WO2003071198A1 - Appareil de transfert de chaleur - Google Patents
Appareil de transfert de chaleur Download PDFInfo
- Publication number
- WO2003071198A1 WO2003071198A1 PCT/IS2003/000007 IS0300007W WO03071198A1 WO 2003071198 A1 WO2003071198 A1 WO 2003071198A1 IS 0300007 W IS0300007 W IS 0300007W WO 03071198 A1 WO03071198 A1 WO 03071198A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plates
- heat transfer
- flow
- fluid
- transfer apparatus
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/083—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning capable of being taken apart
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
- F28D9/0031—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other
- F28D9/0043—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the plates having openings therein for circulation of at least one heat-exchange medium from one conduit to another
- F28D9/005—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits for one heat-exchange medium being formed by paired plates touching each other the plates having openings therein for circulation of at least one heat-exchange medium from one conduit to another the plates having openings therein for both heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2240/00—Spacing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to an apparatus suitable for utilization of thermal energy flowing from a hot fluid to a colder fluid, such as in the generation of electricity.
- a similar device can be used as a heat pump where heat is transferred from one fluid to another by electronic means, or for other purposes in which a temperature gradient across a material provides useful changes in the physical properties of said material.
- thermoelectric module comprising an arrangement of crystals made of thermoelectric material where said modules have two opposite and parallel surfaces.
- one surface must be brought into thermal contact with a hot body and the other surface must be brought into contact with a cold body in order to induce flow of thermal energy from the hot body to the cold body through said thermoelectric module.
- electromotive force arises across the ends of the thermoelectric crystals giving rise to electric current when connected through an electric load.
- thermoelectric module becomes colder and the other hotter than the immediate environment when electric voltage is applied across said crystals as utilized in a variety of cooling devices.
- Other physical principles that are applicable for the present invention involve a useful flow of electrons in response to heat flow, such as thermionic emission, and these principles also apply in the present invention.
- thermoelectric means for the purpose of cooling miscellaneous parts or fluids in a variety of embodiments but much fewer relate to the generation of electricity using thermoelectric or other electronic means.
- the suggested embodiments often resemble traditional heat exchangers in their basic characteristics.
- the following problems arise: a) The externally applied pressure tends to collapse the fluid flow channels and deform the flat surface of the channel, and thus degrading the thermal contact that must be maintained between the fiat surface of the channel and the electronic module.
- Embodiments have been introduced where this problem is solved by modifying the surface geometry of the inner walls of the channel such that mechanical support is provided through the channel against the external pressure applied, thus preventing deformation.
- the fluid must flow slowly in the hot channel to be able to release the required heat through the electronic module into the cold fluid before the hot fluid exits the device.
- the resulting flow velocity of the fluid is very low, giving rise to laminar flow and poor heat transfer from the fluid to the flow channel wall. Therefore, the embodiments of the prior art have attempted to increase the surface area of the inner walls of the flow channel by complex and expensive assembly or machining operations, making the complete apparatus very expensive.
- Figure 1 shows a longitudinal cross section of one embodiment of an improved heat transfer apparatus of the present invention.
- Figure 2 shows an exploded isometric view of the same embodiment as in Figure 1.
- Figure 3 shows a cross section of an alternative embodiment of the present invention, in which only a single layer of electronic cells is accommodated.
- a heat transfer apparatus wherein said apparatus has the advantages of (i) providing even and efficient heat transfer; (ii) providing mechanical support within and between adjacent flow channels; (iii) being easily manufactured from available materials with minimal labour involved; (iv) being manufactured rapidly and inexpensively.
- an improved heat transfer apparatus comprising:
- At least two plates comprising openings for fluid flow, arranged in a substantially parallel fashion, wherein at least one of said plates is a thermally conductive plate.
- first and said second flow channels are oriented in a substantially parallel fashion and wherein thermally conductive plates of said flow channels are positioned adjacently.
- Such an apparatus can thereby maintain a temperature gradient across a layer of material, for example for the purpose of generating electricity, by means of fluids of different temperatures, in a simple and efficient apparatus or, alternatively, utilize a temperature gradient present in said layer of material for transfer of heat between said fluids.
- said openings may be substantially circular in shape.
- said at least one body of material is comprised of electronic cells.
- an apparatus as described above wherein at least one of said plates comprises one of said top end plate and bottom end plate.
- an apparatus wherein means for preventing fluid from escaping from said apparatus are provided.
- Such means may in one aspect be provided by resilient gaskets.
- a space is created between thermally conductive plates of adjacent fluid channels by means of a first resilient gasket, such that the at least one body of material may be accommodated.
- said space for said at least one open structure body may be provided by means of a second resilient gasket placed between said at least two thermally conducting plates.
- said gaskets are provided in an outer part, substantially lining the outer edge of said thermally conductive plates, and an inner part substantially lining said openings.
- the outer and inner parts are provided in one continuous gasket.
- said gaskets are provided by ducts of length substantially equal to the thickness of said body of material with means of sealing against fluid pressure and wherein said ducts are placed substantially concentrically with said openings.
- strips of rigid material of thickness substantially equal to the thickness of said body of material are provided, wherein said strips are placed substantially at the outer edge of said plates.
- the at least one open structure body is made of one or more materials selected from the group consisting of wire-mesh material, labyrinth of wires, ceramics, plastics, metals, sintered material and rigid foam material.
- the at least one open structure body may be comprised of a plurality of non-open structure bodies, wherein said bodies are spatially oriented so as to generate turbulent fluid flow.
- a further aspect of the invention provides a heat transfer apparatus comprising at least one open structure body placed substantially centrally within the opening between said plates and at least one open structure body placed in proximity of said openings.
- said plates are stamped or machined for the purpose of securing in place said resilient gaskets or the at least one open structure body or the at least one body of material.
- a plurality of flow channel layers and layers comprising said at least one body of material are arranged alternately, thus forming a stack of any desired height.
- Said means may in suitable embodiments be provided by threaded rods and end-bolts.
- said plates are circular in shape, thus allowing circular gaskets to be used for fluid containment.
- the present invention further provides a method of maintaining a temperature gradient across a body of material of substantially uniform thickness which comprises providing fluid flow through said first and said second flow channels of the apparatus of the invention, wherein said first flow channel is provided at a temperature different from the temperature of said second flow channel.
- said temperature gradient may be used to alter the physical properties of said material.
- said material induces electricity in response to the temperature gradient.
- a flow channel is a body which serves as a source and storage of thermal energy.
- a body which can be considered to comprise a thermal reservoir body, may be used for the utilization of heat transfer from one thermal body to a second thermal body.
- a body of material is in the present context considered to be any body of any material, which has useful characteristics when placed in a thermal gradient provided by the present invention.
- Such a body of material may in a useful embodiment be provided by an electronic cell.
- An open structure body is in the present context considered to be a body with means for allowing liquid to flow through the body.
- Such an open structure body may be in the form of a porous material, or it may be comprised of a particular arrangement of otherwise liquid-impermeable material, which is arranged in a manner that allows liquid to pass through the body.
- a thermally conductive plate is considered to be a plate comprised of material which conducts thermal energy. Such material is well known to those skilled in the art, and may for example be comprised of one or more metal, metal alloys or any other material showing properties of conducting thermal energy.
- An electronic element is in the present context considered to be an element which can, upon exposure to differential temperature as in the case of a heat exchanger, give rise to electric current, based on principles well known to those skilled in the art.
- each plate may be provided with four holes or openings near the corners as is common in plate heat exchangers and their purpose is substantially the same as in such heat exchangers.
- the open structure body which may in preferred embodiments be comprised of at least one porous body, may be made of metal of uniform thickness, such as a wire mesh, which is placed within a gasket, covering the middle part of the plate such that fluid entering through holes at one end and exiting at the other end is forced through the open structure body, resulting in a flow across the width of the plate from one end to the other.
- the open structure body serves multiple functions in the present invention, in that (1) it distributes the fluid entering through the nipples across the width of the flow channel; (2) it induces turbulent fluid flow in the space formed between the thermally conductive plates; and (3) it propagates compressive forces within the stack, so that compression is overall uniform, thus ensuring a good seal between all elements of the apparatus, which is important for maximizing the efficiency of the apparatus.
- Inducing turbulence in the fluid flow within the open structure body is important, as it prevents laminar flow within the fluid channel, and thus maximizes the efficiency of thermal energy flow and thereby contributes towards maximizing the efficiency of the apparatus.
- the open structure further provides mechanical support to the overall structure. It defines and maintains a uniform gap between the thermally conducting plates. It further defines the thickness of the enclosing resilient gasket in the compressed state and propagates pressure exerted by the end plates through the stack.
- a plurality of sandwiches is created, for the hot and cold fluid, alternately, in as great a number as desired. Between every two sandwiches, a layer of bodies of material is placed within the area covered by the open structure body in the flow channel.
- the bodies of material placed within this area may be of a variety of types, each one providing alternative embodiments of the present invention.
- the bodies of material are comprised of electronic cells, which are cells which, when accommodated in the apparatus according to the present invention, can be used to generate electricity.
- Other types of bodies with alternate responses to thermal energy gradients can be used in alternative embodiments of the invention.
- top and bottom end plates are placed at the top and bottom of the stack and tightened together with threaded rods or equivalent means.
- the resilient gaskets compress until all the thermally conductive plates, the open structure body and the bodies of material come into mechanical contact, thus taking up all additional mechanical stress exerted on the stack by tightening the rods further.
- Figure 1 shows a longitudinal cross section of an improved electronic heat transfer apparatus according to the present invention, in which electronic cells comprise the bodies of material placed between the fluid channels.
- Figure 2 shows an exploded isometric view of the same.
- Figure 3 shows a cross section of an alternative embodiment.
- the construction of the apparatus is in a number of ways similar to the construction of conventional plate heat exchangers with special features to accommodate bodies of material which utilize the thermal energy transfer provided by the apparatus, such as electronic elements. Such bodies of material are commonly constructed with two parallel and flat surfaces through which heat is transferred.
- a first flow channel can be formed that directs hot fluid flow from a first nipple (3), through porous bodies (11,10) into a second nipple (4).
- a second flow channel for a cold fluid can be formed by an arrangement similar to said first flow channel where said cold fluid enters through a first nipple (1), then flows through porous bodies (11,17) and exits through a second nipple (2).
- (8.12.15) are of substantially uniform thickness, said thickness being substantially equal to the thickness of the larger open structured bodies found in the same layer, said open structure bodies (11) having the main purpose of providing mechanical support against pressures exerted by the resilient gasket (13) while at the same time allowing fluid to flow onwards to the larger open structure bodies in the same layer.
- the parts are stacked up in alignment as shown in the exploded view in Fig. 2.
- the resilient gaskets thicker than the bodies they enclose, i.e. electronic cells and open structure bodies, said gaskets will compress when bolts (20) are tightened until the thermally conductive plates (8,12,15,18), the end plates (5,19), the open structure bodies (7,10,17) and electronic cells (14) are all in contact, such that further tightening of the bolts (20) will result in compression of said bodies to the level desired for good thermal conductivity.
- the thickness and stiffness of the resilient gaskets (6,9,13,16) must be controlled such that the final height of the stack causes sufficient surface pressure to hold the internal fluid pressures.
- the open structure bodies (7,10,11,17) may be a wire mesh that allows flow transversally through its web while providing support of uniform thickness at every nodal point in the mesh where two wires cross.
- the wire mesh distributes the flow largely evenly across the width of the flow channel and introduces turbulence that enhances heat transfer.
- the open structure bodies may comprise a labyrinth, or similar arrangement, of one or more wires of substantially uniform diameter, that direct the fluid flow in a pattern that induces suitable flow velocities or turbulence.
- wires lying flat on the adjacent thermally conductive plate their uniform diameter ensures uniform thickness of the open structure bodies thus constructed.
- the open structure bodies may comprise a slice of commonly available open structure materials, such as sintered metals, ceramics or plastics, or foams of the same materials.
- each open structure body as presented in the figures may comprise a plurality of various open structure bodies for the purpose of modifying flow patterns.
- Each open structure body may alternatively be comprised of a plurality of non-open structure bodies, relatively densely spaced, said bodies having the purpose of modifying the flow pattern in the channel, thus generating turbulent fluid flow, as well as maintaining uniform gap between the adjacent thermally conductive plates under pressure.
- the particular open structure body (7) in which no fluid flows needs not be of an open structure but is conveniently made of the same material and cut to the same dimensions as the open structure bodies 10 and 17.
- the purpose of said body (7) is to define the thickness of its enclosing resilient gasket in the compressed state and propagate pressure exerted by the stiff end plates (5,19) through the stack.
- the end plates are preferably made of material of high mechanical stiffness. Such material may be comprised of a thermally conductive material; alternatively, the end plates are comprised of thermally insulating or half-conducting material, such as plastic or other polymers. In principle however, any material which provides necessary mechanical stiffness can be used.
- the resilient gasket of the first type (13) serves the dual purpose of containing flow that is distributed to the flow channels and matching the surface pressure exerted on the thermally conductive plates (12,15) by the thinner resilient gaskets (9,16), so as to preserve the flatness of said thermally conductive plates.
- each of the four round parts of the resilient gasket of the first type (13) may comprise a duct of length equal to the thickness of the electronic cells (14) suitably sealed against the thermally conductive plates (12,15) with an o-ring or other equivalent means.
- the straight segments of the resilient gasket of thicker type (13) may alternatively be made of any substantially rigid material of thickness equal to the thickness of the electronic cells (14) and preferably of low thermal conductivity.
- the resilient gaskets may alternatively be laid out in other shapes that serve the same function as presented, including additional members to enhance separation between the thermally conducting plates.
- the thermally conductive plates (8,12,15,18) may alternatively be stamped or machined in a shape that constrains movement of the resilient gaskets.
- the entire assembly can be extended easily by repeating the layers comprising bodies 9,10,11,12,13,14 and 15 in such a way that hot and cold flow channels are formed alternately with bodies of material, such as electronic cells, in contact with two adjacent channels.
- FIG 3 an alternative embodiment of the present invention is described.
- This particular embodiment represents a simplified embodiment suitable when a single layer of electronic cells is accommodated. Further, this embodiment can be made in a relatively inexpensive and efficient manner.
- two stiff end plates of principally identical design (23) replace the two end plates (5) and (19), each of the plates (23) having a first nipple (1,3) for fluid inlet and a second nipple (2,4) for fluid outlet.
- the stiff end plates may be comprised of thermally conducting material; in principle however, any suitable stiff material may be used.
- a stack of elements comprising a first open structure body (10), a first thermally conductive plate (12), a suitable number of electronic cells (14), a second thermally conductive plate (15), and a second open structure body (17), is clamped between said stiff end plates (23).
- thermally conductive plates are circular in shape, matching a ring (21) that encompasses said stack.
- seals such as o-rings (22) are placed at the outer rim of each of the first and second thermally conductive plates, lining said rims and enclosing each of the first and second porous bodies.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2003206124A AU2003206124A1 (en) | 2002-02-22 | 2003-02-03 | A heat transfer apparatus |
IS7466A IS7466A (is) | 2002-02-22 | 2004-09-22 | A heat transfer apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IS6280 | 2002-02-22 | ||
IS6280 | 2002-02-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003071198A1 true WO2003071198A1 (fr) | 2003-08-28 |
Family
ID=36701244
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IS2003/000007 WO2003071198A1 (fr) | 2002-02-22 | 2003-02-03 | Appareil de transfert de chaleur |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2003206124A1 (fr) |
IS (1) | IS7466A (fr) |
WO (1) | WO2003071198A1 (fr) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004054007A2 (fr) * | 2002-12-09 | 2004-06-24 | M.T.R.E Advanced Technologies Ltd. | Appareil, systeme et procede de transfert de chaleur |
WO2010039086A1 (fr) * | 2008-10-03 | 2010-04-08 | Alfa Laval Corporate Ab | Échangeur thermique à plaques |
DE102009025046A1 (de) * | 2009-06-10 | 2010-12-16 | Behr Gmbh & Co. Kg | Vorrichtung zur elektrischen Abgaswärmenutzung und Verfahren zur Herstellung einer Vorrichtung zur elektrischen Abgaswärmenutzung |
WO2011056333A1 (fr) * | 2009-11-06 | 2011-05-12 | The Boeing Company | Ensemble générateur thermoélectrique et système |
WO2011060951A3 (fr) * | 2009-11-20 | 2011-07-21 | Getes Geothermie Ag | Dispositif de génération de courant |
US8227682B2 (en) | 2003-04-17 | 2012-07-24 | Watts Thermoelectric, Llc | Same plane multiple thermoelectric mounting system |
EP2503611A3 (fr) * | 2011-03-25 | 2013-07-17 | Kabushiki Kaisha Toyota Jidoshokki | Unité de conversion thermoélectrique |
WO2014055808A1 (fr) * | 2012-10-04 | 2014-04-10 | Marlow Industries, Inc. | Système de production d'énergie thermoélectrique |
WO2019073426A1 (fr) * | 2017-10-12 | 2019-04-18 | Amit Garg | Appareil flexible et modulaire de transfert de chaleur thermoélectrique |
US20200031242A1 (en) * | 2015-06-10 | 2020-01-30 | Gentherm Inc. | Thermoelectric module with thermal isolation features for vehicle battery |
EP3677863A1 (fr) * | 2019-01-04 | 2020-07-08 | Christian Hug | Plaques en matériau composite formant échangeur de chaleur |
DE102019114643A1 (de) * | 2019-05-31 | 2020-12-03 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Thermoelektrische Generatorvorrichtung mit mindestens einem Abstandshalter |
US11031536B2 (en) | 2015-06-10 | 2021-06-08 | Gentherm Incorporated | Vehicle battery thermoelectric device with integrated cold plate assembly and method of assembling same |
EP3823052A4 (fr) * | 2018-07-09 | 2022-04-06 | LG Innotek Co., Ltd. | Dispositif de conversion de chaleur |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5584183A (en) * | 1994-02-18 | 1996-12-17 | Solid State Cooling Systems | Thermoelectric heat exchanger |
US6236810B1 (en) * | 1996-12-03 | 2001-05-22 | Komatsu, Ltd. | Fluid temperature control device |
WO2002086980A1 (fr) * | 2001-04-24 | 2002-10-31 | Top-Cool Holding B.V. | Systeme electrique de refroidissement |
-
2003
- 2003-02-03 WO PCT/IS2003/000007 patent/WO2003071198A1/fr not_active Application Discontinuation
- 2003-02-03 AU AU2003206124A patent/AU2003206124A1/en not_active Abandoned
-
2004
- 2004-09-22 IS IS7466A patent/IS7466A/is unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5584183A (en) * | 1994-02-18 | 1996-12-17 | Solid State Cooling Systems | Thermoelectric heat exchanger |
US6236810B1 (en) * | 1996-12-03 | 2001-05-22 | Komatsu, Ltd. | Fluid temperature control device |
WO2002086980A1 (fr) * | 2001-04-24 | 2002-10-31 | Top-Cool Holding B.V. | Systeme electrique de refroidissement |
Cited By (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004054007A3 (fr) * | 2002-12-09 | 2008-01-10 | M T R E Advanced Technologies | Appareil, systeme et procede de transfert de chaleur |
WO2004054007A2 (fr) * | 2002-12-09 | 2004-06-24 | M.T.R.E Advanced Technologies Ltd. | Appareil, systeme et procede de transfert de chaleur |
US8227682B2 (en) | 2003-04-17 | 2012-07-24 | Watts Thermoelectric, Llc | Same plane multiple thermoelectric mounting system |
CN102187171B (zh) * | 2008-10-03 | 2013-08-14 | 阿尔法拉瓦尔股份有限公司 | 板式热交换器 |
WO2010039086A1 (fr) * | 2008-10-03 | 2010-04-08 | Alfa Laval Corporate Ab | Échangeur thermique à plaques |
US9400141B2 (en) | 2008-10-03 | 2016-07-26 | Alfa Laval Corporate Ab | Plate heat exchanger with strengthening sheet |
JP2012504743A (ja) * | 2008-10-03 | 2012-02-23 | アルファ ラヴァル コーポレイト アクチボラゲット | プレート熱交換器 |
DE102009025046A1 (de) * | 2009-06-10 | 2010-12-16 | Behr Gmbh & Co. Kg | Vorrichtung zur elektrischen Abgaswärmenutzung und Verfahren zur Herstellung einer Vorrichtung zur elektrischen Abgaswärmenutzung |
US9112109B2 (en) | 2009-11-06 | 2015-08-18 | The Boeing Company | Thermoelectric generator assembly and system |
WO2011056333A1 (fr) * | 2009-11-06 | 2011-05-12 | The Boeing Company | Ensemble générateur thermoélectrique et système |
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WO2019073426A1 (fr) * | 2017-10-12 | 2019-04-18 | Amit Garg | Appareil flexible et modulaire de transfert de chaleur thermoélectrique |
EP3823052A4 (fr) * | 2018-07-09 | 2022-04-06 | LG Innotek Co., Ltd. | Dispositif de conversion de chaleur |
US11683984B2 (en) | 2018-07-09 | 2023-06-20 | Lg Innotek Co., Ltd. | Heat conversion device |
FR3091581A1 (fr) * | 2019-01-04 | 2020-07-10 | Christian Hug | Plaques en matériau composite formant échangeur de chaleur |
EP3677863A1 (fr) * | 2019-01-04 | 2020-07-08 | Christian Hug | Plaques en matériau composite formant échangeur de chaleur |
DE102019114643A1 (de) * | 2019-05-31 | 2020-12-03 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Thermoelektrische Generatorvorrichtung mit mindestens einem Abstandshalter |
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AU2003206124A1 (en) | 2003-09-09 |
IS7466A (is) | 2004-09-22 |
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