WO2003031158A1 - Fabrication method at micrometer- and nanometer- scales for generation and control of anisotropy of structural, electrical, optical and optoelectronic properties of thin films of conjugated materials - Google Patents
Fabrication method at micrometer- and nanometer- scales for generation and control of anisotropy of structural, electrical, optical and optoelectronic properties of thin films of conjugated materials Download PDFInfo
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- WO2003031158A1 WO2003031158A1 PCT/EP2002/011218 EP0211218W WO03031158A1 WO 2003031158 A1 WO2003031158 A1 WO 2003031158A1 EP 0211218 W EP0211218 W EP 0211218W WO 03031158 A1 WO03031158 A1 WO 03031158A1
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- Prior art keywords
- mold
- process according
- conjugated
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- derivatives
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- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 4
- VPUGDVKSAQVFFS-UHFFFAOYSA-N coronene Chemical compound C1=C(C2=C34)C=CC3=CC=C(C=C3)C4=C4C3=CC=C(C=C3)C4=C2C3=C1 VPUGDVKSAQVFFS-UHFFFAOYSA-N 0.000 claims description 4
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- YTVNOVQHSGMMOV-UHFFFAOYSA-N naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 claims description 3
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- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 3
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical group C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 2
- XBDYBAVJXHJMNQ-UHFFFAOYSA-N Tetrahydroanthracene Natural products C1=CC=C2C=C(CCCC3)C3=CC2=C1 XBDYBAVJXHJMNQ-UHFFFAOYSA-N 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 239000002738 chelating agent Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 125000003983 fluorenyl group Chemical class C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims description 2
- 229910052733 gallium Inorganic materials 0.000 claims description 2
- QRRKXCPLJGPVHN-UHFFFAOYSA-N hexabenzocoronene Chemical compound C12C(C(=C34)C(=C56)C7=C89)=C%10C7=C7C%11=CC=CC7=C8C=CC=C9C5=CC=CC6=C3C=CC=C4C1=CC=CC2=C1C%10=C%11C=CC1 QRRKXCPLJGPVHN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- 230000001939 inductive effect Effects 0.000 claims description 2
- 229910052763 palladium Inorganic materials 0.000 claims description 2
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 claims description 2
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 claims description 2
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 150000004032 porphyrins Chemical class 0.000 claims description 2
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 2
- 238000003860 storage Methods 0.000 claims description 2
- BIGSSBUECAXJBO-UHFFFAOYSA-N terrylene Chemical group C12=C3C4=CC=C2C(C=25)=CC=CC5=CC=CC=2C1=CC=C3C1=CC=CC2=CC=CC4=C21 BIGSSBUECAXJBO-UHFFFAOYSA-N 0.000 claims description 2
- IFLREYGFSNHWGE-UHFFFAOYSA-N tetracene Chemical compound C1=CC=CC2=CC3=CC4=CC=CC=C4C=C3C=C21 IFLREYGFSNHWGE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 claims description 2
- 125000005287 vanadyl group Chemical group 0.000 claims description 2
- OLBVUFHMDRJKTK-UHFFFAOYSA-N [N].[O] Chemical compound [N].[O] OLBVUFHMDRJKTK-UHFFFAOYSA-N 0.000 claims 1
- 239000007767 bonding agent Substances 0.000 claims 1
- 239000004205 dimethyl polysiloxane Substances 0.000 claims 1
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/005—Surface shaping of articles, e.g. embossing; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
- B29C59/046—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts for layered or coated substantially flat surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0005—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
- B29K2995/0044—Anisotropic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0037—Other properties
- B29K2995/0045—Isotropic
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
Definitions
- the present invention reports a method for micrometer- and nanometer- scale fabrication suitable to generate and control the anisotropy of relevant properties, viz. structural, mechanical, electrical, optical and optoelectronic, of thin films of conjugated materials.
- Conjugated materials consist of organic molecules, coordination compounds, polymers, copolymers and polymeric mixtures, containing functional groups with spatially delocalized pi-electrons on the various component atoms (C, N, O, S). These materials exhibit an optical and electronic behavior similar to inorganic semiconductors (and hence, are often termed organic semiconductors). Moreover, it has been demonstrated that they can behave like metals or superconductors upon appropriate experimental conditions.
- the spatial distribution of pi -electrons in a molecule is generally anisotropic. This implies that the response of an aggregate of molecules in electromagnetic fields, hydrodynamic flow, mechanical forces, can be, in principle, anisotropic depending on the order parameters.
- Conjugated materials are important for the development of innovative technologies such as organic (or plastic) optoelectronics, electronics and photonics. These terms designate a variety of systems, devices, circuits and integrated components (both optical and electronic) where a thin film of a conjugated material, whose thickness ranges between 10 and 1000 nanometers, plays the role of the transport layer of charge or energy in the form of radiation.
- Organic optoelectronics and electronics are alternative technologies with respect to conventional semiconductor technology for a variety of consumers' applications for everyday 's life, because of their low manufacturing cost, with components that are disposable and recyclable with low environmental impact.
- Example products are smart cards (with information coded and modifiable in microprocessors based on a conjugated film on a plastic medium); light-emitting diodes working with molecular and/or polymeric electroluminescent thin film, for producing ultraflat, high- efficiency and ultra-bright, flexible screens; environmental and health sensors with high biological compatibility and low weight; labels for identifying widely used goods (food, clothing, letters, parcels) with information that is accessible at any times, directly and noninvasively; security (credit cards, parcels, letters) and cryptography. It has been estimated that for organic integrated circuits alone, this market will amount to more than 700 million euros toward the end of 2002. The success of this technology relies not only on the peculiar properties of the conjugated material, but also on the effectiveness, simplicity and cost of device manufacturing.
- contact printing and imprinting are the most promising for the fabrication of organic integrated circuits. This is due to the simplicity of the approaches, their compatibility with planar technology, the limited number of processes involved, the lower requirements in terms of energy, environmental cleanness and chemical hazards, and finally to the potential to upscale the process to a cyclic automated form that is repeatable a large number of times over large areas.
- the aim of the present invention is to provide a process that allows one to modify, enhance, mampulate and fabricate the structural organization, order and anisotropy of conjugated molecules and/or macromolecules in a thin film.
- An object of the present invention is to provide a process that is suitable to produce a thin film constituted by isotropic regions and anisotropic regions with higher or different molecular order, and accordingly a spatial modulation, also with a preset periodicity, of the tensor properties that depend on molecular order, such as for example polarizability, hyperpolarizability, dielectric permittivity, linear and nonlinear refractive indices, charge mobility, electrical conductivity, thermal conductivity, magnetization and magnetic susceptibility, elasticity, plasticity and stress.
- Another object of the present invention is to provide a process that can be performed on a large scale and is repeatable for a large number of cycles and can be engineered in an existing and commercial technology.
- Another object of the present invention is to provide a process that allows one to modify, enhance, manipulate and fabricate the structural organization, order and anisotropy of the conjugated molecules in a thin film at length scales ranging from micrometers to nanometers.
- Another object of the present invention is to provide a process for fabricating domains with controlled shape, spatial distribution, and anisotropy in linear and nonlinear optical and electrical responses.
- Another object of the present invention is to provide a process for producing thin films of conjugated materials with specific properties in terms of anisotropy of structural, electrical, optical and optoelectronic properties that is effective, simple and has low production costs.
- the invention provides a process for modifying the tensor properties of a thin film constituted by conjugated materials, which includes the step of placing said film in contact with a mold and applying a molding pressure to said mold.
- the conjugated material can be chosen from the group constituted by conjugated molecules and polymers with a rigid rod-like conjugated unit, crystalline liquid polymers and molecules based on rod-like or biaxial structures.
- the conjugated molecules and the polymers with rod-like conjugated unit are chosen for example from the group constituted by oligothienyls, preferably quater-, quinque-, sexi-, septi-, octothienyls, derivatives thereof with substitutions in the ⁇ and/or ⁇ positions or in the ⁇ or ⁇ ' positions, or in any of the positions ⁇ , ⁇ , ⁇ or ⁇ ', and corresponding regioregular and non-regioregular polymers thereof; oligophenyls, preferably quater-, quinque-, sexi-, septi-, octophenylenes, derivatives thereof with substitutions in the ortho and/or meta positions, corresponding regioregular and non- regioregular
- the material can also be chosen from the group constituted by conjugated molecules and polymers having a disk-like conjugated unit, for example perylene and derivatives thereof, preferably 3,4,9, 10-perylene- tetracarboxylic dianhydride (PTCDA), naphthalenetetracarboxylic dianhydride (NTDA); terrylene, coronene, hexabenzocoronene, with or without substitutions; phthalocyanines and porphyrins preferably with metallic centers of Cu or Zn; crystalline liquid molecules based on a disklike structure.
- PTCDA 10-perylene- tetracarboxylic dianhydride
- NTDA naphthalenetetracarboxylic dianhydride
- terrylene coronene, hexabenzocoronene, with or without substitutions
- phthalocyanines and porphyrins preferably with metallic centers of Cu or Zn
- the material can be chosen from the group constituted by coordination compounds and molecules that have a strong electron anisotropy by way of the electrical dipole, such as tris- (hydroxyquinoline)Al(III), known as Alq3, and its derivatives with different metallic centers such as vanadyl, Pd, Pt, Zn, Ga, In, TI, Sn, rare earth elements, or with different ligands, such as hydroxyquinoline substituted in positions 2 or 4 or 5 and more generally aromatic chelating agents based on oxygen and nitrogen.
- the electrical dipole such as tris- (hydroxyquinoline)Al(III), known as Alq3, and its derivatives with different metallic centers such as vanadyl, Pd, Pt, Zn, Ga, In, TI, Sn, rare earth elements, or with different ligands, such as hydroxyquinoline substituted in positions 2 or 4 or 5 and more generally aromatic chelating agents based on oxygen and nitrogen.
- the tensor properties that can be modified with the process according to the present invention are for example polarizability, dielectric permittivity, refractive index, optical absorption, energy transport, charge mobility, electrical and thermal conductivity, magnetization and magnetic susceptibility, elasticity, plasticity and stress.
- the mold used in the process according to the present invention can be a single protrusion, preferably having characteristic dimensions in the micrometer to nanometer range, or can have multiple protrusions.
- the mold used can be a hard mold, preferably made of chromium, steel silicon nitride or silicon oxide, or a mold made of an elastomeric material, preferably poly-(dimethylsiloxane).
- the printing pressure used in the process according to the present invention can be in the range between 1 and 1000 bar.
- the molding step of the process according to the present invention preferably occurs at a temperature in the range between 0 and 300 °C.
- the mold applies to said film normal and/or lateral static or dynamic forces.
- the printing process can be performed on a large area with respect to the characteristic dimensions of the protrusions of the mold.
- the mold can be applied in a configuration that is perpendicular or tilted with respect to the surface, thus producing a continuous spatial variation of the orientation produced in the thin film.
- the pressure applied to the film by each protrusion can also be controlled individually , for example by means of individually addressable piezoelectric elements.
- Said pressure can be modulated locally, thus inducing a continuous or discrete variety of molecular reorientation.
- Figure 1 is a schematic view of the printing step of the process according to the present invention.
- Figure la is a diagram of the static molding process.
- Figure lb is a diagram of the dynamic molding process performed with a sphere.
- Figure 2 illustrates Raman microscope images of molded lines: (a) width 5 ⁇ m and period 10 ⁇ m (b) width 200 nm and period 1 ⁇ m (c) intensity profiles across the stretching direction of the printed lines in (a). The Raman intensity is higher at the molded lines.
- Figure 3 illustrates the Raman dichroism obtained with a Raman microscope on non-molded regions (a) and molded lines (b).
- the dichroic ratio of the intensities is 1.6 and 2.2 for polarization parallel and perpendicular to the molded lines, respectively.
- molding results in an enhancement of anisotropy in excess of 35% in this case.
- Figure 4 illustrates AFM images at various magnifications, which show the quality of the process on a large area (a) and the granular morphology of the non-molded areas (b).
- the height of the protrusions of the mold is approximately 100 nm, and the topographical depression of the molded lines of only 20 nm indicates that the mold did not make contact with the entire surface of the film,
- (c) illustrates a topographical profile that is normal to the lines molded in (b), showing the depression by approximately 30% of the molded lines with respect to the crests.
- Figure 5 illustrates an experimental apparatus for performing dynamic molding (nano -rubbing).
- the load force is established by means of the counterweights of the rocker and can be set in a range so as to obtain suitable values of the pressure applied to the film, for example between 10 +4 and 10 +5 Pa.
- the translation of the specimen is performed by means of a micrometric xy -stage.
- Figure 6 illustrates an optical image (lOOx magnification) under a polarizing microscope of a thin film of anisotropic conjugated molecules after nano-rubbing by means of a rolling sphere. The strong anisotropy of absorption of white light in the region affected by the process is evident.
- Figure 7 illustrates photoluminescence spectra in the channel subjected to nano-rubbing with a large polarization ratio between the components that are parallel and perpendicular to the rubbing direction.
- the physical principle of the process is based on the fact that thin films of anisotropic conjugated molecules have a viscous stress (shear) tensor that allows the reorientation of the molecules on the x-y plane under the action of a load that is normal along z.
- the molecular reorientation is localized spatially at the regions of the film in contact with the mold. Findings indicate that the onset of the local reorientation effect requires the thin film:
- the value of the nominal pressure required to perform these transformations is on the order of 0.1-10 bar/nm of thickness.
- the effective pressure depends on the contact area determined by the shape of the surface of the mold, on the adaptability and conformability of the conjugated material with respect to the mold, and on the relative planarity of the interfaces.
- the regions of the thin film in contact with the protrusions of the mold are the ones affected by the molecular reorganization process, which therefore is local in character.
- the shape of the mold (for example parallel lines and grooves), can produce an azimuthal orientation and therefore uniaxiality in the molded region.
- the result of the process described here is a thin film in which the molded regions are formed by domains of planarly oriented molecules. The molded regions are thinner than the un-molded ones because of the reduction in thickness caused by the different molecular orientation.
- the temperature must be just above a threshold value (for example the glass transition temperature in a polymer), so as to allow orientational diffusion, but must not reach the melting temperature.
- a threshold value for example the glass transition temperature in a polymer
- the optimum results for thin films of conjugated molecules are obtained at temperatures that are close to, but lower than, the annealing temperature of the material at the pressure of 1 bar. This temperature is generally lower than 200 °C for conjugated molecules of interest in plastic electronics.
- the duration of the molding operation is generally short with respect to the time scale of molecular reorientation and has a long range: 1-10 minutes is long enough to reach a condition of equilibrium in a 50-100 nm film.
- the values of P and T vary according to the materials and the thickness of the thin film.
- the velocity V of the mold with respect to the specimen is also important. Typical values of V are between 1 and 10 mm/sec. Reorientation of the molecules is partly determined by the normal force and partly determined by the lateral friction force between the two surfaces, which acts on the x-y components of the viscous stress tensor.
- the process described in the present invention is demonstrated with single-protrusion molds, such as for example a sphere, or a stylus for scanning probe microscopy, thus for a radius of curvature between several hundred micrometers and a few nanometers.
- the most general case of this invention consists of a mold with multiple protrusions or with fabricated structures of varying complexity in order to induce molecular reorientation in static or dynamic conditions. While thickness modification by static molding is known and covered by international patents (e.g. embossing, nanoimprinting), the effect of local reorientation induced by molding, which is the focus of the present patent, is absolutely original and innovative.
- the molds used to induce molecular reorientation can be hard molds, for example made of chromium, steel, silicon oxide, silicon nitride. It is also possible to use molds made of elastomeric material, for example poly- (dimethy lsiloxane) .
- the process according to the invention allows to perform local changes to the molecular orientation of a thin film by virtue of molds on a large area, controlling the molding conditions as described above.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
- Liquid Crystal Substances (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003534171A JP2005504663A (en) | 2001-10-08 | 2002-10-07 | Manufacturing method for generating and controlling the anisotropy of structural, electrical, optical and photoelectric properties of thin films of conjugated materials on the micrometer and nanometer scales |
US10/490,697 US20040262255A1 (en) | 2001-10-08 | 2002-10-07 | Fabrication method at micrometer-and nanometer-scales for generation and control of anisotropy of structural, electrical, optical and optoelectronic properties of thin films of conjugated materials |
EP02800604A EP1434681A1 (en) | 2001-10-08 | 2002-10-07 | Fabrication method at micrometer- and nanometer- scales for generation and control of anisotropy of structural, electrical, optical and optoelectronic properties of thin films of conjugated materials |
Applications Claiming Priority (2)
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IT2001MI002075A ITMI20012075A1 (en) | 2001-10-08 | 2001-10-08 | PROCEDURE FOR THE CONFERENCE AND CONTROL ON MICRO AND NANOMATRIC STAIRS OF THE STRUCTURAL ELECTRIC PROPERTY AND ANISOTROPY PROPERTIES AND |
ITMI2001A002075 | 2001-10-08 |
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WO2003031158A1 true WO2003031158A1 (en) | 2003-04-17 |
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PCT/EP2002/011218 WO2003031158A1 (en) | 2001-10-08 | 2002-10-07 | Fabrication method at micrometer- and nanometer- scales for generation and control of anisotropy of structural, electrical, optical and optoelectronic properties of thin films of conjugated materials |
Country Status (6)
Country | Link |
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US (1) | US20040262255A1 (en) |
EP (1) | EP1434681A1 (en) |
JP (1) | JP2005504663A (en) |
CN (1) | CN100462219C (en) |
IT (1) | ITMI20012075A1 (en) |
WO (1) | WO2003031158A1 (en) |
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WO2006082867A1 (en) * | 2005-02-02 | 2006-08-10 | Scivax Corporation | Hybrid contacting/detaching system |
JP2006228860A (en) * | 2005-02-16 | 2006-08-31 | Kyoto Univ | Organic field effect transistor and its fabrication process |
CN1292977C (en) * | 2005-06-09 | 2007-01-03 | 西安交通大学 | Deep submicron three-dimensional rolling mould and its mfg. method |
CN1314097C (en) * | 2003-09-25 | 2007-05-02 | 茂德科技股份有限公司 | Side wall doping method of isolating furrow |
JP2008279772A (en) * | 2008-06-23 | 2008-11-20 | Canon Inc | Microfabricating method and microfabricating device |
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Also Published As
Publication number | Publication date |
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EP1434681A1 (en) | 2004-07-07 |
JP2005504663A (en) | 2005-02-17 |
CN1564737A (en) | 2005-01-12 |
US20040262255A1 (en) | 2004-12-30 |
CN100462219C (en) | 2009-02-18 |
ITMI20012075A1 (en) | 2003-04-08 |
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