WO2004017474A3 - Dispositifs photoniques et circuits photoniques integres comprenant des structures d'essai sacrificielles et procedes de production de ceux-ci - Google Patents
Dispositifs photoniques et circuits photoniques integres comprenant des structures d'essai sacrificielles et procedes de production de ceux-ci Download PDFInfo
- Publication number
- WO2004017474A3 WO2004017474A3 PCT/US2003/025934 US0325934W WO2004017474A3 WO 2004017474 A3 WO2004017474 A3 WO 2004017474A3 US 0325934 W US0325934 W US 0325934W WO 2004017474 A3 WO2004017474 A3 WO 2004017474A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- photonic
- making
- same
- photonic devices
- testing structures
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12004—Combinations of two or more optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Optical Integrated Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Optical Devices Or Fibers (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003259915A AU2003259915A1 (en) | 2002-08-16 | 2003-08-18 | Photonic devices and pics including sacrificial testing structures and method of making the same |
EP03788642A EP1540722A4 (fr) | 2002-08-16 | 2003-08-18 | Dispositifs photoniques et circuits photoniques integres comprenant des structures d'essai sacrificielles et procedes de production de ceux-ci |
JP2004529126A JP2005535899A (ja) | 2002-08-16 | 2003-08-18 | 犠牲試験構造を含むフォトニックデバイスおよびpicならびにこれらの製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/222,177 | 2002-08-16 | ||
US10/222,177 US6723573B2 (en) | 2002-08-16 | 2002-08-16 | Photonic devices and PICs including sacrificial testing structures and method of making the same |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004017474A2 WO2004017474A2 (fr) | 2004-02-26 |
WO2004017474A3 true WO2004017474A3 (fr) | 2004-06-03 |
Family
ID=31714896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/025934 WO2004017474A2 (fr) | 2002-08-16 | 2003-08-18 | Dispositifs photoniques et circuits photoniques integres comprenant des structures d'essai sacrificielles et procedes de production de ceux-ci |
Country Status (5)
Country | Link |
---|---|
US (2) | US6723573B2 (fr) |
EP (1) | EP1540722A4 (fr) |
JP (1) | JP2005535899A (fr) |
AU (1) | AU2003259915A1 (fr) |
WO (1) | WO2004017474A2 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2002334906A1 (en) * | 2001-10-09 | 2003-04-22 | Infinera Corporation | Transmitter photonic integrated circuits (txpic) and optical transport networks employing txpics |
US20150247779A1 (en) * | 2012-08-29 | 2015-09-03 | Nec Corporation | Optical integrated circuit, and inspection method of optical device in optical integrated circuit |
EP2940500A1 (fr) * | 2014-04-29 | 2015-11-04 | Karlsruher Institut für Technologie | Circuit optique intégré et ses procédés de fabrication et de reconfiguration |
CN108351467B (zh) * | 2015-07-22 | 2020-10-30 | Bb光电公司 | 具有介质波导的化合物半导体光子集成电路 |
US10012798B2 (en) * | 2016-06-30 | 2018-07-03 | International Business Machines Corporation | Sacrificial coupler for testing V-grooved integrated circuits |
US11428646B2 (en) | 2020-08-28 | 2022-08-30 | Openlight Photonics, Inc. | Loss monitoring in photonic circuit fabrication |
US11788929B1 (en) * | 2022-09-29 | 2023-10-17 | Aeva, Inc. | Techniques for wafer level die testing using sacrificial structures |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020176467A1 (en) * | 2001-04-27 | 2002-11-28 | Liyou Yang | Photonic integrated circuit (PIC) and method for making same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4926545A (en) * | 1989-05-17 | 1990-05-22 | At&T Bell Laboratories | Method of manufacturing optical assemblies |
US6204497B1 (en) * | 1997-02-14 | 2001-03-20 | Norman Schiller | Air bag deployment trigger sensor with sacrificial waveguide |
SE524892C2 (sv) * | 1998-03-06 | 2004-10-19 | Ericsson Telefon Ab L M | Provning av optiska sändar- och mottagarmoduler |
AUPR174300A0 (en) * | 2000-11-28 | 2000-12-21 | Redfern Integrated Optics Pty Ltd | Thermo optical phase shifter with reduced power consumption |
-
2002
- 2002-08-16 US US10/222,177 patent/US6723573B2/en not_active Expired - Fee Related
-
2003
- 2003-08-18 EP EP03788642A patent/EP1540722A4/fr not_active Withdrawn
- 2003-08-18 JP JP2004529126A patent/JP2005535899A/ja active Pending
- 2003-08-18 AU AU2003259915A patent/AU2003259915A1/en not_active Abandoned
- 2003-08-18 WO PCT/US2003/025934 patent/WO2004017474A2/fr not_active Application Discontinuation
-
2004
- 2004-04-20 US US10/827,903 patent/US20060151784A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020176467A1 (en) * | 2001-04-27 | 2002-11-28 | Liyou Yang | Photonic integrated circuit (PIC) and method for making same |
Non-Patent Citations (3)
Title |
---|
DETOFSKY ET AL.: "Equivalency Processing Parallel Photonic Integrated Circuit (EP3IC)", APPLIED PHYSICS, vol. 39, no. 5, 10 February 2000 (2000-02-10), pages 818 - 826, XP001028023 * |
MASANOVI ET AL.: "Photonic Integrated Circuit devices for Fiber Optic CDMA Networks", FINAL REPORT FOR MICRO PROJECT 98-035, RDL AND LUCENT TECHNOLOGIES, 1998 - 1999, XP002975057, Retrieved from the Internet <URL:http://www.ucop.edu/research/micro/98_99/98_035.pdf> * |
See also references of EP1540722A4 * |
Also Published As
Publication number | Publication date |
---|---|
US6723573B2 (en) | 2004-04-20 |
AU2003259915A8 (en) | 2004-03-03 |
JP2005535899A (ja) | 2005-11-24 |
WO2004017474A2 (fr) | 2004-02-26 |
US20060151784A1 (en) | 2006-07-13 |
EP1540722A4 (fr) | 2005-10-26 |
EP1540722A2 (fr) | 2005-06-15 |
AU2003259915A1 (en) | 2004-03-03 |
US20040033633A1 (en) | 2004-02-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2006017016A3 (fr) | Dispositifs et leurs procedes de fabrication | |
WO2006076151A3 (fr) | Lithographie et procedes, dispositifs et systemes associes | |
HK1058259A1 (en) | Mems-switched stepped variable capacitor and method of making same mems | |
AU2002364608A1 (en) | Systems and methods of manufacturing integrated photonic circuit devices | |
AU2003303968A1 (en) | An interconnection device for a printed circuit board, a method of manufacturing the same, and an interconnection assembly having the same | |
AU2002303591A1 (en) | Microelectromechanical system devices integrated with semiconductor structures | |
WO2003022325A8 (fr) | Dispositifs intravasculaires, systemes de recuperation et procedes correspondant | |
AU2002254198A1 (en) | Acoustical array with multilayer substrate integrated circuits | |
AU2002329594A1 (en) | Multi-piece fiber optic component and manufacturing technique | |
AU2002305835A1 (en) | Low-temperature patterned wafer bonding with photosensitive benzocylobutene (bcb) and 3d microelectromechanical systems fabrication | |
WO2003083906A3 (fr) | Peau de detecteur de contraintes de cisaillement, souple, integree a un circuit integre, et son procede de fabrication | |
TW200638145A (en) | Display apparatus and method of manufacturing the same | |
WO2004029680A3 (fr) | Ensemble electro-optique | |
WO2004053544A3 (fr) | Circuit imprime photonique | |
WO2005022959A3 (fr) | Dispositifs electroluminescents et procedes correspondants | |
WO2004017474A3 (fr) | Dispositifs photoniques et circuits photoniques integres comprenant des structures d'essai sacrificielles et procedes de production de ceux-ci | |
WO2004111801A3 (fr) | Techniques de communication de cagnottes progressives | |
AU2002341677A1 (en) | Integrated equipment set for forming an interconnect on a substrate | |
AU2001271419A1 (en) | Tunable wavelength add/drop multiplexer based on integrated optic devices | |
EP1992955A3 (fr) | Multiplexeur pour un TAP | |
WO2009037744A1 (fr) | Structure de fibre optique et son procédé de fabrication, puce en forme de bloc utilisée pour celle-ci | |
AU2003241718A1 (en) | Photonic crystal fiber, method of manufacturing the crystal fiber, and method of connecting the fiber | |
WO2008008277A3 (fr) | Noeud optique multifonctionnel et reconfigurable et réseau optique | |
AU1616101A (en) | The passive multiplexor test structure for intergrated circuit manufacturing | |
EP1526402A8 (fr) | Module à dispositif optique |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2003788642 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2004529126 Country of ref document: JP |
|
WWP | Wipo information: published in national office |
Ref document number: 2003788642 Country of ref document: EP |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 2003788642 Country of ref document: EP |