WO2003038894A3 - Chipmodul - Google Patents

Chipmodul Download PDF

Info

Publication number
WO2003038894A3
WO2003038894A3 PCT/DE2002/003425 DE0203425W WO03038894A3 WO 2003038894 A3 WO2003038894 A3 WO 2003038894A3 DE 0203425 W DE0203425 W DE 0203425W WO 03038894 A3 WO03038894 A3 WO 03038894A3
Authority
WO
WIPO (PCT)
Prior art keywords
chip module
chip
frame
inner edges
opposite inner
Prior art date
Application number
PCT/DE2002/003425
Other languages
English (en)
French (fr)
Other versions
WO2003038894A2 (de
Inventor
Andreas Karl
Norbert Koczwara
Boris Mayerhofer
Hans-Georg Mensch
Thomas Spoettl
Original Assignee
Infineon Technologies Ag
Andreas Karl
Norbert Koczwara
Boris Mayerhofer
Hans-Georg Mensch
Thomas Spoettl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag, Andreas Karl, Norbert Koczwara, Boris Mayerhofer, Hans-Georg Mensch, Thomas Spoettl filed Critical Infineon Technologies Ag
Publication of WO2003038894A2 publication Critical patent/WO2003038894A2/de
Publication of WO2003038894A3 publication Critical patent/WO2003038894A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electrotherapy Devices (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Es ist ein Chipmodul vorgesehen, das aus einem rechteckförmigen Halterahmen und einem Chip besteht, der zumindest an zwei sich gegenüberliegenden Innenkanten des Rahmens aufliegt. Dabei ist der Chip mit dem Rahmen an nur einer dieser zwei sich gegenüberliegenden Innenkanten mittels einer Besfestigung fest verbunden.
PCT/DE2002/003425 2001-10-19 2002-09-13 Chipmodul WO2003038894A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10151151.5 2001-10-19
DE10151151A DE10151151A1 (de) 2001-10-19 2001-10-19 Chipmodul

Publications (2)

Publication Number Publication Date
WO2003038894A2 WO2003038894A2 (de) 2003-05-08
WO2003038894A3 true WO2003038894A3 (de) 2003-09-25

Family

ID=7702737

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2002/003425 WO2003038894A2 (de) 2001-10-19 2002-09-13 Chipmodul

Country Status (3)

Country Link
DE (1) DE10151151A1 (de)
TW (1) TW584947B (de)
WO (1) WO2003038894A2 (de)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0562550A1 (de) * 1992-03-23 1993-09-29 Nec Corporation Chipträger für optische Vorrichtung
US5321204A (en) * 1990-10-13 1994-06-14 Gold Star Electron Co., Ltd. Structure of charged coupled device
WO1998008191A1 (de) * 1996-08-22 1998-02-26 Pav Card Gmbh Verfahren zur herstellung einer elektrischen und mechanischen verbindung eines moduls in einer ausnehmung eines kartenträgers
EP0941696A1 (de) * 1998-03-03 1999-09-15 Siemens Aktiengesellschaft Fingertippsensor mit integriertem Tastschalter
WO2001017033A1 (fr) * 1999-09-02 2001-03-08 Stmicroelectronics S.A. Procede de mise en boitier d'une puce de semi-conducteur contenant des capteurs et boitier obtenu

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5321204A (en) * 1990-10-13 1994-06-14 Gold Star Electron Co., Ltd. Structure of charged coupled device
EP0562550A1 (de) * 1992-03-23 1993-09-29 Nec Corporation Chipträger für optische Vorrichtung
WO1998008191A1 (de) * 1996-08-22 1998-02-26 Pav Card Gmbh Verfahren zur herstellung einer elektrischen und mechanischen verbindung eines moduls in einer ausnehmung eines kartenträgers
EP0941696A1 (de) * 1998-03-03 1999-09-15 Siemens Aktiengesellschaft Fingertippsensor mit integriertem Tastschalter
WO2001017033A1 (fr) * 1999-09-02 2001-03-08 Stmicroelectronics S.A. Procede de mise en boitier d'une puce de semi-conducteur contenant des capteurs et boitier obtenu

Also Published As

Publication number Publication date
DE10151151A1 (de) 2002-06-13
TW584947B (en) 2004-04-21
WO2003038894A2 (de) 2003-05-08

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