WO2004017474A3 - Dispositifs photoniques et circuits photoniques integres comprenant des structures d'essai sacrificielles et procedes de production de ceux-ci - Google Patents

Dispositifs photoniques et circuits photoniques integres comprenant des structures d'essai sacrificielles et procedes de production de ceux-ci Download PDF

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Publication number
WO2004017474A3
WO2004017474A3 PCT/US2003/025934 US0325934W WO2004017474A3 WO 2004017474 A3 WO2004017474 A3 WO 2004017474A3 US 0325934 W US0325934 W US 0325934W WO 2004017474 A3 WO2004017474 A3 WO 2004017474A3
Authority
WO
WIPO (PCT)
Prior art keywords
photonic
making
same
photonic devices
testing structures
Prior art date
Application number
PCT/US2003/025934
Other languages
English (en)
Other versions
WO2004017474A2 (fr
Inventor
Liyou Yang
Haiyan An
Original Assignee
Sarnoff Corp
Liyou Yang
Haiyan An
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sarnoff Corp, Liyou Yang, Haiyan An filed Critical Sarnoff Corp
Priority to EP03788642A priority Critical patent/EP1540722A4/fr
Priority to JP2004529126A priority patent/JP2005535899A/ja
Priority to AU2003259915A priority patent/AU2003259915A1/en
Publication of WO2004017474A2 publication Critical patent/WO2004017474A2/fr
Publication of WO2004017474A3 publication Critical patent/WO2004017474A3/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Optical Integrated Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)

Abstract

L'invention concerne une structure d'essai formée sur un circuit photonique intégré comprenant une pluralité de premiers composants photoniques possédant une fonction donnée qui correspond à un ensemble d'interconnexions particulières de ces premiers composants photoniques. La structure d'essai comprend au moins un second composant photonique conçu pour permettre l'essai d'au moins un des premiers composants photoniques, et au moins une trajectoire photonique reliant optiquement ce ou ces premier(s) composant(s) photoniques(s) avec le ou les second(s) composant(s) photoniques. Cette trajectoire photonique est distincte des interconnexions particulières des composants.
PCT/US2003/025934 2002-08-16 2003-08-18 Dispositifs photoniques et circuits photoniques integres comprenant des structures d'essai sacrificielles et procedes de production de ceux-ci WO2004017474A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP03788642A EP1540722A4 (fr) 2002-08-16 2003-08-18 Dispositifs photoniques et circuits photoniques integres comprenant des structures d'essai sacrificielles et procedes de production de ceux-ci
JP2004529126A JP2005535899A (ja) 2002-08-16 2003-08-18 犠牲試験構造を含むフォトニックデバイスおよびｐｉｃならびにこれらの製造方法
AU2003259915A AU2003259915A1 (en) 2002-08-16 2003-08-18 Photonic devices and pics including sacrificial testing structures and method of making the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/222,177 2002-08-16
US10/222,177 US6723573B2 (en) 2002-08-16 2002-08-16 Photonic devices and PICs including sacrificial testing structures and method of making the same

Publications (2)

Publication Number Publication Date
WO2004017474A2 WO2004017474A2 (fr) 2004-02-26
WO2004017474A3 true WO2004017474A3 (fr) 2004-06-03

Family

ID=31714896

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/025934 WO2004017474A2 (fr) 2002-08-16 2003-08-18 Dispositifs photoniques et circuits photoniques integres comprenant des structures d'essai sacrificielles et procedes de production de ceux-ci

Country Status (5)

Country Link
US (2) US6723573B2 (fr)
EP (1) EP1540722A4 (fr)
JP (1) JP2005535899A (fr)
AU (1) AU2003259915A1 (fr)
WO (1) WO2004017474A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7283694B2 (en) * 2001-10-09 2007-10-16 Infinera Corporation Transmitter photonic integrated circuits (TxPIC) and optical transport networks employing TxPICs
WO2014034238A1 (fr) * 2012-08-29 2014-03-06 日本電気株式会社 Circuit optique intégré, et procédé d'inspection de dispositif optique dans un circuit optique intégré
EP2940500A1 (fr) * 2014-04-29 2015-11-04 Karlsruher Institut für Technologie Circuit optique intégré et ses procédés de fabrication et de reconfiguration
CN108351467B (zh) * 2015-07-22 2020-10-30 Bb光电公司 具有介质波导的化合物半导体光子集成电路
US10012798B2 (en) * 2016-06-30 2018-07-03 International Business Machines Corporation Sacrificial coupler for testing V-grooved integrated circuits
US11428646B2 (en) 2020-08-28 2022-08-30 Openlight Photonics, Inc. Loss monitoring in photonic circuit fabrication
US11788929B1 (en) * 2022-09-29 2023-10-17 Aeva, Inc. Techniques for wafer level die testing using sacrificial structures

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020176467A1 (en) * 2001-04-27 2002-11-28 Liyou Yang Photonic integrated circuit (PIC) and method for making same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4926545A (en) * 1989-05-17 1990-05-22 At&T Bell Laboratories Method of manufacturing optical assemblies
US6204497B1 (en) * 1997-02-14 2001-03-20 Norman Schiller Air bag deployment trigger sensor with sacrificial waveguide
SE524892C2 (sv) * 1998-03-06 2004-10-19 Ericsson Telefon Ab L M Provning av optiska sändar- och mottagarmoduler
AUPR174300A0 (en) * 2000-11-28 2000-12-21 Redfern Integrated Optics Pty Ltd Thermo optical phase shifter with reduced power consumption

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020176467A1 (en) * 2001-04-27 2002-11-28 Liyou Yang Photonic integrated circuit (PIC) and method for making same

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
DETOFSKY ET AL.: "Equivalency Processing Parallel Photonic Integrated Circuit (EP3IC)", APPLIED PHYSICS, vol. 39, no. 5, 10 February 2000 (2000-02-10), pages 818 - 826, XP001028023 *
MASANOVI ET AL.: "Photonic Integrated Circuit devices for Fiber Optic CDMA Networks", FINAL REPORT FOR MICRO PROJECT 98-035, RDL AND LUCENT TECHNOLOGIES, 1998 - 1999, XP002975057, Retrieved from the Internet <URL:http://www.ucop.edu/research/micro/98_99/98_035.pdf> *
See also references of EP1540722A4 *

Also Published As

Publication number Publication date
AU2003259915A1 (en) 2004-03-03
US20040033633A1 (en) 2004-02-19
JP2005535899A (ja) 2005-11-24
AU2003259915A8 (en) 2004-03-03
WO2004017474A2 (fr) 2004-02-26
EP1540722A4 (fr) 2005-10-26
EP1540722A2 (fr) 2005-06-15
US20060151784A1 (en) 2006-07-13
US6723573B2 (en) 2004-04-20

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