WO2003077618A3 - Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive - Google Patents
Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive Download PDFInfo
- Publication number
- WO2003077618A3 WO2003077618A3 PCT/US2003/002965 US0302965W WO03077618A3 WO 2003077618 A3 WO2003077618 A3 WO 2003077618A3 US 0302965 W US0302965 W US 0302965W WO 03077618 A3 WO03077618 A3 WO 03077618A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermoplastic adhesive
- printed circuit
- electronic device
- circuit board
- surface mount
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title abstract 10
- 230000001070 adhesive effect Effects 0.000 title abstract 10
- 229920001169 thermoplastic Polymers 0.000 title abstract 9
- 239000004416 thermosoftening plastic Substances 0.000 title abstract 9
- 239000007787 solid Substances 0.000 abstract 3
- 239000004952 Polyamide Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229920002647 polyamide Polymers 0.000 abstract 1
- 229920000098 polyolefin Polymers 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003207779A AU2003207779A1 (en) | 2002-03-05 | 2003-01-31 | Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/091,086 US6906425B2 (en) | 2002-03-05 | 2002-03-05 | Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive |
US10/091,086 | 2002-03-05 | ||
US10/091,262 US20030170450A1 (en) | 2002-03-05 | 2002-03-05 | Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive |
US10/091,262 | 2002-03-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003077618A2 WO2003077618A2 (en) | 2003-09-18 |
WO2003077618A3 true WO2003077618A3 (en) | 2003-11-06 |
Family
ID=27807215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/002965 WO2003077618A2 (en) | 2002-03-05 | 2003-01-31 | Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU2003207779A1 (en) |
WO (1) | WO2003077618A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113299593B (en) * | 2021-05-21 | 2023-01-10 | 錼创显示科技股份有限公司 | Adhesion layer structure and semiconductor structure |
Families Citing this family (9)
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---|---|---|---|---|
CN101283381B (en) | 2005-09-08 | 2011-12-14 | 卡德赖博私人有限公司 | A dynamic transaction card and a method of writing information to the same |
DE102006018275A1 (en) * | 2006-04-20 | 2007-10-31 | Conti Temic Microelectronic Gmbh | Electronic device e.g. camera module, for use in a motor vehicle electronics, has padding layer adapted to thermal expansions of electronic component and printed circuit board with respect to layer`s thermal expansion-coefficient |
US20080176428A1 (en) * | 2007-01-24 | 2008-07-24 | Brandenburg Scott D | Connector applied underfill |
CN101547560B (en) * | 2008-03-28 | 2011-11-02 | 诺亚电子股份有限公司 | Repairing binding method for printed circuit board finished product with multi-plate typesetting |
US9324601B1 (en) | 2014-11-07 | 2016-04-26 | International Business Machines Corporation | Low temperature adhesive resins for wafer bonding |
WO2016097372A1 (en) | 2014-12-19 | 2016-06-23 | Cardlab Aps | A method and an assembly for generating a magnetic field and a method of manufacturing an assembly |
EP3035230A1 (en) | 2014-12-19 | 2016-06-22 | Cardlab ApS | A method and an assembly for generating a magnetic field |
EP3082071A1 (en) | 2015-04-17 | 2016-10-19 | Cardlab ApS | Device for and method of outputting a magnetic field |
TWI808422B (en) | 2021-05-21 | 2023-07-11 | 錼創顯示科技股份有限公司 | Adhesive-layer structure and semiconductor structure |
Citations (11)
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JPS5768053A (en) * | 1980-10-16 | 1982-04-26 | Seiko Epson Corp | Integrated circuit package |
US4873397A (en) * | 1986-12-25 | 1989-10-10 | Tdk Corporation | Electronic circuit element |
JPH0336788A (en) * | 1989-07-04 | 1991-02-18 | Murata Mfg Co Ltd | Surface mounting type electronic component and mounting method thereof |
JPH04249307A (en) * | 1991-02-04 | 1992-09-04 | Nippon Chemicon Corp | Chip type capacitor and mounting method thereof |
JPH04352491A (en) * | 1991-05-30 | 1992-12-07 | Matsushita Electric Ind Co Ltd | Method of packaging electronic parts |
JPH05347474A (en) * | 1992-06-16 | 1993-12-27 | Matsushita Electric Ind Co Ltd | Piece for temporarily fixing electronic part |
EP0729182A2 (en) * | 1995-02-23 | 1996-08-28 | Matsushita Electric Industrial Co., Ltd | Chip carrier and method of manufacturing and mounting the same |
JPH08250835A (en) * | 1995-03-10 | 1996-09-27 | Nec Corp | Method for mounting lsi package having metallic bump |
JPH10335527A (en) * | 1997-05-30 | 1998-12-18 | Nec Corp | Semiconductor device, mounting method of semiconductor device and manufacture thereof |
DE19822470A1 (en) * | 1998-05-19 | 1999-12-09 | Litton Precision Prod Int | Flat molded part for securing electronic components, e.g. flip-chips and ball grid arrays to carriers |
US6037657A (en) * | 1995-07-20 | 2000-03-14 | Matsushita Electric Industrial Co., Ltd. | Carrier, semiconductor device, and method of their mounting |
-
2003
- 2003-01-31 WO PCT/US2003/002965 patent/WO2003077618A2/en active Search and Examination
- 2003-01-31 AU AU2003207779A patent/AU2003207779A1/en not_active Abandoned
Patent Citations (11)
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JPS5768053A (en) * | 1980-10-16 | 1982-04-26 | Seiko Epson Corp | Integrated circuit package |
US4873397A (en) * | 1986-12-25 | 1989-10-10 | Tdk Corporation | Electronic circuit element |
JPH0336788A (en) * | 1989-07-04 | 1991-02-18 | Murata Mfg Co Ltd | Surface mounting type electronic component and mounting method thereof |
JPH04249307A (en) * | 1991-02-04 | 1992-09-04 | Nippon Chemicon Corp | Chip type capacitor and mounting method thereof |
JPH04352491A (en) * | 1991-05-30 | 1992-12-07 | Matsushita Electric Ind Co Ltd | Method of packaging electronic parts |
JPH05347474A (en) * | 1992-06-16 | 1993-12-27 | Matsushita Electric Ind Co Ltd | Piece for temporarily fixing electronic part |
EP0729182A2 (en) * | 1995-02-23 | 1996-08-28 | Matsushita Electric Industrial Co., Ltd | Chip carrier and method of manufacturing and mounting the same |
JPH08250835A (en) * | 1995-03-10 | 1996-09-27 | Nec Corp | Method for mounting lsi package having metallic bump |
US6037657A (en) * | 1995-07-20 | 2000-03-14 | Matsushita Electric Industrial Co., Ltd. | Carrier, semiconductor device, and method of their mounting |
JPH10335527A (en) * | 1997-05-30 | 1998-12-18 | Nec Corp | Semiconductor device, mounting method of semiconductor device and manufacture thereof |
DE19822470A1 (en) * | 1998-05-19 | 1999-12-09 | Litton Precision Prod Int | Flat molded part for securing electronic components, e.g. flip-chips and ball grid arrays to carriers |
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PATENT ABSTRACTS OF JAPAN vol. 006, no. 144 (E - 122) 3 August 1982 (1982-08-03) * |
PATENT ABSTRACTS OF JAPAN vol. 015, no. 165 (E - 1061) 25 April 1991 (1991-04-25) * |
PATENT ABSTRACTS OF JAPAN vol. 017, no. 022 (E - 1307) 14 January 1993 (1993-01-14) * |
PATENT ABSTRACTS OF JAPAN vol. 017, no. 214 (E - 1357) 27 April 1993 (1993-04-27) * |
PATENT ABSTRACTS OF JAPAN vol. 018, no. 188 (E - 1532) 31 March 1994 (1994-03-31) * |
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 01 31 January 1997 (1997-01-31) * |
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 03 31 March 1999 (1999-03-31) * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113299593B (en) * | 2021-05-21 | 2023-01-10 | 錼创显示科技股份有限公司 | Adhesion layer structure and semiconductor structure |
Also Published As
Publication number | Publication date |
---|---|
AU2003207779A1 (en) | 2003-09-22 |
WO2003077618A2 (en) | 2003-09-18 |
AU2003207779A8 (en) | 2003-09-22 |
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