WO2003105192A3 - Apparatus and method for cassette-less transfer of wafers - Google Patents

Apparatus and method for cassette-less transfer of wafers Download PDF

Info

Publication number
WO2003105192A3
WO2003105192A3 PCT/US2003/018384 US0318384W WO03105192A3 WO 2003105192 A3 WO2003105192 A3 WO 2003105192A3 US 0318384 W US0318384 W US 0318384W WO 03105192 A3 WO03105192 A3 WO 03105192A3
Authority
WO
WIPO (PCT)
Prior art keywords
gripper
wafers
lifter
wafer basket
cassette
Prior art date
Application number
PCT/US2003/018384
Other languages
French (fr)
Other versions
WO2003105192A2 (en
Inventor
Edward R Fix
Michael J Vashro
Douglas R Farnlund
Sven Evers
Todd C Mohler
Original Assignee
Akrion Llc
Edward R Fix
Michael J Vashro
Douglas R Farnlund
Sven Evers
Todd C Mohler
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akrion Llc, Edward R Fix, Michael J Vashro, Douglas R Farnlund, Sven Evers, Todd C Mohler filed Critical Akrion Llc
Priority to AU2003273852A priority Critical patent/AU2003273852A1/en
Publication of WO2003105192A2 publication Critical patent/WO2003105192A2/en
Publication of WO2003105192A3 publication Critical patent/WO2003105192A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

Abstract

The invention is a method and apparatus for transferring one or more wafers (20) through chemical processing so as to reduce the problem of chemical cross-contamination. The invention utilizes a separate wafer basket (21) for each chemical process tank and an apparatus comprising: a gripper (12, 13) having an open position and a closed position; a lifter (11) having a lowered and a raised position and means (18) to engage a wafer basket; means (16, 17) to open and close the gripper; means (15) to raise and lower the lifter; and wherein the lifter and gripper are arranged so that when a loaded wafer basket is engaged by the means to engage and the gripper is in the open position, and upon the gripper being closed to the closed position, the gripper grips and unloads the wafers from the loaded wafer basket upon the lifter being lowered.
PCT/US2003/018384 2002-06-07 2003-06-09 Apparatus and method for cassette-less transfer of wafers WO2003105192A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003273852A AU2003273852A1 (en) 2002-06-07 2003-06-09 Apparatus and method for cassette-less transfer of wafers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38710902P 2002-06-07 2002-06-07
US60/387,109 2002-06-07

Publications (2)

Publication Number Publication Date
WO2003105192A2 WO2003105192A2 (en) 2003-12-18
WO2003105192A3 true WO2003105192A3 (en) 2004-03-18

Family

ID=29736263

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/018384 WO2003105192A2 (en) 2002-06-07 2003-06-09 Apparatus and method for cassette-less transfer of wafers

Country Status (2)

Country Link
AU (1) AU2003273852A1 (en)
WO (1) WO2003105192A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6833685B2 (en) 2014-11-10 2021-02-24 ブルックス オートメーション インコーポレイテッド Tool automatic teaching method and equipment

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4568234A (en) * 1983-05-23 1986-02-04 Asq Boats, Inc. Wafer transfer apparatus
US5301700A (en) * 1992-03-05 1994-04-12 Tokyo Electron Limited Washing system
US5505577A (en) * 1990-11-17 1996-04-09 Tokyo Electron Limited Transfer apparatus
US5983479A (en) * 1996-02-21 1999-11-16 Nec Corporation Apparatus and method of automatically removing a wafer carrier from a container
US6074515A (en) * 1997-03-24 2000-06-13 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing substrates
US6345947B1 (en) * 1997-11-10 2002-02-12 Tokyo Electron Limited Substrate arranging apparatus and method
US6457929B2 (en) * 1998-11-03 2002-10-01 Seh America, Inc. Apparatus and method for automatically transferring wafers between wafer holders in a liquid environment

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4568234A (en) * 1983-05-23 1986-02-04 Asq Boats, Inc. Wafer transfer apparatus
US5505577A (en) * 1990-11-17 1996-04-09 Tokyo Electron Limited Transfer apparatus
US5301700A (en) * 1992-03-05 1994-04-12 Tokyo Electron Limited Washing system
US5983479A (en) * 1996-02-21 1999-11-16 Nec Corporation Apparatus and method of automatically removing a wafer carrier from a container
US6074515A (en) * 1997-03-24 2000-06-13 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing substrates
US6345947B1 (en) * 1997-11-10 2002-02-12 Tokyo Electron Limited Substrate arranging apparatus and method
US6457929B2 (en) * 1998-11-03 2002-10-01 Seh America, Inc. Apparatus and method for automatically transferring wafers between wafer holders in a liquid environment

Also Published As

Publication number Publication date
AU2003273852A1 (en) 2003-12-22
WO2003105192A2 (en) 2003-12-18
AU2003273852A8 (en) 2003-12-22

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