WO2004040645A1 - Echangeur thermique microfluidique de regulation locale de la temperature - Google Patents

Echangeur thermique microfluidique de regulation locale de la temperature Download PDF

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Publication number
WO2004040645A1
WO2004040645A1 PCT/NL2003/000749 NL0300749W WO2004040645A1 WO 2004040645 A1 WO2004040645 A1 WO 2004040645A1 NL 0300749 W NL0300749 W NL 0300749W WO 2004040645 A1 WO2004040645 A1 WO 2004040645A1
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WO
WIPO (PCT)
Prior art keywords
microfluidic
temperature control
heat exchanger
channel
reagent
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PCT/NL2003/000749
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English (en)
Inventor
Rosanne Marieke Guijt
Arash Dodge
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Stichting Voor De Technische Wetenschappen
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Priority to AU2003276783A priority Critical patent/AU2003276783A1/en
Publication of WO2004040645A1 publication Critical patent/WO2004040645A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D5/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, using the cooling effect of natural or forced evaporation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/0093—Microreactors, e.g. miniaturised or microfabricated reactors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L7/00—Heating or cooling apparatus; Heat insulating devices
    • B01L7/52—Heating or cooling apparatus; Heat insulating devices with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24V—COLLECTION, PRODUCTION OR USE OF HEAT NOT OTHERWISE PROVIDED FOR
    • F24V30/00—Apparatus or devices using heat produced by exothermal chemical reactions other than combustion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00781—Aspects relating to microreactors
    • B01J2219/00783—Laminate assemblies, i.e. the reactor comprising a stack of plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00781—Aspects relating to microreactors
    • B01J2219/00851—Additional features
    • B01J2219/00858—Aspects relating to the size of the reactor
    • B01J2219/00862—Dimensions of the reaction cavity itself
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00781—Aspects relating to microreactors
    • B01J2219/00873—Heat exchange
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00781—Aspects relating to microreactors
    • B01J2219/0095—Control aspects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J2219/00781—Aspects relating to microreactors
    • B01J2219/00993—Design aspects
    • B01J2219/00995—Mathematical modeling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/18—Means for temperature control
    • B01L2300/1838—Means for temperature control using fluid heat transfer medium
    • B01L2300/185—Means for temperature control using fluid heat transfer medium using a liquid as fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2400/00—Moving or stopping fluids
    • B01L2400/06—Valves, specific forms thereof
    • B01L2400/0677—Valves, specific forms thereof phase change valves; Meltable, freezing, dissolvable plugs; Destructible barriers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0077—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for tempering, e.g. with cooling or heating circuits for temperature control of elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to microfluidic devices. More specifically, it relates to spatially localized control of temperatures in microfluidic or micro-electronic devices.
  • Cooling of microfluidic devices can for example be done with external components or by convection. It has been achieved by clamping [5] or gluing the microfluidic device to an external Peltier element [8], or by contacting the microdevice with a copper block, passively cooled by contact with cooling fins [6].
  • the convection technique primarily consists of using the heat exchange between the device and ambient air, an effect which may be enhanced by blowing compressed air or nitrogen gas over the microdevice [7, 11].
  • Integrated cooling techniques have also been presented. In one case, an integrated cooling system utilizing a microchannel in a printed circuit board was described.
  • the present invention relates to a microfluidic heat exchanger comprising:
  • microfluidic heat exchanger enables a new integrated method for spatially localized cooling and/or heating in microfluidic devices using endothermic and exothermic reactions, respectively.
  • the thermal effect can be initiated by mixing two or more reagents by application of a vacuum to the temperature control channel.
  • the invention makes heating or cooling elements obsolete, which results in less complicated devices. Besides, by avoiding electrically powered heating or cooling elements, no extra electrical input is needed for the temperature control.
  • an operating temperature is set by fixing one or more of the following parameters:
  • LI is a length of the first microfluidic channel and L2 is a length of the second microfluidic channel, the lengths (LI, L2) being measured from an inlet (11, 21) along the microfluidic channels, to a connection with the temperature control channel.
  • the present invention relates to an electronic apparatus comprising:
  • the invention relates to a microfluidic device comprising
  • microfluidic integrated circuit with at least one microfluidic component
  • the temperature control channel is in thermal contact with at least a part of at least one microfluidic component and wherein the microfluidic heat exchanger is integrated in the microfluidic integrated circuit.
  • Integration of the temperature control system in microfluidic devices is simple, and does not necessarily require additional microfabrication steps. Since the endothermic or exothermic chemical reaction takes place in a microchannel, integration of a temperature control system does not dramatically increase the footprint of a microfluidic device.
  • the microfluidic device comprises sets of heat exchangers, which are positioned at different positions along a microfluidic component, each set of the two heat exchangers being arranged to produce a specific temperature in the part of the at least one microfluidic component.
  • Integrated heat exchangers along a microfluidic component such as a single reaction channel, allow thermocycling of compounds migrating or being pumped through the reaction channel.
  • the small feature size of the heat exchanger also allows multiple temperature control units on a microdevice where multiple reactions occur in parallel.
  • Fig. 1 shows a laminar flow of two fluids coming from two reactant channels.
  • Fig. 2 shows a microfluidic circuit according to an embodiment of the invention.
  • Fig. 3 is a cross sectional view of the circuitry of figure 2 at the line III- III.
  • Fig. 4 shows a part of a printed circuit board of an electronic apparatus with a heat exchanger according to the invention.
  • Fig. 5 shows an embodiment of the invention for the use in a flowing PCR system.
  • Fig. 6 shows an embodiment of the invention for use as a "freeze valve”.
  • TCCs temperature control channels
  • Localization of the cooling or heating effect is controlled by positioning the chemical reaction at the reactant flow interface where the two reagent streams are in contact with one another.
  • fluid flows are laminar. That is, the velocity at any one point in a channel is predictable and unchanging, and streamlines are well defined.
  • FIG 1 two fluids coming from two different reagent channels (RC) 1 , 2 are merged together into a single temperature control channel 3.
  • the two fluids generally follow laminar streamlines and flow side-by-side, as indicated in figure 1.
  • Figure 2 shows an embodiment of the invention, in which the temperature control channel 3 (TCC) is in thermal contact with a central channel 4.
  • the central channel 4 is part of a separate microfluidic circuit, the temperature of which has to be controlled. Fluid enters the central channel 4 via an inlet 41 and leaves the central channel 4 via an outlet 42.
  • a first reagent enters RC 1 via inlet 11, and a second reagent enters RC 2 via inlet 21.
  • Inlet 11, 21 may be connected to respective reagent reservoirs via inlet channels (not shown in figure 2).
  • Figure 3 is a cross sectional view of the circuitry of figure 2 at the line III-III.
  • the two TCCs 3, 3' are shown together with the central channel 4.
  • the channels 3, 3' and 4 are formed in a substrate 5, and are covered by a layer 6, which may for example be made of glass.
  • Typical values for the widths of the TCCs are 108 ⁇ m, and for the width of central channel 54 ⁇ m.
  • the depths of the channels may be different for all three channels and may e.g. vary between 2 ⁇ m and 500 ⁇ m.
  • the widths of the channels may vary between 2 ⁇ m and 1000 ⁇ m, while the length of the part of the channels where they thermally connect, may vary between e.g. 1 mm and 100 mm.
  • the relative widths of the reagent flows in the TCC 3, 3' are determined by their flow rate ratio.
  • reactions can occur.
  • two-reagent reactions are used.
  • the evaporation of acetone can be used as an endothermic reaction.
  • the violent exothermic dissolution of concentrated H 2 SO 4 in water can be used, with water in RC 1 and H SO 4 in RC 2.
  • the microfluidic structure shown in figure 2 and 3, can be etched into a glass substrate using conventional photolithography techniques and wet chemical etching [13].
  • TCCs 3, 3' are integrated along both sides of the central channel, see Figure 2, to obtain a temperature effect. Different temperature effects and temperature gradients could be obtained. First, a temperature gradient could be obtained along the central channel 4.
  • the extent to which a fluid may be cooled in the central channel 4 depends on the relative volumes of the different reagents, and can be influenced by varying relative flow rates from RC 1 and RC 2. These latter parameters can be controlled by varying the flow resistance of the channels involved. Flow resistance depends on channel cross- section and length as well as fluid viscosity. If a certain pressure P is applied to a channel i, the flow Q t induced through the channel i is given by:
  • the vacuum applied to the outlet 32 i.e. the waste reservoir
  • the vacuum applied to the outlet 32 simultaneously creates the same negative pressure at the ends of RC 1 and RC 2.
  • Q1/Q 2 depends only on channel lengths and viscosities of the fluids used, providing some flexibility in setting the flow rate ratio in the two channels.
  • Two different structures were tested to verify the difference in the cooling effect induced by varying the flow ratio in the reagent channels RC 1, RC 2, as presented in table 1.
  • equation 2 the air-to-acetone flow ratios 0.3:1 and 7:1 are obtained.
  • Temperatures in the central channel 4 are estimated at respectively 5 °C and -3 °C, demonstrating the influence of the flow ratio on the cooling effect.
  • Cooling in glass-glass devices is shown to be less efficient than in the glass-PDMS hybrids. This may be because acetone vapour also escapes through the gas-permeable PDMS, thereby driving the acetone evaporation process more strongly and augmenting the cooling effect. This implies that a larger air-acetone contact surface would be required for efficient cooling in a fully glass device.
  • Heating the central channel 4 can be performed in glass-glass devices, with a layout and operating procedure identical to the devices used for the cooling experiments (figure 1).
  • concentrated H 2 SO 4 from RC 2 and water from RC 1 . come together in the TCC, where the exothermic dissolution reaction takes place.
  • devices identical to the ones used for the cooling tests were used to investigate the effect of flow ratio on heating. Since the viscosities of the fluids used in this case are different, the flow ratios change as indicated in Table 1. For the 0.4:1 water-to-H 2 SO 4 a temperature of 76°C could be estimated, whereas for the 11 :1 ratio heating up to 36°C was estimated. These results are summarized in Table 1.
  • an electrical device 101 is cooled by a microfluidic heat exchanger as described above.
  • the heat exchanger comprises a temperature control channel 3, which is in thermal contact with the electrical device 101.
  • First and second reagents are delivered via a first and second inlet 1, 2 to the TCC 3.
  • an endothermic (or exothermic) reaction is caused, which cools (or heats) the electrical device 101, which is in close contact with the TCC 3.
  • the reactant is transferred to, for example, a waste via an outlet 32.
  • the microfluidic heat exchanger is integrated in the printed circuit board 101.
  • FIG 4 only one electrical device is shown, but the invention can be used to cool more than one device with one heat exchanger, or alternatively, several heat exchangers can cool (or heat) several electrical devices.
  • Figure 5 shows an embodiment of the invention for the use in a flowing PCR system.
  • a microchannel 51 serpentines along nine sets of heat exchangers 52, 53, 54, 55, 56, 57, 58, 59, 60. Each set of heat exchangers is configured as described above. To obtain specific temperatures in the microchannel 51, each set of heat exchangers 52, 53, 54, 55, 56, 57, 58, 59, 60 is supplied by specific reagents.
  • the reagent channels RC 1 and RC 2 of the individual heat exchangers have predetermined lengths, in order to bias the correct flow ratios in the different temperature control channels.
  • three different temperatures TI, T2, T3 are used to amplify DNA strands flowing through the microchannel 51. Thanks to the arrangement of figure 5, the DNA substance is repeatedly exposed to three different temperatures TI , T2, T3, while flowing through the microchannel.
  • PCR in a flowing system has been demonstrated in [6].
  • PCR can be done in a stagnant system, by variation of a local temperature.
  • the present invention can also be used in stagnant systems.
  • thermochemical reactions such as enzyme assays, immunological assays and hybridisation of DNA without non-specific binding are optimal at 37 °C.
  • non biochemical reactions for example used for phosphate analysis [15] and the Berthelot reaction, see ref [16] can be accelerated when performed at elevated temperatures.
  • a heat exchanger according to the invention can be used to control the temperatures at these reactions. Temperatures can be set by varying the type of reaction, type of reagents, length of reagent channels, cross-section and geometry of the reagent channels 1, 1', 2, 2' and TCC 3, 3', viscosity of the reagents, number of TCCs 3, 3', or pressure of a pump connected to the inlets 21, 41 and/or outlet 32. It is further noted that reactions in the central channel 4 can be performed either in a continuous flow system, or in a stopped-flow mode where a fluid is brought in and then stopped in the channel.
  • FIG. 6 shows another embodiment of the present invention.
  • an endothermic reaction can be causes in the TCC 3, 3'. If the temperature in the TCC 3, 3' is below the freezing point of a substance, which is pumped through a central channel 65, the substance 70 will locally freeze, blocking the flow in the central channel 65.
  • This application can be used to avoid the substance from entering in, for example, a reaction chamber 66, see figure 6.
  • the heat exchanger will function as a so-called "freeze valve".
  • the driving force of the microfluidic heat exchanger discussed above is vacuum, resulting in low-power consumption during cooling or heating.
  • Another option is to use pumps, connected to each reagent reservoir for reagent delivery.
  • the invention is in no way limited to the use of only two reagent channels nor to two reagents. More reagent channels are conceivable. If, for example, three reagent channels are connected to the TCC 3, 3', it might be possible to create two interfaces 10. This may enhance the reaction and thus the thermal effect. Moreover, the invention is not restricted to two reagents causing either an endothermic or exothermic reaction. That reaction may, alternatively, be caused by three or more reagents. Furthermore, the term "Temperature Control Channel” should be broadly interpreted as referring to a cavity in which different reagents react.
  • the channel may well be very short, or may have a very different form, such as a circle or an ellipse. In that case, the term "reaction chamber” would apply. This remark also applies to the central channel 4.
  • the heat exchanger is either used in a microfluidic device or in a printed circuit board provided with micro-electronic devices. This separation into two different applications (i.e. microfluidics and microelectronics) may vanish if the invention is used inside a micro-electronic device (i.e. inside an electronic integrated circuit "IC"). It is assumed that such an integrated device with both microfluidic heat exchangers and integrated electronic circuitry can be referred to as "microfluidic device”.

Abstract

L'invention concerne des dispositifs microfluidiques, nouveaux outils prometteurs permettant d'étudier et d'optimiser des réactions et des analyses (bio)chimiques. De nombreuses réactions (bio)chimiques requièrent une régulation précise de la température, par exemple dans une opération de thermocyclage pour PCR. On décrit un nouveau système intégré de régulation de la température pour des dispositifs microfluidiques, qui met en oeuvre des réactions chimiques pour réguler localement la température. Dans un mode de réalisation, l'évaporation d'acétone a été utilisée, en tant que réaction endothermique, pour refroidir un microcanal. En variante, le chauffage d'un microcanal peut être obtenu par dissolution d'un acide sulfurique concentré dans de l'eau, dans une réaction exothermique. La délimitation de la zone de contact de deux flux dans le canal microfluidique permet de régler la position de l'emplacement où se produit l'effet thermique, tandis que le rapport des débits a une incidence sur l'ampleur de l'effet thermique.
PCT/NL2003/000749 2002-10-31 2003-10-31 Echangeur thermique microfluidique de regulation locale de la temperature WO2004040645A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003276783A AU2003276783A1 (en) 2002-10-31 2003-10-31 Microfluidic heat exchanger for locatized temperature control

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP02079584 2002-10-31
EP02079584.5 2002-10-31

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WO2004040645A1 true WO2004040645A1 (fr) 2004-05-13

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Cited By (9)

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Publication number Priority date Publication date Assignee Title
WO2007027663A2 (fr) * 2005-08-30 2007-03-08 California Institute Of Technology Procede et appareil pour refroidissement par evaporation dans des systemes microfluidiques
WO2008102164A1 (fr) * 2007-02-23 2008-08-28 Mark Collins Procédé de génération de chaleur
WO2011042702A2 (fr) 2009-10-07 2011-04-14 Mark Collins Appareil de génération de chaleur
WO2011138748A1 (fr) * 2010-05-04 2011-11-10 Centre National De La Recherche Scientifique Support de puce microfluidique et systeme de regulation thermique d'un echantillon
WO2012140170A2 (fr) 2011-04-13 2012-10-18 Mark Collins Appareil de production de chaleur
WO2013190745A1 (fr) * 2012-06-22 2013-12-27 パナソニック株式会社 Dispositif microfluidique
US8776870B2 (en) 2008-05-07 2014-07-15 The Regents Of The University Of California Tunable thermal link
JP2017009435A (ja) * 2015-06-22 2017-01-12 富士電機株式会社 加熱冷却機構及び加熱冷却システム
WO2019070489A1 (fr) * 2017-10-04 2019-04-11 Ih Ip Holdings Limited Dispositif de commande intégré à une carte de réacteur

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US5763951A (en) * 1996-07-22 1998-06-09 Northrop Grumman Corporation Non-mechanical magnetic pump for liquid cooling
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
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WO2001064332A1 (fr) * 2000-03-02 2001-09-07 Newcastle Universtiy Ventures Limited Dispositif et procede de distribution de reacteur capillaire
US20010041357A1 (en) * 1999-07-28 2001-11-15 Yves Fouillet Method for carrying out a biochemical protocol in continuous flow in a microreactor
US20020092363A1 (en) * 2001-01-16 2002-07-18 Jorgenson James W. Contactless resistive heater for liquids in microenvironments and related methods

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5763951A (en) * 1996-07-22 1998-06-09 Northrop Grumman Corporation Non-mechanical magnetic pump for liquid cooling
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
WO1999022858A1 (fr) * 1997-11-05 1999-05-14 British Nuclear Fuels Plc Reactions de composes aromatiques
US20010041357A1 (en) * 1999-07-28 2001-11-15 Yves Fouillet Method for carrying out a biochemical protocol in continuous flow in a microreactor
WO2001064332A1 (fr) * 2000-03-02 2001-09-07 Newcastle Universtiy Ventures Limited Dispositif et procede de distribution de reacteur capillaire
US20020092363A1 (en) * 2001-01-16 2002-07-18 Jorgenson James W. Contactless resistive heater for liquids in microenvironments and related methods

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007027663A3 (fr) * 2005-08-30 2007-06-21 California Inst Of Techn Procede et appareil pour refroidissement par evaporation dans des systemes microfluidiques
WO2007027663A2 (fr) * 2005-08-30 2007-03-08 California Institute Of Technology Procede et appareil pour refroidissement par evaporation dans des systemes microfluidiques
WO2008102164A1 (fr) * 2007-02-23 2008-08-28 Mark Collins Procédé de génération de chaleur
US9267703B2 (en) 2007-02-23 2016-02-23 Mark Collins Method of generating heat
US8776870B2 (en) 2008-05-07 2014-07-15 The Regents Of The University Of California Tunable thermal link
WO2011042702A2 (fr) 2009-10-07 2011-04-14 Mark Collins Appareil de génération de chaleur
US9494326B2 (en) 2009-10-07 2016-11-15 Mark Collins Apparatus for generating heat
WO2011138748A1 (fr) * 2010-05-04 2011-11-10 Centre National De La Recherche Scientifique Support de puce microfluidique et systeme de regulation thermique d'un echantillon
FR2959678A1 (fr) * 2010-05-04 2011-11-11 Centre Nat Rech Scient Puce microfluidique, support, systeme et procede de mise en oeuvre pour une regulation thermique spatialement controlee et rapide d'un echantillon
WO2012140170A2 (fr) 2011-04-13 2012-10-18 Mark Collins Appareil de production de chaleur
WO2013190745A1 (fr) * 2012-06-22 2013-12-27 パナソニック株式会社 Dispositif microfluidique
US20150190811A1 (en) * 2012-06-22 2015-07-09 Panasonic Intellectual Property Management Co., Ltd. Microfluidic device
JPWO2013190745A1 (ja) * 2012-06-22 2016-02-08 パナソニックＩｐマネジメント株式会社 マイクロ流体デバイス
US9475052B2 (en) 2012-06-22 2016-10-25 Panasonic Intellectual Property Management Co., Ltd. Microfluidic device
JP2017009435A (ja) * 2015-06-22 2017-01-12 富士電機株式会社 加熱冷却機構及び加熱冷却システム
WO2019070489A1 (fr) * 2017-10-04 2019-04-11 Ih Ip Holdings Limited Dispositif de commande intégré à une carte de réacteur

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