WO2003036693A3 - Procede et systeme permettant des contacts electriques pour des procedes de traitement electrolytique - Google Patents

Procede et systeme permettant des contacts electriques pour des procedes de traitement electrolytique Download PDF

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Publication number
WO2003036693A3
WO2003036693A3 PCT/US2002/034633 US0234633W WO03036693A3 WO 2003036693 A3 WO2003036693 A3 WO 2003036693A3 US 0234633 W US0234633 W US 0234633W WO 03036693 A3 WO03036693 A3 WO 03036693A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrical contacts
provide electrical
processes
electrotreating
electrotreating processes
Prior art date
Application number
PCT/US2002/034633
Other languages
English (en)
Other versions
WO2003036693A2 (fr
Inventor
Bulent M Basol
Homayoun Talieh
Boguslaw A Nagorski
Cyprian E Uzoh
Jeffrey A Bogart
Original Assignee
Nutool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nutool Inc filed Critical Nutool Inc
Priority to KR10-2004-7006065A priority Critical patent/KR20040070342A/ko
Priority to JP2003539084A priority patent/JP2005507170A/ja
Priority to EP02786571A priority patent/EP1444722A2/fr
Priority to AU2002350038A priority patent/AU2002350038A1/en
Publication of WO2003036693A2 publication Critical patent/WO2003036693A2/fr
Publication of WO2003036693A3 publication Critical patent/WO2003036693A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Sustainable Development (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

La présente invention concerne des systèmes et des procédés permettant des contacts électriques sur une pièce à usiner pour faciliter les procédés de traitement électrolytique, notamment les procédés d'électrodéposition et d'attaque électrochimique.
PCT/US2002/034633 2001-10-26 2002-10-28 Procede et systeme permettant des contacts electriques pour des procedes de traitement electrolytique WO2003036693A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR10-2004-7006065A KR20040070342A (ko) 2001-10-26 2002-10-28 전기처리 공정용 전기 콘택을 제공하는 방법 및 시스템
JP2003539084A JP2005507170A (ja) 2001-10-26 2002-10-28 電気的処理プロセスのための電気接点を形成する方法及びシステム
EP02786571A EP1444722A2 (fr) 2001-10-26 2002-10-28 Procede et systeme permettant des contacts electriques pour des procedes de traitement electrolytique
AU2002350038A AU2002350038A1 (en) 2001-10-26 2002-10-28 Method and system to provide electrical contacts for electrotreating processes

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34875801P 2001-10-26 2001-10-26
US60/348,758 2001-10-26

Publications (2)

Publication Number Publication Date
WO2003036693A2 WO2003036693A2 (fr) 2003-05-01
WO2003036693A3 true WO2003036693A3 (fr) 2003-11-13

Family

ID=23369412

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/034633 WO2003036693A2 (fr) 2001-10-26 2002-10-28 Procede et systeme permettant des contacts electriques pour des procedes de traitement electrolytique

Country Status (7)

Country Link
EP (1) EP1444722A2 (fr)
JP (1) JP2005507170A (fr)
KR (1) KR20040070342A (fr)
CN (1) CN1316557C (fr)
AU (1) AU2002350038A1 (fr)
TW (1) TWI223848B (fr)
WO (1) WO2003036693A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102353480B (zh) * 2011-07-12 2013-05-08 北京邮电大学 一种法向压力施加装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6156167A (en) * 1997-11-13 2000-12-05 Novellus Systems, Inc. Clamshell apparatus for electrochemically treating semiconductor wafers
US20010000396A1 (en) * 1998-11-30 2001-04-26 Applied Materials Inc. Electric contact element for electrochemical deposition system
WO2001071066A1 (fr) * 2000-03-17 2001-09-27 Nu Tool Inc. Dispositif assurant le contact electrique avec la surface d'une piece semiconductrice pendant le depot du revetement metallique
US20010035354A1 (en) * 2000-05-12 2001-11-01 Nu Tool Inc. Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing
US20020053516A1 (en) * 2000-11-03 2002-05-09 Basol Bulent M. Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6001235A (en) * 1997-06-23 1999-12-14 International Business Machines Corporation Rotary plater with radially distributed plating solution
US6132587A (en) * 1998-10-19 2000-10-17 Jorne; Jacob Uniform electroplating of wafers
US6251236B1 (en) * 1998-11-30 2001-06-26 Applied Materials, Inc. Cathode contact ring for electrochemical deposition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6156167A (en) * 1997-11-13 2000-12-05 Novellus Systems, Inc. Clamshell apparatus for electrochemically treating semiconductor wafers
US20010000396A1 (en) * 1998-11-30 2001-04-26 Applied Materials Inc. Electric contact element for electrochemical deposition system
WO2001071066A1 (fr) * 2000-03-17 2001-09-27 Nu Tool Inc. Dispositif assurant le contact electrique avec la surface d'une piece semiconductrice pendant le depot du revetement metallique
US20010035354A1 (en) * 2000-05-12 2001-11-01 Nu Tool Inc. Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing
US20020053516A1 (en) * 2000-11-03 2002-05-09 Basol Bulent M. Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate

Also Published As

Publication number Publication date
CN1316557C (zh) 2007-05-16
AU2002350038A1 (en) 2003-05-06
TWI223848B (en) 2004-11-11
JP2005507170A (ja) 2005-03-10
TW200300577A (en) 2003-06-01
WO2003036693A2 (fr) 2003-05-01
CN1636266A (zh) 2005-07-06
KR20040070342A (ko) 2004-08-07
EP1444722A2 (fr) 2004-08-11

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