JP2003123924A - Socket of semiconductor package and contact - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology capable of reducing self-inductance, realizing high density, and reducing the size by further lowering the height of a socket, while taking into consideration contact reliability of contact point parts. SOLUTION: This socket has a plurality of contacts 10 for contacting with a plurality of solder balls S of a semiconductor package 1, a socket body 15 provided with an installing hole 11 of the respective contacts, a through hole 12 penetrating in the height direction of the socket body, and a support hole 13 of the contacts. The respective contacts have an erected piece 101 extending along the through hole, a support piece 102 inserted into the support hole by extending from the base end side 104, and contact point parts 103 formed in a free end part, and contacting the solder balls. The respective contact point parts are arranged in the height projecting from a surface 15a of the socket body. Guide projections 14 are arranged in positions opposed to the contact point parts of the respective contacts. These contact point parts and guide projections are made with intervals to make the solder balls contact both of them.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique of a socket and a contact of a semiconductor package having a plurality of contacts for making contact with a plurality of solder balls arranged on one surface of the semiconductor package.

[0002]

2. Description of the Related Art In recent years, the pitch of integrated circuits has been narrowed due to the demand for miniaturization and high speed of information processing equipment. Along with this, the mounting method is shifting from through holes to surface mounting, and the terminal arrangement is shifting from the peripheral arrangement to the lattice arrangement. Further, a ball grid array (BGA), in which solder balls are arranged in a grid pattern on the lower surface thereof, is becoming mainstream as a surface mountable package even with a grid array.

When a socket is used between a BGA type integrated circuit and a substrate, a burn-in test or a high frequency test of the integrated circuit is performed using a test socket, and the integrated circuit is mounted on the substrate for replacement. I have something to do. In the socket, it is necessary to ensure that all contacts are in contact with both the terminals of the integrated circuit and the terminals formed on the substrate in order to ensure sufficient electrical continuity.

On the other hand, as the degree of integration and operating speed of integrated circuits increase, it is required to reduce the inductance for higher speed clocks. In order to meet this requirement, it is necessary to make the current passing distance in the contact (between the contact portions) interposed between the terminal of the integrated circuit and the terminal of the substrate as short as possible.

Conventionally, as a socket of a semiconductor package having a plurality of solder balls arranged in a grid pattern, for example, one described in Japanese Patent Application Laid-Open No. 8-222335 is known.

The socket 300 described in the publication is shown in FIG.
~ Equipped with contacts 305 as shown in FIG. The contact 305 is formed by stamping from a metal plate, and has a side wall 301 on both sides and has a substantially U-shaped cross section.
02, a contact piece 303 having a substantially C-shaped elasticity extending from the lower part of the base 302 toward the side wall 301 and extending above the base 302, and a solder ball S of the IC package 400 provided near the tip of the contact piece 303. Contact part 303 that comes into contact with
a and a contact portion 304 protruding from the lower end of the base body 302 to the side opposite to the contact piece 303.

[0007]

In this test socket, the contact piece 303 is formed as an arc-shaped leaf spring because the solder ball S comes into pressure contact with the contact portion 303a. Therefore, it is difficult to shorten the electric path length from the contact portion 303a to the contact portion 304, the self-inductance cannot be reduced, and the semiconductor package cannot be tested or evaluated with high accuracy in a high frequency region. . Further, most of the one surface of the contact piece 303 is in pressure contact with the inner wall of the contact pressure inlet, so that it is difficult to elastically deform.

A socket shown in FIG. 15 is known as a technique for dealing with such a problem. This is one in which a contact 310 processed into a substantially U shape is press-fitted and fixed in a socket body 311, and the standing piece 3 excluding a fixing region 312.
The portion 13 is configured to be elastically deformable. Thus, the standing piece 313 is elastically deformed when the contact portion 314 comes into contact with the solder ball 315, so that the solder ball 315 is not damaged. In addition, we are working to reduce the height (thinner) of the socket.

However, this socket technology also has the following problems to be solved. That is, it is a problem to meet the demand for further height reduction of the socket. In the socket shown in FIG. 15, the presence of the fixing region 312 shortens the length of the elastically deformable standing piece 313. for that reason,
There is a problem that it is difficult to achieve a further height reduction. Further, since the maximum dimension α of the contact 310 becomes long, there is also a problem that the inductance cannot be further reduced.

In particular, regarding the height reduction of the socket, when the height of the elastically deformable standing piece 313 is shortened due to the further height reduction, the elasticity is lowered and the load on the solder ball 315 is increased, which causes damage. The problem arises.

As a technique for reducing the height of the socket,
There is a contact sheet technology described in JP 2001-167857 A. This is a contact spring configured by a plurality of cantilever beams having a spherical terminal holding portion.

In the contact sheet described in the above publication, all of the cantilever beams are arranged in a plane with respect to the sheet, and therefore, the advantage that it can be made thinner can be obtained, but there is a problem that it cannot be arranged in high density. . That is, since a plurality of cantilever beams are laid flat on each other, the area occupied by one contact spring becomes large, and accordingly, the contact spring cannot be densely arranged.

Further, in the prior art, since the contact itself has a complicated shape and a plurality of cantilever beams are used for one spherical terminal, there is a problem in that assembly takes time and costs are increased. It was

An object of the present invention is to reduce the self-inductance by further reducing the height of the socket, and also to increase the density, and in consideration of contact reliability of contact parts and cost reduction. It is to provide a technology of a socket and a contact of a semiconductor package.

[0015]

The present invention has the following features to attain the object mentioned above.

A semiconductor package socket according to the present invention has a plurality of contacts for contacting a plurality of solder balls arranged on one side of the semiconductor package, respectively.
A socket body provided with a plurality of mounting holes for mounting each contact. The mounting hole includes a through hole penetrating in the height direction of the socket body and a contact support hole. Each contact has a raised piece extending along the through hole,
A support piece extending from the base end side of the upstanding piece and inserted into the support hole, and a contact portion formed at the free end portion of the upstanding piece and contacting the solder ball are provided. Each contact portion is arranged at a height protruding from the surface of the socket body. Guide protrusions are provided on the surface of the socket body at positions facing the contact portions of the contacts, and the contact portions and the guide protrusions are
The spacing is set so that the solder balls contact both of them.

According to the present invention, the mounting hole of the contact includes the through hole and the support hole, and the contact includes the upright piece extending along the through hole, and the support piece extending from the upright piece and inserted into the support hole. Equipped with. Therefore, the upright piece is elastically deformable by being supported by the support piece. As a result, the entire length of the standing piece can be effectively used as an elastically deformable portion. Thereby, the self-inductance can be reduced by further reducing the height of the socket. In addition, since the upright piece has a form extending along the through hole, higher density can be achieved as compared with the case where the contacts are arranged in a plane.
Further, on the surface of the socket body, guide protrusions are provided at positions facing the contact portions of the respective contacts, and the contact portions and the guide protrusions are set at intervals so that the solder balls come into contact with them. Therefore, the contact portion of the contact and the guide protrusion of the socket body come into contact with one solder ball. Since the guide protrusion is formed on the socket body, the contact itself may have only one simple shape, and the cost can be reduced accordingly.

It is desirable that the through hole is set to have a size such that the upright piece can be displaced therein. By setting such that the upright piece can be displaced inside the through hole in this way, the upright piece can be made into a free form without restraining the entire upright piece, and the independence of the upright piece can be enhanced. This makes it possible to construct a durable contact by setting the length of the effective spring portion as the total length of the standing piece.

The guide projection is formed with an inclined surface having a downward slope toward the through hole, and the surface of the contact portion of the contact is formed as a curved surface extending away from the inclined surface toward the free end of the standing piece. It is desirable that
When the inclined surface and the curved surface are provided as described above, they serve as guide surfaces to exert the function of smoothly guiding the solder ball to the intended relative position. In particular, since the curved surface of the contact portion of the contact easily slides on the solder ball, which is a spherical surface, it is possible to make contact with a low frictional force. As a result, it is possible to improve the reliability of contact and realize a low load on the solder balls.

It is desirable that the support piece be provided with a retaining projection for the support hole. The retainer protrusion can securely fix the support piece in the support hole.

The socket body is formed in a plate shape, the contact portions of the contacts are arranged on the front surface side, the base end portions of the contacts are arranged on the rear surface side, and the base end portions project from the rear surface. Is desirable. According to this structure, since the base end portion of each contact projects from the back surface of the socket body, the base end portion can be directly used as a terminal. For example, a socket may be arranged on the circuit board, and the base end of each contact may be brought into contact with a terminal provided on the surface of the circuit board. As a result, the entire length of the upright piece can be effectively used, and this also contributes to height reduction.

The socket main body may be provided with a recess having a uniform depth on the surface side, and the contact portions of the respective contacts are exposed in the recess. By providing a recess on the surface side of the socket body, it is possible to expose the contact portion of each contact and give each contact portion a greater degree of freedom. As a result, the size of the through hole can be designed to be small.

It is desirable that a U-shaped curved portion be formed between the upright piece and the support piece of the contact.
The U-shaped curved portion exerts the action of making the upright piece elastically deformable and the action of making the support piece substantially parallel to the upright piece. Accordingly, the support piece can be easily inserted and inserted into the support hole.

On the other hand, the contact according to the present invention is mounted on the socket body in order to contact a plurality of solder balls arranged on one side of the semiconductor package, and is formed by processing a conductive metal plate. And a standing piece having a contact portion for the solder ball formed on the free end,
The support piece is provided with a support piece extending from the base end side of the upright piece to support the upright piece on the socket body, and a U-shaped curved portion provided between the support piece and the upright piece.

According to the contact of the present invention, the upright piece and the support piece are provided, and the support piece extends from the base end side of the upright piece.
Therefore, the upright piece is elastically deformable by being supported by the support piece. As a result, the entire length of the standing piece from the free end to the base end can be effectively used as an elastically deformable portion. Thereby, the self-inductance can be reduced by further reducing the height of the socket. Since the U-shaped curved portion is formed between the support piece and the upright piece, the upright piece is elastically deformably supported by the support piece, and the distance between the support piece and the upright piece is maintained.

It is desirable that the contact portion is formed as a curved surface extending in a direction away from the solder ball toward the free end of the standing piece. Since the curved surface of the contact portion is slippery with respect to the solder ball, which is a spherical surface, it is possible to make contact with a low frictional force. As a result, it is possible to improve the reliability of contact and realize a low load on the solder balls.

The upright piece includes a reaction force piece, which is formed between a contact portion curved in an inverted U shape and a free end of the upright piece, the free end contacting and supporting the socket body. By doing so, a repulsive force may be generated in the reaction piece. With this structure, the contact force of the contact portion with respect to the solder ball can be increased.

[0028]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the accompanying FIGS. FIG. 1 is a plan view of a socket (test socket) of a semiconductor package according to an embodiment of the present invention. 2 is the X of FIG.
It is a -X sectional view. FIG. 3 is a sectional view taken along line YY of FIG.
FIG. 4 is an enlarged perspective view of the contact.

The test socket TS shown in these figures is
One side (bottom surface) of the plurality of solder balls S arranged in a grid pattern
BGA (Ball Grid Arra) of the semiconductor package 1 in
y) This is a socket for test evaluation.

This test socket TS is provided with a plurality of contacts 10 arranged in a grid corresponding to the arrangement of the solder balls S of the semiconductor package 1 and a plurality of mounting holes 11 for mounting the respective contacts 10. And a main body (housing) 15. The mounting hole 11 includes a through hole 12 penetrating in the height direction of the socket body 15 and a contact 1.
0 supporting holes 13. The support hole 13 is the through hole 12.
It is provided in the form of being independent next to, and opens on the back surface 15b of the socket body 15.

Each contact 10 has a through hole 12
The upright piece 101 extends along with the upright piece 101, and the upright piece 101 extends from the upright piece 101 and is inserted into the support hole 13. A contact portion 103 that contacts the solder ball S is formed at a free end (upper end portion) of the standing piece 101.
The support piece 102 extends from a base end portion (lower end portion) 104 of the.

Each contact portion 103 is arranged at a height protruding from the surface 15a of the socket body 15. Guide protrusions 14 are provided on the surface 15 a of the socket body 15 at positions facing the contact portions 103 of the contacts 10. The contact portion 103 and the guide protrusion 14 are
It is set to an interval where the solder balls S are in contact with both of them.

The guide protrusion 14 is formed with an inclined surface 141 having a downward slope toward the through hole 12. The surface of the contact portion 103 arranged at a position facing the inclined surface 141 is formed as a curved surface extending in a direction away from the inclined surface 141 toward the free end (upper end) of the standing piece 101. Specifically, it is formed into an arcuate curved surface that bulges toward the inclined surface 141 side.

The contact portion 10 having a curved surface in this way
3 and the inclined surface 141 are provided so that they serve as guide surfaces and can exert an action of smoothly guiding the solder ball S to a target relative position. In particular, the curved surface of the contact portion 103 is a spherical solder ball S.
Since it is slippery, it can be contacted with low friction.
As a result, it is possible to improve the reliability of contact and to make a low-load contact with the solder ball S.

The size of the through hole 12 of the mounting hole 11 is set so that the standing piece 101 can be displaced therein. That is, as shown in FIGS. 6 to 8, the shape of the through hole 12 itself is sufficiently larger than the cross-sectional shape of the standing piece 12. Here, it is formed in a plane rectangle. By setting the upright pieces 101 so that they can be easily displaced inside the through hole 12, a free form that does not restrain the entire upright pieces 101 is taken into consideration, and consideration is given to increasing the independence of each upright piece 101. Is.

As a result, a durable contact can be constructed with the length of the effective spring portion as the total length of the standing piece 101. Further, by increasing the elastic force of the spring in this way, the load on the solder ball S at the time of contact with the solder ball S is reduced, and the solder ball S in the thickness direction (height direction) of the socket body 15 is formed. It is also possible to deal with variations in.

The support piece 102 is provided with a retaining projection 105 for the support hole 13. Retaining projection 10
5, the support piece 102 can be securely fixed to the support hole 13, and the support piece 102 can be easily attached to the support hole 13, thereby contributing to the manufacturability.

As shown in FIGS. 6 to 8, the socket body 15 is made of insulating synthetic resin in a plate shape, and the contact portions 103 of the contacts 10 are arranged on the surface 15a side thereof (see FIG. 9). The base end portions 104 of the contacts 10 are arranged on the back surface 15b side (see FIG. 10), and each base end portion 104 projects from the back surface 15b.

That is, the base end portion 104 of the contact 10 is projected from the back surface 15b of the socket body 15 so that the base end portion 104 can be directly used as a terminal. Here, the test socket TS is arranged on the circuit board 20, and the base end portion 104 of each contact 10 is brought into contact with the terminal 21 provided on the surface of the circuit board 20. As a result, the entire length of the upright piece 101 can be effectively used, and this also contributes to height reduction.

The socket body 15 is provided with a recess 16 having a uniform depth on the surface 15a side, and at least the contact portion 103 of each contact 10 is exposed in the recess 16. By providing the recess 16 on the surface 15a side of the socket body 15, the contact portions 103 of each contact 10 can be exposed, and a greater degree of freedom can be given to each contact portion 103. As a result, the through hole 12
It is possible to design a small size.

Standing piece 101 of contact 10 and supporting piece 1
A bending portion 106 that bends in a U shape is formed between the bending portion 106 and 02. This curved portion 10
6 is designed so that the standing piece 101 can be elastically deformed and the supporting piece 102 can be made substantially parallel to the standing piece 101. Here, standing piece 1
The form in which 01 is elastically deformed includes, for example, the case where the upright piece 101 itself is curved, the case where the contact point portion 103 is displaced in the horizontal direction or the vertical direction, and the like.

The distance between the support hole 13 and the through hole 12 on the back surface 15b of the socket body 15 is set smaller than the distance between the upright piece 101 and the support piece 102. The reason for setting in this way is to prevent the standing piece 101 from contacting the inner wall of the through hole 12 and increase the degree of freedom of the standing piece 101.

Considering that the solder ball S has a spherical shape, the contact portion 103 arranged so as to face the inclined surface 141 has a function of separating from the inclined surface 141 by the elasticity of the standing piece 101 when the solder ball S is contacted. receive. In this state, the contact portion 103 has an action of approaching the inclined surface 141. This makes it possible to reliably contact the solder ball S by utilizing the elasticity of the contact and improve the reliability of the contact.

When each contact 10 is mounted in each mounting hole 11, as shown in FIG.
The base end portion 104 of the socket slightly protrudes from the back surface 15b of the socket body 15 to form a contact portion for the terminal 21 of the circuit board 20.

In this embodiment, when the contact 10 is mounted in the mounting hole 11 of the socket body (housing) 15, only the supporting piece 102 is press-fitted into the supporting hole 13, so that the upright piece 101 is vertically moved. It will be possible to move slightly. This makes it possible to absorb variations in the base end portion (tail) 104 that constitutes the contact portion to the circuit board 20.

9 and 10 show the socket body 1
5 is a perspective view of the test socket TS in which the contacts 10 are mounted in all the mounting holes 11 of FIG. Of these, FIG. 10 is a perspective view showing the back surface side for the sake of understanding.

FIG. 11 is an enlarged cross-sectional view of the essential parts showing another embodiment of the present invention. In this embodiment, the shape of the contact 10A is slightly different. Since other configurations are basically the same as those of the previous embodiment, the same components are designated by the same reference numerals to simplify the description.

The contact 10A is the previous contact 10
Similarly, the upright piece 101, the support piece 102, and the contact portion 1
03, a base end portion 104, a retaining protrusion 105, and a U-shaped curved portion 106, a reaction force piece 108 is provided. The reaction piece 108 has a shape in which the contact portion 103 is bent into an inverted U shape and the free end 109 of the upright piece 101 is extended to the inner wall of the through hole 12. The free end 109 has a through hole 12
It is set so that the repulsive force can be obtained by contacting the inner wall of the.

When the solder ball S is arranged between the contact portion 103 and the inclined surface 141, the contact 10A is formed as shown in FIG.
At, elastically deforms as shown by the broken line. At that time, in addition to the repulsive force due to the elastic deformation of the standing piece 101 including the U-shaped curved portion 106, the repulsive force of the reaction force piece 108 is also applied. Therefore, this configuration can be adopted when the contact force of the contact with the solder ball S is weaker than the target contact force.

The present invention is not limited to the BGA type test socket as in the above-described embodiment, but may be a CSP.
The present invention can be applied to all semiconductor package sockets such as (Chipu Size Package) sockets.

[0051]

As described above, according to the present invention, the mounting hole of the contact has the through hole and the supporting hole, and the contact has the standing piece extending along the through hole and the supporting hole extending from the standing piece. And a support piece to be inserted into. Therefore, the upright piece is elastically deformable by being supported by the support piece. as a result,
The entire length of the standing piece can be effectively used as an elastically deformable portion. Thereby, the self-inductance can be reduced by further reducing the height of the socket.

Further, since the upright piece has a form extending along the through hole, it is possible to increase the density as compared with the case where the contacts are arranged in a plane. Also, by increasing the effective spring part of the contact and by pressing only the support piece without pressing the entire contact into the socket body, the degree of freedom of the entire standing piece can be obtained, and the contact part Contact reliability can be improved.

Further, since the contact portion and the guide protrusion are brought into contact with one solder ball and the guide protrusion is formed on the socket body, the contact itself may have only one simple shape, which is low cost. Can be realized.

[Brief description of drawings]

FIG. 1 is a plan view of a test socket according to the present invention.

FIG. 2 is a cross-sectional view taken along line XX of FIG.

3 is a cross-sectional view taken along the line YY of FIG.

FIG. 4 is an enlarged perspective view of a contact according to the present invention.

FIG. 5 shows a contact according to the present invention, (a)
Is a plan view, (b) is a front view, and (c) is a right side view.

FIG. 6 is a plan view of a socket body according to the present invention.

7 is a cross-sectional view taken along line X1-X1 of FIG.

8 is a cross-sectional view taken along the line Y1-Y1 of FIG.

FIG. 9 is a partial perspective view of a test socket according to the present invention.

FIG. 10 is a perspective view of the back surface side of the test socket according to the present invention.

FIG. 11 is a partial enlarged cross-sectional view of a test socket according to another embodiment of the present invention.

FIG. 12 is a cross-sectional view illustrating a conventional test socket.

FIG. 13 is a front view of a contact provided in a conventional test socket.

FIG. 14 is a side view of a contact mounted on a conventional test socket.

FIG. 15 is a partially enlarged sectional view of a conventional test socket.

[Explanation of symbols]

TS test socket 1 Semiconductor package 10, 10A contact 101 Standing piece 102 support piece 103 contact 104 base end 105 retaining protrusion 106 curved part 108 Reaction piece 109 Free end 11 mounting holes 12 through holes 13 Support holes 14 Guide protrusion 141 inclined surface 15 Socket body (housing) 15a surface 15b back side 16 recess 20 circuit board 21 terminals S solder ball

Front page continuation (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01R 13/24 H01R 13/24 (72) Inventor Masanori Yagi 1-5-4 Fukamihigashi, Yamato City, Kanagawa Prefecture Nihon Molex In-house F-term (reference) 2G003 AC01 AD09 AG01 AG12 AH05 2G011 AA06 AA16 AB01 AB06 AB07 AC01 AC14 AC21 AC31 AE22 AF07 5E024 CA18 CB04

Claims (10)

[Claims] 1. A semiconductor package comprising: a plurality of contacts for respectively contacting a plurality of solder balls arranged on one side of a semiconductor package; and a socket main body having a plurality of mounting holes for mounting the respective contacts. Is provided with a through hole penetrating in the height direction of the socket body, and a support hole for the contact, and each of the contacts is provided with a standing piece extending along the through hole, and extending from a base end side of the standing piece. A support piece to be inserted into the support hole and a contact portion formed at a free end of the upright piece and contacting the solder ball are provided, each contact portion having a height protruding from a surface of the socket body. Guide protrusions are provided on the surface of the socket body at positions facing the contact portions of the contacts, and the contact portions and the guide protrusions are provided on both sides of the solder ball. It is set to a distance in contact, the semiconductor package of the socket. 2. The socket of a semiconductor package according to claim 1, wherein the through hole is sized so that the upright piece can be displaced therein. 3. The guide protrusion is formed with an inclined surface having a downward slope toward the through hole, and a surface of the contact portion extends in a direction extending away from the inclined surface toward a free end of the upright piece. The semiconductor package socket according to claim 1, which is formed on the surface. 4. The socket of a semiconductor package according to claim 1, wherein the supporting piece is provided with a retaining protrusion for the supporting hole. 5. The socket body is formed in a plate shape, the contact portions of the contacts are arranged on the front surface side, the base end portions of the contacts are arranged on the rear surface side, and the base end portions project from the rear surface. The socket of the semiconductor package according to claim 1, wherein 6. The semiconductor package according to claim 5, wherein the socket body is provided with a recess having a uniform depth on the front surface side, and the contact portion of each contact is exposed in the recess. Socket. 7. The semiconductor package socket according to claim 1, wherein a U-shaped curved portion is formed between the upright piece and the support piece of the contact. 8. A contact mounted on a socket body for contacting each of a plurality of solder balls arranged on one side of a semiconductor package, the contact being formed by processing a conductive metal plate and having a solder on a free end. A standing piece on which a contact point for the ball is formed, a support piece extending from the base end side of the standing piece to support the standing piece on the socket body, and a U shape provided between the support piece and the standing piece. Contacts with curved parts. 9. The contact according to claim 8, wherein the contact portion is formed on a curved surface extending in a direction away from the solder ball toward a free end of the upright piece. 10. The upright piece comprises a reaction force piece, the reaction force piece being formed between a contact portion curved in an inverted U shape and a free end of the upright piece, the free end contacting the socket body. The contact according to claim 8, wherein the contact piece is configured to generate a repulsive force by being supported by the contact piece.