltage breakdown performance characteristics |
US7864546B2 (en) * | 2007-02-13 | 2011-01-04 | Akros Silicon Inc. | DC-DC converter with communication across an isolation pathway |
US7923710B2 (en) | 2007-03-08 | 2011-04-12 | Akros Silicon Inc. | Digital isolator with communication across an isolation barrier |
US7701731B2 (en) | 2007-02-13 | 2010-04-20 | Akros Silicon Inc. | Signal communication across an isolation barrier |
US20080181316A1 (en) * | 2007-01-25 | 2008-07-31 | Philip John Crawley | Partitioned Signal and Power Transfer Across an Isolation Barrier |
US7667408B2 (en) | 2007-03-12 | 2010-02-23 | Cirrus Logic, Inc. | Lighting system with lighting dimmer output mapping |
US8076920B1 (en) | 2007-03-12 | 2011-12-13 | Cirrus Logic, Inc. | Switching power converter and control system |
US8018171B1 (en) | 2007-03-12 | 2011-09-13 | Cirrus Logic, Inc. | Multi-function duty cycle modifier |
US20080224631A1 (en) * | 2007-03-12 | 2008-09-18 | Melanson John L | Color variations in a dimmable lighting device with stable color temperature light sources |
US7852017B1 (en) | 2007-03-12 | 2010-12-14 | Cirrus Logic, Inc. | Ballast for light emitting diode light sources |
JP4985024B2 (en) * | 2007-03-28 | 2012-07-25 | 富士ゼロックス株式会社 | Rotating body for powder conveyance and toner cartridge |
US7554473B2 (en) * | 2007-05-02 | 2009-06-30 | Cirrus Logic, Inc. | Control system using a nonlinear delta-sigma modulator with nonlinear process modeling |
CA2687120A1 (en) * | 2007-05-08 | 2008-11-13 | Scanimetrics Inc. | Ultra high speed signal transmission/reception |
US8362481B2 (en) | 2007-05-08 | 2013-01-29 | Scanimetrics Inc. | Ultra high speed signal transmission/reception |
US8116055B2 (en) * | 2007-06-21 | 2012-02-14 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Methods and apparatuses for performing common mode pulse compensation in an opto-isolator |
US7808759B2 (en) * | 2007-06-21 | 2010-10-05 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Methods and apparatuses for performing common mode pulse compensation in an opto-isolator |
US8102127B2 (en) | 2007-06-24 | 2012-01-24 | Cirrus Logic, Inc. | Hybrid gas discharge lamp-LED lighting system |
JP4957495B2 (en) * | 2007-10-03 | 2012-06-20 | 株式会社豊田自動織機 | Signal transmission circuit |
US7804697B2 (en) * | 2007-12-11 | 2010-09-28 | Cirrus Logic, Inc. | History-independent noise-immune modulated transformer-coupled gate control signaling method and apparatus |
US7960845B2 (en) | 2008-01-03 | 2011-06-14 | Linear Technology Corporation | Flexible contactless wire bonding structure and methodology for semiconductor device |
US7755525B2 (en) * | 2008-01-30 | 2010-07-13 | Cirrus Logic, Inc. | Delta sigma modulator with unavailable output values |
US8576589B2 (en) * | 2008-01-30 | 2013-11-05 | Cirrus Logic, Inc. | Switch state controller with a sense current generated operating voltage |
US8022683B2 (en) * | 2008-01-30 | 2011-09-20 | Cirrus Logic, Inc. | Powering a power supply integrated circuit with sense current |
US8008898B2 (en) | 2008-01-30 | 2011-08-30 | Cirrus Logic, Inc. | Switching regulator with boosted auxiliary winding supply |
US8084894B2 (en) * | 2008-02-04 | 2011-12-27 | Analog Devices, Inc. | Solid state relay |
US7796076B2 (en) * | 2008-02-26 | 2010-09-14 | Cirrus Logic, Inc. | Transformer-isolated analog-to-digital converter (ADC) feedback apparatus and method |
CA2623257A1 (en) * | 2008-02-29 | 2009-08-29 | Scanimetrics Inc. | Method and apparatus for interrogating an electronic component |
US8258911B2 (en) | 2008-03-31 | 2012-09-04 | Avago Technologies ECBU IP (Singapor) Pte. Ltd. | Compact power transformer components, devices, systems and methods |
US7759881B1 (en) | 2008-03-31 | 2010-07-20 | Cirrus Logic, Inc. | LED lighting system with a multiple mode current control dimming strategy |
US8169193B2 (en) * | 2008-04-09 | 2012-05-01 | Analog Devices, Inc. | Charge injection discharge circuit |
JP5253012B2 (en) * | 2008-06-24 | 2013-07-31 | ローム株式会社 | Power semiconductor drive circuit device and signal transmission circuit device used therefor |
US8008902B2 (en) * | 2008-06-25 | 2011-08-30 | Cirrus Logic, Inc. | Hysteretic buck converter having dynamic thresholds |
US8344707B2 (en) * | 2008-07-25 | 2013-01-01 | Cirrus Logic, Inc. | Current sensing in a switching power converter |
US8279628B2 (en) | 2008-07-25 | 2012-10-02 | Cirrus Logic, Inc. | Audible noise suppression in a resonant switching power converter |
US8212491B2 (en) * | 2008-07-25 | 2012-07-03 | Cirrus Logic, Inc. | Switching power converter control with triac-based leading edge dimmer compatibility |
US8237269B2 (en) * | 2008-08-01 | 2012-08-07 | Qualcomm Incorporated | High Q transformer disposed at least partly in a non-semiconductor substrate |
US20100054001A1 (en) * | 2008-08-26 | 2010-03-04 | Kenneth Dyer | AC/DC Converter with Power Factor Correction |
US8487546B2 (en) | 2008-08-29 | 2013-07-16 | Cirrus Logic, Inc. | LED lighting system with accurate current control |
US7902665B2 (en) * | 2008-09-02 | 2011-03-08 | Linear Technology Corporation | Semiconductor device having a suspended isolating interconnect |
US8179110B2 (en) * | 2008-09-30 | 2012-05-15 | Cirrus Logic Inc. | Adjustable constant current source with continuous conduction mode (“CCM”) and discontinuous conduction mode (“DCM”) operation |
US8222872B1 (en) | 2008-09-30 | 2012-07-17 | Cirrus Logic, Inc. | Switching power converter with selectable mode auxiliary power supply |
US8288954B2 (en) | 2008-12-07 | 2012-10-16 | Cirrus Logic, Inc. | Primary-side based control of secondary-side current for a transformer |
US8362707B2 (en) | 2008-12-12 | 2013-01-29 | Cirrus Logic, Inc. | Light emitting diode based lighting system with time division ambient light feedback response |
US8299722B2 (en) * | 2008-12-12 | 2012-10-30 | Cirrus Logic, Inc. | Time division light output sensing and brightness adjustment for different spectra of light emitting diodes |
US7994863B2 (en) * | 2008-12-31 | 2011-08-09 | Cirrus Logic, Inc. | Electronic system having common mode voltage range enhancement |
WO2010095368A1 (en) | 2009-02-20 | 2010-08-26 | 日本電気株式会社 | Reception circuit and signal reception method |
JP5238562B2 (en) * | 2009-03-13 | 2013-07-17 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
JP5578797B2 (en) | 2009-03-13 | 2014-08-27 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
US8432182B2 (en) | 2009-03-30 | 2013-04-30 | Analog Devices, Inc. | USB isolator with advanced control features |
US8618630B2 (en) | 2009-03-31 | 2013-12-31 | Nec Corporation | Semiconductor device |
US8477856B2 (en) * | 2009-03-31 | 2013-07-02 | Analog Devices, Inc. | Multi-bit digital signal isolator |
CZ301690B6 (en) * | 2009-04-01 | 2010-05-26 | Ceské vysoké ucení technické v Praze Fakulta strojní | Electronic circuit for evaluation of information from sensors with variable electric resistance |
WO2010119625A1 (en) * | 2009-04-13 | 2010-10-21 | 日本電気株式会社 | Semiconductor device and method for testing same |
US8482223B2 (en) * | 2009-04-30 | 2013-07-09 | Cirrus Logic, Inc. | Calibration of lamps |
US8198874B2 (en) * | 2009-06-30 | 2012-06-12 | Cirrus Logic, Inc. | Switching power converter with current sensing transformer auxiliary power supply |
US8248145B2 (en) * | 2009-06-30 | 2012-08-21 | Cirrus Logic, Inc. | Cascode configured switching using at least one low breakdown voltage internal, integrated circuit switch to control at least one high breakdown voltage external switch |
US8212493B2 (en) | 2009-06-30 | 2012-07-03 | Cirrus Logic, Inc. | Low energy transfer mode for auxiliary power supply operation in a cascaded switching power converter |
US8963535B1 (en) | 2009-06-30 | 2015-02-24 | Cirrus Logic, Inc. | Switch controlled current sensing using a hall effect sensor |
US8390083B2 (en) | 2009-09-04 | 2013-03-05 | Analog Devices, Inc. | System with recessed sensing or processing elements |
US9155174B2 (en) * | 2009-09-30 | 2015-10-06 | Cirrus Logic, Inc. | Phase control dimming compatible lighting systems |
CN102845037B (en) * | 2009-11-05 | 2016-03-16 | 罗姆股份有限公司 | The method and apparatus of signal circuit device, semiconductor device, inspection semiconductor device, Signal transmissions device and use the motor driver of Signal transmissions device |
US8654483B2 (en) * | 2009-11-09 | 2014-02-18 | Cirrus Logic, Inc. | Power system having voltage-based monitoring for over current protection |
US8380146B2 (en) * | 2009-12-31 | 2013-02-19 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd. | Multi-band, multi-mode RF transmit amplifier system with separate signal paths for linear and saturated operation |
EP2547000B1 (en) | 2010-03-09 | 2017-12-27 | Toyota Jidosha Kabushiki Kaisha | Signal transmitting apparatus |
JP5566153B2 (en) * | 2010-03-29 | 2014-08-06 | パナソニック株式会社 | Isolated communication system |
JP5504046B2 (en) | 2010-05-11 | 2014-05-28 | パナソニック株式会社 | Insulated communication system and transmission unit and reception unit applied to the isolated communication system |
JP5170165B2 (en) | 2010-06-11 | 2013-03-27 | 株式会社村田製作所 | Isolated switching power supply |
US20120002377A1 (en) * | 2010-06-30 | 2012-01-05 | William French | Galvanic isolation transformer |
EP2408097A1 (en) * | 2010-07-12 | 2012-01-18 | ABB Oy | Current-fed converter |
EP2408096A1 (en) | 2010-07-12 | 2012-01-18 | ABB Oy | Current-fed converter with quadratic conversion ratio |
CN102331980A (en) * | 2010-07-14 | 2012-01-25 | 上海联易医疗器械技术有限公司 | USB device isolator |
US9000675B2 (en) | 2010-09-21 | 2015-04-07 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Transmitting and receiving digital and analog signals across an isolator |
US8462003B2 (en) | 2010-09-21 | 2013-06-11 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Transmitting and receiving digital and analog signals across an isolator |
US8847503B2 (en) | 2010-09-21 | 2014-09-30 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Transmitting and receiving digital and analog signals across an isolator |
US8634480B2 (en) * | 2010-09-30 | 2014-01-21 | Infineon Technologies Austria Ag | Signal transmission arrangement with a transformer and signal transmission method |
CN105489576A (en) | 2010-11-18 | 2016-04-13 | 斯兰纳私人集团有限公司 | Single-chip integrated circuit with capacitive isolation |
US8451032B2 (en) | 2010-12-22 | 2013-05-28 | Silicon Laboratories Inc. | Capacitive isolator with schmitt trigger |
US8569861B2 (en) | 2010-12-22 | 2013-10-29 | Analog Devices, Inc. | Vertically integrated systems |
CN103339825B (en) | 2011-05-11 | 2015-12-23 | 松下电器产业株式会社 | Electromagnetic resonance coupler |
WO2012153531A1 (en) | 2011-05-11 | 2012-11-15 | パナソニック株式会社 | Electromagnetic resonance coupler |
WO2012157180A1 (en) | 2011-05-18 | 2012-11-22 | ルネサスエレクトロニクス株式会社 | Reception circuit and signal reception method |
US8558344B2 (en) | 2011-09-06 | 2013-10-15 | Analog Devices, Inc. | Small size and fully integrated power converter with magnetics on chip |
US8497700B2 (en) | 2011-10-21 | 2013-07-30 | Samsung Electro-Mechanics | Systems and methods for propagating digital data across an isolation barrier |
CN103339857B (en) | 2011-11-01 | 2017-02-15 | 松下知识产权经营株式会社 | Gate drive circuit |
JP6074747B2 (en) | 2011-11-01 | 2017-02-08 | パナソニックIpマネジメント株式会社 | Resonant coupler |
WO2013114818A1 (en) | 2012-01-30 | 2013-08-08 | パナソニック株式会社 | Gate driver circuit |
US8502584B1 (en) * | 2012-03-30 | 2013-08-06 | Silicon Laboratories Inc | Capacitive isolation receiver circuitry |
US8644365B2 (en) | 2012-03-30 | 2014-02-04 | Silicon Laboratories Inc. | Providing voltage isolation on a single semiconductor die |
US9030232B2 (en) * | 2012-04-13 | 2015-05-12 | Semiconductor Energy Laboratory Co., Ltd. | Isolator circuit and semiconductor device |
US9768945B2 (en) | 2012-04-23 | 2017-09-19 | Analog Devices, Inc. | Isolated system data communication |
US9184588B2 (en) | 2012-04-23 | 2015-11-10 | Analog Devices, Inc. | Isolated measurement system with power transmitter disabling |
US9972196B2 (en) | 2012-04-23 | 2018-05-15 | Analog Devices, Inc. | Isolator system with status data integrated with measurement data |
JP5891100B2 (en) | 2012-04-26 | 2016-03-22 | ルネサスエレクトロニクス株式会社 | Semiconductor device and data transmission method |
US8648634B2 (en) * | 2012-05-10 | 2014-02-11 | International Business Machines Corporation | Input jitter filter for a phase-locked loop (PLL) |
JP5885586B2 (en) | 2012-05-22 | 2016-03-15 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
WO2013179333A1 (en) | 2012-05-29 | 2013-12-05 | Fuji Electric Co., Ltd. | Isolator and isolator manufacturing method |
US9054690B2 (en) | 2012-08-29 | 2015-06-09 | Analog Devices Global | Chopped oscillator |
JP6048052B2 (en) | 2012-10-11 | 2016-12-21 | 富士電機株式会社 | Signal transmission device and switching power supply device |
JP5875704B2 (en) * | 2012-12-04 | 2016-03-02 | 三菱電機株式会社 | Signal transmission circuit |
US8786393B1 (en) | 2013-02-05 | 2014-07-22 | Analog Devices, Inc. | Step up or step down micro-transformer with tight magnetic coupling |
US9293997B2 (en) | 2013-03-14 | 2016-03-22 | Analog Devices Global | Isolated error amplifier for isolated power supplies |
US8928383B2 (en) | 2013-03-15 | 2015-01-06 | Analog Devices, Inc. | Integrated delayed clock for high speed isolated SPI communication |
JP6238175B2 (en) * | 2013-04-15 | 2017-11-29 | パナソニックIpマネジメント株式会社 | Electromagnetic resonance coupler and high-frequency transmission device |
US9118392B2 (en) | 2013-04-16 | 2015-08-25 | Silicon Laboratories Inc. | Isolated serializer-deserializer |
US9698461B2 (en) | 2013-04-18 | 2017-07-04 | Panasonic Intellectual Property Management Co., Ltd. | Resonant coupler |
US9466413B2 (en) | 2013-06-28 | 2016-10-11 | Freescale Semiconductor, Inc. | Die-to-die inductive communication devices and methods |
US9337905B2 (en) * | 2013-07-01 | 2016-05-10 | Texas Instruments Incorporated | Inductive structures with reduced emissions and interference |
CN104576883B (en) | 2013-10-29 | 2018-11-16 | 普因特工程有限公司 | Chip installation array substrate and its manufacturing method |
US9160423B2 (en) | 2013-12-12 | 2015-10-13 | Freescale Semiconductor, Inc. | Die-to-die inductive communication devices and methods |
JP6248649B2 (en) * | 2014-01-23 | 2017-12-20 | 株式会社デンソー | Isolated communication device |
US10992346B2 (en) * | 2014-03-26 | 2021-04-27 | Nxp Usa, Inc. | Systems and devices with common mode noise suppression structures and methods |
JP6512547B2 (en) | 2014-04-15 | 2019-05-15 | パナソニックIpマネジメント株式会社 | Electromagnetic resonance coupler and transmission device |
US9531280B2 (en) | 2014-05-09 | 2016-12-27 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Isolation device and system |
US10051701B2 (en) | 2014-07-16 | 2018-08-14 | Philips Lighting Holding B.V. | Systems and methods for maintaining dimmer behavior in a low-power lamp assembly |
US9584147B2 (en) | 2014-08-22 | 2017-02-28 | Analog Devices Global | Isolator system supporting multiple ADCs via a single isolator channel |
US9660848B2 (en) | 2014-09-15 | 2017-05-23 | Analog Devices Global | Methods and structures to generate on/off keyed carrier signals for signal isolators |
DE112015004340T5 (en) | 2014-09-24 | 2017-06-01 | Analog Devices, Inc. | Circuits and systems for multiplexed communication via an isolator |
US9520920B2 (en) | 2014-10-27 | 2016-12-13 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Transmitting and receiving digital and analog signals across an isolator using amplitude modulation |
US9219028B1 (en) | 2014-12-17 | 2015-12-22 | Freescale Semiconductor, Inc. | Die-to-die inductive communication devices and methods |
US10439739B2 (en) * | 2015-06-12 | 2019-10-08 | Qualcomm Incorporated | Divided ring for common-mode (CM) and differential-mode (DM) isolation |
US9666558B2 (en) | 2015-06-29 | 2017-05-30 | Point Engineering Co., Ltd. | Substrate for mounting a chip and chip package using the substrate |
JP6237909B1 (en) | 2015-07-03 | 2017-11-29 | 富士電機株式会社 | Isolator and method of manufacturing isolator |
US9829531B2 (en) | 2015-10-23 | 2017-11-28 | Maxim Integrated Products, Inc. | Dual galvanic isolation barriers and monitoring systems and methods |
TWI595518B (en) | 2015-11-04 | 2017-08-11 | 財團法人工業技術研究院 | Electronic isolator packaging structure and manufacturing method for electronic isolator |
US9653455B1 (en) * | 2015-11-10 | 2017-05-16 | Analog Devices Global | FET—bipolar transistor combination |
GB201604796D0 (en) | 2015-11-10 | 2016-05-04 | Analog Devices Global | A combined isolator and power switch |
US9698594B2 (en) | 2015-11-10 | 2017-07-04 | Analog Devices Global | Overvoltage protection device, and a galvanic isolator in combination with an overvoltage protection device |
US9935628B2 (en) | 2015-11-10 | 2018-04-03 | Analog Devices Global | FET—bipolar transistor combination, and a switch comprising such a FET—bipolar transistor combination |
EP3171516B1 (en) * | 2015-11-19 | 2019-06-26 | Etel S. A.. | Circuit assembly with at least one power transistor for a converter |
TWI573315B (en) | 2016-01-19 | 2017-03-01 | 財團法人工業技術研究院 | Galvanic isolator circuit |
GB201603111D0 (en) | 2016-02-23 | 2016-04-06 | Cooper Technologies Co | Universal isolator |
GB201603108D0 (en) | 2016-02-23 | 2016-04-06 | Cooper Technologies Co | Configurable isolator |
GB201603207D0 (en) * | 2016-02-24 | 2016-04-06 | Cooper Technologies Co | Electronic device configuration |
GB201603211D0 (en) | 2016-02-24 | 2016-04-06 | Cooper Technologies Co | Voltage crowbar |
US10523016B2 (en) * | 2016-05-04 | 2019-12-31 | Analog Devices Global | Physical isolation between MAC and PHY ethernet connections |
GB201608819D0 (en) | 2016-05-19 | 2016-07-06 | Cooper Technologies Co | Electronic device and surge handling |
CN105897251B (en) * | 2016-05-20 | 2019-01-22 | 西安矽源半导体有限公司 | A kind of digital signal isolator and its method |
US9948193B2 (en) * | 2016-06-10 | 2018-04-17 | Stmicroelectronics S.R.L. | Galvanically isolated DC-DC converter with bidirectional data transmission |
JP6741497B2 (en) * | 2016-07-01 | 2020-08-19 | ラピスセミコンダクタ株式会社 | Signal conversion device, processing device, communication system, and signal conversion method |
RU168337U1 (en) * | 2016-08-04 | 2017-01-30 | Акционерное общество "Протон" (АО "Протон") | ELECTRONIC INTEGRAL RELAY WITH TRANSFORMER DISCHARGE AND OVERLOAD PROTECTION |
US10205442B2 (en) * | 2016-08-08 | 2019-02-12 | Analog Devices Global | Galvanically isolated data isolator with improved common mode transient rejection |
US10651147B2 (en) | 2016-09-13 | 2020-05-12 | Allegro Microsystems, Llc | Signal isolator having bidirectional communication between die |
US10749524B2 (en) * | 2017-01-18 | 2020-08-18 | Mitsubishi Electric Corporation | Isolator circuit |
CN110678745B (en) | 2017-05-15 | 2023-03-10 | 亚德诺半导体国际无限责任公司 | Integrated ion sensing apparatus and method |
RU2661278C1 (en) * | 2017-06-16 | 2018-07-13 | Открытое акционерное общество "Авангард" | Logic signals galvanic isolation device (embodiments) |
RU174045U1 (en) * | 2017-08-24 | 2017-09-27 | Общество с ограниченной ответственностью "НИКТЕС" | Electronic solenoid relay |
TWI649540B (en) | 2017-10-26 | 2019-02-01 | 財團法人工業技術研究院 | Batteryless rotary encoder |
US10730743B2 (en) | 2017-11-06 | 2020-08-04 | Analog Devices Global Unlimited Company | Gas sensor packages |
US10840013B2 (en) * | 2018-05-22 | 2020-11-17 | Texas Instruments Incorporated | Galvanic isolation in devices |
US10756715B2 (en) * | 2018-07-03 | 2020-08-25 | Rohm Co., Ltd. | Signal transfer device |
US11482924B2 (en) | 2018-07-26 | 2022-10-25 | Analog Devices International Unlimited Company | Power isolator exhibiting low electromagnetic interference |
RU186467U1 (en) * | 2018-09-13 | 2019-01-22 | Российская Федерация, от имени которой выступает Министерство обороны Российской Федерации | TRANSMISSION DEVICE FOR MANCHESTER CODING |
CN109355821B (en) * | 2018-09-26 | 2021-02-12 | 浙江众邦机电科技有限公司 | Isolation transmission circuit and isolation encoder system |
US11532934B2 (en) * | 2018-11-29 | 2022-12-20 | Analog Devices International Unlimited Company | Protection device |
US11587839B2 (en) | 2019-06-27 | 2023-02-21 | Analog Devices, Inc. | Device with chemical reaction chamber |
RU2714224C1 (en) * | 2019-09-10 | 2020-02-13 | Акционерное общество "ПКК МИЛАНДР" | Data transmission device with galvanic isolation by means of pulse transformer |
US11115244B2 (en) | 2019-09-17 | 2021-09-07 | Allegro Microsystems, Llc | Signal isolator with three state data transmission |
US11533027B2 (en) | 2019-10-18 | 2022-12-20 | Analog Devices, Inc. | Low power receiver circuit for isolated data communications |
TWI702780B (en) | 2019-12-03 | 2020-08-21 | 財團法人工業技術研究院 | Isolator and signal generation method for improving common mode transient immunity |
US11626805B2 (en) | 2020-12-22 | 2023-04-11 | Infineon Technologies Ag | Control loop for flyback power converter |
US11637724B2 (en) | 2021-03-12 | 2023-04-25 | Analog Devices, Inc. | Coding schemes for communicating multiple logic states through a digital isolator |
US11804770B2 (en) | 2021-10-06 | 2023-10-31 | Infineon Technologies Ag | Analyzing a control signal in order to control a power converter to deliver energy to a load |
CN116800229A (en) * | 2022-03-17 | 2023-09-22 | 澜起电子科技(上海)有限公司 | Burr removing circuit |
US12088191B1 (en) | 2023-04-07 | 2024-09-10 | Allero MicroSystems, LLC | High side gate driver architecture |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0307345A1 (en) * | 1987-09-11 | 1989-03-15 | Siemens Aktiengesellschaft | Circuit arrangement for the transmission of pulses between two galvanically separated circuits |
US5164621A (en) * | 1990-11-06 | 1992-11-17 | Mitsubishi Denki Kabushiki Kaisha | Delay device including generator compensating for power supply fluctuations |
US5384808A (en) * | 1992-12-31 | 1995-01-24 | Apple Computer, Inc. | Method and apparatus for transmitting NRZ data signals across an isolation barrier disposed in an interface between adjacent devices on a bus |
US5701037A (en) * | 1994-11-15 | 1997-12-23 | Siemens Aktiengesellschaft | Arrangement for inductive signal transmission between the chip layers of a vertically integrated circuit |
US5825259A (en) * | 1994-08-03 | 1998-10-20 | Madge Networks Limited | Electromagnetic interference isolator with common mode choke |
EP0977406A1 (en) * | 1998-07-17 | 2000-02-02 | Endress + Hauser Wetzer GmbH + Co. KG | Circuit for transmission of galvanically isolated digital signals |
WO2001028094A1 (en) * | 1999-10-08 | 2001-04-19 | Cirrus Logic, Inc. | Open loop supply independent digital/logic delay circuit and method |
US20030042571A1 (en) * | 1997-10-23 | 2003-03-06 | Baoxing Chen | Chip-scale coils and isolators based thereon |
US20030052712A1 (en) * | 2001-07-05 | 2003-03-20 | Comer Alan Elbert | Electrically-programmable interconnect architecture for easily-configurable stacked circuit arrangements |
Family Cites Families (109)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US57968A (en) * | 1866-09-11 | Improvement in plows | ||
US3058078A (en) | 1956-02-21 | 1962-10-09 | Siegfried R Hoh | Low capacitance transformer |
US3058070A (en) * | 1959-11-04 | 1962-10-09 | Reingold Irving | Microwave duplexer |
US3537022A (en) | 1968-01-10 | 1970-10-27 | Hewlett Packard Co | Signal translating circuit |
JPS5119739B1 (en) | 1970-11-06 | 1976-06-19 | ||
US3714540A (en) | 1970-11-10 | 1973-01-30 | Oxy Metal Finishing Corp | Isolation and transforming circuit |
US3808673A (en) | 1971-03-17 | 1974-05-07 | Monsanto Co | Opto-isolator devices and method for the fabrication thereof |
US3798608A (en) | 1972-12-15 | 1974-03-19 | Johnson Service Co | Digital signal transmission apparatus |
DE2529296A1 (en) | 1975-07-01 | 1977-01-20 | Ferranti Ltd | Isolating transformer used as pulse transformer - is for use with high speed pulses and has two annular cores covered in windings |
US4027152A (en) | 1975-11-28 | 1977-05-31 | Hewlett-Packard Company | Apparatus and method for transmitting binary-coded information |
US4024452A (en) | 1976-03-10 | 1977-05-17 | Bell Telephone Laboratories, Incorporated | Integrated solid state isolator circuit |
DE2649796C2 (en) * | 1976-10-29 | 1978-10-26 | Herbert 7853 Steinen Huettlin | Hose coupling |
DE2706935C2 (en) * | 1977-02-18 | 1984-05-24 | Robert Bosch Gmbh, 7000 Stuttgart | Electronic switch with voltage-independent switch-off status |
US4118603A (en) | 1977-05-31 | 1978-10-03 | Noramco, Inc. | DC signaling circuit for use in conjunction with isolation transformers |
US4227045A (en) | 1978-06-28 | 1980-10-07 | Honeywell Inc. | Data processing protocol system |
US4275404A (en) | 1979-10-05 | 1981-06-23 | Bell Telephone Laboratories, Incorporated | Monolithic opto-isolator |
US4302807A (en) | 1980-08-04 | 1981-11-24 | Burroughs Corporation | Controlled current base drive circuit |
US4547961A (en) | 1980-11-14 | 1985-10-22 | Analog Devices, Incorporated | Method of manufacture of miniaturized transformer |
US4538136A (en) | 1981-03-30 | 1985-08-27 | Amtel Systems Corporation | Power line communication system utilizing a local oscillator |
JPS58215833A (en) | 1982-06-10 | 1983-12-15 | Yamatake Honeywell Co Ltd | Transmitter of magnetic signal |
US4818855A (en) | 1985-01-11 | 1989-04-04 | Indala Corporation | Identification system |
GB2173956B (en) | 1985-03-29 | 1989-01-05 | Plessey Co Plc | Improvements relating to electric transformers |
US4660014A (en) | 1985-06-19 | 1987-04-21 | Jaycor | Electromagnetic pulse isolation transformer |
US4703283A (en) | 1986-02-24 | 1987-10-27 | Howard Samuels | Isolation amplifier with T-type modulator |
US4780795A (en) | 1986-04-28 | 1988-10-25 | Burr-Brown Corporation | Packages for hybrid integrated circuit high voltage isolation amplifiers and method of manufacture |
US4748419A (en) | 1986-04-28 | 1988-05-31 | Burr-Brown Corporation | Isolation amplifier with precise timing of signals coupled across isolation barrier |
US4835486A (en) | 1986-04-28 | 1989-05-30 | Burr-Brown Corporation | Isolation amplifier with precise timing of signals coupled across isolation barrier |
US4785345A (en) | 1986-05-08 | 1988-11-15 | American Telephone And Telegraph Co., At&T Bell Labs. | Integrated transformer structure with primary winding in substrate |
US4825450A (en) | 1987-03-12 | 1989-04-25 | The Boeing Company | Binary data communication system |
US4924210A (en) | 1987-03-17 | 1990-05-08 | Omron Tateisi Electronics Company | Method of controlling communication in an ID system |
US4885582A (en) | 1987-09-28 | 1989-12-05 | The Grass Valley Group, Inc. | "Simple code" encoder/decoder |
US4959631A (en) | 1987-09-29 | 1990-09-25 | Kabushiki Kaisha Toshiba | Planar inductor |
JPH01116281A (en) | 1987-10-29 | 1989-05-09 | Aisin Seiki Co Ltd | Ignition device |
US4859877A (en) | 1988-01-04 | 1989-08-22 | Gte Laboratories Incorporated | Bidirectional digital signal transmission system |
US4817865A (en) | 1988-03-17 | 1989-04-04 | Racal Data Communications Inc. | Ventilation system for modular electronic housing |
US5041780A (en) | 1988-09-13 | 1991-08-20 | California Institute Of Technology | Integrable current sensors |
CA1331214C (en) | 1989-01-05 | 1994-08-02 | Kun-Ming Lee | Interfacing control circuit with active circuit charge or discharge |
US4937468A (en) | 1989-01-09 | 1990-06-26 | Sundstrand Corporation | Isolation circuit for pulse waveforms |
JPH0377360A (en) | 1989-08-18 | 1991-04-02 | Mitsubishi Electric Corp | Semiconductor device |
US5057968A (en) | 1989-10-16 | 1991-10-15 | Lockheed Corporation | Cooling system for electronic modules |
US4959877A (en) * | 1989-11-24 | 1990-10-02 | Covil Donald M | All-season floating blanket |
US5396394A (en) | 1990-02-06 | 1995-03-07 | International Business Machines Corp. | ISDN device line protection circuit |
FR2662320B1 (en) | 1990-05-18 | 1994-05-13 | Cemagref | CONTACTLESS CONNECTION DEVICE FOR CONNECTING SERIES BUS LINES. |
US5128729A (en) | 1990-11-13 | 1992-07-07 | Motorola, Inc. | Complex opto-isolator with improved stand-off voltage stability |
GB2252208B (en) | 1991-01-24 | 1995-05-03 | Burr Brown Corp | Hybrid integrated circuit planar transformer |
US5102040A (en) | 1991-03-28 | 1992-04-07 | At&T Bell Laboratories | Method and apparatus for fan control to achieve enhanced cooling |
US5204551A (en) | 1991-07-01 | 1993-04-20 | Motorola, Inc. | Method and apparatus for high power pulse modulation |
FR2679670B1 (en) | 1991-07-23 | 1993-10-29 | Dan Serbanescu | CONTACTLESS BILATERAL COMMUNICATION SYSTEM FOR MICROPROCESSOR CREDIT CARDS. |
US5142432A (en) | 1991-10-21 | 1992-08-25 | General Motors Corporation | Fault detection apparatus for a transformer isolated transistor drive circuit for a power device |
JP3141562B2 (en) | 1992-05-27 | 2001-03-05 | 富士電機株式会社 | Thin film transformer device |
US5369666A (en) | 1992-06-09 | 1994-11-29 | Rockwell International Corporation | Modem with digital isolation |
US5270882A (en) | 1992-07-15 | 1993-12-14 | International Business Machines Corporation | Low-voltage, low-power amplifier for magnetoresistive sensor |
US5588021A (en) | 1992-09-25 | 1996-12-24 | Light & Sound Design Limited | Repeater for use in a control network |
US5444600A (en) | 1992-12-03 | 1995-08-22 | Linear Technology Corporation | Lead frame capacitor and capacitively-coupled isolator circuit using the same |
US5334882A (en) | 1992-12-14 | 1994-08-02 | National Semiconductor | Driver for backplane transceiver logic bus |
WO1994017558A1 (en) | 1993-01-29 | 1994-08-04 | The Regents Of The University Of California | Monolithic passive component |
JP3293677B2 (en) * | 1993-02-15 | 2002-06-17 | 日本電子株式会社 | Scanning electron microscope |
US5469098A (en) | 1993-03-29 | 1995-11-21 | Exide Electronics Corporation | Isolated gate drive |
US5568516A (en) | 1993-07-02 | 1996-10-22 | Phonic Ear Incorporated | Very low power cordless headset system |
US5615229A (en) | 1993-07-02 | 1997-03-25 | Phonic Ear, Incorporated | Short range inductively coupled communication system employing time variant modulation |
US5533054A (en) | 1993-07-09 | 1996-07-02 | Technitrol, Inc. | Multi-level data transmitter |
WO1995020768A1 (en) | 1994-01-31 | 1995-08-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Miniaturized planar-design coil assembly for the detection of ferromagnetic materials |
US5467607A (en) | 1994-02-22 | 1995-11-21 | At&T Corp. | Air conditioning control system |
JP3213156B2 (en) | 1994-03-15 | 2001-10-02 | 富士通株式会社 | Electronics |
JP3822919B2 (en) * | 1994-05-27 | 2006-09-20 | ソニー株式会社 | Solid-state imaging device and driving method of solid-state imaging device |
US5539598A (en) | 1994-12-08 | 1996-07-23 | International Business Machines Corporation | Electrostatic protection for a shielded MR sensor |
JP3487461B2 (en) | 1994-12-17 | 2004-01-19 | ソニー株式会社 | Transformers and amplifiers |
US5596466A (en) | 1995-01-13 | 1997-01-21 | Ixys Corporation | Intelligent, isolated half-bridge power module |
US5716323A (en) | 1995-04-05 | 1998-02-10 | Karl Storz Imaging | Electrical isolation of endoscopic video camera |
US5786979A (en) | 1995-12-18 | 1998-07-28 | Douglass; Barry G. | High density inter-chip connections by electromagnetic coupling |
US5990753A (en) * | 1996-01-29 | 1999-11-23 | Stmicroelectronics, Inc. | Precision oscillator circuit having a controllable duty cycle and related methods |
CN1183587C (en) * | 1996-04-08 | 2005-01-05 | 德克萨斯仪器股份有限公司 | Method and apparatus for galvanically isolating two integrated circuits from each others |
US5801602A (en) | 1996-04-30 | 1998-09-01 | 3Com Corporation | Isolation and signal filter transformer |
DE19618127C1 (en) * | 1996-05-06 | 1997-10-09 | Knuerr Mechanik Ag | Fastening arrangement |
US5877667A (en) | 1996-08-01 | 1999-03-02 | Advanced Micro Devices, Inc. | On-chip transformers |
US5831426A (en) | 1996-08-16 | 1998-11-03 | Nonvolatile Electronics, Incorporated | Magnetic current sensor |
US5731954A (en) | 1996-08-22 | 1998-03-24 | Cheon; Kioan | Cooling system for computer |
US5714938A (en) | 1996-11-19 | 1998-02-03 | Cae Electronics Ltd. | Temperature protection device for air cooled electronics housing |
US6206467B1 (en) | 1996-11-20 | 2001-03-27 | F.S. Fehrer Gmbh & Co. Kg | Upholstered element fastened to a cover by means of a hook and loop strip |
US5781077A (en) | 1997-01-28 | 1998-07-14 | Burr-Brown Corporation | Reducing transformer interwinding capacitance |
US5952849A (en) | 1997-02-21 | 1999-09-14 | Analog Devices, Inc. | Logic isolator with high transient immunity |
DE19718420A1 (en) | 1997-04-30 | 1998-11-12 | Siemens Ag | Integrated data transmission circuit with electrical isolation between input and output circuit |
US5969590A (en) | 1997-08-05 | 1999-10-19 | Applied Micro Circuits Corporation | Integrated circuit transformer with inductor-substrate isolation |
US5831525A (en) | 1997-09-18 | 1998-11-03 | Harvey; James C. | Filtered air, temperature controlled removable computer cartridge devices |
US6188494B1 (en) * | 1997-10-17 | 2001-02-13 | Schweitzer Engineering Laboratories, Inc. | Fiber-optic transceiver for long distance data communications |
US6054780A (en) | 1997-10-23 | 2000-04-25 | Analog Devices, Inc. | Magnetically coupled signal isolator using a Faraday shielded MR or GMR receiving element |
US6873065B2 (en) | 1997-10-23 | 2005-03-29 | Analog Devices, Inc. | Non-optical signal isolator |
US5942937A (en) | 1997-11-19 | 1999-08-24 | Advanced Micro Devices, Inc. | Signal detection circuit using a plurality of delay stages with edge detection logic |
US5900683A (en) | 1997-12-23 | 1999-05-04 | Ford Global Technologies, Inc. | Isolated gate driver for power switching device and method for carrying out same |
US6069802A (en) | 1998-07-31 | 2000-05-30 | Priegnitz; Robert A. | Transformer isolated driver and isolated forward converter |
US6127663A (en) | 1998-10-09 | 2000-10-03 | Ericsson Inc. | Electronics cabinet cooling system |
US6087882A (en) | 1998-12-04 | 2000-07-11 | Analog Devices, Inc. | Ultra-low power magnetically coupled digital isolator using spin valve resistors |
DE19922123A1 (en) | 1999-05-12 | 2000-11-23 | Siemens Ag | Bus interface implemented as integrated circuit |
DE19922127C2 (en) | 1999-05-12 | 2002-05-29 | Siemens Ag | Integrated circuit with an A / D or D / A converter with electrical isolation |
DE19922128C1 (en) | 1999-05-12 | 2001-01-25 | Siemens Ag | Integrated circuit for generating a drive signal for an isolated gate bipolar transistor (IGBT) |
DE19922129C1 (en) | 1999-05-12 | 2000-09-28 | Siemens Ag | Logical combination method for signals |
US6728320B1 (en) | 1999-09-23 | 2004-04-27 | Texas Instruments Incorporated | Capacitive data and clock transmission between isolated ICs |
US6501363B1 (en) | 1999-11-03 | 2002-12-31 | Innosys, Inc. | Vertical transformer |
US6262600B1 (en) | 2000-02-14 | 2001-07-17 | Analog Devices, Inc. | Isolator for transmitting logic signals across an isolation barrier |
WO2002073914A1 (en) * | 2001-03-13 | 2002-09-19 | The National University Of Singapore | Method and apparatus to recover data from pulses |
US6911860B1 (en) | 2001-11-09 | 2005-06-28 | Altera Corporation | On/off reference voltage switch for multiple I/O standards |
DE10205705C1 (en) | 2002-02-12 | 2003-05-08 | Infineon Technologies Ag | Integratable circuit for floating signal transfer has selection circuit connected to secondary winding that separates secondary pulses in accordance with association with input signal edges |
DE10232642B4 (en) | 2002-07-18 | 2006-11-23 | Infineon Technologies Ag | Integrated transformer arrangement |
DE10262239B4 (en) | 2002-09-18 | 2011-04-28 | Infineon Technologies Ag | Digital signal transmission method |
EP1618712A2 (en) * | 2003-04-30 | 2006-01-25 | Analog Devices, Inc. | Signal isolators using micro-transformers |
US7409526B1 (en) * | 2003-10-28 | 2008-08-05 | Cisco Technology, Inc. | Partial key hashing memory |
US7376212B2 (en) | 2004-06-03 | 2008-05-20 | Silicon Laboratories Inc. | RF isolator with differential input/output |
US7302247B2 (en) | 2004-06-03 | 2007-11-27 | Silicon Laboratories Inc. | Spread spectrum isolator |
US7489526B2 (en) | 2004-08-20 | 2009-02-10 | Analog Devices, Inc. | Power and information signal transfer using micro-transformers |
-
2004
- 2004-04-29 EP EP04751265A patent/EP1618712A2/en not_active Ceased
- 2004-04-29 US US10/834,959 patent/US7075329B2/en not_active Expired - Lifetime
- 2004-04-29 WO PCT/US2004/013806 patent/WO2004100473A2/en active Application Filing
- 2004-04-29 EP EP20100185533 patent/EP2302850A1/en not_active Withdrawn
-
2006
- 2006-07-06 US US11/481,997 patent/US7692444B2/en not_active Expired - Lifetime
-
2007
- 2007-12-27 US US12/005,675 patent/US7683654B2/en not_active Expired - Lifetime
-
2009
- 2009-11-10 US US12/615,815 patent/US7920010B2/en not_active Expired - Lifetime
-
2011
- 2011-03-31 US US13/077,324 patent/US8736343B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0307345A1 (en) * | 1987-09-11 | 1989-03-15 | Siemens Aktiengesellschaft | Circuit arrangement for the transmission of pulses between two galvanically separated circuits |
US5164621A (en) * | 1990-11-06 | 1992-11-17 | Mitsubishi Denki Kabushiki Kaisha | Delay device including generator compensating for power supply fluctuations |
US5384808A (en) * | 1992-12-31 | 1995-01-24 | Apple Computer, Inc. | Method and apparatus for transmitting NRZ data signals across an isolation barrier disposed in an interface between adjacent devices on a bus |
US5825259A (en) * | 1994-08-03 | 1998-10-20 | Madge Networks Limited | Electromagnetic interference isolator with common mode choke |
US5701037A (en) * | 1994-11-15 | 1997-12-23 | Siemens Aktiengesellschaft | Arrangement for inductive signal transmission between the chip layers of a vertically integrated circuit |
US20030042571A1 (en) * | 1997-10-23 | 2003-03-06 | Baoxing Chen | Chip-scale coils and isolators based thereon |
EP0977406A1 (en) * | 1998-07-17 | 2000-02-02 | Endress + Hauser Wetzer GmbH + Co. KG | Circuit for transmission of galvanically isolated digital signals |
WO2001028094A1 (en) * | 1999-10-08 | 2001-04-19 | Cirrus Logic, Inc. | Open loop supply independent digital/logic delay circuit and method |
US20030052712A1 (en) * | 2001-07-05 | 2003-03-20 | Comer Alan Elbert | Electrically-programmable interconnect architecture for easily-configurable stacked circuit arrangements |
Non-Patent Citations (2)
Title |
---|
HOROWITZ P; HILL W: "The Art of Electronics" 1989, CAMBRIDGE UNIVERSITY PRESS , CAMBRIDGE, U.K. , XP002330340 page 25 * |
See also references of EP1618712A2 * |
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WO2018069771A1 (en) | 2016-10-13 | 2018-04-19 | Analog Devices Global | Systems and methods for transferring power across an isolation barrier |
US10367489B2 (en) | 2016-10-13 | 2019-07-30 | Analog Devices Gloval | Systems and methods for transferring power across an isolation barrier |
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US11018660B2 (en) | 2018-09-07 | 2021-05-25 | Analog Devices Global Unlimited Company | Multi-mode feedback control through digital isolator |
Also Published As
Publication number | Publication date |
---|---|
EP1618712A2 (en) | 2006-01-25 |
US20100134139A1 (en) | 2010-06-03 |
WO2004100473A3 (en) | 2005-09-15 |
US20080169834A1 (en) | 2008-07-17 |
WO2004100473A9 (en) | 2005-01-06 |
US20050057277A1 (en) | 2005-03-17 |
EP2302850A1 (en) | 2011-03-30 |
US7683654B2 (en) | 2010-03-23 |
US7075329B2 (en) | 2006-07-11 |
US8736343B2 (en) | 2014-05-27 |
US20060250155A1 (en) | 2006-11-09 |
US20110175642A1 (en) | 2011-07-21 |
US7920010B2 (en) | 2011-04-05 |
US7692444B2 (en) | 2010-04-06 |
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