JP4209156B2 - Inspection condition data management method and system, program, and computer-readable recording medium - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an inspection condition data management method and system, a program, and an inspection apparatus.
[0002]
[Prior art]
An inspection of a semiconductor integrated circuit will be described as an example. A semiconductor integrated circuit is manufactured by repeating a process of transferring a pattern formed on a photomask onto a semiconductor wafer by film formation, lithography, and etching. Circuit pattern defects and foreign matter that occur during the manufacturing process greatly affect the yield of semiconductor integrated circuits. Therefore, in the semiconductor integrated circuit manufacturing factory, an inspection process is provided in the middle of the manufacturing process in order to detect and take measures against foreign matters and defects at an early stage.
[0003]
As a device for inspecting foreign matter and defects existing on a pattern of a semiconductor wafer, there is a foreign matter inspection device that irradiates a semiconductor wafer with laser light and finds the foreign matter by the difference in intensity of scattered light. In addition, there is an appearance inspection apparatus that shoots an image by irradiating a semiconductor wafer with visible light, ultraviolet light, or an electron beam, and compares it with an image of a circuit pattern of an adjacent chip to detect a pattern abnormality. Hereinafter, foreign substances and pattern abnormalities are collectively referred to as defects. Further, the foreign substance inspection device and the appearance inspection device are collectively referred to as a defect inspection device. In order to use this defect inspection apparatus, inspection condition data corresponding to the circuit pattern and the inspection process is required. Inspection condition data can be roughly divided into the following four categories.
In the semiconductor manufacturing process, since the material and circuit pattern on the wafer surface vary depending on the inspection process and product type, the optimum laser light, visible light, ultraviolet light, and electron beam intensity for inspection differ. Further, a threshold is provided for the intensity of scattered light and the brightness of the image to identify a defect. This threshold also varies depending on the product type and the inspection process. The condition for detecting these defects is the first classification. Below, the data of this condition is called defect detection condition data.
[0004]
Further, the defect inspection apparatus detects a defect by comparing with a circuit pattern of an adjacent chip. In order to compare with the circuit pattern of the adjacent chip, it is necessary to register the chip arrangement in the wafer in the inspection condition in advance. These are the classifications of the second inspection conditions. Below, the data of this condition is called sequence information.
[0005]
Further, the defect inspection apparatus reads the alignment mark on the wafer to accurately grasp the position and direction of the wafer. For this purpose, the alignment mark position information and the alignment mark image are registered. These conditions are the third classification of inspection conditions. Hereinafter, this condition is referred to as alignment condition data.
[0006]
In addition, the defect inspection apparatus may detect color irregularities on the wafer, metal wiring grains, and the like as defects. These are called pseudo defects because they do not affect the performance of the semiconductor integrated circuit. An area where many pseudo defects are detected is usually set as a non-inspection area. This setting of the non-inspection area is the fourth classification. Hereinafter, this condition is referred to as non-inspection area data.
[0007]
By the way, if the above-mentioned arrangement information is the same kind, it is common in another inspection process. Therefore, in order to shorten the creation time of the inspection condition data, for example, in Japanese Patent Laid-Open No. 2001-35893, the inspection condition is set by separately handling the array information common to the product type and other conditions different for each inspection process. There is a description intended to reduce time. In addition, as in the invention in Japanese Patent Laid-Open No. 2000-233345, there is also provided a technique for easily inspecting inspection conditions between inspection apparatuses by providing an inspection condition management server for centrally managing inspection condition data of a plurality of defect inspection apparatuses. Proposed.
[0008]
[Problems to be solved by the invention]
Of the above four classification conditions, the setting of defect detection condition data takes the longest time. This is because, in setting defect detection condition data, it is necessary to set optimum conditions by repeating trial inspection and condition adjustment for confirming the validity of the conditions several times. In general, it takes several hours to create it. On the other hand, as a trend in recent years, the production volume of high-variety and low-volume system LSIs has increased, and each semiconductor integrated circuit manufacturer has been required to create inspection condition data corresponding to many types one by one. Yes. For this reason, the preparation time of inspection condition data tends to increase, and reduction of the preparation time of inspection condition data is an important issue.
[0009]
However, conventional techniques such as the inventions in Japanese Patent Laid-Open No. 2001-35893 and Japanese Patent Laid-Open No. 2000-233345 are intended to improve the operability at the time of creating inspection condition data. It did not radically reduce the creation time of the condition data. Therefore, an object of the present invention is to reduce the number of trial inspections and the like and to quickly and easily set the defect detection condition data.
[0010]
[Means for Solving the Problems]
The inspection condition management method of the present invention that achieves the above object is a method of creating inspection condition data of an inspection apparatus for detecting foreign matter or pattern defects in a wafer with a circuit pattern, the computer using an input means. The step of accepting the input of the product name and the table defining the product name received from the input means and the similarity between the products are collated, and the similar product of the product is searched in the storage device for storing the inspection condition data. A step of recognizing in the storage means an inspection process in which inspection condition data exists for the similar product, and editing and outputting a similar product according to the number of inspection processes from the retrieved similar product group. The step of accepting selection of similar varieties from each input means, and the inspection of similar varieties accepted selection for each inspection process The inspection condition data extracted from the storage means according to the, to the step of configuring the test condition data varieties accepted from the input means based on the inspection condition data, characterized in that it comprises a.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
At least the following will be clarified by the description of the present specification.
In the inspection condition data management method, generating the matrix data in which the searched similar products and the recognized inspection process are set as vertical and horizontal axes and the attribute information of the inspection condition data is associated with the axis intersection, and the matrix data And a procedure for receiving selection of similar varieties for each inspection process in the user interface. This facilitates the user's recognition of the relationship between the similar product and the inspection process and various designation operations.
[0012]
Further, in the matrix data of the inspection condition data management method, the vertical axis or the horizontal axis can be formed by listing similar varieties according to their similarity. This further facilitates the user's recognition of the relationship between the similar product and the inspection process and various designation operations.
[0013]
Further, in the inspection condition data management method, the table defining the degree of similarity between varieties has a data format described as a tree structure in which the varieties are attribute-classified. For the accepted product type, the method may include a step of determining a degree of similarity for each hierarchy or section of the tree structure and a step of selecting a similar product according to the determination result. According to this, editing / management of inspection condition data becomes simple and reliable, and selection processing of similar varieties becomes easy.
[0014]
Further, in the inspection condition data management method, the hierarchy of the tree structure includes at least one of a node representing a minimum dimension of a circuit pattern, a family name representing a use of the circuit pattern, and a process flow name representing a manufacturing procedure. Thus, it is possible to determine the priority between the elements and perform the similarity determination. This makes it possible to create inspection condition data in accordance with the characteristics of the wafer with a circuit pattern.
[0015]
Further, in the inspection condition data management method, the inspection condition data in the storage means includes the intensity of an electromagnetic wave or an electron beam applied to the wafer with a circuit pattern, and constitutes inspection condition data of a product type received from the input means As information to be performed, information on the intensity of the electromagnetic wave or electron beam can be included. According to this, it is possible to include the intensity of the electromagnetic wave or electron beam irradiated to the wafer with the circuit pattern as the inspection condition data.
[0016]
In the inspection condition data management method, the inspection condition data in the storage means includes a defect determination threshold value based on the intensity of electromagnetic waves or electron beams scattered or reflected by a wafer with a circuit pattern, and is received from the input means. The information that constitutes the inspection condition data of the various varieties may include information on the intensity of the electromagnetic wave or electron beam. According to this, the inspection condition data can include a defect determination threshold value based on the intensity of the electromagnetic wave or electron beam scattered or reflected by the wafer with the circuit pattern.
[0017]
Furthermore, a system for creating inspection condition data of an inspection apparatus for detecting foreign matters or pattern defects of a wafer with a circuit pattern, the unit receiving an input of a product name from an input unit, and the product name received from the input unit The storage means for searching for similar varieties of the product type in a storage unit for storing the inspection condition data by collating with a table defining the similarity between the product types, and the inspection step for which the inspection condition data exists for the similar product type Means for recognizing in the means, means for editing and outputting similar varieties from the retrieved similar varieties group according to the number of inspection processes, receiving similar varieties selection for each inspection process from the input means, and selection for each inspection process The inspection condition data relating to the inspection process of the similar varieties received is extracted from the storage means, and the input means is based on the inspection condition data. Means for configuring the test condition data received varieties, can the be made to the inspection condition data management system, which comprises a. According to this, the system which implement | achieves the inspection condition data management method of this invention can be provided.
[0018]
Also, inspection condition data for an inspection apparatus for detecting foreign matter or pattern defects of a wafer with a circuit pattern is created. On the computer, The step of accepting the input of the product name from the input means and the table defining the product name received from the input means and the similarity between the products are collated, and the similar product of the product is stored in the storage device for storing the inspection condition data. A step of recognizing in the storage means an inspection process in which inspection condition data exists for the similar product, and editing and outputting a similar product according to the number of inspection processes from the searched similar product group. The step of accepting selection of similar varieties for each inspection process from the input means, and the inspection condition data relating to the inspection process of the similar varieties accepted for selection for each inspection process are extracted from the storage means, and the input based on the inspection condition data Configuring the inspection condition data of the kind received from the means; Execute An inspection condition data management program characterized by the above can be made. According to this, the program which makes a computer perform the inspection condition data management method of this invention can be provided.
[0019]
Furthermore, The step of accepting the input of the product name from the input means to the computer for creating the inspection condition data of the inspection apparatus for detecting the foreign matter or pattern defect of the wafer with the circuit pattern, and the similarity between the product name and the product received from the input means The storage means storing the inspection condition data and collating with a table that defines the degree, and searching for similar varieties of the varieties, and recognizing the inspection process in which inspection condition data exists for the similar varieties in the storage means A step of editing and outputting similar varieties according to the number of inspection processes from the group of similar varieties searched and receiving a selection of similar varieties for each inspection process from the input means; Inspection condition data relating to the inspection process of the product type is extracted from the storage means, and the input is performed based on the inspection condition data. A step of configuring the test condition data varieties accepted from means causes execution A computer-readable recording medium on which the inspection condition data management program is recorded can be provided. According to this, it is possible to provide a recording medium containing the inspection condition data management program.
[0021]
In general, semiconductor integrated circuits are classified into product families such as DRAMs, SRAMs, and microcomputers according to their applications. Further, in semiconductor integrated circuits, gate widths and wiring intervals are becoming narrower every generation due to technological advances. These generations are classified as 0.35 micrometer node and 0.25 micrometer node with the smallest line and space pitch. A flowchart showing the manufacturing procedure is called a process flow. Semiconductor integrated circuits can also be classified according to the applied process flow.
[0022]
If the same inspection process is used, the defect detection condition data is considered to be similar even if the types are different, and the similarity of the defect detection condition data between the types is analyzed. When the detection condition data is compared, it is found that the difference is small. In particular, the values are very close between varieties to which the same process flow is applied. On the other hand, when the product families of different product families are compared, the difference is large. Similarly, the difference is also large between the products of different nodes.
[0023]
From these analysis results, similar types of defect detection condition data can be defined by a tree structure hierarchically classified by node, product family, process flow, and the like. Therefore, in the present invention, based on this tree structure, defect detection condition data of the same inspection process of existing varieties is reused to create new defect detection condition data. On the other hand, in the system LSI for multi-product and small-volume production, the number of existing products is enormous, and it is very complicated work to search for defect detection condition data to be reused according to the tree structure. Therefore, we propose an inspection condition data management system that can perform this work efficiently.
[0024]
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows a network configuration example including an inspection condition data management system. The network configuration includes an inspection condition server 101 that stores existing inspection condition data, a terminal 102 that connects to the inspection condition server 101 via the network 104 and creates inspection condition data, and a defect inspection apparatus 103 (hereinafter referred to as inspection). Device 103).
[0025]
The inspection condition server 101 is connected to a network 104 such as an interface or a LAN via a network interface 105 that exhibits a data communication function or the like. The inspection condition server 101 includes a control unit 106, a calculation unit 107, a user interface 108, a main storage device 109, and a secondary storage device 110 (storage means). Here, the user interface 108 not only exhibits an appropriate output function, but also functions as an input unit that accepts various inputs and instructions from the user. Further, the inspection condition data management system may include all of the inspection condition server 101, the terminal 102, and the defect inspection apparatus 103, and the function as the inspection condition data management system is integrated in any of the apparatuses. It may be a thing.
[0026]
Among these, the secondary storage device 110 stores inspection condition data 121, product type list data 122, inspection process list data 123, and product type inspection process data 125. The data stored in the secondary storage device 110 can be used as a table that defines the similarity between types. There are as many inspection condition data 121 as the number of inspection processes for each product type. The product type list data 122 and the inspection process list data 123 exist for the number of inspection apparatuses 103 included in the network. The type-specific inspection process data 125 exists for each type of inspection device.
[0027]
On the other hand, the terminal 102 is connected to the network 104 via the network interface 115. The terminal 102 includes a control unit 116, a calculation unit 117, a user interface 118, a main storage device 119, and a secondary storage device 120.
[0028]
FIG. 2 shows an example of the inspection condition data 121. In this example, an example in which data is described in an XML format (Extensible Markup Language) is shown. Therefore, the content of the data description between the tags takes the form of a data structure. For example, between the “product_data” tag and the “/ product_data” tag, the type name and the inspection process name to which this inspection condition data is applied, and the type number and the inspection process number are described. In addition, defect detection condition data is described between the “detective_parameter” tag and the “/ detective_parameter” tag.
[0029]
The defect detection condition data includes the incident angle of the laser irradiating the wafer, the laser power, the defect determination threshold value of the scattered light intensity for determining the defect, the defect determination threshold value of the peripheral chip, and the space filter interval. Is described. The laser power displays the incident angle in degrees. Laser power describes the percentage of maximum laser power in percent.
[0030]
The defect determination threshold value describes the ratio of the detection limit of the detector in percentage. Peripheral chip defect determination threshold describes the percentage of the detection limit of the detector in percent. Spatial filter spacing is described in nm. In the data example of FIG. 2, the laser power is 30%, and the defect determination threshold is 50%.
[0031]
Also, sequence information is described between the “array_data” tag and the “/ array_data” tag. As the array information, the number of chips and the chip size are described. In the example of FIG. 2, the number of chips is set to 8 in the X direction and the Y direction. The chip size is “200000000 nm” in the X and Y directions.
[0032]
Alignment information is described between the “alignment_data” tag and the “/ alignment_data” tag. The alignment information describes two chips used for alignment and a reference image number used for alignment. The alignment chip in the example of FIG. 2 is the third chip from the bottom, counting from the left, and the third chip from the bottom, counting from the left. The number of the reference image used for alignment here is “001”.
[0033]
A non-inspection area is described between the “inhibit_area” tag and the “/ inhibit_area” tag. The non-inspection area is defined by a rectangle, and the coordinates of the lower left and upper right corners of the rectangle are described in nm units. The non-inspection area in the example of FIG. 2 is a quadrangle having coordinates of “(0, 0)” and “(20000, 20000000)” with respect to the lower left of the chip as a reference.
[0034]
On the other hand, the product list data 122 is constructed as the tree structure of FIG. FIG. 3 is an example of a tree structure showing classification information of the types manufactured in the semiconductor manufacturing factory. In FIG. 3, the example classified by the node like 0.13 micrometers and 0.25 micrometers from the route was shown. Further, the 0.13 micrometer node is classified into a family such as DRAM, SRAM, and LOGIC. In the hierarchy below the family, the process flow and its sub-types are further branched. For example, the process flow D1 corresponds to the DRAM product types D001 and D002 of the 0.13 micrometer node. In this way, the tree structure hierarchy is composed of at least one of a node representing the minimum circuit pattern dimension, a family name representing the use of the circuit pattern, and a process flow name representing the manufacturing procedure. Assume that similarity determination is performed.
[0035]
FIG. 4 is an example of the product list data 122 representing the tree structure shown in FIG. 3 in the XML format. There are as many types of product list data 122 as the number of inspection devices 103 managed by the inspection condition server 101. The inspection apparatus 103 to which the created inspection condition data is applied is described in the product list data 122 and is distinguished from other inspection apparatuses. In the present embodiment, when selecting similar inspection condition data to be used from the existing inspection condition data stored in the secondary storage device 110 of the inspection condition server 103, it is described in the product list data 122. Use node, family, and process classifications.
[0036]
In the attribute of the “products_list” tag of the product list data 122, the device name of the inspection device 103 to which this file is applied is described. Here, “inspection 1” is the name of the inspection apparatus 103. The type described between the “node” tag and the “/ node” tag is a type belonging to the node described in the attribute of the node tag. The varieties described between the “family” tag and the “/ family” tag are varieties belonging to the product family described in the attribute of the family tag. The kind described between the “process_flow” tag and the “/ process_flow” tag is a kind manufactured in the process flow described in the attribute of the process_flow tag.
[0037]
The product type name is described between the “products” tag and the “/ product” tag. The product number is described in the product tag. This kind number is uniquely given for each kind. For example, in FIG. 4, “D001” is a DRAM of a 0.13 micrometer node and is a type manufactured by the process flow “D1”. The product number of the product “D001” is “1”.
[0038]
FIG. 5 shows an example of the inspection process list data 123. In the inspection process list data 123, a process number that uniquely identifies the same inspection process regardless of the product type is set in the inspection process. For example, the device name of the inspection device 103 to which this file is applied is described in an “inspection_steps_list” tag. Here, “inspection 1” is the name of the inspection apparatus 103. The inspection process name of the type to be inspected by the inspection apparatus 103 is described between the “steps_data” tag and the “/ steps_data” tag. Further, the inspection process name is described between the “STEP” tag and the “/ STEP” tag. For example, “Locus Si3N4” is an inspection process name. The step number is described in the attribute of the STEP tag.
[0039]
FIG. 6 shows an example of the type-specific inspection process data 125. The product-specific inspection process data 125 exists for each product type and describes the inspection process for the target product type. In the product-specific inspection process data 125, for example, an inspection process for the product type is described between a “steps” tag and a “/ steps” tag. Note that the step number and the state of the inspection condition data are displayed in the attribute of the step tag. This process number is the same as the process number written in the inspection process list data 123. “State” represents the state of the inspection condition data. For example, state = “3” means inspection condition data with a use record, while state = “2” means inspection condition data with no use record. Further, state = “1” means that there is no inspection condition data.
[0040]
FIG. 7 shows product information data 126 describing product classification information for each product. In FIG. 7, the “inspection_condition” tag describes the name of the inspection apparatus 103 in the attribute. Here, the inspection apparatus name is “inspection1”. In the “product” tag, the product name is described. The product name here is “D004”. In the “node” tag, a node of the type “D004” is described. In the “family” tag, the family name “D004” is described. In the “process_flow” tag, the name of the process flow that manufactured “D004” is described. The product type information data 126 may be stored in the secondary storage device 110 of the inspection condition server 101 and used for product type selection when reusing existing inspection condition data. The product type information data 126 and the product type inspection process data 125 may be described in the same file.
[0041]
FIG. 8 is a flowchart showing an example of a procedure for creating inspection condition data in the present embodiment. Hereinafter, the actual procedure of the inspection condition data management method of this embodiment will be described. The newly created inspection condition data is referred to as inspection condition data 121a. The inspection condition data to be reused is assumed to be inspection condition data 121b.
[0042]
First, the user interface 118 of the terminal 102 as an input means (or the user interface 108 of the inspection condition server 101) receives the input of the product name (and inspection process name) of the inspection condition data 121a that the user wants to newly create (step 1). ). The terminal 102 issues a reference request for the product list data 122 to the inspection condition server 101 in accordance with the received product name or the like. A search process based on the node name, family name, and process flow name is performed (step 2), and the type of inspection condition data to be reused is selected.
[0043]
If there is no product selected here, the process is terminated (step 3). On the other hand, if there is a product selected, the inspection condition data 121b to be reused is read from the secondary storage device 110 of the inspection condition server 101 ( Step 4). Then, from the read inspection condition data 121b, inspection condition data 121a of the kind / inspection process to be newly inspected is created (step 5). The created inspection condition data 121a is output to the inspection apparatus 103 via the network 104 (step 6). The inspection apparatus 103 executes inspection processing using the inspection condition data 121a. The above is an outline of a procedure example for creating new inspection condition data.
[0044]
Note that the processing of each step described above may be performed by the terminal 102 that has acquired appropriate information from the inspection condition server 101 as described above, or may be performed entirely by the inspection condition server 101. Hereinafter, in the present embodiment, description will be made assuming a situation in which the terminal 104 acquires existing inspection condition data from the inspection condition server 101 and performs appropriate processing.
[0045]
Next, a detailed description of each major step described above will be given below. FIG. 9 is an example of the procedure explaining the details of step 2 in FIG. The terminal 104 reads the product list data 122 from the secondary storage device 110 of the inspection condition server 101 (step 11). Read the product number of the target product described in the read product list data 122 (inspection data creation target: product accepted from the input means here) and substitute it into a variable x defined in the main memory 119, for example. Store (step 12).
[0046]
Next, the inspection process list data 123 is similarly read from the secondary storage device 110 (step 13). The process number of the target inspection process described in the read inspection process list data 123 (the inspection condition data creation target: the process accepted from the input means here) is read, and for example, a variable y defined in the main storage device 119 or the like is read. Substitute and store (step 14).
[0047]
The number of varieties already inspected in the corresponding inspection process recognized in the above steps 11 to 14 is substituted into the variable j in the same manner as above (step 15). Here, “already inspected” means that there is a track record of performing inspection with the inspection condition data of the corresponding product type and the corresponding inspection process. For example, in the type-specific inspection process data 125 of FIG. 6, STATE = “3” in the “Cont W Depo” process, and there is an inspection result. Therefore, in the “Cont WDepo” process, the product type “D004” can be recognized as an already-inspected product type. The details of step 15 will be described later with reference to FIG.
[0048]
If it is determined that the variable j is j> 0 (step 16), the type number of the tested type is output to the user interface 118. Alternatively, it is stored in an appropriate storage means such as the main storage device 119 or the secondary storage device 120 (step 23). At the time of this output, for example, it is preferable that a plurality of already inspected varieties (its varieties number) are listed and displayed according to the amount of inspection process data and presented to the user, so that it is easy to select similar varieties. Of course, such a display form may be similarly performed in the following processing. On the other hand, if it is determined that j = 0, the number of the same node and the same family type already inspected in the corresponding inspection process is substituted into the variable j as described above (step 17).
[0049]
If it is determined that the variable j here is j> 0 (step 18), the type number of the tested type is output to the user interface 118. Alternatively, it is stored in an appropriate storage means such as the main storage device 119 or the secondary storage device 120 (step 24). On the other hand, if it is determined that j = 0, the number of the same node type already inspected in the corresponding inspection process is substituted into the variable j in the same manner as described above (step 19).
[0050]
If it is determined that the variable j here is j> 0 (step 20), the type number of the tested type is output to the user interface 118. Alternatively, it is stored in an appropriate storage means such as the main storage device 119 or the secondary storage device 120 (step 25). On the other hand, if it is determined that j = 0, the number of varieties already inspected in the corresponding inspection process is substituted into the variable j as described above (step 21).
[0051]
If it is determined that the variable j here is j> 0 (step 22), the type number of the tested type is output to the user interface 118. Alternatively, it is stored in an appropriate storage means such as the main storage device 119 or the secondary storage device 120 (step 26). On the other hand, if it is determined that j = 0, the control is returned to step 3 in the flow of FIG.
[0052]
The terminal 104 substitutes, for example, the one having the largest number of inspection processes included in the product type, which is selected by the user from the product number output in steps 23 to 26, into the variable z (step 27). Alternatively, the terminal 104 may perform the process in which the user selects the one having the largest number of inspection processes. Details of the processing in step 27 will be described later with reference to FIG. When the process of step 27 is completed, control is returned to the process of step 3 in the flow of FIG.
[0053]
FIG. 10 is a diagram showing details of step 15 in FIG. In this step, the terminal 104 first searches the “process_flow” tag described in the product list data 122 for the “process_flow” tag immediately before the corresponding product (step 41). Subsequently, the product number of the “product” tag described immediately after the searched tag is substituted into the variable ps (step 42).
[0054]
Next, the product number of the “product” tag immediately before the “/ process_flow” tag paired with the tag searched in the step 41 is substituted for the variable pe (step 43), and the variable ps is substituted for the variable i. Substitute (step 44). Also, the product-specific inspection process data 125 of product number = i is called (step 45). If it is determined that state = “3” of the inspection process with process number = y (step 46), a process of substituting the variable i into the array p (j) is performed (step 47), and j + 1 is assigned to the variable j. Is substituted (step 48).
[0055]
On the other hand, if it is determined in step 46 that state ≠ 3, the product-specific inspection process data of product number = i is closed (step 49), and 1 is added to i (step 50). If it is determined that the variable i is greater than the variable pe (step 51), the process returns to step 6 in the flow of FIG. On the other hand, if it is determined that the variable i is equal to or less than the variable pe, the process returns to step 45 described above.
[0056]
Note that the processing in Step 15, Step 17, Step 19, and Step 21 in FIG. For example, if the “process_flow” tag is described in the “family” tag and the “/ process_flow” tag is described in the “/ family” tag in the procedure in the flow of FIG. Further, if the “process_flow” tag is changed to the “node” tag and the “/ process_flow” tag is changed to the “/ node” tag in the procedure in the flow of FIG. Also, if the “process_flow” tag is changed to the “products” tag and the “/ process_flow” tag is changed to the “/ products” tag in the procedure of the flow of FIG.
[0057]
FIG. 11 is a diagram showing details of the processing in step 27 in the flow of FIG. The terminal 104 here substitutes the number of product numbers output in steps 23 to 26 in the flow of FIG. 9 for a variable n (step 61). If this variable n is determined to be n = 1 (step 62), the corresponding product number is output to the user interface 118 (step 67). Further, it is stored in appropriate storage means such as the main storage device 119 or the secondary storage device 120.
[0058]
On the other hand, if the variable n is determined as n> 1, it is enumerated according to the number of inspection steps and output to the user interface. Alternatively, the number of the product number closest to the product number of the corresponding inspection process is substituted into the variable n (step 63). Subsequently, when it is determined that the variable n is n = 1 (step 64), the closest product number is output to the user interface in the same manner as described above (step 68). On the other hand, if the variable n is determined as n> 1, the two closest product numbers are output to the user interface or the like (step 65). The smallest product number is output (step 66), and the process returns to step 3 in the flow of FIG.
[0059]
FIG. 12 is an example of a GUI (Graphical User Interface) in the present embodiment. This GUI uses the similar varieties of the varieties for which inspection condition data is to be created and their inspection processes as the vertical and horizontal axes, and attribute information of the inspection condition data (eg, the presence or absence of data and past usage records) at the axis intersection. Takes the form of matrix data. Hereinafter, a method of creating the product type list data 122, the inspection process list data 123, and the product type inspection process data 125 will be described with reference to FIG. In FIG. 12, the type name description column 201 shows the type of semiconductor integrated circuit, the process flow name description column 202 shows the process flow name, the family name description column 203 shows the family name of the semiconductor integrated circuit, and the node name description column. The node of each type is displayed in 204, and the process name in the inspection process name description column 205 is displayed.
[0060]
The inspection condition data state display column 206 displays the state of inspection condition data for the corresponding product type and process, and one cell corresponds to one product type and one process. The same detection condition application type button 217 is used to define a type to which the user applies the same detection condition. The inspection condition data creation button 218 is used by the user to create inspection condition data.
[0061]
In this figure, for example, a double circle “◎” displayed in the inspection condition data state display field 206 indicates that “the inspection condition data has been created and has a record of application to the inspection”. The circle “◯” display indicates that “the inspection condition data exists but is not applied to the inspection”. The dot “•” display indicates that “there is no inspection condition data for the process corresponding to the corresponding product type”. The state without display indicates that “the corresponding inspection process is not an inspection target in the corresponding product type”.
[0062]
The inspection device name display field 221 displays the inspection device name of the inspection device 103. The type addition button 222 is used when the user adds a new type to the type name description field 201. The inspection process addition button 223 is used when the user adds a new inspection process to the inspection process display field 205. The inspection object button 224 is used by the user to change the non-inspection object to the inspection object. The non-inspection target button 225 is used when the user changes the inspection target to a non-inspection target.
[0063]
FIG. 13 shows an example of a method for adding a new variety. The GUI 200a, GUI 200b, and GUI 200c in FIG. 13 are part of the GUI 200 shown in FIG. FIGS. 13A, 13B, and 13C show how the GUI 200 transitions. For example, the user selects the kind addition line 231 of the GUI 200a shown in FIG. Subsequently, the kind addition button 222 shown in FIG.
[0064]
Then, the terminal 104 accepts these selection events and the like, as shown in FIG. 13B, under the type addition line 231, a new type column 232, a new type process flow column 233, a new type product family column 234, The GUI 200b to which the new product type node field 235 is added is generated and displayed.
[0065]
It is assumed that the user clicks the new product type field 232 here with the mouse 250 and then inputs, for example, “L007” from the keyboard. In addition, after clicking the new product type process flow column 233 with the mouse 250, "L2" is input from the keyboard. Further, after clicking on the new product family column 233 with the mouse, “LOGIC” is input from the keyboard. Then, after clicking the new product type node column 234 with the mouse 250, “0.13” is input from the keyboard. Then, the terminal 104 that has received these events generates and displays a GUI 200c in which a new product is added and the configuration is changed as shown in FIG. The addition of the inspection process is performed in the same procedure.
[0066]
As described above, when a new variety is added, the inspection process for the corresponding variety is not registered. Next, an example of a method for registering the “LocusSiN” process of the product type “L007” in the inspection process will be described with reference to FIG. GUI 200d and GUI 200e in FIG. 14 are a part of GUI 200 in FIG. In FIG. 14A, the new additional inspection process column 241 is blank. For example, the user selects the new additional inspection process column 241 with the mouse 250 and clicks the inspection object button 224 in FIG. In response to this, the terminal 104 changes the new additional inspection process column 241 to dot display as shown in the GUI 200e in FIG. When the user clicks the list saving button with the mouse 250, the terminal 104 generates the product type list data 121, the inspection process list data, and the product type inspection process file.
[0067]
Here, other embodiments will be described. FIG. 15 shows another example of the GUI in this embodiment. FIG. 16 is an example of a reuse priority table showing priorities for reusing inspection condition data. In this embodiment, if a plurality of similar varieties are selected, they are displayed in matrix data in descending order of similarity, and a situation is assumed in which the user instructs which similar cultivar inspection condition data is used for each inspection process. . First, the screen configuration of the GUI 300 in FIG. 15 will be described. The product type registration field 310 includes a product type registration field 311, a node registration field 312, a family name registration field 313, a process flow name registration field 314, and a product type registration button 315. The similar product display column 320 includes a process number threshold value column 321 and a similar product display button 322. This process number threshold value column 321 takes the form of a pull-down menu for selecting a number from 1 to 20 (that is, a threshold value for the number of processes).
[0068]
The inspection process addition field 330 includes an inspection process addition button 331, an inspection process up button 332, an inspection process down button 333, an inspection process deletion button 334, an inspection process confirmation button 335, and a list save button. The inspection condition selection area 340 includes an inspection process name display area 341, a similar kind name display area 342, a similar kind process flow name display area 343, a similar kind family name display area 345, a similar kind node name display area 346, and an inspection condition. It consists of a data display area 347. The GUI 300 is provided with an inspection condition data creation button 370 for instructing creation of inspection condition data.
[0069]
Next, a procedure for creating inspection condition data using the GUI 300 will be described. The user describes the product name in the product name registration field 311, the node in the node registration field 312, and the process flow name in the process flow registration field 313. Next, the inspection process number threshold value is selected from the pull-down menu in the process number threshold value column 330. The inspection process number threshold is a threshold for limiting the types of products displayed in the similar product name display area 342. Therefore, the terminal 104 performs display processing only on the types that exceed the inspection process number threshold among the types searched from the received type name, node, and process flow name.
[0070]
Next, when the user presses the similar product display button 322, the terminal 104 that has received the button displays a similar product name in the similar product display area 342 according to the similarity. The similarity here is as shown in the reuse priority table 360 of FIG. This consists of the tree structure hierarchy described above, consisting of nodes representing the minimum dimensions of circuit patterns, family names representing the use of circuit patterns, and process flow names representing manufacturing procedures. This is the basis for determining similarity. At this time, only products having a larger number of inspection processes than the threshold value specified in the process number threshold value column 321 are displayed. In the inspection process display area 341, the logical sum of the inspection processes of the selected similar products is displayed. In the inspection condition data display area, when there is inspection condition data for the corresponding product type / inspection process, a double circle “◎” display 348 is displayed as in the above embodiment, and when there is no inspection condition data, a blank 349 is displayed. Is done. The selection inspection condition column 360 is displayed in a shaded manner. In each inspection process, the cell having the highest similarity and having the inspection condition data is shaded 349 to indicate that it is reuse inspection condition data.
[0071]
Subsequently, the user designates an inspection process for the inspection type (in this case, “L004”). The inspection process displayed in the inspection process display area 340 and not the inspection process of “L004” is selected by clicking the inspection process name with the mouse 360 and then deleted by clicking the inspection process deletion button 340. To do.
[0072]
To add a new inspection process, the user clicks an inspection process addition button 335 with the mouse 360. Further, the inspection process is moved by the inspection process up button 332 or the inspection process down button 333, and the position is confirmed by the inspection process confirmation button 335. If the position is confirmed, the inspection process name displayed in the inspection process display area 341 is stored in the inspection process data 125 classified by product type “L004” by using a list saving button.
[0073]
Subsequently, the user selects inspection condition data to be reused for each inspection process. The user can select inspection condition data to be reused for each inspection process by moving the shaded display 349 horizontally on the GUI 300 with the mouse 360. The user clicks an inspection condition data creation button 370 to create inspection condition data 121.
[0074]
As described above, in the inspection condition data management method of the present invention, new inspection condition data is created by reusing the defect detection conditions of the existing inspection condition data accumulated in the inspection condition server. By using existing conditions, it is possible to set optimal defect detection conditions without manual adjustment. In this example, a search for similar varieties is performed using the varieties list data 122 describing information for classifying varieties. The method for searching for similar varieties is not limited to this example. In addition, an example has been described in which the user accepts various instructions and selections on the GUI and the processing of the inspection condition data management method proceeds. However, the same instructions and selection contents are algorithmized regardless of the instructions and selections by the user. Of course, it is possible to complete the process of creating the inspection condition data only by the terminal 104 or the inspection condition server 101.
[0075]
In the present embodiment, only one terminal 102 and one inspection apparatus 103 are shown, but there may be a plurality of terminals 102 and inspection apparatuses 103. In addition, although the inspection condition server 101 and the terminal 102 are illustrated as separate hardware, both may be configured by a single hardware. Of course, similarly, the terminal 102 may be integrated with the inspection apparatus 103.
[0076]
In addition, nodes, families, and process flows were used as tree structure hierarchies indicating information for classifying products, but the tree structure hierarchy is not limited to these, and any element that can classify products is used. It may be a thing.
[0077]
Further, the inspection condition data 121, the product type list data 122, the inspection process list data 123, and the product type inspection process data 125 may be provided in separate storage devices and function as independent databases. Or may be combined as appropriate through a single storage device.
[0078]
In addition, the apparatus that is the inspection condition server 101 and the terminal 104 is not only a server computer but also an apparatus having an arithmetic function and an input / output function that can realize processing to be performed in the inspection condition data management method of the present invention. Any one is acceptable. Further, regarding the network connecting the inspection condition server 101, the terminal 104, and the defect inspection apparatus 103, in addition to the Internet and LAN, various networks such as a WAN (Wide Area Network), a dedicated line, a power line network, and a wireless network can be used. It can also be adopted. In addition, if virtual private network technology such as VPN is used, communication with improved security is established on the Internet.
[0079]
According to the embodiment of the present invention, the following effects can be obtained.
According to the present invention, by extracting optimal inspection condition data from existing inspection condition data with a track record, and creating inspection condition data based on the data, new inspection condition data can be created with little or no trial inspection. It becomes possible to do. Therefore, it is possible to shorten the creation time of the inspection condition data, increase the operation time of the inspection apparatus, and improve the inspection frequency.
[0080]
As mentioned above, although embodiment of this invention was described concretely based on the embodiment, it is not limited to this and can be variously changed in the range which does not deviate from the summary.
[0081]
【The invention's effect】
According to the present invention, an inspection condition data management method and system, a program, and an inspection apparatus can be provided.
[Brief description of the drawings]
FIG. 1 is a diagram showing a network configuration example including an inspection condition data management system.
FIG. 2 is a diagram illustrating an example of inspection condition data.
FIG. 3 is an example of a tree structure showing classification information of types manufactured in a semiconductor manufacturing manufacturing factory.
FIG. 4 is a diagram showing an example of product type list data for hierarchically managing product types manufactured in a semiconductor manufacturing and manufacturing factory.
FIG. 5 is a diagram showing an example of product type list data for managing an inspection process.
FIG. 6 is a diagram showing an example of an inspection process file for each product type in which an inspection process is described for each product type.
FIG. 7 is a diagram showing an example of product type data describing product type classification information.
FIG. 8 is a flowchart showing an example of a procedure for creating inspection condition data in the present embodiment.
FIG. 9 is an example of a procedure showing details of step 2 in FIG. 8;
10 is an example of a procedure showing details of step 15 in FIG. 9;
FIG. 11 is an example of a procedure showing details of step 27 in FIG. 9;
FIG. 12 is a diagram illustrating an example of a GUI according to the present embodiment.
FIG. 13 is a diagram showing an example of a procedure for newly registering an inspection type.
FIG. 14 is a diagram showing an example of a procedure for registering an inspection process.
FIG. 15 is another example of a GUI according to the present embodiment.
FIG. 16 is an example of a reuse priority table showing priorities for reusing inspection condition data.
[Explanation of symbols]
1 Newly created inspection condition data type name / process name input step
2 Steps to select the type for which inspection condition data is reused
3 Step to confirm the presence or absence of the product selected in Step 2
Step to read 4 reuse inspection condition data
5 Inspection condition data creation step
6 Step to output inspection condition data to inspection device
11 Product list reading step
12 Substituting the product number of the corresponding product for variable X
13 Inspection process list reading step
14 Substituting the process number of the corresponding process for variable Y
15 Substitute the number of varieties that meet the condition into variable J
16 Conditional branch step with variable J
17 Substitute the number of varieties that meet the condition for variable J
18 Conditional branch step with variable J
19 Substituting the number of varieties in condition for variable J
20 Conditional branch by variable J
21 Substitute the number of varieties that meet the conditions for variable J
22 Conditional branch by variable J
23-26 Step of outputting the product number of the product type that meets the conditions, Step of substituting the product number of the reuse inspection condition for variable Z
31 Step of reading the same detection condition application type file of the relevant inspection process
32 Substituting the product number for the variable RX
33 Step of substituting product number for variable RY
34 Conditional branch by comparison of variables X and Y
35 Message output step
41 Process flow tag search step
42 Substituting product number for variable PS
43 Step of substituting product number for variable PE
44 Substituting PS for variable I
45 Inspection process file reading step by product type
46 Step of judging the condition of the inspection condition data
47 Substituting product number into array P (J)
48 Adding 1 to variable J
49 Close the inspection process file by product type
50 Adding 1 to variable I
51 Conditional branch by variable I
61 Substituting the number of product types for variable N
62 Step for conditional branching by variable N
63 Step of substituting the number of product types for variable N
64 Conditional branch with variable N
65 Step to output product number
66-68 Step of outputting the selected product number
101 Inspection condition server
102 terminals
103 Inspection equipment
104 network
105 Network interface
106 Control unit
107 Calculation unit
108 User interface
109 Main memory
110 Secondary storage device
115 Network interface
116 control unit
117 Calculation unit
118 User Interface
119 Main memory
120 Secondary storage device
121 Inspection condition data
122 Product list data
123 Inspection process list data
125 Inspection process data by product type
123 Product information data
200 GUI of this system
201 Product name description column
202 Process flow name description field
203 Family name description field
204 Node name description field
205 Inspection process name description column
206 Inspection condition data status display field
216 Selection area
217 Same detection condition setting button
218 Inspection condition data creation button
221 Inspection device name display field
224 Button for inspection
225 Non-inspection button
231 Variety additional business
232 New product line
233 New product process flow column
235 New variety node column
241 New additional inspection process column
250 mice

Claims (10)

A method of creating inspection condition data of an inspection apparatus for detecting foreign matter or pattern defects of a wafer with a circuit pattern by a computer,
The computer accepting an input of the product name from the input means;
Collating the kind name received from the input means with a table that defines the degree of similarity between the kinds, and searching for a similar kind of the kind in the storage means for storing the inspection condition data;
Recognizing in the storage means an inspection process in which inspection condition data exists for the similar product,
Editing and outputting similar varieties according to the number of inspection processes from the retrieved similar varieties group, and receiving similar varieties selection for each inspection process from the input means;
Extracting inspection condition data relating to the inspection process of similar varieties that have received selection for each inspection process from the storage means, and configuring the inspection condition data of the varieties received from the input means based on the inspection condition data;
An inspection condition data management method comprising: Generating the matrix data in which the retrieved similar varieties and the recognized inspection process have vertical and horizontal axes, and the attribute information of the inspection condition data is associated with the axis intersection;
Outputting the matrix data to a user interface;
A procedure for accepting selection of similar varieties for each inspection process in the user interface;
The inspection condition data management method according to claim 1, further comprising:   3. The inspection condition data management method according to claim 2, wherein in the matrix data, the vertical axis or the horizontal axis is formed by listing similar varieties according to the degree of similarity. The table defining the degree of similarity between varieties and the data format describing each tree as an attribute classification tree structure,
In the similar varieties search step,
For the kind received from the input means, determining the similarity for each hierarchy or section of the tree structure;
Selecting a similar variety according to the result of the determination;
The inspection condition data management method according to claim 1, further comprising:   The hierarchy of the tree structure is composed of at least one of a node representing the minimum dimension of the circuit pattern, a family name representing the use of the circuit pattern, and a process flow name representing the manufacturing procedure, and a priority order is defined between the elements. The inspection condition data management method according to claim 4, wherein similarity determination is performed. The inspection condition data in the storage means includes the intensity of electromagnetic waves or electron beams applied to the circuit pattern wafer,
2. The inspection condition data management method according to claim 1, wherein information on the intensity of the electromagnetic wave or electron beam is included as information constituting the inspection condition data of the product type received from the input means. The inspection condition data in the storage means includes a defect determination threshold value based on the intensity of electromagnetic waves or electron beams scattered or reflected by a wafer with a circuit pattern,
2. The inspection condition data management method according to claim 1, characterized in that information on the intensity of the electromagnetic wave or electron beam is included as information constituting the inspection condition data of the kind received from the input means. A system for creating inspection condition data of an inspection apparatus for detecting foreign matter or pattern defects of a wafer with a circuit pattern,
Means for accepting the input of the product name from the input means;
Means for collating the name of the product received from the input means with a table defining the similarity between the products, and searching for similar products of the product in the storage device for storing the inspection condition data;
Means for recognizing in the storage means an inspection process in which inspection condition data exists for the similar product,
Means for editing and outputting similar varieties according to the number of inspection processes from the group of similar varieties searched, and accepting selection of similar varieties for each inspection process from the input means;
Means for extracting inspection condition data relating to the inspection process of similar varieties for which selection for each inspection process has been received from the storage means, and constituting inspection condition data for the varieties received from the input means based on the inspection condition data;
The inspection condition data management system characterized by including. In a computer that creates inspection condition data of an inspection device that detects foreign matters or pattern defects of a wafer with a circuit pattern ,
Receiving the input of the product name from the input means;
Collating the kind name received from the input means with a table that defines the degree of similarity between the kinds, and searching for a similar kind of the kind in the storage means for storing the inspection condition data;
Recognizing in the storage means an inspection process in which inspection condition data exists for the similar product,
Editing and outputting similar varieties according to the number of inspection processes from the retrieved similar varieties group, and receiving similar varieties selection for each inspection process from the input means;
Extracting inspection condition data relating to the inspection process of similar varieties that have received selection for each inspection process from the storage means, and configuring the inspection condition data of the varieties received from the input means based on the inspection condition data;
Inspection condition data management program for causing the execution. In a computer that creates inspection condition data of an inspection device that detects foreign matters or pattern defects of a wafer with a circuit pattern,
Receiving the input of the product name from the input means;
Collating the kind name received from the input means with a table that defines the degree of similarity between the kinds, and searching for a similar kind of the kind in the storage means for storing the inspection condition data;
Recognizing in the storage means an inspection process in which inspection condition data exists for the similar product,
Editing and outputting similar varieties according to the number of inspection processes from the retrieved similar varieties group, and receiving similar varieties selection for each inspection process from the input means;
Extracting inspection condition data relating to the inspection process of similar varieties that have received selection for each inspection process from the storage means, and configuring the inspection condition data of the varieties received from the input means based on the inspection condition data;
The computer-readable recording medium which recorded the inspection condition data management program which performs this .

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