WO2004041454A3 - Substrate processing apparatus and method - Google Patents
Substrate processing apparatus and method Download PDFInfo
- Publication number
- WO2004041454A3 WO2004041454A3 PCT/US2003/034758 US0334758W WO2004041454A3 WO 2004041454 A3 WO2004041454 A3 WO 2004041454A3 US 0334758 W US0334758 W US 0334758W WO 2004041454 A3 WO2004041454 A3 WO 2004041454A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- steam
- processing apparatus
- substrate processing
- substrate
- stream
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 2
- 230000002093 peripheral effect Effects 0.000 abstract 2
- 230000002596 correlated effect Effects 0.000 abstract 1
- 238000009987 spinning Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2230/00—Other cleaning aspects applicable to all B08B range
- B08B2230/01—Cleaning with steam
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Liquid Crystal (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Treatment Of Fiber Materials (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003286823A AU2003286823A1 (en) | 2002-10-31 | 2003-10-30 | Substrate processing apparatus and method |
KR1020117020428A KR101252967B1 (en) | 2002-10-31 | 2003-10-30 | Substrate processing apparatus and method |
KR1020057007746A KR101094679B1 (en) | 2002-10-31 | 2003-10-30 | Substrate processing apparatus and method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-318875 | 2002-10-31 | ||
JP2002318875A JP4105931B2 (en) | 2002-10-31 | 2002-10-31 | Object processing apparatus and method |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004041454A2 WO2004041454A2 (en) | 2004-05-21 |
WO2004041454A3 true WO2004041454A3 (en) | 2004-07-22 |
Family
ID=32310348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/034758 WO2004041454A2 (en) | 2002-10-31 | 2003-10-30 | Substrate processing apparatus and method |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4105931B2 (en) |
KR (2) | KR101094679B1 (en) |
AU (1) | AU2003286823A1 (en) |
TW (1) | TWI248109B (en) |
WO (1) | WO2004041454A2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004046802B3 (en) * | 2004-09-27 | 2006-04-27 | Mafac Ernst Schwarz Gmbh & Co. Kg Maschinenfabrik | Treatment device and method for the cleaning and / or drying treatment of workpieces |
JP2006128238A (en) * | 2004-10-27 | 2006-05-18 | Aqua Science Kk | Object treatment device and object treatment method |
JP2007173277A (en) | 2005-12-19 | 2007-07-05 | Fujitsu Ltd | Spin cleaning device and wafer cleaning method |
JP4813430B2 (en) * | 2007-07-12 | 2011-11-09 | 東京エレクトロン株式会社 | Substrate cleaning apparatus, substrate cleaning method, and recording medium |
US8360817B2 (en) | 2009-04-01 | 2013-01-29 | Ebara Corporation | Polishing apparatus and polishing method |
JP5634381B2 (en) * | 2011-11-01 | 2014-12-03 | 東京エレクトロン株式会社 | Substrate cleaning method, substrate cleaning apparatus, and computer-readable storage medium |
CN103700610B (en) * | 2013-12-31 | 2017-01-25 | 北京七星华创电子股份有限公司 | Device and method for improving wafer etching uniformity |
CN104793385B (en) * | 2015-04-23 | 2018-01-19 | 京东方科技集团股份有限公司 | Stripping means, display base plate and the display device of ultra-thin substrate |
CN110000141A (en) * | 2019-04-22 | 2019-07-12 | 中信戴卡股份有限公司 | A kind of mold automatic flushing device that cleaning solution recycles |
JP7505439B2 (en) * | 2021-04-12 | 2024-06-25 | 三菱電機株式会社 | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5051136A (en) * | 1989-02-02 | 1991-09-24 | Nokia Mobile Phones Ltd. | Procedure for washing circuit boards and means for use in said procedure |
US5269878A (en) * | 1992-12-10 | 1993-12-14 | Vlsi Technology, Inc. | Metal patterning with dechlorinization in integrated circuit manufacture |
US5651832A (en) * | 1992-11-03 | 1997-07-29 | Valmet Corporation | Method for cleaning rolls |
US5964952A (en) * | 1994-10-04 | 1999-10-12 | Kunze-Concewitz; Horst | Method of cleaning surfaces with water and steam |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3320640B2 (en) * | 1997-07-23 | 2002-09-03 | 東京エレクトロン株式会社 | Cleaning equipment |
JPH11307492A (en) * | 1998-04-20 | 1999-11-05 | Tokyo Electron Ltd | Substrate cleaning device |
TW505822B (en) * | 1999-06-09 | 2002-10-11 | Tokyo Electron Ltd | Developing method and developing apparatus |
US6634806B2 (en) * | 2000-03-13 | 2003-10-21 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
-
2002
- 2002-10-31 JP JP2002318875A patent/JP4105931B2/en not_active Expired - Fee Related
-
2003
- 2003-10-30 AU AU2003286823A patent/AU2003286823A1/en not_active Abandoned
- 2003-10-30 KR KR1020057007746A patent/KR101094679B1/en not_active IP Right Cessation
- 2003-10-30 WO PCT/US2003/034758 patent/WO2004041454A2/en active Application Filing
- 2003-10-30 KR KR1020117020428A patent/KR101252967B1/en not_active IP Right Cessation
- 2003-10-31 TW TW092130509A patent/TWI248109B/en not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5051136A (en) * | 1989-02-02 | 1991-09-24 | Nokia Mobile Phones Ltd. | Procedure for washing circuit boards and means for use in said procedure |
US5651832A (en) * | 1992-11-03 | 1997-07-29 | Valmet Corporation | Method for cleaning rolls |
US5269878A (en) * | 1992-12-10 | 1993-12-14 | Vlsi Technology, Inc. | Metal patterning with dechlorinization in integrated circuit manufacture |
US5964952A (en) * | 1994-10-04 | 1999-10-12 | Kunze-Concewitz; Horst | Method of cleaning surfaces with water and steam |
Also Published As
Publication number | Publication date |
---|---|
KR20110105405A (en) | 2011-09-26 |
KR20050065668A (en) | 2005-06-29 |
AU2003286823A1 (en) | 2004-06-07 |
JP2004153172A (en) | 2004-05-27 |
KR101252967B1 (en) | 2013-04-15 |
JP4105931B2 (en) | 2008-06-25 |
TW200425223A (en) | 2004-11-16 |
TWI248109B (en) | 2006-01-21 |
WO2004041454A2 (en) | 2004-05-21 |
KR101094679B1 (en) | 2011-12-20 |
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