WO2003031994B1 - Socket and contact of semiconductor package - Google Patents

Socket and contact of semiconductor package

Info

Publication number
WO2003031994B1
WO2003031994B1 PCT/US2002/031443 US0231443W WO03031994B1 WO 2003031994 B1 WO2003031994 B1 WO 2003031994B1 US 0231443 W US0231443 W US 0231443W WO 03031994 B1 WO03031994 B1 WO 03031994B1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
socket
piece
semiconductor package
upright piece
Prior art date
Application number
PCT/US2002/031443
Other languages
French (fr)
Other versions
WO2003031994A1 (en
Inventor
Kiyoshi Adachi
Masanori Yagi
Original Assignee
Molex Inc
Kiyoshi Adachi
Masanori Yagi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc, Kiyoshi Adachi, Masanori Yagi filed Critical Molex Inc
Priority to US10/488,716 priority Critical patent/US6981881B2/en
Publication of WO2003031994A1 publication Critical patent/WO2003031994A1/en
Publication of WO2003031994B1 publication Critical patent/WO2003031994B1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

The present invention is directed to a socket connector (TS) having a plurality of contacts to be brought into contact with a plurality of solder balls (S) of a semiconductor package, a socket body (15) in which a mounting hole (11) is provided for each contact (10), a through-hole pierced in a height direction of the socket body and a contact support hole (13) are provided. Each contact (10) is provided with an upright piece (101) extending through the through-hole, a support piece extending from a proximal end side of the upright piece to be inserted into the through-hole and a contact portion (103) formed at a free end portion of the upright piece to be brought into contact with the solder ball. Each contact portion is arranged at a height level such that it projects from the surface of the socket body. A guide projection (14) is provided at a position to face an associated contact portion of each contact. These contact portion and guide projection are set at an interval such that the solder ball may be brought into contact with the both.

Claims

AMENDED CLAIMS[Received by the International Bureau on 09 May 2003 (09.05.03); original claims 1-15 replaced by amended claims 1-15(3 pages)]
1. A socket of a semiconductor package comprising a plurality of contacts to be brought into contact with a plurality of solder balls arranged on one side of the semiconductor package and a socket body in which a plurality of mounting holes are provided for mounting the respective contacts, wherein said mounting hole is provided with a through-hole pierced in a height direction of the socket body and a contact support hole, characterized in that: each of said contacts is provided with an upright piece extending through the through-hole, a support piece extending from a proximal end side of the upright piece to be inserted into the through-hole, and a contact portion formed at a free end portion of the upright piece to be brought into contact with the solder ball; said each contact portion is arranged at a height level such that it projects from the surface of the socket body and a guide projection is provided on the surface of the socket body at a position to face an associated contact portion of each contact; and said contact portion and guide projection are set at an interval such that the solder ball may be brought into contact with both the contact portion and the guide projection.
2. The socket of a semiconductor package according to claim 1, wherein said through-hole is set to a size such that the upright piece may be shifted within its interior.
3. The socket of a semiconductor package according to claim 1, wherein a slant surface having a downward gradient toward the through-hole is formed in the projection.
4. The socket of a semiconductor package according to claim 1, wherein the surface of the contact portion of the contact is formed into a curved surface extending in a direction moving further away from the guide projection.
5. The socket of a semiconductor package according to claim 1 , wherein the support piece includes a pull-off preventing projection to be received in the support hole. 17
6. The socket of a semiconductor package according to claim 1 , wherein said socket body is formed into a planar shape, and the contact portion of each extends above a surface of the socket body.
7. The socket of a semiconductor package according to claim 1 , wherein the proximal end portion of each contact is arranged on a substrate mounting surface of said socket body, and each proximal end portion projects from the substrate mounting surface.
8. The socket of a semiconductor package according to claim 1 , wherein a recess portion having a uniform depth is provided on a surface side of the socket body and the contact portion of each contact is exposed within the recess portion.
9. The socket of a semiconductor package according to claim 1 , wherein a U-shaped curved portion is formed between the upright piece and the support piece of the contact.
10. The socket of a semiconductor package according to claim 1, wherein each contact includes a reactive piece extending from the contact portion.
11. A contact for being mounted on a socket body to be brought into contact with each of a plurality of solder balls arranged on one surface of a semiconductor package, characterized in that: said contact comprises an upright piece formed with contact portions to be brought into contact with solder balls at a free end portion, a support piece extending from a proximal end side of the upright piece so that the upright piece is supported to a socket body, and a U-shaped curved portion provided between the support piece and the upright piece.
12. The contact according to claim 11 wherein said contact portion is formed to be a curved surface extending in a direction moving further away from the solder ball as it extends toward the free end of the upright piece. 18
13. The contact according to claim 11, wherein said upright piece is provided with a reaction piece extending from the contact portion.
14. The contact according to claim 11, wherein said contact includes a reaction piece formed between the contact portion and the free end of the upright piece.
15. The contact according to claim 11 , wherein said upright piece is provided with a reaction piece, the reaction piece is formed between the contact portion curved in an inverted U- shape and the free end of the upright piece, and the free end is in contact with and supported to the socket body to thereby generate reaction force in the reaction piece.
PCT/US2002/031443 2001-10-05 2002-10-02 Socket and contact of semiconductor package WO2003031994A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/488,716 US6981881B2 (en) 2001-10-05 2002-10-02 Socket and contact of semiconductor package

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001309954A JP3977621B2 (en) 2001-10-05 2001-10-05 Semiconductor package sockets and contacts
JP2001/309954 2001-10-05

Publications (2)

Publication Number Publication Date
WO2003031994A1 WO2003031994A1 (en) 2003-04-17
WO2003031994B1 true WO2003031994B1 (en) 2003-08-21

Family

ID=19129017

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/031443 WO2003031994A1 (en) 2001-10-05 2002-10-02 Socket and contact of semiconductor package

Country Status (4)

Country Link
JP (1) JP3977621B2 (en)
CN (1) CN1281965C (en)
TW (1) TW560762U (en)
WO (1) WO2003031994A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007234604A (en) * 2003-07-29 2007-09-13 Advantest Corp Socket and test apparatus
EP1650837A4 (en) * 2003-07-29 2007-12-26 Advantest Corp Socket, and testing device
WO2006114828A1 (en) * 2005-04-06 2006-11-02 Advantest Corporation Socket and electronic component testing apparatus using such socket
JP3964440B2 (en) 2005-10-07 2007-08-22 タイコエレクトロニクスアンプ株式会社 Contacts and electrical connectors
JP4749479B2 (en) * 2008-07-31 2011-08-17 山一電機株式会社 Contact and IC socket using the same
JP2010118275A (en) 2008-11-13 2010-05-27 Yamaichi Electronics Co Ltd Socket for semiconductor device
JP2011191187A (en) * 2010-03-15 2011-09-29 Nhk Spring Co Ltd Contact probe and probe unit
CN104300323A (en) * 2013-07-19 2015-01-21 中国探针股份有限公司 Connector combination
CN105719730B (en) * 2016-02-05 2017-09-22 燕山大学 A kind of embedded straight line segmentation shape of a hoof flexible electronic device crosslinking conductor structure
KR101944693B1 (en) * 2018-12-04 2019-02-01 황동원 BGA Socket device for testing an BGA IC

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5419710A (en) * 1994-06-10 1995-05-30 Pfaff; Wayne K. Mounting apparatus for ball grid array device
US6069481A (en) * 1995-10-31 2000-05-30 Advantest Corporation Socket for measuring a ball grid array semiconductor
JPH11233216A (en) * 1998-02-16 1999-08-27 Nippon Denki Factory Engineering Kk Ic socket for test

Also Published As

Publication number Publication date
JP2003123924A (en) 2003-04-25
TW560762U (en) 2003-11-01
WO2003031994A1 (en) 2003-04-17
JP3977621B2 (en) 2007-09-19
CN1281965C (en) 2006-10-25
CN1564947A (en) 2005-01-12

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