WO2003100854A3 - Electronic component module and method for the production thereof - Google Patents
Electronic component module and method for the production thereof Download PDFInfo
- Publication number
- WO2003100854A3 WO2003100854A3 PCT/DE2003/001612 DE0301612W WO03100854A3 WO 2003100854 A3 WO2003100854 A3 WO 2003100854A3 DE 0301612 W DE0301612 W DE 0301612W WO 03100854 A3 WO03100854 A3 WO 03100854A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- projections
- production
- electronic component
- connection
- component module
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H01—ELECTRIC ELEMENTS
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01052—Tellurium [Te]
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- H—ELECTRICITY
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- H01L2924/01057—Lanthanum [La]
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- H01L2924/01075—Rhenium [Re]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/114—Pad being close to via, but not surrounding the via
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003232635A AU2003232635A1 (en) | 2002-05-24 | 2003-05-19 | Electronic component module and method for the production thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10223203.2 | 2002-05-24 | ||
DE10223203A DE10223203B4 (en) | 2002-05-24 | 2002-05-24 | Electronic component module and method for its production |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003100854A2 WO2003100854A2 (en) | 2003-12-04 |
WO2003100854A3 true WO2003100854A3 (en) | 2005-01-06 |
Family
ID=29414141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2003/001612 WO2003100854A2 (en) | 2002-05-24 | 2003-05-19 | Electronic component module and method for the production thereof |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2003232635A1 (en) |
DE (1) | DE10223203B4 (en) |
WO (1) | WO2003100854A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100555706B1 (en) | 2003-12-18 | 2006-03-03 | 삼성전자주식회사 | ??? for fine pitch solder ball and flip-chip package method using the UBM |
US20080171181A1 (en) * | 2007-01-11 | 2008-07-17 | Molex Incorporated | High-current traces on plated molded interconnect device |
US8829663B2 (en) | 2007-07-02 | 2014-09-09 | Infineon Technologies Ag | Stackable semiconductor package with encapsulant and electrically conductive feed-through |
EP2831905A1 (en) | 2012-03-30 | 2015-02-04 | MSG Lithoglas GmbH | Semiconductor device and method for producing a glass-like layer |
US8963335B2 (en) | 2012-09-13 | 2015-02-24 | Invensas Corporation | Tunable composite interposer |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4814295A (en) * | 1986-11-26 | 1989-03-21 | Northern Telecom Limited | Mounting of semiconductor chips on a plastic substrate |
WO1996009646A1 (en) * | 1994-09-23 | 1996-03-28 | Siemens N.V. | Polymer stud grid array |
US6002590A (en) * | 1998-03-24 | 1999-12-14 | Micron Technology, Inc. | Flexible trace surface circuit board and method for making flexible trace surface circuit board |
US6060665A (en) * | 1998-03-16 | 2000-05-09 | Lucent Technologies Inc. | Grooved paths for printed wiring board with obstructions |
GB2349014A (en) * | 1999-03-19 | 2000-10-18 | Ibm | Method for forming an electronic structure |
WO2001082372A1 (en) * | 2000-04-20 | 2001-11-01 | Siemens Aktiengesellschaft | Polymer stud grid array having feedthroughs and method for producing a substrate for a polymer stud grid array of this type |
EP1106040B1 (en) * | 1998-07-10 | 2002-03-27 | Siemens S.A. | Method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections |
WO2002045163A2 (en) * | 2000-11-29 | 2002-06-06 | Siemens Dematic Ag | Method for producing semiconductor modules and a module produced according to said method |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998027589A1 (en) * | 1996-12-19 | 1998-06-25 | Telefonaktiebolaget Lm Ericsson (Publ) | Flip-chip type connection with elastic contacts |
DE10059176C2 (en) * | 2000-11-29 | 2002-10-24 | Siemens Ag | Intermediate carrier for a semiconductor module, semiconductor module produced using such an intermediate carrier, and method for producing such a semiconductor module |
-
2002
- 2002-05-24 DE DE10223203A patent/DE10223203B4/en not_active Expired - Fee Related
-
2003
- 2003-05-19 AU AU2003232635A patent/AU2003232635A1/en not_active Abandoned
- 2003-05-19 WO PCT/DE2003/001612 patent/WO2003100854A2/en not_active Application Discontinuation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4814295A (en) * | 1986-11-26 | 1989-03-21 | Northern Telecom Limited | Mounting of semiconductor chips on a plastic substrate |
WO1996009646A1 (en) * | 1994-09-23 | 1996-03-28 | Siemens N.V. | Polymer stud grid array |
US6060665A (en) * | 1998-03-16 | 2000-05-09 | Lucent Technologies Inc. | Grooved paths for printed wiring board with obstructions |
US6002590A (en) * | 1998-03-24 | 1999-12-14 | Micron Technology, Inc. | Flexible trace surface circuit board and method for making flexible trace surface circuit board |
EP1106040B1 (en) * | 1998-07-10 | 2002-03-27 | Siemens S.A. | Method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections |
GB2349014A (en) * | 1999-03-19 | 2000-10-18 | Ibm | Method for forming an electronic structure |
WO2001082372A1 (en) * | 2000-04-20 | 2001-11-01 | Siemens Aktiengesellschaft | Polymer stud grid array having feedthroughs and method for producing a substrate for a polymer stud grid array of this type |
WO2002045163A2 (en) * | 2000-11-29 | 2002-06-06 | Siemens Dematic Ag | Method for producing semiconductor modules and a module produced according to said method |
Non-Patent Citations (1)
Title |
---|
CHRISTENSEN C ET AL: "WAFER THROUGH-HOLE INTERCONNECTIONS WITH HIGH VERTICAL WIRING DENSITIES", IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY: PART A, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, vol. 19, no. 4, 1 December 1996 (1996-12-01), pages 516 - 521, XP000638749, ISSN: 1070-9886 * |
Also Published As
Publication number | Publication date |
---|---|
AU2003232635A1 (en) | 2003-12-12 |
DE10223203B4 (en) | 2004-04-01 |
DE10223203A1 (en) | 2003-12-04 |
WO2003100854A2 (en) | 2003-12-04 |
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