WO2004014603A3 - Tampon a polir comprenant une fenetre - Google Patents

Tampon a polir comprenant une fenetre Download PDF

Info

Publication number
WO2004014603A3
WO2004014603A3 PCT/US2003/024995 US0324995W WO2004014603A3 WO 2004014603 A3 WO2004014603 A3 WO 2004014603A3 US 0324995 W US0324995 W US 0324995W WO 2004014603 A3 WO2004014603 A3 WO 2004014603A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
window
fabrication process
polishing pad
pads
Prior art date
Application number
PCT/US2003/024995
Other languages
English (en)
Other versions
WO2004014603A2 (fr
WO2004014603B1 (fr
Inventor
Jason Wright
Andreas Norbert Wiswesser
Boguslaw A Swedek
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/282,730 external-priority patent/US6832950B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of WO2004014603A2 publication Critical patent/WO2004014603A2/fr
Publication of WO2004014603A3 publication Critical patent/WO2004014603A3/fr
Publication of WO2004014603B1 publication Critical patent/WO2004014603B1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Abstract

L'invention concerne des tampons à polir comprenant une fenêtre, des systèmes contenant lesdits tampons à polir, et des procédés faisant intervenir ceux-ci. A titre d'exemple, un faisceau lumineux (34) présentant une longueur d'ondes comprise entre 300 et 500 nm peut être dirigé dans une partie transparente (44) d'une surface de polissage d'un tampon à polir (18) pendant un polissage réalisé lors de procédés de fabrication STI (isolation par tranchée peu profonde), SOG (spin-on-glass), et SOI (silicium sur isolant). A titre d'autre exemple, le tampon à polir peut comprendre une couche support (116), une couche de polissage (120), une fenêtre (140) solide, et des couches d'un premier et d'un deuxième matériau adhésif différents (150, 160) situées entre la couche support et la fenêtre solide.
PCT/US2003/024995 2002-08-09 2003-08-08 Tampon a polir comprenant une fenetre WO2004014603A2 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US40241602P 2002-08-09 2002-08-09
US60/402,416 2002-08-09
US10/282,730 US6832950B2 (en) 2002-10-28 2002-10-28 Polishing pad with window
US10/282,730 2002-10-28
US10/638,259 US20040082271A1 (en) 1999-01-25 2003-08-07 Polishing pad with window
US10/638,259 2003-08-07

Publications (3)

Publication Number Publication Date
WO2004014603A2 WO2004014603A2 (fr) 2004-02-19
WO2004014603A3 true WO2004014603A3 (fr) 2004-08-05
WO2004014603B1 WO2004014603B1 (fr) 2004-12-16

Family

ID=31721422

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/024995 WO2004014603A2 (fr) 2002-08-09 2003-08-08 Tampon a polir comprenant une fenetre

Country Status (2)

Country Link
US (1) US20040082271A1 (fr)
WO (1) WO2004014603A2 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2337973A1 (fr) * 2000-03-22 2001-09-22 Illinois Tool Works Inc. Panneaux antiderapants resistants aux intemperies
US6939198B1 (en) * 2001-12-28 2005-09-06 Applied Materials, Inc. Polishing system with in-line and in-situ metrology
US20050161814A1 (en) 2002-12-27 2005-07-28 Fujitsu Limited Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
KR100737201B1 (ko) * 2004-04-28 2007-07-10 제이에스알 가부시끼가이샤 화학 기계 연마 패드, 그 제조 방법 및 반도체 웨이퍼의화학 기계 연마 방법
US20060089095A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US7306507B2 (en) * 2005-08-22 2007-12-11 Applied Materials, Inc. Polishing pad assembly with glass or crystalline window
US8157614B2 (en) * 2009-04-30 2012-04-17 Applied Materials, Inc. Method of making and apparatus having windowless polishing pad and protected fiber
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
CN102133734B (zh) * 2010-01-21 2015-02-04 智胜科技股份有限公司 具有侦测窗的研磨垫及其制造方法
US20110281510A1 (en) * 2010-05-12 2011-11-17 Applied Materials, Inc. Pad Window Insert
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US20140120802A1 (en) * 2012-10-31 2014-05-01 Wayne O. Duescher Abrasive platen wafer surface optical monitoring system
US8961266B2 (en) * 2013-03-15 2015-02-24 Applied Materials, Inc. Polishing pad with secondary window seal
US11282755B2 (en) 2019-08-27 2022-03-22 Applied Materials, Inc. Asymmetry correction via oriented wafer loading
WO2023126854A1 (fr) * 2021-12-31 2023-07-06 3M Innovative Properties Company Tampon de polissage microrépliqué comprenant une fenêtre en polymère fluoré
CN115056137A (zh) * 2022-06-20 2022-09-16 万华化学集团电子材料有限公司 一种具有研磨一致性终点检测窗的抛光垫及其应用

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5949927A (en) * 1992-12-28 1999-09-07 Tang; Wallace T. Y. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US6071177A (en) * 1999-03-30 2000-06-06 Taiwan Semiconductor Manufacturing Co., Ltd Method and apparatus for determining end point in a polishing process
US6247998B1 (en) * 1999-01-25 2001-06-19 Applied Materials, Inc. Method and apparatus for determining substrate layer thickness during chemical mechanical polishing
US6361646B1 (en) * 1998-06-08 2002-03-26 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
US6447369B1 (en) * 2000-08-30 2002-09-10 Micron Technology, Inc. Planarizing machines and alignment systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5486129A (en) * 1993-08-25 1996-01-23 Micron Technology, Inc. System and method for real-time control of semiconductor a wafer polishing, and a polishing head
US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US5461007A (en) * 1994-06-02 1995-10-24 Motorola, Inc. Process for polishing and analyzing a layer over a patterned semiconductor substrate
US5964643A (en) * 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6537133B1 (en) * 1995-03-28 2003-03-25 Applied Materials, Inc. Method for in-situ endpoint detection for chemical mechanical polishing operations
US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6010538A (en) * 1996-01-11 2000-01-04 Luxtron Corporation In situ technique for monitoring and controlling a process of chemical-mechanical-polishing via a radiative communication link
US5872633A (en) * 1996-07-26 1999-02-16 Speedfam Corporation Methods and apparatus for detecting removal of thin film layers during planarization
US5868896A (en) * 1996-11-06 1999-02-09 Micron Technology, Inc. Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6271047B1 (en) * 1998-05-21 2001-08-07 Nikon Corporation Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
US6190234B1 (en) * 1999-01-25 2001-02-20 Applied Materials, Inc. Endpoint detection with light beams of different wavelengths

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5949927A (en) * 1992-12-28 1999-09-07 Tang; Wallace T. Y. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US6361646B1 (en) * 1998-06-08 2002-03-26 Speedfam-Ipec Corporation Method and apparatus for endpoint detection for chemical mechanical polishing
US6247998B1 (en) * 1999-01-25 2001-06-19 Applied Materials, Inc. Method and apparatus for determining substrate layer thickness during chemical mechanical polishing
US6071177A (en) * 1999-03-30 2000-06-06 Taiwan Semiconductor Manufacturing Co., Ltd Method and apparatus for determining end point in a polishing process
US6447369B1 (en) * 2000-08-30 2002-09-10 Micron Technology, Inc. Planarizing machines and alignment systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates

Also Published As

Publication number Publication date
WO2004014603A2 (fr) 2004-02-19
WO2004014603B1 (fr) 2004-12-16
US20040082271A1 (en) 2004-04-29

Similar Documents

Publication Publication Date Title
WO2004014603A3 (fr) Tampon a polir comprenant une fenetre
AU2003264819A1 (en) Transparent microporous materials for cmp
AU2001253382A1 (en) Abrasive article having a window system for polishing wafers, and methods
US6224460B1 (en) Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process
US7547243B2 (en) Method of making and apparatus having polishing pad with window
WO2004072199A3 (fr) Composition de polissage abrasive melangee et procede d'utilisation associe
WO2003009349A3 (fr) Procedes et compositions pour polir mecaniquement et chimiquement des substrats d'isolation de tranchees peu profondes
WO2005000527A3 (fr) Matiere de tampon de polissage multicouche pour polissage chimique-mecanique
BR0017149A (pt) Curativo médico possuindo superfìcies de topo e de fundo, método de fabricação do mesmo, e, método de transferência de um adesivo para um substrato
AU4472997A (en) Semiconductor substrate polishing pad dresser, method of manufacturing the same, and chemicomechanical polishing method using the same dresser
AU2003236328A1 (en) Polishing pad and semiconductor substrate manufacturing method using the polishing pad
WO2004006296A3 (fr) Corps stratifie, procede et dispositif pour fabriquer un substrat ultramince a l'aide du corps stratifie
WO2002070623A8 (fr) Articles de protection
WO2003010831A1 (fr) Dispositif electroluminescent a semi-conducteur presentant un substrat irregulier
AU4517397A (en) Method of manufacturing semiconductor article
AU6767601A (en) Method for making substrates and resulting substrates
AU3211697A (en) Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers
WO2001089767A3 (fr) Procede de fabrication d'un composant a semi-conducteur et systeme de polissage chimico-mecanique concu a cet effet
WO2002091433A3 (fr) Procede permettant de polir la face arriere de plaquettes
CA2321835A1 (fr) Article abrasif et procede de production
EP1283090A3 (fr) Procédé de polissage de substrats anguleux
AU3384100A (en) A polishing pad having a water-repellant film thereon and a method for manufacturing the same
WO2001069676A3 (fr) Procede et appareil de liaison de substrats
EP1262313A3 (fr) Stratifié, en particulier pour sols
AU7626500A (en) Patterned release film between two laminated surfaces

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): CN JP KR SG

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR

121 Ep: the epo has been informed by wipo that ep was designated in this application
B Later publication of amended claims

Effective date: 20040716

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP