WO2004032284A1 - Elektrischer kontakt - Google Patents
Elektrischer kontakt Download PDFInfo
- Publication number
- WO2004032284A1 WO2004032284A1 PCT/DE2003/003296 DE0303296W WO2004032284A1 WO 2004032284 A1 WO2004032284 A1 WO 2004032284A1 DE 0303296 W DE0303296 W DE 0303296W WO 2004032284 A1 WO2004032284 A1 WO 2004032284A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- contact
- electrical contact
- tin
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
- H01R13/035—Plated dielectric material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
Definitions
- the invention is based on an electrical contact, in particular an electrical contact of a connector, according to the type defined in more detail in the preamble of claim 1.
- Such an electrical contact is known from US Pat. No. 5,892,424 and represents an encapsulated contact point of an electrical connection.
- the known electrical contact consists of a substrate on which a contact layer is applied, which serves to increase the wear resistance of the electrical contact.
- This contact layer has a matrix formed from a first element which is doped with a second element.
- the matrix can be formed from an element selected from the group consisting of Mo, Zr, Nb, Hf, Ta and W includes.
- the additional element can be formed from an element selected from a group comprising Zn, Cd, Hg, Al, Ga, In, Tl, Ge, Sn, Pb, As, Sb and Bi.
- the additional element stabilizes the contact resistance of the electrical contact see during an electrical switching process. Furthermore, the additional element leads to an improvement in the wear resistance and the oxidation resistance of the electrical contact.
- the proportion of additional elements in the contact layer can be between 0.5 atom% and 50 atom%.
- the contact layer is applied by a sputtering process, an ion-assisted vapor deposition process, an ion plating process or a plasma CVD process.
- a sputtering process an ion-assisted vapor deposition process
- an ion plating process or a plasma CVD process.
- these processes are complex and not suitable for the production of large quantities.
- the metals from which the contact layer of the known electrical contact is made are expensive and therefore likewise not suitable for contacts which are required in large quantities. This applies in particular to electrical contacts in motor vehicles, which are required in quantities of 1000 to 3000 units per motor vehicle.
- electrical contacts in the automotive sector often have a contact layer made of tin.
- This layer can be hot-dip tinned or electroplated
- tin is characterized by its ductility and its good electrical conductivity.
- an intermediate layer consisting of intermetallic compounds such as CuSn3, Cu5Sn6 is formed at the interface to the substrate, which usually consists of a copper-based alloy, such as CuSn4-bronze, CuNiSi or the like, by diffusion.
- the intermediate layer is harder than the contact layer and can grow due to the temperature.
- tin alloys or layers have the disadvantage that they tend to rub through due to their low hardness and the resulting low wear resistance with frequent plugging operations or due to vehicle or engine-related vibrations, which leads to increased oxidation, so-called friction corrosion , leads.
- the abrasion and / or the fretting corrosion can in turn lead to a failure of an electrical component of a motor vehicle assigned to the relevant contact, for example a sensor, a control device or the like.
- thermotin a tin-based contact layer, also known as thermotin, of an electrical contact is known from practice, which consists of 100% intermetallic phases and is produced by hot aging. is posed. Abrasion tests have only shown limited usability for such contact layers.
- AuCo alloys with sub-nickel plating, silver layers with copper sub-plating or sub-nickel plating, or even gold layers have often been used as the contact layer in electrical contacts.
- the electrical contact according to the invention with a metallic substrate, on which a contact layer in the form of a gradient layer is applied, which is formed from at least two elements, one of which is silver and forms a matrix for the second element or with it is alloyed or of which one is nickel and the other phosphorus or of which one is indium and the other tin has the advantage that it is because of the for the components used in the contact layer, their availability and their relatively low procurement costs are a contact layer which is also suitable for electrical contacts required in large quantities.
- a gradient layer in the sense of the invention is a contact layer in which the proportion of the two elements changes in the direction of the normal to the substrate surface.
- the proportion of tin in a silver matrix or silver / tin alloy can decrease in the direction facing away from the substrate.
- the change in the element proportions of the contact layer can be linear. In this case it is a linear concentration gradient. Alternatively, it can also be a concentration gradient graded according to a staircase function.
- the proportion of one element in the contact layer in the gradient direction can pass through a range between 0% and 100%.
- the substrate is, for example, a substrate which is usually used for plug connections in the automotive sector, for example an alloy based on copper, such as CuSn4 bronze, CuNiSi or the like.
- a substrate made of a nickel-based alloy could also be used.
- the second element or additional element can be tin, gold or indium.
- the gradient layer preferably has a thickness of about 1 ⁇ m to 3 ⁇ m, but it can also be made with a greater thickness.
- the gradient layer can have a noble metal cover layer at least in regions.
- the noble metal cover layer preferably has a thickness between approximately 0.1 ⁇ m and 0.3 ⁇ m and thus represents a so-called “flash” layer.
- Au, Ru, Pt and. are particularly suitable as noble metals for the “flash” layer / or Pd.
- the contact layer is preferably produced by a galvanic process or else by a PVD (Physical Vapor Deposition) process.
- an electrical contact 1 which represents a contact of a connector that is used in an automobile.
- the electrical contact 1 comprises a substrate 2, which is made of a copper-based alloy such as CuSn4, CuNi2Si or the like.
- the substrate 2 has a thickness between 0.1 mm and 0.5 mm.
- a contact layer 3 which is applied by a galvanic process, is arranged on the substrate 2 of the electrical contact 1.
- the contact layer 3 represents a silver / tin material system, the silver and the tin being alloyed with one another.
- the proportion of tin in the contact layer 3 decreases in a substantially linear manner in the direction facing away from the substrate 2, for example from approximately 100% to approximately 20%.
- the contact layer 3 thus forms a gradient layer.
- the thickness of the contact layer 3 is in a range between approximately 1 ⁇ m and 3 ⁇ m.
- the gradient points in the opposite direction, so that the proportion of tin in the contact layer increases in the direction of the substrate and consequently the highest silver concentration is present on the surface of the contact layer or gradient layer.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Contacts (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03770895A EP1550185A1 (de) | 2002-10-02 | 2003-10-02 | Elektrischer kontakt |
US10/524,726 US7589290B2 (en) | 2002-10-02 | 2003-10-02 | Electric contact |
JP2004540534A JP2006501615A (ja) | 2002-10-02 | 2003-10-02 | 電気コンタクト |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10246062A DE10246062A1 (de) | 2002-10-02 | 2002-10-02 | Elektrischer Kontakt |
DE10246062.0 | 2002-10-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004032284A1 true WO2004032284A1 (de) | 2004-04-15 |
Family
ID=32010124
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2003/003296 WO2004032284A1 (de) | 2002-10-02 | 2003-10-02 | Elektrischer kontakt |
Country Status (5)
Country | Link |
---|---|
US (1) | US7589290B2 (de) |
EP (1) | EP1550185A1 (de) |
JP (1) | JP2006501615A (de) |
DE (1) | DE10246062A1 (de) |
WO (1) | WO2004032284A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10326788B4 (de) * | 2003-06-13 | 2005-05-25 | Robert Bosch Gmbh | Kontaktoberflächen für elektrische Kontakte und Verfahren zur Herstellung |
DE102006043795B3 (de) | 2006-09-19 | 2008-05-29 | Saia-Burgess Oldenburg Gmbh & Co. Kg | Elektrischer Mikroschalter |
DE112012004855T5 (de) * | 2011-11-22 | 2014-09-11 | Nec Schott Components Corporation | Temperatursicherung und Schleifelektrode verwendet für eine Temperatursicherung |
DE102011088793A1 (de) * | 2011-12-16 | 2013-06-20 | Tyco Electronics Amp Gmbh | Elektrischer Steckverbinder mit mikrostrukturiertem Kontaktelement |
EP2838096B1 (de) * | 2013-08-16 | 2017-07-19 | General Electric Company | Elektrisches Kontaktsystem |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0428740A1 (de) * | 1989-05-10 | 1991-05-29 | The Furukawa Electric Co., Ltd. | Elektrisches kontaktmaterial, verfahren zur herstellung und so hergestellter kontakt |
US5800932A (en) | 1995-02-28 | 1998-09-01 | The Furukawa Electric Co., Ltd. | Electric contact material and a manufacturing method therefor |
US6183886B1 (en) * | 1998-04-03 | 2001-02-06 | Olin Corporation | Tin coatings incorporating selected elemental additions to reduce discoloration |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3623205A (en) * | 1969-12-24 | 1971-11-30 | Curtiss Wright Corp | Composite bearing structure |
DE2536985B2 (de) * | 1975-08-20 | 1977-10-06 | W.C. Heraeus Gmbh, 6450 Hanau | Elektrischer kontakt, insbesondere steckkontakt und verfahren zu dessen herstellung |
DE2540943B2 (de) * | 1975-09-13 | 1978-02-02 | W.C. Heraeus Gmbh, 6450 Hanau | Kontaktkoerper fuer einen elektrischen steckkontakt |
DE2940772C2 (de) * | 1979-10-08 | 1982-09-09 | W.C. Heraeus Gmbh, 6450 Hanau | Elektrischer Schwachstromkontakt |
JPS63221517A (ja) * | 1987-03-09 | 1988-09-14 | 古河電気工業株式会社 | 電気接点材料とその製造法 |
US5420056A (en) * | 1994-01-14 | 1995-05-30 | Texas Instruments Incorporated | Junction contact process and structure for semiconductor technologies |
US5892424A (en) | 1995-02-10 | 1999-04-06 | The Furukawa Electric Co., Ltd. | Encapsulated contact material and a manufacturing method therefor, and a manufacturing method and a using method for an encapsulated contact |
JPH08298038A (ja) | 1995-02-28 | 1996-11-12 | Furukawa Electric Co Ltd:The | 電気接点材料とその製造方法 |
US6136460A (en) * | 1998-04-03 | 2000-10-24 | Olin Corporation | Tin coatings incorporating selected elemental additions to reduce discoloration |
-
2002
- 2002-10-02 DE DE10246062A patent/DE10246062A1/de not_active Withdrawn
-
2003
- 2003-10-02 EP EP03770895A patent/EP1550185A1/de not_active Withdrawn
- 2003-10-02 US US10/524,726 patent/US7589290B2/en not_active Expired - Fee Related
- 2003-10-02 WO PCT/DE2003/003296 patent/WO2004032284A1/de active Application Filing
- 2003-10-02 JP JP2004540534A patent/JP2006501615A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0428740A1 (de) * | 1989-05-10 | 1991-05-29 | The Furukawa Electric Co., Ltd. | Elektrisches kontaktmaterial, verfahren zur herstellung und so hergestellter kontakt |
US5800932A (en) | 1995-02-28 | 1998-09-01 | The Furukawa Electric Co., Ltd. | Electric contact material and a manufacturing method therefor |
US6183886B1 (en) * | 1998-04-03 | 2001-02-06 | Olin Corporation | Tin coatings incorporating selected elemental additions to reduce discoloration |
Also Published As
Publication number | Publication date |
---|---|
EP1550185A1 (de) | 2005-07-06 |
US20060163047A1 (en) | 2006-07-27 |
US7589290B2 (en) | 2009-09-15 |
JP2006501615A (ja) | 2006-01-12 |
DE10246062A1 (de) | 2004-04-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60221079T3 (de) | Zinn-Silberbeschichtungen | |
EP1547107B1 (de) | Elektrischer kontakt | |
DE102007047007A1 (de) | Elektrisches Kontaktelement und ein Verfahren zum Herstellen desselben | |
EP1157820B1 (de) | Elektrisch leitfähiges Metallband und Steckverbinder | |
DE102014117410B4 (de) | Elektrisches Kontaktelement, Einpressstift, Buchse und Leadframe | |
DE10138204B4 (de) | Elektrischer Kontakt | |
DE112014005145T5 (de) | Plattenanschluss, Herstellungsverfahren hierfür und Plattenverbinder | |
DE102011015253A1 (de) | Kommutator | |
EP1616372B1 (de) | Elektrische steckkontakte und ein halbzeug für deren herstellung | |
WO2004032284A1 (de) | Elektrischer kontakt | |
DE112016005445T5 (de) | Im Fahrzeug montiertes Elektronikmodul, Kartenrandverbinder und Verbinder | |
DE1789062C3 (de) | Verfahren zum Herstellen von Metallkontaktschichten für Halbleiteranordnungen | |
DE102011088211A1 (de) | Kontaktelement und Verfahren zu seiner Herstellung | |
EP3797181B1 (de) | Kupferband zur herstellung von elektrischen kontakten und verfahren zur herstellung eines kupferbandes und steckverbinder | |
DE102005055742A1 (de) | Verfahren zum Herstellen einer kontaktgeeigneten Schicht auf einem Metallelement | |
DE102012208681A1 (de) | Zinnbeschichtung, zugehöriges Kontaktelement und Verfahren zum Aufbringen einer Zinnbeschichtung | |
DE3434627A1 (de) | Elektrischer gleitkontakt, insbesondere fuer kommutierungssysteme | |
DE102009023191A1 (de) | Gehäuse mit einer Beschichtung | |
DE102019119348B4 (de) | Beschichtetes Trägerband und Verwendung desselben zum Bonden einer Leistungselektronik | |
DE102015205695B4 (de) | Halbleiterbauelement, Kontaktanordnung und Verfahren zur Herstellung | |
EP1411591A2 (de) | Elektrische Kontaktoberflächen | |
WO2017125330A1 (de) | Mehrschichtsystem mit auf zinn basierenden schichten | |
WO2015188971A1 (de) | Substrat mit einer oberflächenbeschichtung und verfahren zum beschichten einer oberfläche eines substrates | |
DE202016101688U1 (de) | Leistungshalbleitermodul mit einem Schaltungsträger | |
DE102013212069A1 (de) | Zinnbeschichtung, zugehöriges Kontaktelement und Verfahren zum Aufbringen einer Zinnbeschichtung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): JP US |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2003770895 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref document number: 2006163047 Country of ref document: US Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10524726 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2004540534 Country of ref document: JP |
|
WWP | Wipo information: published in national office |
Ref document number: 2003770895 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 10524726 Country of ref document: US |