WO2004021416A1

WO2004021416A1 - Inspection condition data management method, system, program, and inspection device

Info

Publication number: WO2004021416A1
Application number: PCT/JP2003/010787
Authority: WO
Inventors: Yohei Asakawa; Makoto Ono; Daisuke Fujiki
Original assignee: Hitachi, Ltd.
Priority date: 2002-08-27
Filing date: 2003-08-26
Publication date: 2004-03-11
Also published as: JP2004087820A; JP4209156B2; AU2003257548A1

Abstract

An inspection condition data management method includes steps of: receiving an input of type name from an input section; referencing the type name received from the input section and a table defining a similarity between the types, so as to search a type similar to the type in a storage section containing inspection condition data; recognizing the inspection step containing the inspection condition data on the similar type in the storage section; editing/outputting the similar type picked up from the searched similar type group in proportion to the number of inspection steps and receiving the similar type selection for each inspection step from the input section; and extracting from the storage section, inspection condition data on the similar type inspection step which has received the selection for each inspection step and using this inspection condition data to create inspection condition data on the type received from the input section.

Description

Specification

Inspection condition data management method and system, program, inspection device Cross-reference of related applications

This application claims the priority based on Japanese Patent Application No. 200-024-2 4 7 2 19 filed on Aug. 27, 2002, the contents of which are incorporated herein by reference. Invite.

Technical field

The present invention relates to an inspection condition data management method and system, a program, and an inspection device. Background art

An inspection of a semiconductor integrated circuit will be described as an example. A semiconductor integrated circuit is manufactured by repeating a process of transferring a pattern formed on a photomask onto a semiconductor wafer by film formation, lithography, and etching. Defects in the circuit pattern and the generation of foreign matter during the manufacturing process greatly affect the yield of semiconductor integrated circuits. Therefore, in semiconductor integrated circuit manufacturing plants, an inspection process is provided in the middle of the manufacturing process in order to detect foreign substances and defects early and take countermeasures.

As an apparatus for inspecting a foreign substance and a defect present on a pattern of a semiconductor wafer, there is a foreign substance inspection apparatus that irradiates a semiconductor wafer with a laser beam and detects the foreign substance based on a difference in intensity of scattered light. There is also a visual inspection device that irradiates a semiconductor wafer with visible light, ultraviolet light, or an electron beam, captures an image, compares the image with a circuit pattern image of an adjacent chip, and detects a pattern abnormality. In the following, foreign matter and pattern abnormalities are collectively called defects. In addition, the particle inspection device and the appearance inspection device are collectively called a defect inspection device. In order to use this defect inspection device, the inspection corresponding to the circuit pattern and inspection process is required. Inspection condition data is required. Inspection condition data can be roughly divided into the following four categories. In the semiconductor manufacturing process, the material and circuit pattern on the wafer surface vary depending on the inspection process and product type, so the optimal laser light, visible light, ultraviolet light, and electron beam intensity for inspection differ. In addition, thresholds are set for the intensity of the scattered light and the brightness of the image to identify defects, and these thresholds also differ depending on the type and inspection process. The conditions for detecting these defects are the first category. Hereinafter, the data of this condition is referred to as defect detection condition data.

The defect inspection system detects defects by comparing them with the circuit patterns of adjacent chips. In order to compare with the circuit pattern of the adjacent chip, it is necessary to register the chip arrangement in the wafer in the inspection condition in advance. These are the classifications of the second test condition. Hereinafter, the data of this condition is referred to as array information.

In addition, the defect inspection device reads the alignment mark on the wafer to accurately grasp the position and direction of the wafer. The registration information of the alignment mark and the image of the alignment mark are registered. These conditions are the third category of inspection conditions. Hereinafter, this condition is referred to as alignment condition data.

In addition, the defect inspection apparatus may detect a color unevenness on a wafer, a grain of a metal wiring, or the like as a defect. These are called pseudo defects because they do not affect the performance of the semiconductor integrated circuit. An area where many false defects are detected is usually set as a non-inspection area. The setting of the non-inspection area is the fourth classification. Hereinafter, this condition is referred to as non-inspection area data.

By the way, the above sequence information is common in different inspection processes as long as the same type is used. Therefore, in order to reduce the time required to create inspection condition data, for example, in Japanese Patent Application Laid-Open No. 2001-35893, inspection conditions are set by dividing the array information common to the product types and other conditions that differ for each inspection process. The statement is intended to reduce time. Further, as in the invention disclosed in JP-A-2000-233345, an inspection condition management server for centrally managing inspection condition data of a plurality of defect inspection devices is provided, Techniques for facilitating diversion of inspection conditions have also been proposed.

Of the above four conditions, setting the defect detection condition data takes the longest time. This is because, in setting the defect detection condition data, it is necessary to repeat the test inspection and the condition adjustment for confirming the validity of the condition several times to set the optimum condition. Generally, it takes several hours to create. On the other hand, in recent years, there has been an increase in the production volume of system LSIs of many types and small quantities, and each semiconductor integrated circuit manufacturer needs to create inspection condition data corresponding to many types at a time. ing. Therefore, the time required to create inspection condition data tends to increase, and reducing the time required to create inspection condition data has become an important issue.

However, conventional techniques such as disclosed in JP-A-2001-35893 and JP-A-2000-233345 are intended to improve operability when creating inspection condition data, and to reduce the number of trial inspections. The time required to create inspection condition data was not fundamentally reduced. Disclosure of the invention

An object of the present invention is to reduce the number of test inspections and the like and to quickly and easily set defect detection condition data.

In order to achieve the above and other objects, an inspection condition management method according to one aspect of the present invention is to generate inspection condition data of an inspection device for detecting a foreign substance or a pattern defect included in a wafer with a circuit pattern by a computer. A step of receiving an input of a type name from the computer unit and an input unit, and comparing the type name received from the input unit with a table defining similarity between types, and checking inspection condition data. Retrieving a similar type of the type in a storage unit for storing the same type; recognizing an inspection process in which inspection condition data exists for the similar type in the storage unit; Editing and outputting similar products according to the number of products, and accepting selection of similar products for each inspection process from the input unit. Extracting, from the storage unit, the inspection condition data relating to the inspection process of the similar type that has been selected for each inspection process, and configuring the inspection condition data of the type received from the input unit based on the inspection condition data. .

Other features and objects of the present invention will become apparent from reading the description of the present specification with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE FIGURES

Fig. 1 shows an example of a network configuration including an inspection condition data management system. Fig. 2 shows an example of inspection condition data.

Fig. 3 shows an example of a structure that shows the classification information of the types manufactured at a semiconductor manufacturing plant.

Fig. 4 is a diagram showing an example of type list data that hierarchically manages types manufactured at semiconductor manufacturing plants.

Figure 5 shows an example of product list data that manages the inspection process.

FIG. 6 is a diagram of an example of a type-specific inspection process file describing an inspection process for each type, FIG. 7 is a diagram illustrating an example of type information data describing type classification information,

FIG. 8 is a flowchart showing an example of a procedure for creating inspection condition data in the present embodiment, FIG. 9 is an example of a procedure showing details of step 2 in FIG.

FIG. 10 is an example of a procedure showing details of step 15 in FIG. 9,

Figure 11 is an example of a procedure detailing step 27 in Figure 9,

FIG. 12 is a diagram showing an example of GUI in the present embodiment,

FIG. 13 is a diagram showing an example of a procedure for registering a new inspection type,

FIG. 14 is a diagram showing an example of a procedure for registering an inspection process,

FIG. 15 shows another example of GUI in the present embodiment,

FIG. 16 is an example of a reuse priority table showing the priority of reusing inspection condition data. The main symbols used in the drawings are summarized below.

1 Newly created inspection condition data product name process name input step

2 Steps for selecting a product type for reusing inspection condition data

3 Step to confirm the presence of the type selected in Step 2

4 Step for reading reuse inspection condition data

5 Inspection condition data creation step

6 Step of outputting inspection condition data to inspection equipment

1 1 Type list reading step

1 2 Step of substituting the product number of the product type into variable X

1 3 Inspection process list reading step

1 4 Step of substituting the process number of the corresponding process into variable Y

1 5 Step of substituting the number of varieties that meet the condition into variable J

1 6 Conditional branch step by variable J

(1) Substituting the number of varieties that meet the conditions into variable J

1 8 Conditional branch step by variable J

1 9 Step of substituting the number of varieties in condition into variable J

2 0 Conditional branch by variable J

2 1 Step of substituting the number of varieties that meet the conditions into variable J

2 2 Conditional branch by variable J

2 3 to 26 Step of outputting the model number of the model that meets the conditions, Step of substituting the model number of the reuse inspection condition for variable Z

3 1 Step for reading the file with the same detection condition applicable model in the relevant inspection process

3 2 Step of assigning product number to variable R X

3 3 Step of assigning the product number to the variable RY

3 4 Conditional branch by comparing variables X and Y

3 5 Message output step 41 Process Flow Tag Search Step

42 Step of assigning model number to variable PS

43 Step of substituting product number for variable PE

44 Step of substituting P S for variable I

45 Type-specific inspection process file reading step

46 Steps for Determining Inspection Condition Data Status

47 Step of assigning model number to array P (J)

Step to add 1 to 48 variables]

49 Step to close the inspection process file for each type

50 Step to add 1 to variable I

51 Conditional branch by variable I

6 1 Step of substituting the number of product types for variable N

62 Conditional branch by variable N

63 Step of substituting the type number into variable N

'64 Conditional branch at variable N

65 Step to output model number

66 to 68 Steps to output the selected product number

01 Inspection condition server 102 Terminal

03 Inspection equipment 104 Network

05 Network interface 106 Control unit

07 Operation unit 108 User interface

09 Storage 1 10 Secondary storage

1 5 Network interface 1 16 Control unit

17 Operation unit 1 18 User interface

19 Main storage device 120 Secondary storage device

21 Inspection condition data 122 Product list data 1 2 3 Inspection process list data 1 2 5 Inspection process data by product type

1 2 3 Type information data 2 0 0 GU I of this system

2 0 1 Model name description field 2 0 2 Process flow name description field

2 0 3 Family name description field 2 0 4 Node name description field

2 0 5 Inspection process name description field 2 0 6 Inspection condition data status display field

2 1 6 Selection area 2 1 7 Same detection condition setting button 2 1 8 Inspection condition data creation button 2 2 1 Inspection device name display field

2 2 4 Inspection button 2 2 5 Non-inspection button

2 3 1 New type line 2 3 2 New type column

2 3 3 New type process flow column 2 3 5 New type node column

2 4 1 New additional inspection process column 2 5 0 Mouse

For a more complete understanding of the present invention and its advantages, refer to the following description in conjunction with the accompanying drawings. BEST MODE FOR CARRYING OUT THE INVENTION

At least the following matters will be made clear by the description in the present specification and the description of the accompanying drawings.

In the inspection condition data management method, a step of generating matrix data in which the searched similar type and the recognized inspection process are set as a vertical axis and a horizontal axis, and the axis intersection is associated with attribute information of the inspection condition data; And a step of receiving a selection of similar varieties for each inspection process in the user interface. According to this, the user can easily recognize the relationship between the similar product and the inspection process and perform various designation operations.

Further, in the matrix data of the inspection condition data management method, the vertical axis or the horizontal axis can be formed by listing similar products according to their similarities. This According to this, it becomes easier for the user to recognize the relationship between the similar product and the inspection process and to perform various designation operations.

Further, in the inspection condition data management method, the table in which the similarity between types is determined is in a data format in which each type is described as a tree structure in which each type is classified into attributes. The method may include the steps of: determining a similarity for each hierarchy or node of the received varieties, and selecting similar varieties according to the result of the determination. According to this, the editing and management of the inspection condition data can be easily and reliably performed, and the selection processing of similar types can be easily performed.

In the inspection condition data management method, the hierarchy of the tree structure may be determined from at least one of a node representing a minimum dimension of a circuit pattern, a family name representing a use of the circuit pattern, and a process flow name representing a manufacturing procedure. It is possible to determine the similarity by setting priorities among the elements. According to this, it is possible to create the inspection condition data according to the characteristics of the wafer with the circuit pattern.

Further, in the inspection condition data management method, the inspection condition data in the storage unit includes an intensity of an electromagnetic wave or an electron beam applied to a wafer with a circuit pattern, and the inspection condition data of the type received from the input unit. The information to be configured may include information on the intensity of the electromagnetic wave or the electron beam. According to this, the inspection condition data can include the intensity of an electromagnetic wave or an electron beam applied to a wafer with a circuit pattern.

In the inspection condition data management method, the inspection condition data in the storage unit may include a defect determination threshold based on the intensity of an electromagnetic wave or an electron beam scattered or reflected by a wafer with a circuit pattern. The information constituting the inspection condition data of the kind received from the department may include information on the intensity of the electromagnetic wave or the electron beam. According to this, as inspection condition data, a wafer with a circuit pattern is scattered or reflected by an electromagnetic wave or an electron beam. And a defect determination threshold based on the intensity of the defect.

Further, there is provided a system for creating inspection condition data of an inspection device for detecting a foreign substance or a pattern defect included in a wafer with a circuit pattern, wherein a part for inputting a type name from an input unit is provided, and a type name received from the input unit. And a table that determines the degree of similarity between the varieties, and searches for a similar varieties of the varieties in a storage unit that stores the inspection condition data. A part to be recognized in the storage part; a part to edit and output a similar kind according to the number of inspection processes from the searched similar kind group; and a part to receive a similar kind selection for each inspection process from the input part; The inspection condition data relating to the inspection process of the similar type for which the selection of the selection has been accepted is extracted from the storage unit, and based on the inspection condition data, A portion constituting the inspection condition data only with varieties, can the be made to the inspection condition data management system including a. According to this, it is possible to provide a system for realizing the inspection condition data management method of the present invention.

A program for causing a computer to execute a method of creating inspection condition data of an inspection device that detects a foreign substance or a pattern defect included in a wafer with a circuit pattern, the method including: receiving an input of a type name from an input unit; Comparing the type name received from the input unit with a table defining similarity between types, and searching for a similar type of the type in a storage unit for storing inspection condition data; A step of recognizing the inspection process in which the condition data exists in the storage unit; and editing and outputting a similar product according to the number of inspection processes from the retrieved similar product group, and inputting a similar product selection for each inspection process. And the inspection condition data relating to the inspection process of the similar type that has been selected for each inspection process. Extracted from parts, can and be made inspection conditions de one data management program including the steps of constituting the inspection condition data of said input unit was Installing received from varieties on the basis of the test condition data. According to this, it is possible to provide a program for causing a computer to execute the inspection condition data management method of the present invention. Further, a computer-readable recording medium on which the inspection condition data management program is recorded can be provided. According to this, it is possible to provide a recording medium containing the inspection condition data management program.

An inspection apparatus for detecting a foreign substance or a pattern defect included in a wafer with a circuit pattern, a detection unit for detecting a foreign substance or a pattern defect, a data acquisition unit for acquiring inspection condition data from the inspection condition management system, An inspection apparatus having a storage unit for storing inspection condition data, a control unit for controlling the inspection unit in accordance with the inspection condition data, and an output unit for outputting an inspection result can be provided. According to this, it is possible to provide an inspection apparatus that performs an inspection using the inspection condition data formed by the inspection condition data management method of the present invention.

In general, semiconductor integrated circuits are classified into product families such as DRAM, SRAM, and microcomputer according to their applications. In semiconductor integrated circuits, due to technological advances, the ratio of the width of the wire divided by the distance between the wires becomes narrower for each generation. These generations are classified into 0.35 micrometer nodes and 0.25 micrometer nodes according to the minimum line and space pitch. Also, a flowchart showing the manufacturing procedure is called a process flow. Semiconductor integrated circuits can be classified according to the applied process flow.

If the inspection process is the same, it is considered that the defect detection condition data is similar even if the product type is different, and as a result of analyzing the similarity of the defect detection condition data between the product types, it was found that the product family and Comparison of the detection condition data shows that the difference is small. In particular, the values are extremely close between varieties to which the same process flow is applied. On the other hand, when comparing products with different product families, the difference is large. Similarly, the difference is also large between products with different nodes.

Based on the results of these analyses, it is possible to define similar types of defect detection condition data based on a hierarchical structure that is hierarchically classified according to nodes, product families, process flows, and so on. Therefore, in the present invention, the same inspection of existing varieties is performed based on this tree structure. New defect detection condition data shall be created by reusing process defect detection condition data. On the other hand, the number of existing products is enormous in system LSIs of high-mix low-volume production, and searching for defect detection condition data to be reused according to a tree structure is a very complicated task. Therefore, we propose an inspection condition data management system that can perform this work efficiently.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows an example of a network configuration including a detection condition data management system. In this network configuration, an inspection condition server 101 for storing existing inspection condition data and an inspection condition server 101 connected to the inspection condition server 101 via the network 104 to create inspection condition data. A terminal 102 and a defect inspection device 103 (hereinafter, inspection device 103) are included.

The inspection condition server 101 is connected to a network 104 such as an interface or a LAN via a network interface 105 that exhibits a data communication function or the like. The detection condition server 101 includes a control unit 106, a calculation unit 107, a user interface 108, a main storage device 109, and a secondary storage device 110 (storage unit). I have. The user interface 108 here not only exhibits an appropriate output function, but also functions as an input unit for receiving various inputs and instructions from the user. In addition, the inspection condition data management system may include the inspection condition server 101, the terminal 102, and the defect inspection device 103, or any one of the devices may have the inspection condition data management system. The functions of the system may be integrated.

Among them, the secondary storage device 110 stores the inspection condition data 121, the type list data 122, the inspection process list data 123, and the type-specific inspection process data 125. Is done. The data stored in the secondary storage device 110 can be used as a table that determines the similarity between types. Inspection condition data 1 2 1 exists as many as the number of inspection processes for each product type. Type list data 1 2 2 and inspection process list data 1 23 exist as many as the number of inspection apparatuses 103 included in the network. Inspection process data 1 25 for each type exists for each type of inspection equipment.

On the other hand, the terminal 102 is connected to the network 104 via the network interface 115. The terminal 102 includes a control unit 116, a calculation unit 117, a user interface 118, a main storage unit 119, and a secondary storage unit 120.

FIG. 2 shows an example of the inspection condition data 122. In this example, an example in which data is described in an XML format (ExtenesiveMarkupLanguage) will be described. Therefore, the content of the data description between the tags is taken as a data structure. For example, between the "prodact-datat" tag and the "/ prodct-datat" tag, describe the type name and inspection process name to which the inspection condition data applies, and the type number and inspection process number. Defect detection condition data is described between the tag "detectiVe-parameter" and the tag "Zdetectivi e-aramete r".

The defect detection condition data includes the angle of incidence of the laser beam irradiating the wafer, the laser power, the defect judgment threshold of the scattered light intensity for defect judgment, the defect judgment threshold of peripheral chips, and the interval of the spatial filter Describe. The angle of incidence of the laser is expressed in degrees. The laser power is described as a percentage of the maximum output of the laser. The defect judgment threshold describes the ratio to the detection limit of the detector in percentage. The peripheral chip defect judgment threshold describes the ratio to the detection limit of the detector in percentage display. Spatial filter spacing is described in nm. In the data example of FIG. 2, the laser power is 30%, and the defect determination threshold is 50%.

In addition, array information is described between the "array-data" tag and the array-data "tag. The number of chips and the chip size are described as the array information. In the example of FIG. Eight in the X and Y directions. The chip size is "200000000 nm" in the X and Y directions. Describe the alignment information between the alig nment one data tag and the / alig nment one data tag. The alignment information describes the two chips used for the alignment and the reference image number used for the alignment. In the example of Fig. 2, the alignment chips are the first third chip from the bottom, counting from the left, and the tenth third chip from the bottom, counting from the left. The reference image number used for this alignment is "001".

Describe the non-inspection area between the "inhibit one area" tag and the "Zinh ibit one area tag. The non-inspection area is defined as a rectangle, and the coordinates of the lower left and upper right corners of the rectangle are described in nm. In the non-inspection area in the example of Fig. 2, two vertices are squares of coordinates of "(0, 0)" and "(20000, 200000 00)" based on the lower left of the chip.

On the other hand, the kind list data 122 is constructed as a tree structure shown in FIG. Figure 3 is an example of a tree structure showing the classification information of the types manufactured at the semiconductor manufacturing plant. Fig. 3 shows an example in which nodes are classified by node, such as 0.13 micrometer and 0.25 micrometer. Furthermore, the 0.13 micrometer node is classified into families such as DRAM, SRAM, and LOGIC. In the hierarchy below the family, the process flow and its lower-level products are further divided. For example, if the process flow is D1, it corresponds to the product types DO 01 and DO 02 of the 0.13 micrometer node DRAM product. In this way, the hierarchy of the tree structure is composed of at least one of the node representing the minimum dimension of the circuit pattern, the family name representing the use of the circuit pattern, and the process flow name representing the manufacturing procedure. Then, the similarity determination is performed.

FIG. 4 is an example of the kind list data 122 representing the tree structure shown in FIG. 3 in the XML format. The kind list data 122 exists for the number of the inspection apparatuses 103 managed by the inspection condition server 101. Inspection equipment that applies created inspection condition data The device 103 is described in the product list data 122 and is distinguished from other inspection devices. In the present embodiment, when selecting similar inspection condition data to be used from the existing inspection condition data stored in the secondary storage device 110 of the inspection condition server 103, the type list data is used. Use the node, family, and process classifications described in 122.

In the attribute of the "productss-listat" tag of the kind list data 122, describe the name of the inspection apparatus 103 to which this file is applied. Here, “inspectione1” is the name of the inspection apparatus 103. The varieties described between the "node" tag and the "/ node" tag are varieties belonging to the node described in the attribute of the "node" tag. The varieties described between the "fam i1y" tag and the "Zfam i1y" tag are the varieties belonging to one of the product families described in the attribute of the fami1y tag. The varieties described between the process-flow tag and the / process-i1ow tag are varieties manufactured by the process flow described in the attribute of the processs-ί1ow tag.

The product name is described between the "prodact" tag and the "Zprodct" tag. The product number is described in the pro du ct tag. This variety number is given for each variety. For example, in FIG. 4, "DO 0 1" is a DRAM of 0.13 micrometer node, and is a type manufactured by the process flow "D 1". The type number of the type "D00 1" is "1".

Fig. 5 shows an example of inspection process list data 123. In the inspection process list data 123, a process number that uniquely identifies the same inspection process irrespective of the product type is set in the inspection process and checked. For example, describe the name of the inspection device 103 that applies this file to the “inspection1 steps1list” tag. In this example, “inspection1” is the name of the inspection device 103. “stepdata” tag And the "/ steps-data" tag, describe the inspection process name of the type to be inspected by the inspection device 103. Also, between the "STEP" tag and the "/ STEP" tag Describe the inspection process name. For example, {Locus S i 3 N 4} is an inspection process name. The process number is described in the attribute of the STEP tag.

Fig. 6 shows an example of the type-specific inspection process data 125. The type-specific inspection process data 125 is present for each type and describes the inspection process of the target type. In the inspection process data 125 for each type, for example, the inspection process of the type is described between a “steps” tag and a “/ steps” tag. In the attribute of the steps tag, the process number and the state of the inspection condition data are displayed. This process number is the same as the process number described in the inspection process list data 123. "State" indicates the state of the inspection condition data. For example, state = {3} means inspection condition data that has been used, while state = {2} means inspection condition data that has not been used. Also, “stat _e = 〃 l” means that there is no inspection condition data.

FIG. 7 shows type information data 126 describing type classification information for each type. In FIG. 7, the name of the inspection device 103 is described in the attribute of the “i 1 spe c ct i o n_ c o n d i t i o n” attribute. Here, the inspection device name is "inspection! '. The product name is described in the" product "tag. The product name is" D 004 ". The product type is" D "in the" node "tag. Describe the node of "004". Describe the family name of "D004" in the "fami 1 y" tag. Describe the name of the process flow that produced "DO 04" in the "proces s_f 1 ow" tag. The type information data 126 may be stored in the secondary storage device 110 of the inspection condition server 101 and used for selecting a type when reusing the existing inspection condition data. The data 126 and the type-specific inspection process data 125 may be described in the same file.

FIG. 8 is a flowchart showing an example of a procedure for creating inspection condition data in the present embodiment. Hereinafter, the actual procedure of the inspection condition data management method of the present embodiment will be described. The newly created inspection condition data is assumed to be inspection condition data 1 2 1a. Also reuse The inspection condition data is assumed to be inspection condition data 1 2 1b.

First, the user interface 111 of the terminal 102 as an input unit (or the user interface of the inspection condition server 101) is used. The inspection condition data that the user wants to newly create 1 2 1 Accept the input of the type name (and inspection process name) of a (step 1). The terminal 102 issues a reference request for the type list data 122 to the inspection condition server 101 in accordance with the received type name and the like. Then, a search process is performed based on the node name, the family name, and the process flow name (Step 2), and the type of the inspection condition data to be reused is selected.

If there is no selected type, the process is terminated (step 3). If there is a selected type, the inspection condition data 1 2 1b to be reused is stored in the secondary storage of the inspection condition server 101. Read from device 110 (step 4). Then, based on the read inspection condition data 121b, the inspection condition data 122a for the type / inspection process to be newly inspected is created (step 5). The created inspection condition data 121a is output to the inspection device 103 via the network 104 (step 6). The inspection device 103 executes the inspection process using the inspection condition data 122a. The above is an outline of an example of a procedure for creating new inspection condition data.

In addition, the process of each step described above may be performed by the terminal 102 obtained from the inspection condition server 101 as appropriate, as described above, or may be performed entirely by the inspection condition server 101. Good. Hereinafter, in the present embodiment, description will be made assuming a situation in which the terminal 104 acquires existing inspection condition data from the inspection condition server 101 and performs appropriate processing.

Next, a detailed description of each of the main steps described above will be given below. FIG. 9 is an example of a procedure illustrating details of step 2 in FIG. The terminal 104 reads the type list data 122 from the secondary storage device 110 of the inspection condition server 101 (Step 11) _{D The} target type described in the read type list data 122 Inspection condition data creation target: In this case, the type number of the type) The data is read and assigned to, for example, a variable X determined in the main storage device 119 (step 12).

Next, the inspection process list data 123 is similarly read from the secondary storage device 110 (step 13). The process number of the target inspection process described in the read inspection process list data 123 (the inspection condition data creation target: the process accepted from the input unit in this case) is read, and it is determined, for example, in the main storage device 119. The variable y is substituted and stored (step 14).

The number of varieties already inspected in the relevant inspection process recognized in steps 11 to 14 above is substituted for the variable j in the same manner as described above (step 15). Here, “already inspected” means that there is a track record of performing an inspection using the inspection condition data of the relevant product / applicable inspection process. For example, in the inspection process data 125 for each product type shown in FIG. 6, STATE = 3 in the “Cont W Depo” step, and there is an inspection record. Therefore, in the “Cont W Deo” process, the variety “D004” can be recognized as a tested variety. Step 15 will be described later in detail with reference to FIG.

If it is determined that the variable j is: i> 0 (step 16), the type number of the inspected type is output to the user interface 118. Alternatively, it is stored in an appropriate storage unit such as the main storage device 119 or the secondary storage device 120 (step 23). At the time of this output, for example, a plurality of inspected varieties (type numbers) are enumerated and displayed according to the amount of the inspection process data, and are presented to the user. Of course, such a display form is similarly performed in the following processing. On the other hand, if it is determined that j = 0, the number of the same node and the same family already inspected in the corresponding inspection process is substituted for the variable j in the same manner as described above (step 17).

If it is determined that the variable j I j> 0 here (step 18), the type number of the inspected type is output to the user interface 118. Alternatively, the information is stored in an appropriate storage unit such as the main storage device 119 or the secondary storage device 120 (step 24). On the other hand, if it is determined that〗 = 0, the number of the same node types already inspected in the relevant inspection process Is assigned to the variable j in the same manner as above (step 19).

If it is determined that the variable j force and j> 0 (step 20), the type number of the inspected type is output to the user interface 118. Alternatively, it is stored in an appropriate storage unit such as the main storage device 119 or the secondary storage device 120 (step 25). On the other hand, if it is determined that j = 0, the number of varieties already inspected in the relevant inspection process is substituted for the variable j in the same manner as described above (step 21).

If it is determined that the variable j power ;, j> 0 (step 22), the type number of the inspected type is output to the user interface 118. Alternatively, it is stored in an appropriate storage unit such as the main storage device 119 or the secondary storage device 120 (step 26). On the other hand, if it is determined that j = 0, control is returned to the process of step 3 in the flow of FIG.

The terminal 104 substitutes, for the variable z, the one selected by the user from the product number output in the above steps 23 to 26, for example, the type having the largest number of inspection steps provided by the product (step 27). . Alternatively, the terminal 104 may perform the process of selecting the one having the largest number of inspection steps by the user. The details of the process in step 27 will be described later with reference to FIG. Upon completion of the process of step 27, the control returns to the process of step 3 in the flow of FIG.

FIG. 10 is a diagram showing the details of step 15 in FIG. In this step, the terminal 104 first searches for the “process-f 1 ow” tag immediately before the corresponding type from the “process-f 1 o” tags described in the type list data 122 (step 4). 1) Subsequently, the type number of the “p r 0 d u ct” tag described immediately after the searched tag is substituted into a variable p s (step 42).

Next, the type number of the “product” tag immediately before the “no process—flow” tag paired with the tag searched in step 41 is substituted for the variable pe (step 43), and the variable ps Is assigned to a variable i (step 44). Further, the type-specific inspection process data 125 of the type number = i is called (step 45). Here, if it is determined that the state of the inspection process with the process number = y is 3〃 (Step 46), the process of substituting the variable i into the array p (j) is performed (Step 47), and the variable j Is substituted for j + 1 (step 48).

On the other hand, if the state I ≠ 3 ”is defined in step 46 as semi-IJ, the type-specific inspection process data of type number = i is closed (step 49), and 1 is added to i (step 50). If it is determined that i is greater than the variable pe (step 51), the process returns to step 6 in the flow of Fig. 9. On the other hand, if it is determined that the variable i is equal to or less than the variable pe, the process returns to step 45 described above. .

Note that the processing in steps 15, 17, 19, and 21 in FIG. 9 has almost the same contents. For example, in the procedure in the flow of FIG. 10, if the “process-flow ク frfamlily” tag and the / processsflow tag are described in the “/ fami1y” tag, the processing in step 17 is performed. Further, in the procedure in the flow of FIG. 10, if the “process—f1ow” tag is changed to “nodede” and the “/ processs−f” ow ”tag is changed to the node tag, the processing in step 19 is performed. Also, in the Tegawakai in the flow of FIG. 10, if the “procss-flow” tag is changed to the “procsts-flow” tag and the “process-sfl-ow” tag is changed to the “procusts” tag, the processing in step 21 is performed.

FIG. 11 is a diagram showing the details of the processing of step 27 in the flow of FIG. The terminal 104 here substitutes the number of the model numbers output in steps 23 to 26 in the flow of FIG. 9 into a variable n (step 61). If the variable n is determined to be _n = i (step 62), the corresponding product number is output to the user interface 118 (step 67). Also, it is stored in an appropriate storage unit such as the main storage device 119 and the secondary storage device 120.

On the other hand, if it is determined that the variable n force η> 1, enumerate according to the number of inspection processes. Output to the user interface. Alternatively, the number of the product type number closest to the product type number in the corresponding inspection process is substituted for the variable n (step 63). Subsequently, if the variable n is determined to be n = l here (step 64), the closest kind number is output to the user interface as in the above (step 68). On the other hand, if the variable n is determined to be n> 1, the two closest product numbers are output to the user interface or the like as described above (step 65). In addition, the smallest product number is output (step 66), and the process returns to step 3 in the flow of FIG.

FIG. 12 is an example of GU I (GraphicacalUserIlnterfacce) in the present embodiment. This GUI uses the vertical and horizontal axes of similar products of the product type for which the inspection condition data is to be created and their inspection processes. The intersection of the axes indicates the attribute information of the inspection condition data. Etc.) in the form of matrix data. Hereinafter, the method of creating the product list data 122, the inspection process list data 123, and the product-specific inspection process data 125 will be described with reference to FIGS. In the type name description column 201 in FIG. 12, the type name of the semiconductor integrated circuit is shown in 201, the process flow name is written in the process flow name description column 202, and the family name of the semiconductor integrated circuit is written in the family name description column 203. The node name description field 204 displays the node of each type, and the inspection process name description field 205 displays the process name.

The inspection condition data status display column 206 displays the status of the inspection condition data of the corresponding product type and process, and one cell corresponds to one product type and one process. The same detection condition applicable type button 217 is used by the user to define a type to which the same detection condition is applied. The inspection condition data creation button 2 18 is used by the user to create inspection condition data. In this figure, for example, a double circle “◎” in the inspection condition data state display column 206 indicates that “the inspection condition data has been created and has a track record applied to the inspection”. A circle “〇” indicates that “inspection condition data exists but has not been applied to the inspection”. The dot "·" display indicates that "the inspection condition data for the applicable product and applicable process does not exist". Not display This state indicates that "the applicable inspection process is not the subject of inspection for the applicable product type".

The inspection device name of the inspection device 103 is displayed in the inspection device name display column 221. The type addition button 222 is used by the user to add a new type to the type name description field 201. The inspection process addition button 223 is used by the user to add a new inspection process to the inspection process display column 205. The inspection target button 224 is used when the user changes a non-inspection target to an inspection target. The non-inspection target button 225 is used when the user changes the inspection target to a non-inspection target.

Figure 13 shows an example of a method for adding a new variety. GU I 200a, GU 1 200b, and GU I 200c in FIG. 13 are a part of the GU I 200 shown in FIG. FIGS. 13a, 13b, and 13c show the transition of the GUI 200, respectively. For example, the user drags the breed addition line 231 of GU1 200a in FIG. Subsequently, the type addition button 222 shown in FIG.

Then, the terminal 104 receives these selection events and the like, and as shown in FIG. 13b, a new type column 232, a new type process flow column 233, a new type product family column 234, a new type Generates and displays GU I 200 b with the addition of the type node column 235.

The user clicks the new type column 232 here with the mouse 250, and then inputs, for example, "L007" from the keyboard. In addition, after clicking on the new type process flow column 233 with the mouse 250, input "L2" from the keyboard. Further, after clicking on the new type product family column 233 with a mouse, "LOG IC" is input from the keyboard. Then, after clicking on the new type node column 234 with the mouse 250, "0.13" is input from the keyboard. Then, the terminal 104 receiving these events generates and displays a GU 1200c in which a new type is added and the configuration is changed as shown in FIG. 13C. The same procedure is used for adding the inspection process. Performed by

As mentioned above, when a new product type is added, the inspection process for that product type has not been registered. Next, referring to FIG. 14, an example of a method of registering the “LocusSIN” process of the product type “L07” in the inspection process will be described. GUI200d and GUI200e in FIG. 14 are a part of GUI200 in FIG. In FIG. 14a, the new additional inspection process column 2 41 is blank. For example, the user selects a new additional inspection process column 2 41 with the mouse 250 and clicks the inspection target button 2 2 4 in FIG. 12 with the mouse 250. Then, the terminal 104 receiving this changes the new additional inspection process column 241 to a dot display as shown in GUI 200e in FIG. 14b. When the user clicks the list save button with the mouse 250 here, the terminal 104 generates the type list data 1221, the inspection process list data, and the type-specific inspection process file.

Here, other embodiments will be described. FIG. 15 shows another example of GUI in the present embodiment. FIG. 16 is an example of a reuse priority table showing priorities for reusing the detection condition data. In this embodiment, if a plurality of similar products are selected, they are displayed in the matrix data in descending order of similarity, and a situation in which the user instructs which similar product type to use for each inspection process. Assumed.

First, the screen configuration of the GUI 300 in FIG. 15 will be described. The product type registration field 3 1 0 is the product type registration field 3 1 1, the node registration 檷 3 1 2, the family name registration field 3 1 3, the process flow name registration field 3 1 4, and the product type registration button 3 1 5 It consists of. Further, the similar kind display field 320 is constituted by a process number threshold value section 321 and a similar kind display button 322. The number-of-steps threshold field 3 2 1 takes the form of a pull-down menu for selecting, for example, a number from 1 to 20 (that is, the threshold of the number of steps). In the Inspection Process Addition column 330, there is an Inspection Process Add button 3 3 1, Inspection Process Up button 3 3 2, Inspection Process Down button 3 3 3, Inspection Process Erase button 3 3 4, Inspection Process It consists of a confirm button 3 3 5 and a list save button. Inspection condition selection area 340 includes inspection process name display area 341, similar type name display area 342, similar type process flow name display area 344, similar type family name display area 345, similar It consists of a type node name display area 346 and an inspection condition data display area 347. Further, the GUI 300 is provided with an inspection condition data creation button 370 for instructing the creation of inspection condition data.

Next, a procedure for creating inspection condition data using the GU1300 will be described. The user describes the product name in the product name registration field 311, the node in the node registration field 312, and the process flow name in the process flow registration field 313. Next, select the threshold value of the number of inspection steps from the pull-down menu of the threshold value column of the number of steps column 330. The inspection process number threshold is a threshold value for limiting the types displayed in the similar type name display area 3422. Therefore, the terminal 104 performs display processing only on the type exceeding the number of inspection steps, among the types searched from the received type name, node, and process flow name.

Next, when the user presses the similar kind display button 3 2 2, the terminal 104 receiving the button displays a similar kind name in the similar kind display area 3422 in accordance with the degree of similarity. The similarity here is as shown in the reuse priority table 360 of FIG. This means that the hierarchy of the above-mentioned tree structure is composed of nodes representing the minimum dimensions of the circuit pattern, family names representing the uses of the circuit pattern, and process flow names representing the manufacturing procedure, and priorities are defined among the elements. This is the basis for performing the similarity determination. At this time, only the types having more inspection steps than the threshold value specified in the step number threshold value column 3 2 1 are displayed. In the inspection process display area 341, the logical sum of the inspection processes of the selected similar products is displayed. In the inspection condition data display area, when the inspection condition data of the applicable product / inspection process exists, a double circle "◎" is displayed as in the above embodiment. 3 4 8 Force Blank if there is no inspection condition data 3 4 9 is displayed. The selected inspection condition column 360 is shaded. In each inspection process, the cell of the type with the highest similarity for which the inspection condition data exists Shaded display 3 4 9 indicates that it is reuse inspection condition data.

Next, the user specifies the inspection process for the inspection type (in this case, “L004”). For the inspection process displayed in the inspection process display area 340, which is not the “L004” inspection process, the user clicks the inspection process name with the mouse 360 to select it, and then performs the inspection. Click the process deletion button 3 4 0 to delete.

To add a new inspection process, the user clicks the add inspection process button 335 with the mouse 360. In addition, the inspection process is moved by the inspection process up button 3 32 or the inspection process down button 3 33, and the position is confirmed by the inspection process confirmation button 3 3 5. When the position is determined, the name of the inspection process displayed in the inspection process display area 341 is stored in the type-specific inspection process data 125 of “L004” by the list save button.

Subsequently, the user selects the inspection condition data to be reused for each inspection process. The user can select the inspection condition data to be reused for each inspection process by moving the hatched display 349 with the mouse 360 horizontally on the GUI 300. The user clicks the inspection condition data creation button 370 to create inspection condition data 1 2 1.

As described above, in the inspection condition data management method of the present invention, new inspection condition data is created by reusing the defect detection conditions of the existing inspection condition data stored in the inspection condition server. By using existing conditions, it is possible to set optimal defect detection conditions without manual adjustment. In this example, a search for similar varieties was performed using the breed list data 122, which contains information for classifying varieties. The search method for similar varieties is not limited to this example. In addition, an example has been described in which the user accepts various instructions and selections on the GUI and proceeds with the inspection condition data management method.However, the same instructions and selections are algorithmized regardless of the user's instructions and selections. Needless to say, the process of creating the inspection condition data may be completed only by the terminal 104 or the inspection condition server 101. In the present embodiment, only one terminal 102 and one inspection device 103 are shown. There may be a plurality of terminals 102 and inspection devices 103. In addition, although the inspection condition server 101 and the terminal 102 are shown as separate hardware, both may be configured by one piece of hardware. Of course, similarly, the terminal 102 may be configured as a unit with the inspection device 103.

Nodes, families, and process flows were used as the tree structure hierarchy indicating the information for classifying the varieties. However, the hierarchy of the tree structure is not limited to these, and any element that can classify the varieties is used. It may be.

In addition, the inspection condition data 121, the type list data 122, the inspection process list data 123, and the type-specific inspection process data 125 are provided in separate storage devices, and are provided as independent databases. It may function, may be combined as appropriate through a network, or may be provided collectively in one storage device.

In addition, the device including the inspection condition server 101 and the terminal 104 includes not only a server computer but also an arithmetic function and an input / output function capable of realizing processing to be performed in the inspection condition data management method of the present invention. Any device can be used as long as it is available. Furthermore, regarding the network connecting the inspection condition server 101, terminal 104, defect inspection device 103, etc., in addition to the Internet and LAN, WAN (Wide Area Network), dedicated line, power line network, Various networks such as wireless networks can be adopted. Also, if virtual dedicated network technology such as VPN is used, communication with improved security is established on the Internet, which is preferable. Industrial potential

According to the embodiment of the present invention described above, optimal inspection condition data is extracted from existing existing inspection condition data, and inspection condition data is created based thereon. Thus, new inspection condition data can be created with no or few trial inspections. Therefore, it is possible to shorten the time for creating the inspection condition data, increase the operation time of the inspection apparatus, and improve the inspection frequency.

While the preferred embodiments of the invention have been described in detail, various changes, substitutions, and alterations therein may be made without departing from the spirit and scope of the invention as defined by the appended claims. It should be understood.

Claims

The scope of the claims

1. A method for creating, by a computer, inspection condition data of an inspection apparatus for detecting a foreign substance or a pattern defect of a wafer with a circuit pattern,

A step in which the computer receives an input of the type name from the input unit; and a step in which the type name received from the input unit is compared with a table in which the similarity between the types is determined. Steps to search for similar varieties,

A step of recognizing and recognizing in the storage unit an inspection step in which inspection condition data exists for the similar type,

Editing and outputting a similar type from the searched similar type group according to the number of inspection processes, and receiving a similar type selection for each inspection process from an input unit;

Extracting, from the storage unit, the inspection condition data relating to the inspection process of the similar type that has been selected for each inspection process, and configuring the inspection condition data of the type received from the input unit based on the inspection condition data; ,

including.

2. a step of generating matrix data in which the searched similar type and the recognized inspection process are set as the vertical and horizontal axes, and the axis intersections are associated with the attribute information of the inspection condition data;

A step of outputting the matrix data to a user interface; a step of receiving a similar kind selection for each inspection process in the user interface;

The inspection condition data management method according to claim 1, comprising:

3. In the matrix data, list similar varieties according to their similarity. 3. The inspection condition data management method according to claim 2, wherein a vertical axis or a horizontal axis is formed by and.

4. There is no data format that describes the table that defines the similarity between varieties as a file structure that classifies each type of attribute.

In the step of searching for similar varieties,

Determining a similarity for each layer or each node of the rill structure for the variety received from the input unit;

Selecting a similar variety according to the result of the determination;

5. The hierarchy of the tree structure is composed of at least one of the node representing the minimum dimension of the circuit pattern, the family name representing the use of the circuit pattern, and the process flow name representing the manufacturing procedure, and between each element. The inspection condition data management method according to claim 4, wherein similarity determination is performed by setting a priority order.

6. The inspection condition data in the storage unit includes the intensity of an electromagnetic wave or an electron beam applied to a wafer with a circuit pattern,

2. The inspection condition data management method according to claim 1, wherein the information constituting the inspection condition data of the type received from the input unit includes information on the intensity of the electromagnetic wave or the electron beam.

7. The inspection condition data in the storage unit includes a defect determination threshold based on the intensity of electromagnetic waves or electron beams scattered or reflected by the wafer with a circuit pattern,

The inspection condition data according to claim 1, wherein the information constituting the inspection condition data of the type received from the input unit includes information on the intensity of the electromagnetic wave or the electron beam. Management method.

8. A system for creating inspection condition data of an inspection device for detecting foreign matter or pattern defects of a wafer with a circuit pattern,

A part for accepting the input of the type name from the input part,

A part for comparing the type name received from the input unit with a table defining similarity between types, and searching for a similar type of the type in a storage unit for storing inspection condition data;

A part for recognizing, in the storage part, an inspection step in which inspection condition data exists for the similar kind,

A part that edits and outputs a similar type from the searched similar type group according to the number of inspection processes, and receives a similar type selection for each inspection process from an input unit;

A part for extracting inspection condition data relating to the inspection process of a similar type that has been selected for each inspection process from the storage unit, and configuring the inspection condition data of the type received from the input unit based on the inspection condition data. ,

including.

9. A program for causing a computer to execute a method of creating inspection condition data of an inspection device that detects a foreign substance or a pattern defect of a wafer with a circuit pattern,

A step of receiving an input of a type name from the input unit;

A step of collating the type name received from the input unit with a table defining similarity between types, and searching for a similar type of the type in a storage unit for storing inspection condition data;

Recognizing, in the storage unit, an inspection step in which inspection condition data exists for the similar type, Editing and outputting a similar type from the searched similar type group according to the number of inspection processes, and receiving a similar type selection for each inspection process from an input unit;

Extracting, from the storage unit, inspection condition data relating to the inspection process of a similar type, which has been selected for each inspection process, and configuring the inspection condition data of the type received from the input unit based on the inspection condition data When,

including.

10. A computer-readable recording medium recording the inspection condition data management program according to claim 9.

1 1. An inspection device for detecting foreign matter or pattern defects of a wafer with a circuit pattern,

A detector for detecting a foreign substance or a pattern defect;

A data acquisition unit that acquires inspection condition data from the inspection condition management system; a storage unit that stores the acquired inspection condition data;

A control unit for controlling the inspection unit according to the inspection condition data;

An output unit that outputs an inspection result;

Having.