WO2004095484A2 - Reducing oxides in a fluid-based switch - Google Patents
Reducing oxides in a fluid-based switch Download PDFInfo
- Publication number
- WO2004095484A2 WO2004095484A2 PCT/US2004/000984 US2004000984W WO2004095484A2 WO 2004095484 A2 WO2004095484 A2 WO 2004095484A2 US 2004000984 W US2004000984 W US 2004000984W WO 2004095484 A2 WO2004095484 A2 WO 2004095484A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fluid
- switching fluid
- switch
- cavities
- reducing material
- Prior art date
Links
- 239000012530 fluid Substances 0.000 title claims abstract description 148
- 239000000463 material Substances 0.000 claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 39
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 9
- 229910052753 mercury Inorganic materials 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 239000011777 magnesium Substances 0.000 claims description 5
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 4
- 239000011343 solid material Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 239000012279 sodium borohydride Substances 0.000 claims description 2
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 2
- 239000003638 chemical reducing agent Substances 0.000 claims 2
- 239000012280 lithium aluminium hydride Substances 0.000 claims 1
- -1 lithium aluminum hydride Chemical compound 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 238000000151 deposition Methods 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical compound [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000002195 soluble material Substances 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H35/00—Switches operated by change of a physical condition
- H01H35/24—Switches operated by change of fluid pressure, by fluid pressure waves, or by change of fluid flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H29/00—Switches having at least one liquid contact
- H01H29/02—Details
- H01H29/04—Contacts; Containers for liquid contacts
- H01H29/06—Liquid contacts characterised by the material thereof
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/004—Optical devices or arrangements for the control of light using movable or deformable optical elements based on a displacement or a deformation of a fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H29/00—Switches having at least one liquid contact
- H01H2029/008—Switches having at least one liquid contact using micromechanics, e.g. micromechanical liquid contact switches or [LIMMS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H29/00—Switches having at least one liquid contact
- H01H29/28—Switches having at least one liquid contact with level of surface of contact liquid displaced by fluid pressure
Definitions
- Liquid metal micro switches have been made that use a liquid metal, such as mercury, as the switching fluid.
- the liquid metal may make and break electrical contacts.
- a force is applied to the switching fluid, which causes it to change form and move.
- the liquid metal may form oxide films that inhibit proper functioning of the switch.
- the oxide film may increase the surface tension of the liquid metal, which may increase the energy required for the switch to change state.
- a method for reducing oxides on switching fluid includes depositing a switching fluid on a first substrate.
- a solid reducing material is deposited so that it contacts at least a portion of the switching fluid.
- the reducing material reacts with oxides on the switching fluid.
- the first substrate is mated to a second substrate, the first substrate and the second substrate defining therebetween a cavity holding the switching fluid, the cavity being sized to allow movement of the switching fluid between first and second states.
- the method comprises depositing a switching fluid on a first substrate.
- the switching fluid is mixed with a reducing material to react with oxides on the switching fluid.
- the first substrate is mated to a second substrate, the first substrate and the second substrate defining therebetween a cavity holding the switching fluid, the cavity being sized to allow movement of the switching fluid between first and second states.
- the method comprises depositing a switching fluid in a switching fluid channel.
- An actuating fluid mixed with reducing material is deposited on a first substrate.
- the reducing material contacts the switching fluid during switch state changes and reduces oxides on the switching fluid.
- the first substrate and a second substrate are then mated together, the substrates defining between them a cavity holding the switching fluid and one or more additional cavities, connected to the switching fluid cavity, that hold the actuating fluid mixed with the reducing material.
- FIG. 1 illustrates a plan view of a first exemplary embodiment of a fluid-based switch
- FIG. 2 illustrates an elevation of the switch shown in FIG. 1 ;
- FIG. 3 illustrates an exemplary method that may be used to produce the fluid-bases switch of FIGS. 1 and 2;
- FIG. 4 illustrates an elevation of a second exemplary embodiment of a fluid-based switch
- FIG. 5 illustrates an exemplary method that may be used to produce the fluid-based switch of FIG. 4;
- FIG. 6 illustrates a perspective view of a first exemplary embodiment of a switch including reducing material to react with oxides on switching fluid
- FIG. 7 illustrates a perspective view of a second exemplary embodiment of a switch including reducing material to react with oxides on switching fluid
- FIG. 8 illustrates a plan view of another embodiment of a switch including reducing material
- FIG. 9 illustrates an exemplary method that may be used to produce the switch of FIG. 8.
- FIGS. 1 and 2 illustrate a fluid-based switch such as a LI MS.
- the switch 100 includes a switching fluid cavity 104, a pair of actuating fluid cavities 102, 106, and a pair of cavities 108, 110 that connect corresponding ones of the actuating fluid cavities 102, 106 to the switching fluid cavity 104. It is envisioned that more or fewer cavities may be formed in the switch. For example, the pair of actuating fluid cavities 102, 106 and pair of connecting cavities 108, 110 may be replaced by a single actuating fluid cavity and single connecting cavity. [0015] As illustrated by FIG.
- the switch 100 may be produced by depositing 305 a switching fluid 118 on a plurality of switch contacts (e.g., electrodes) 112-116 on a first substrate 101.
- the switching fluid may be a liquid metal, such as mercury or alloys that contain gallium.
- the switching fluid 118 may be used to make and break contact between the contacts 112, 114, 116.
- the switching fluid may be deposited on a plurality of wettable pads and may be used to open and block light paths.
- the switch illustrated in FIG. 1 includes three contacts, it should be appreciated that alternate embodiments may have a different number of contacts.
- a reducing material 120 is deposited 310 in a location so that it will contact at least a portion of the switching fluid 118 during switch state changes.
- the reducing material 120 may be a material that has a lower negative reduction potential than the switching fluid 118 that is used to react with oxides that form on the switching fluid 118.
- the reducing material may be a solid layer of carbon, chromium, magnesium, aluminum, titanium, manganese, nickel, silicon or other suitable material.
- the substrates 101 , 103 are mated together 315.
- a cavity holding the switching fluid 118 is defined between the substrates. The cavity is sized to allow movement of the switching fluid between first and second states. If the temperature is high enough within the cavity holding the switching fluid or catalysts are present, the reaction between the reducing material and oxides on the switching fluid can proceed when the reducing material contacts the switching fluid.
- FIG. 4 illustrates an alternate embodiment of a switch including reducing material to reduce oxides on switching fluid.
- the switch 400 can be produced by depositing 505 switching fluid mixed with reducing material 418 on a plurality of contacts 412, 414, 416 located on a first substrate 401.
- switching fluid mixed with reducing material 418 may be deposited on wettable pads or liquid electrodes.
- Substrates 401 and 403 are mated together 515 so that a switching fluid cavity is defined between the substrates.
- the reducing material may be particles or powder deposited on or mixed with the switching fluid. This may increase the surface area of the reducing material and allow less material to reduce larger amounts of switching fluid oxides.
- the switching fluid may be a liquid metal, such as mercury, and the reducing material may be carbon, chromium, magnesium, aluminum, titanium, manganese, nickel, or silicon. Other suitable reducing materials may also be used.
- the switching fluid may be mixed allowing the reducing material to contact and react with any oxides that may have formed on the switching fluid.
- the switch 600 comprises a first substrate 602 and a second substrate 604 mated together.
- the substrates 602 and 604 define between them a number of cavities 606, 608, and 610.
- Exposed within one or more of the cavities are a plurality of electrodes 612, 614, 616.
- a switching fluid 618 e.g., a conductive liquid metal such as mercury
- An actuating fluid 620 held within one or more of the cavities serves to apply the forces to the switching fluid 618.
- the forces applied to the switching fluid 618 result from pressure changes in the actuating fluid 620.
- the pressure changes in the actuating fluid 620 impart pressure changes to the switching fluid 618, and thereby cause the switching fluid 618 to change form, move, part, etc.
- the pressure of the actuating fluid 620 held in cavity 606 applies a force to part the switching fluid 618 as illustrated.
- the rightmost pair of electrodes 614, 616 of the switch 600 are coupled to one another.
- pressure changes in the actuating fluid 620 may be achieved by means of heating the actuating fluid 620, or by means of piezoelectric pumping.
- the former is described in U.S. Patent #6,323,447 of Kondoh et al. entitled “Electrical Contact Breaker Switch, Integrated Electrical Contact Breaker Switch, and Electrical Contact Switching Method", which is hereby incorporated by reference for all that it discloses.
- Switch 600 further includes reducing material 622 mixed with switching fluid 618.
- Reducing material 622 may have a lower negative reduction potential than switching fluid 618. If the temperature is high enough or catalysts are present, the reducing material may react with oxides and reduce the oxides on the switching fluid 418.
- the switching fluid is mercury
- the reducing material 622 may be carbon, chromium, magnesium, aluminum, titanium, manganese, nickel, silicon or other suitable material.
- reducing material 618 may be a solid material deposited on one of the substrates.
- the substrates 702 and 704 define between them a number of cavities 706, 708, 710. Exposed within one or more of the cavities are a plurality of wettable pads 712-716.
- a switching fluid 718 e.g., a liquid metal such as mercury
- the switching fluid 718 serves to open and block light paths 722/724, 726/728 through one or more of the cavities, in response to forces that are applied to the switching fluid 718.
- the light paths may be defined by waveguides 722-728 that are aligned with translucent windows in the cavity 708 holding the switching fluid.
- Switch 700 additionally includes reducing material 730 mixed with switching fluid 618.
- Reducing material 730 may have a lower negative reduction potential than switching fluid 718 and may be used to react with oxides that may form on switching fluid 718.
- the switching fluid is mercury
- the reducing material 730 may be carbon, chromium, magnesium, aluminum, titanium, manganese, nickel, silicon or other suitable material.
- FIG. 8 illustrates another embodiment of a fluid-based switch having reducing material.
- the switch 800 includes a switching fluid cavity 804 holding switching fluid 818, a pair of actuating fluid cavities 802, 806, and a pair of cavities 808, 810 that connect corresponding ones of the actuating fluid cavities 802, 806 to the switching fluid cavity 804. It is envisioned that more or fewer cavities may be formed in the switch. For example, the pair of actuating fluid cavities 802, 806 and pair of connecting cavities 808, 810 may be replaced by a single actuating fluid cavity and single connecting cavity.
- Actuating fluid cavities 802, 806 hold reducing material dissolved or mixed with actuating fluid 815.
- the actuating fluid may be a perfluorocarbon oil (e.g., 3M FluorinertTM), and the reducing material may be a soluble material, such as aluminum hydride or sodium borohydride.
- the actuating fluid applies forces to the switching fluid 818 to cause the switch 800 to change state.
- the actuating fluid mixed with reducing material 815 contacts switching fluid. The reducing material may then react with oxides on the switching fluid.
- the switch 800 may be produced by depositing 905 a switching fluid 818 in a switching fluid channel.
- Switching fluid may be deposited on a plurality of switch contacts (e.g., electrodes, or wettable pads) located in the switching fluid channel.
- the switching fluid channel may be located on either substrate mated together to form the switch.
- An actuating fluid mixed with reducing material 815 is also deposited 910 on one of the substrates.
- the first substrate is mated to the second substrate so that a cavity 804 holding the switching fluid 818 is defined between the substrates.
- the cavity 804 is sized to allow movement of the switching fluid between first and second states.
- One or more additional cavities 802, 806 holding the actuating fluid mixed with reducing material 815 are also defined between the substrates. As the actuating fluid mixed with reducing material 815 applies force to the switching fluid 818 during switch state changes, the reducing material may reduce oxides on the switching fluid by reacting with the oxides. [0029] Additional details concerning the construction and operation of a switch such as that which is illustrated in FIG. 7 may be found in the aforementioned patent of Kondoh et al., and patent application of Marvin Wong. [0030] While illustrative and presently preferred embodiments of the invention have been described in detail herein, it is to be understood that the inventive concepts may be otherwise variously embodied and employed. The appended claims are intended to be construed to include such variations, except as limited by the prior art.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Contacts (AREA)
- Fluid Mechanics (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04702500A EP1614129A4 (en) | 2003-04-14 | 2004-01-15 | Reducing oxides on a switching fluid in a fluid-based switch |
JP2006508603A JP2006523924A (en) | 2003-04-14 | 2004-01-15 | Reduction of oxides on switching fluids in fluid-based switches |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/414,130 | 2003-04-14 | ||
US10/414,130 US6774325B1 (en) | 2003-04-14 | 2003-04-14 | Reducing oxides on a switching fluid in a fluid-based switch |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004095484A2 true WO2004095484A2 (en) | 2004-11-04 |
WO2004095484A3 WO2004095484A3 (en) | 2005-02-10 |
Family
ID=32825073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/000984 WO2004095484A2 (en) | 2003-04-14 | 2004-01-15 | Reducing oxides in a fluid-based switch |
Country Status (6)
Country | Link |
---|---|
US (1) | US6774325B1 (en) |
EP (1) | EP1614129A4 (en) |
JP (1) | JP2006523924A (en) |
KR (1) | KR20060002990A (en) |
CN (1) | CN1771574A (en) |
WO (1) | WO2004095484A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6228856B1 (en) | 1996-09-13 | 2001-05-08 | Schering Corporation | Compounds useful for inhibition of farnesyl protein transferase |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7071432B2 (en) * | 2003-04-14 | 2006-07-04 | Agilent Technologies, Inc. | Reduction of oxides in a fluid-based switch |
US6963038B1 (en) * | 2004-05-28 | 2005-11-08 | Agilent Technologies, Inc. | Liquid metal contact microrelay |
US7132614B2 (en) * | 2004-11-24 | 2006-11-07 | Agilent Technologies, Inc. | Liquid metal switch employing electrowetting for actuation and architectures for implementing same |
US7210499B2 (en) * | 2005-01-18 | 2007-05-01 | Dale Carpenter | Methods and apparatus for a direct connect on-off controller |
US7488908B2 (en) * | 2005-10-20 | 2009-02-10 | Agilent Technologies, Inc. | Liquid metal switch employing a switching material containing gallium |
US7449649B2 (en) * | 2006-05-23 | 2008-11-11 | Lucent Technologies Inc. | Liquid switch |
US7990241B2 (en) * | 2008-01-22 | 2011-08-02 | Thermo Fisher Scientific, Inc. | Encapsulated switches employing mercury substitute and methods of manufacture thereof |
CN105895437B (en) * | 2016-05-18 | 2017-11-24 | 温州正合知识产权服务有限公司 | Durable electric power driving switch |
Family Cites Families (92)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2251316A (en) * | 1939-05-22 | 1941-08-05 | Bucklen Bear Lab Inc | Switch |
US2312672A (en) | 1941-05-09 | 1943-03-02 | Bell Telephone Labor Inc | Switching device |
US2564081A (en) | 1946-05-23 | 1951-08-14 | Babson Bros Co | Mercury switch |
US2744175A (en) * | 1953-03-10 | 1956-05-01 | Moore William Stirling | Electrical safety switches |
US3249722A (en) * | 1963-09-24 | 1966-05-03 | Jr John E Lindberg | Electrical relay employing liquid metal in a capillary tube that is wet by the liquid metal |
GB1143822A (en) | 1965-08-20 | |||
DE1614671B2 (en) | 1967-12-04 | 1971-09-30 | Siemens AG, 1000 Berlin u. 8000 München | INDEPENDENT MERCURY RELAY |
US3639165A (en) | 1968-06-20 | 1972-02-01 | Gen Electric | Resistor thin films formed by low-pressure deposition of molybdenum and tungsten |
US3600537A (en) | 1969-04-15 | 1971-08-17 | Mechanical Enterprises Inc | Switch |
US3657647A (en) | 1970-02-10 | 1972-04-18 | Curtis Instr | Variable bore mercury microcoulometer |
FR2282710A1 (en) * | 1974-08-19 | 1976-03-19 | Laurent Philippe | Switch made or broken by a conducting liquid - has compressible tubular member moving liquid through insulating tube to span contacts |
US3955059A (en) * | 1974-08-30 | 1976-05-04 | Graf Ronald E | Electrostatic switch |
US4103135A (en) | 1976-07-01 | 1978-07-25 | International Business Machines Corporation | Gas operated switches |
FR2392485A1 (en) | 1977-05-27 | 1978-12-22 | Orega Circuits & Commutation | SWITCH WITH WET CONTACTS, AND MAGNETIC CONTROL |
SU714533A2 (en) | 1977-09-06 | 1980-02-05 | Московский Ордена Трудового Красного Знамени Инженерно-Физический Институт | Switching device |
FR2418539A1 (en) | 1978-02-24 | 1979-09-21 | Orega Circuits & Commutation | Liquid contact relays driven by piezoelectric membrane - pref. of polyvinylidene fluoride film for high sensitivity at low power |
FR2458138A1 (en) | 1979-06-01 | 1980-12-26 | Socapex | RELAYS WITH WET CONTACTS AND PLANAR CIRCUIT COMPRISING SUCH A RELAY |
US4419650A (en) | 1979-08-23 | 1983-12-06 | Georgina Chrystall Hirtle | Liquid contact relay incorporating gas-containing finely reticular solid motor element for moving conductive liquid |
US4245886A (en) | 1979-09-10 | 1981-01-20 | International Business Machines Corporation | Fiber optics light switch |
US4336570A (en) | 1980-05-09 | 1982-06-22 | Gte Products Corporation | Radiation switch for photoflash unit |
DE8016981U1 (en) | 1980-06-26 | 1980-11-06 | W. Guenther Gmbh, 8500 Nuernberg | Mercury electrode switch |
DE3138968A1 (en) | 1981-09-30 | 1983-04-14 | Siemens AG, 1000 Berlin und 8000 München | OPTICAL CONTROL DEVICE FOR CONTROLLING THE RADIATION GUIDED IN AN OPTICAL WAVE GUIDE, IN PARTICULAR OPTICAL SWITCHES |
DE3206919A1 (en) | 1982-02-26 | 1983-09-15 | Philips Patentverwaltung Gmbh, 2000 Hamburg | DEVICE FOR OPTICALLY DISCONNECTING AND CONNECTING LIGHT GUIDES |
US4475033A (en) | 1982-03-08 | 1984-10-02 | Northern Telecom Limited | Positioning device for optical system element |
FR2524658A1 (en) | 1982-03-30 | 1983-10-07 | Socapex | OPTICAL SWITCH AND SWITCHING MATRIX COMPRISING SUCH SWITCHES |
US4628161A (en) | 1985-05-15 | 1986-12-09 | Thackrey James D | Distorted-pool mercury switch |
GB8513542D0 (en) | 1985-05-29 | 1985-07-03 | Gen Electric Co Plc | Fibre optic coupler |
US4652710A (en) | 1986-04-09 | 1987-03-24 | The United States Of America As Represented By The United States Department Of Energy | Mercury switch with non-wettable electrodes |
JPS62276838A (en) | 1986-05-26 | 1987-12-01 | Hitachi Ltd | Semiconductor device |
US4742263A (en) | 1986-08-15 | 1988-05-03 | Pacific Bell | Piezoelectric switch |
US4804932A (en) | 1986-08-22 | 1989-02-14 | Nec Corporation | Mercury wetted contact switch |
JPS63294317A (en) | 1987-01-26 | 1988-12-01 | Shimizu Tekkosho:Goushi | Body seal machine |
US4797519A (en) | 1987-04-17 | 1989-01-10 | Elenbaas George H | Mercury tilt switch and method of manufacture |
DE3739193A1 (en) * | 1987-11-19 | 1989-06-01 | Kurt Blaschke | Electrical switch, and a method for its production |
US5278012A (en) | 1989-03-29 | 1994-01-11 | Hitachi, Ltd. | Method for producing thin film multilayer substrate, and method and apparatus for detecting circuit conductor pattern of the substrate |
US4988157A (en) | 1990-03-08 | 1991-01-29 | Bell Communications Research, Inc. | Optical switch using bubbles |
FR2667396A1 (en) | 1990-09-27 | 1992-04-03 | Inst Nat Sante Rech Med | Sensor for pressure measurement in a liquid medium |
US5415026A (en) | 1992-02-27 | 1995-05-16 | Ford; David | Vibration warning device including mercury wetted reed gauge switches |
DE69220951T2 (en) | 1992-10-22 | 1998-01-15 | Ibm | Near field phatone tunnel devices |
US5391846A (en) * | 1993-02-25 | 1995-02-21 | The Center For Innovative Technology | Alloy substitute for mercury in switch applications |
US5886407A (en) | 1993-04-14 | 1999-03-23 | Frank J. Polese | Heat-dissipating package for microcircuit devices |
US5972737A (en) | 1993-04-14 | 1999-10-26 | Frank J. Polese | Heat-dissipating package for microcircuit devices and process for manufacture |
GB9309327D0 (en) | 1993-05-06 | 1993-06-23 | Smith Charles G | Bi-stable memory element |
GB9403122D0 (en) | 1994-02-18 | 1994-04-06 | Univ Southampton | Acousto-optic device |
JPH08125487A (en) | 1994-06-21 | 1996-05-17 | Kinseki Ltd | Piezoelectric vibrator |
FI110727B (en) | 1994-06-23 | 2003-03-14 | Vaisala Oyj | Electrically adjustable thermal radiation source |
JP3182301B2 (en) | 1994-11-07 | 2001-07-03 | キヤノン株式会社 | Microstructure and method for forming the same |
US5675310A (en) | 1994-12-05 | 1997-10-07 | General Electric Company | Thin film resistors on organic surfaces |
US5502781A (en) | 1995-01-25 | 1996-03-26 | At&T Corp. | Integrated optical devices utilizing magnetostrictively, electrostrictively or photostrictively induced stress |
WO1996030916A2 (en) | 1995-03-27 | 1996-10-03 | Philips Electronics N.V. | Method of manufacturing an electronic multilayer component |
EP0746022B1 (en) | 1995-05-30 | 1999-08-11 | Motorola, Inc. | Hybrid multi-chip module and method of fabricating |
US5751074A (en) | 1995-09-08 | 1998-05-12 | Edward B. Prior & Associates | Non-metallic liquid tilt switch and circuitry |
US5732168A (en) | 1995-10-31 | 1998-03-24 | Hewlett Packard Company | Thermal optical switches for light |
KR0174871B1 (en) | 1995-12-13 | 1999-02-01 | 양승택 | Thermally driven micro relay device with latching characteristics |
US6023408A (en) | 1996-04-09 | 2000-02-08 | The Board Of Trustees Of The University Of Arkansas | Floating plate capacitor with extremely wide band low impedance |
JP2817717B2 (en) | 1996-07-25 | 1998-10-30 | 日本電気株式会社 | Semiconductor device and manufacturing method thereof |
US5874770A (en) | 1996-10-10 | 1999-02-23 | General Electric Company | Flexible interconnect film including resistor and capacitor layers |
US5841686A (en) | 1996-11-22 | 1998-11-24 | Ma Laboratories, Inc. | Dual-bank memory module with shared capacitors and R-C elements integrated into the module substrate |
GB2321114B (en) | 1997-01-10 | 2001-02-21 | Lasor Ltd | An optical modulator |
US6180873B1 (en) | 1997-10-02 | 2001-01-30 | Polaron Engineering Limited | Current conducting devices employing mesoscopically conductive liquids |
TW405129B (en) | 1997-12-19 | 2000-09-11 | Koninkl Philips Electronics Nv | Thin-film component |
US6021048A (en) | 1998-02-17 | 2000-02-01 | Smith; Gary W. | High speed memory module |
US6351579B1 (en) | 1998-02-27 | 2002-02-26 | The Regents Of The University Of California | Optical fiber switch |
AU3409699A (en) | 1998-03-09 | 1999-09-27 | Bartels Mikrotechnik Gmbh | Optical switch and modular switch system consisting of optical switching elements |
US6207234B1 (en) | 1998-06-24 | 2001-03-27 | Vishay Vitramon Incorporated | Via formation for multilayer inductive devices and other devices |
US6212308B1 (en) | 1998-08-03 | 2001-04-03 | Agilent Technologies Inc. | Thermal optical switches for light |
US5912606A (en) | 1998-08-18 | 1999-06-15 | Northrop Grumman Corporation | Mercury wetted switch |
US6201293B1 (en) | 1998-11-19 | 2001-03-13 | Xerox Corporation | Electro optical devices with reduced filter thinning on the edge pixel photosites and method of producing same |
US6323447B1 (en) | 1998-12-30 | 2001-11-27 | Agilent Technologies, Inc. | Electrical contact breaker switch, integrated electrical contact breaker switch, and electrical contact switching method |
EP1050773A1 (en) | 1999-05-04 | 2000-11-08 | Corning Incorporated | Piezoelectric optical switch device |
US6373356B1 (en) | 1999-05-21 | 2002-04-16 | Interscience, Inc. | Microelectromechanical liquid metal current carrying system, apparatus and method |
US6396012B1 (en) | 1999-06-14 | 2002-05-28 | Rodger E. Bloomfield | Attitude sensing electrical switch |
US6304450B1 (en) | 1999-07-15 | 2001-10-16 | Incep Technologies, Inc. | Inter-circuit encapsulated packaging |
JP2001185017A (en) * | 1999-12-22 | 2001-07-06 | Agilent Technol Inc | Switching |
US6487333B2 (en) | 1999-12-22 | 2002-11-26 | Agilent Technologies, Inc. | Total internal reflection optical switch |
US6320994B1 (en) | 1999-12-22 | 2001-11-20 | Agilent Technolgies, Inc. | Total internal reflection optical switch |
DE60102450D1 (en) | 2000-02-02 | 2004-04-29 | Raytheon Co | CONTACT STRUCTURE FOR MICRO RELAY AND RF APPLICATIONS |
US6356679B1 (en) | 2000-03-30 | 2002-03-12 | K2 Optronics, Inc. | Optical routing element for use in fiber optic systems |
US6446317B1 (en) | 2000-03-31 | 2002-09-10 | Intel Corporation | Hybrid capacitor and method of fabrication therefor |
NL1015131C1 (en) | 2000-04-16 | 2001-10-19 | Tmp Total Micro Products B V | Apparatus and method for switching electromagnetic signals or beams. |
US6470106B2 (en) * | 2001-01-05 | 2002-10-22 | Hewlett-Packard Company | Thermally induced pressure pulse operated bi-stable optical switch |
JP2002207181A (en) | 2001-01-09 | 2002-07-26 | Minolta Co Ltd | Optical switch |
JP2002260499A (en) * | 2001-02-23 | 2002-09-13 | Agilent Technol Inc | Switch device using conductive fluid |
US6490384B2 (en) | 2001-04-04 | 2002-12-03 | Yoon-Joong Yong | Light modulating system using deformable mirror arrays |
JP4420581B2 (en) | 2001-05-09 | 2010-02-24 | 三菱電機株式会社 | Optical switch and optical waveguide device |
US6647165B2 (en) * | 2001-05-31 | 2003-11-11 | Agilent Technologies, Inc. | Total internal reflection optical switch utilizing a moving droplet |
US20030035611A1 (en) | 2001-08-15 | 2003-02-20 | Youchun Shi | Piezoelectric-optic switch and method of fabrication |
US6512322B1 (en) | 2001-10-31 | 2003-01-28 | Agilent Technologies, Inc. | Longitudinal piezoelectric latching relay |
US6515404B1 (en) | 2002-02-14 | 2003-02-04 | Agilent Technologies, Inc. | Bending piezoelectrically actuated liquid metal switch |
US6633213B1 (en) | 2002-04-24 | 2003-10-14 | Agilent Technologies, Inc. | Double sided liquid metal micro switch |
US6646527B1 (en) * | 2002-04-30 | 2003-11-11 | Agilent Technologies, Inc. | High frequency attenuator using liquid metal micro switches |
US6559420B1 (en) | 2002-07-10 | 2003-05-06 | Agilent Technologies, Inc. | Micro-switch heater with varying gas sub-channel cross-section |
-
2003
- 2003-04-14 US US10/414,130 patent/US6774325B1/en not_active Expired - Fee Related
-
2004
- 2004-01-15 WO PCT/US2004/000984 patent/WO2004095484A2/en active Application Filing
- 2004-01-15 JP JP2006508603A patent/JP2006523924A/en active Pending
- 2004-01-15 EP EP04702500A patent/EP1614129A4/en not_active Withdrawn
- 2004-01-15 KR KR1020057019427A patent/KR20060002990A/en not_active Application Discontinuation
- 2004-01-15 CN CNA2004800096297A patent/CN1771574A/en active Pending
Non-Patent Citations (1)
Title |
---|
See references of EP1614129A4 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6228856B1 (en) | 1996-09-13 | 2001-05-08 | Schering Corporation | Compounds useful for inhibition of farnesyl protein transferase |
Also Published As
Publication number | Publication date |
---|---|
KR20060002990A (en) | 2006-01-09 |
EP1614129A4 (en) | 2007-07-25 |
EP1614129A2 (en) | 2006-01-11 |
CN1771574A (en) | 2006-05-10 |
WO2004095484A3 (en) | 2005-02-10 |
US6774325B1 (en) | 2004-08-10 |
JP2006523924A (en) | 2006-10-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1405821B1 (en) | Method of fabricating an integrated circuit and its precursor assembly | |
US6774325B1 (en) | Reducing oxides on a switching fluid in a fluid-based switch | |
JP2004025431A (en) | Micro-electromechanical switch and its manufacturing method | |
JP2004055549A (en) | Liquid separator in liquid metal microswitch | |
US7071432B2 (en) | Reduction of oxides in a fluid-based switch | |
US6924443B2 (en) | Reducing oxides on a switching fluid in a fluid-based switch | |
US6781074B1 (en) | Preventing corrosion degradation in a fluid-based switch | |
US6787720B1 (en) | Gettering agent and method to prevent corrosion in a fluid switch | |
JP2009524191A (en) | Switch, method and system for switching the state of a signal path | |
EP1614130B1 (en) | Substrate with liquid electrode | |
US6872904B2 (en) | Fluid-based switch | |
US6794591B1 (en) | Fluid-based switches | |
TW200421638A (en) | Latching relay with switch bar | |
GB2400743A (en) | Latching relay | |
US6759611B1 (en) | Fluid-based switches and methods for producing the same | |
EP1739700A2 (en) | Architecture and method of fabrication for a liquid metal microswitch (LIMMS) | |
KR102120486B1 (en) | Micro Switch With Clad Type | |
JP4701113B2 (en) | Switch with wettable surface | |
JP2003086043A (en) | Make break contact | |
Cao | Electromagnetic effects in MEMS application: actuators, relay and packaging | |
TW200421382A (en) | Bending-mode latching relay |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DPEN | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed from 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2004702500 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 20048096297 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020057019427 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2006508603 Country of ref document: JP |
|
WWP | Wipo information: published in national office |
Ref document number: 1020057019427 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 2004702500 Country of ref document: EP |