WO2004053455A3 - Plating bath composition control - Google Patents

Plating bath composition control Download PDF

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Publication number
WO2004053455A3
WO2004053455A3 PCT/US2003/037718 US0337718W WO2004053455A3 WO 2004053455 A3 WO2004053455 A3 WO 2004053455A3 US 0337718 W US0337718 W US 0337718W WO 2004053455 A3 WO2004053455 A3 WO 2004053455A3
Authority
WO
WIPO (PCT)
Prior art keywords
plating bath
composition
composition control
bath composition
changing
Prior art date
Application number
PCT/US2003/037718
Other languages
French (fr)
Other versions
WO2004053455A2 (en
Inventor
Robert Talasek
Den Berg Marc Van
William F Ryann
Original Assignee
Advanced Tech Materials
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Tech Materials filed Critical Advanced Tech Materials
Priority to AU2003293069A priority Critical patent/AU2003293069A1/en
Publication of WO2004053455A2 publication Critical patent/WO2004053455A2/en
Publication of WO2004053455A3 publication Critical patent/WO2004053455A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Control Of Non-Electrical Variables (AREA)

Abstract

A method of plating bath composition control. The method may include analysis of a plating bath to determine byproduct concentrations and changing the composition of the plating bath as a result thereof. Additionally, plating bath solution may be circulated between reservoirs before, during, or after the analysis and the changing of the composition. Methods may be carried out with use of a system having separate reservoirs, an analyzer, and a dosing controller for the changing of the composition.
PCT/US2003/037718 2002-12-09 2003-11-25 Plating bath composition control WO2004053455A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003293069A AU2003293069A1 (en) 2002-12-09 2003-11-25 Plating bath composition control

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/314,776 US20040108213A1 (en) 2002-12-09 2002-12-09 Plating bath composition control
US10/314,776 2002-12-09

Publications (2)

Publication Number Publication Date
WO2004053455A2 WO2004053455A2 (en) 2004-06-24
WO2004053455A3 true WO2004053455A3 (en) 2004-08-05

Family

ID=32468562

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/037718 WO2004053455A2 (en) 2002-12-09 2003-11-25 Plating bath composition control

Country Status (3)

Country Link
US (1) US20040108213A1 (en)
AU (1) AU2003293069A1 (en)
WO (1) WO2004053455A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3819840B2 (en) * 2002-07-17 2006-09-13 大日本スクリーン製造株式会社 Plating apparatus and plating method
US7166203B2 (en) * 2002-09-12 2007-01-23 Teck Cominco Metals Ltd. Controlled concentration electrolysis system
US7678258B2 (en) * 2003-07-10 2010-03-16 International Business Machines Corporation Void-free damascene copper deposition process and means of monitoring thereof
US7291253B2 (en) * 2004-05-04 2007-11-06 Eci Technology, Inc. Detection of an unstable additive breakdown product in a plating bath
DE102005024910A1 (en) * 2005-05-31 2006-12-07 Advanced Micro Devices, Inc., Sunnyvale Method and system for in-line control of solder bump deposition
JP2007051362A (en) * 2005-07-19 2007-03-01 Ebara Corp Plating apparatus and method for managing plating liquid
US7676890B2 (en) 2005-10-25 2010-03-16 Black And Decker, Inc. Vibration dampening handle for a powered apparatus
JP2009242941A (en) * 2008-03-11 2009-10-22 Panasonic Corp Semiconductor device production method and semiconductor production apparatus
KR101022923B1 (en) 2008-05-06 2011-03-16 삼성전기주식회사 Qualitative analysis method and apparatus for high molecular additives in metal plating solutions
US20100068404A1 (en) * 2008-09-18 2010-03-18 Guardian Industries Corp. Draw-off coating apparatus for making coating articles, and/or methods of making coated articles using the same
US8808521B2 (en) * 2010-01-07 2014-08-19 Boli Zhou Intelligent control system for electrochemical plating process
KR20120083170A (en) * 2011-01-17 2012-07-25 삼성전자주식회사 Plating method using photoresist residue analysis method in plating solution
JP6373157B2 (en) * 2014-10-14 2018-08-15 日置電機株式会社 Electrochemical sensor and electrochemical measuring device
US10590560B1 (en) 2018-08-22 2020-03-17 Eci Technology, Inc. Control of additive turnover in an electrodeposition solution

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
US6200436B1 (en) * 1999-04-27 2001-03-13 Advanced Micro Devices, Inc. Recycling consistent plating system for electroplating

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US3951602A (en) * 1974-06-25 1976-04-20 E. I. Du Pont De Nemours And Company Spectrophotometric formaldehyde-copper monitor
US4096301A (en) * 1976-02-19 1978-06-20 Macdermid Incorporated Apparatus and method for automatically maintaining an electroless copper plating bath
US4229218A (en) * 1979-02-05 1980-10-21 Shipley Company Inc. Self-monitoring electroless plating solution
US4479852A (en) * 1983-01-21 1984-10-30 International Business Machines Corporation Method for determination of concentration of organic additive in plating bath
JPS60104246A (en) * 1983-11-11 1985-06-08 C Uyemura & Co Ltd Method for analyzing formaldehyde in chemical copper plating bath
US4694682A (en) * 1984-03-29 1987-09-22 Etd Technology, Inc. Analysis of organic additives in plating baths using novel chromatographic methods in a mass balance approach
US4628726A (en) * 1984-03-29 1986-12-16 Etd Technology, Inc. Analysis of organic compounds in baths used in the manufacture of printed circuit board using novel chromatographic methods
US4631116A (en) * 1985-06-05 1986-12-23 Hughes Aircraft Company Method of monitoring trace constituents in plating baths
US4707378A (en) * 1986-07-11 1987-11-17 International Business Machines Corporation Method and apparatus for controlling the organic contamination level in an electroless plating bath
US4914719A (en) * 1989-03-10 1990-04-03 Criticare Systems, Inc. Multiple component gas analyzer
US5352350A (en) * 1992-02-14 1994-10-04 International Business Machines Corporation Method for controlling chemical species concentration
DE69535979D1 (en) * 1994-02-28 2009-08-20 Analytica Of Branford Inc MULTIPOL ION CONDUCTOR FOR MASS SPECTROMETRY
US5858196A (en) * 1996-01-31 1999-01-12 Kawasaki Steel Corporation Method of controlling component concentration of plating solution in continuous electroplating
US6113769A (en) * 1997-11-21 2000-09-05 International Business Machines Corporation Apparatus to monitor and add plating solution of plating baths and controlling quality of deposited metal
US6416647B1 (en) * 1998-04-21 2002-07-09 Applied Materials, Inc. Electro-chemical deposition cell for face-up processing of single semiconductor substrates
US6365033B1 (en) * 1999-05-03 2002-04-02 Semitoof, Inc. Methods for controlling and/or measuring additive concentration in an electroplating bath
US6113759A (en) * 1998-12-18 2000-09-05 International Business Machines Corporation Anode design for semiconductor deposition having novel electrical contact assembly
US6585876B2 (en) * 1999-04-08 2003-07-01 Applied Materials Inc. Flow diffuser to be used in electro-chemical plating system and method
US6521112B1 (en) * 1999-07-13 2003-02-18 Dj Parker Company, Inc. Paced chemical replenishment system
US6508924B1 (en) * 2000-05-31 2003-01-21 Shipley Company L.L.C. Control of breakdown products in electroplating baths
WO2001096632A2 (en) * 2000-06-15 2001-12-20 Applied Materials, Inc. A method and apparatus for conditioning electrochemical baths in plating technology
US6454927B1 (en) * 2000-06-26 2002-09-24 Applied Materials, Inc. Apparatus and method for electro chemical deposition
US20030150734A1 (en) * 2002-02-11 2003-08-14 Applied Materials, Inc. Electroplating solution composition control
US6749739B2 (en) * 2002-10-07 2004-06-15 Eci Technology, Inc. Detection of suppressor breakdown contaminants in a plating bath

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4774101A (en) * 1986-12-10 1988-09-27 American Telephone And Telegraph Company, At&T Technologies, Inc. Automated method for the analysis and control of the electroless metal plating solution
US6200436B1 (en) * 1999-04-27 2001-03-13 Advanced Micro Devices, Inc. Recycling consistent plating system for electroplating

Also Published As

Publication number Publication date
WO2004053455A2 (en) 2004-06-24
US20040108213A1 (en) 2004-06-10
AU2003293069A1 (en) 2004-06-30
AU2003293069A8 (en) 2004-06-30

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