WO2003027695A1 - Thermal head for maintaining a constant temperature of a dut - Google Patents
Thermal head for maintaining a constant temperature of a dut Download PDFInfo
- Publication number
- WO2003027695A1 WO2003027695A1 PCT/US2002/013464 US0213464W WO03027695A1 WO 2003027695 A1 WO2003027695 A1 WO 2003027695A1 US 0213464 W US0213464 W US 0213464W WO 03027695 A1 WO03027695 A1 WO 03027695A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thermal head
- under test
- heating element
- device under
- lid
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
Definitions
- This invention relates generally to semiconductor technology, and more particularly, to the design of a thermal head for maintaining substantially constant temperature of a semiconductor device under test
- thermal head 10 having a thermal head body 12 and a heating element 14 at the surface 16 ofthe thermal head 10.
- the surface 16 of the thermal head 10 may be brought into contact with the lid 18 of the device under test 20, for example, a flip-chip mounted in a printed circuit board 22 ( Figure 1).
- the output of the heating element 14 can be increased and decreased by respectively increasing and decreasing electrical current flow therethrough, and by utilization of a passage 24 through which coolant 26, for example, water, may flow.
- coolant 26 for example, water
- lidded devices raises special problems.
- power levels of the device 20 may change rapidly, resulting in a rapid increase or decrease in the temperature of the device under test 20.
- the temperature of the thermal head 10 must be quickly changed and applied to the device 20 to bring the device 20 back to the chosen temperature.
- the heat and cooling from the thermal head 10 is applied to the device 20 through the lid 18, i.e., the lid 18 must be heated or cooled and the heat or cooling effect from the lid 18 is applied to the device 20.
- the heating element 14 is configured so that the entire lid 18 is heated thereby, i.e., the area of the heating element 14 is substantially the same as or greater than the area of the lid 18 ( Figure 1) so that the entire mass of the lid 18 (for example, 40 g) must be very rapidly changed in temperature, if rapid change in temperature of the device 20 is to be achieved Because of the large mass of the lid 18, the amount of power consumed during such temperature swing may for example be 10 times as much as that for an unlidded device.
- the thermal head hi order to meet the goal of rapid change in device under test temperature, the thermal head must be capable of providing rapid changes in its power level, and must also be capable of achieving a very high power level. This results in the thermal head being complicated and expensive in design and manufacture, and even then the desired rapid change in device temperature may not be achieved
- the present invention is a thermal head for providing heat to a device under test
- the head includes a thermal body which may be positioned adjacent a lid of the device, and a heating element is mounted to the thermal head body and operable to provide heat to the device under test with the thermal body positioned adjacent the hd of the device.
- the area of the heating element is less than the area of the device under test, so that with the elements so positioned, the heating element overlies the device under test and heat from the heating element is transferred through and spreads out within the lid so that the thermal footprint of the heated portion of the hd adjacent the device substantially coincides with the area of the device.
- Figure 1 is a sectional view illustrating a prior art thermal head used in conjunction with a device under test
- Figure 2 is a sectional view similar to that shown in Figure 1, but illustrating the present invention.
- Figure 3 is a sectional view taken along the line 3-3 of Figure 2.
- Figure 2 is a cross-sectional view similar to that shown in Figure 1, but illustrating the present invention.
- a device under test 30 for example, a flip-chip, is mounted on a printed circuit board 32.
- the device under test 30 has thereover and hi contact therewith a Hd 34.
- a thermal head 36 in furtherance ⁇ f the present invention is shown.
- the thermal head 36 includes a thermal head body 38 having a substantially centrally mounted heating element 40 at the surface 42 of the thermal head 36, and additional electric heating elements 44, 46, also at the surface 42 of the thermal head 36, which may be located on either side of and/or surround the centrally located heating element 40.
- the power output of the heating element 40 may be increased and decreased independently of the heating elements 44, 46, by respective increase and decrease in the level of electrical current flow through the heating element 40.
- the power output of the heating elements 44, 46 may also be increased and decreased in a similar manner by varying the level of electrical current flow therethrough
- the thermal head body 38 also includes a passage 48 through which coolant 50, for example, water, may flow.
- the temperature of the thermal head 36 By changing electrical current flow and/or providing or cutting off coolant flow, the temperature of the thermal head 36, and thus the temperature of the device under test 30 adjacent thereto, can be varied hi the use of the apparatus of Figure 2, the thermal head body 38 of the thermal head 36 is positioned adjacent the lid 34 cf the device 30 under test in the form of an integrated circuit, with the surface 42 of the thermal head 36 in contact with the hd 34 of the device 30. With the elements so positioned, the heating element 40 overlies the device tinder test 30.
- the area of the heating element 40 is less than the area of the lid 34, and is indeed less than the area of the device under test 30, so that as the heating element 40 is used, the heat therefrom is transferred through and spreads and out within the lid 34 and is applied to the device under test 30 as shown by the arrows 52, 54 ( Figures 2 and 3), with the area, ie., the "thermal footprint" , of the heated portion 56 of the hd 34 adjacent the device 30 substantially coinciding with the area of the device 30.
- the system also provides advantage during a cooling state, i.e., where coolant 50 flows through the thermal head body 38 in order to reduce the temperature of the device under test 30. Since, during the use of the heating element 40, only a relatively small part of the hd 34 is heated, the total heat that the cooling system must remove is substantially reduced from that in the prior art, i.e., the cooling system is dealing with a reduced thermal load as compared to the prior art, so the cooling system can be a relatively low- capacity, simple and inexpensive system.
- a heating element 405 x 10 mm centrally located over the device under test 30 will define a spreading characteristic of heat from the heating element 40 so that the "thermal footprint" and area of the device 30 under test are substantially, the same, i.e., they substantially coincide.
Abstract
In the present thermal head (36), a thermal head body (38) may be positioned adjacent a lid (34) of a device under test (30), and a heating element (40) mounted to the thermal head body (38) is operable to provide heat to the device under test (30) with the thermal head body (38) so positioned. The area of the heating element (40) is less than the area of the device under test (30), so that with elements so positioned, the heating element (40) overlies the device under test (30) and heat is transferred from the heating element (40) through the lid (34), spreading outward within the lid (34), so that the thermal footprint (58) of the heated portion of the lid (34) adjacent the device (30) substantially coincides with the area of the device (30).
Description
THERMAL HEAD FOR MAINTAINING A CONSTANT TEMPERATURE OF A DUT
BACKGROUND OF THE INVENTION
1. Technical Field This invention relates generally to semiconductor technology, and more particularly, to the design of a thermal head for maintaining substantially constant temperature of a semiconductor device under test
2. Background Art
High density power dissipated in modern microprocessors necessitates use of the spreaders in order to maintain acceptable temperatures. The integration of a copper lid into the package of the device achieves this purpose.
Semiconductor devices typically undergo a variety of test procedures, including short-circuit tests, burn - in tests, and device functional tests to insure their proper operatioa During for example functional testing, it is important that the temperature of the device under test be held at a substantially constant value. In furtherance thereof, it is well known to provide a thermal head 10 having a thermal head body 12 and a heating element 14 at the surface 16 ofthe thermal head 10. The surface 16 of the thermal head 10 may be brought into contact with the lid 18 of the device under test 20, for example, a flip-chip mounted in a printed circuit board 22 (Figure 1). The output of the heating element 14 can be increased and decreased by respectively increasing and decreasing electrical current flow therethrough, and by utilization of a passage 24 through which coolant 26, for example, water, may flow. By changing electrical current flow and/or providing or cutting off coolant flow, the temperature of the thermal head 10, and thus the temperature of the device under test 20 adjacent thereto, can be varied
The testing of lidded devices in this manner raises special problems. During the testing of the device 20, power levels of the device 20 may change rapidly, resulting in a rapid increase or decrease in the temperature of the device under test 20. Inresponse thereto, the temperature of the thermal head 10 must be quickly changed and applied to the device 20 to bring the device 20 back to the chosen temperature. The heat and cooling from the thermal head 10 is applied to the device 20 through the lid 18, i.e., the lid 18 must be heated or cooled and the heat or cooling effect from the lid 18 is applied to the device 20. Typically, the heating element 14 is configured so that the entire lid 18 is heated thereby, i.e., the area of the heating element 14 is substantially the same as or greater than the area of the lid 18 (Figure 1) so that the entire mass of the lid 18 (for example, 40 g) must be very rapidly changed in temperature, if rapid change in temperature of the device 20 is to be achieved Because of the large mass of the lid 18, the amount of power consumed during such temperature swing may for example be 10 times as much as that for an unlidded device.
hi order to meet the goal of rapid change in device under test temperature, the thermal head must be capable of providing rapid changes in its power level, and must also be capable of achieving a very high power level. This results in the thermal head being complicated and expensive in design and manufacture, and even then the desired rapid change in device temperature may not be achieved
DISCLOSURE OF THE INVENTION
The present invention is a thermal head for providing heat to a device under test The head includes a thermal body which may be positioned adjacent a lid of the device, and a heating element is mounted to the thermal head body and operable to provide heat to the device under test with the thermal body positioned adjacent the hd of the device. The area of the heating element is less than the area of the device under test, so that with the elements so positioned, the heating element overlies the device under test and heat from the heating element is transferred through and spreads out within the lid so that the thermal footprint of the heated portion of the hd adjacent the device substantially coincides with the area of the device.
The present invention is better understood upon consideration of the detailed description below, in conjunction with the accompanying drawings. As will become readily apparent to those skilled in the art from the following description, there is shown and described an embodiment of this invention simply by way of the illustration of the best mode to carry out the invention. As will be realized, the invention is capable of other embodiments and its several details are capable of modifications and various obvious aspects, all without departing from the scope of the invention Accordingly, the drawings and detailed description will be regarded as illustrative in nature and not as restrictive.
BRIEF DESCRIPTION OF THE DRAWINGS
The novel features believed characteristic of the invention are set forth in the appended claims. The invention itself, however, as well as said preferred mode of use, and further objects and advantages thereof, will best be understood by reference to the following detailed description of an illustrative embodiment when read in conjunction with the accompanying drawings, wherein: Figure 1 is a sectional view illustrating a prior art thermal head used in conjunction with a device under test;
Figure 2 is a sectional view similar to that shown in Figure 1, but illustrating the present invention; and
Figure 3 is a sectional view taken along the line 3-3 of Figure 2.
BEST MODEfS) FOR CARRYING OUT THE INVENTION
Reference is now made in detail to a specific embodiment of the present invention which illustrates the best mode presently contemplated by the inventor for practicing the invention.
Figure 2 is a cross-sectional view similar to that shown in Figure 1, but illustrating the present invention. As shown therein, a device under test 30, for example, a flip-chip, is mounted on a printed circuit board 32. The device under test 30 has thereover and hi contact therewith a Hd 34. A thermal head 36 in furtherance αf the present invention is shown. The thermal head 36 includes a thermal head body 38 having a substantially centrally mounted heating element 40 at the surface 42 of the thermal head 36, and additional electric heating elements 44, 46, also at the surface 42 of the thermal head 36, which may be located on either side of and/or surround the centrally located heating element 40. The power output of the heating element 40 may be increased and decreased independently of the heating elements 44, 46, by respective increase and decrease in the level of electrical current flow through the heating element 40. The power output of the heating elements 44, 46 may also be increased and decreased in a similar manner by varying the level of electrical current flow therethrough The thermal head body 38 also includes a passage 48 through which coolant 50, for example, water, may flow. By changing electrical current flow and/or providing or cutting off coolant flow, the temperature of the thermal head 36, and thus the temperature of the device under test 30 adjacent thereto, can be varied hi the use of the apparatus of Figure 2, the thermal head body 38 of the thermal head 36 is positioned adjacent the lid 34 cf the device 30 under test in the form of an integrated circuit, with the surface 42 of the thermal head 36 in contact with the hd 34 of the device 30. With the elements so positioned, the heating element 40 overlies the device tinder test 30. The area of the heating element 40 is less than the area of the lid 34, and is indeed less than the area of the device under test 30, so that as the heating element 40 is used, the heat therefrom is transferred through and spreads and out within the lid 34 and is applied to the device under test 30 as shown by the arrows 52, 54 (Figures 2 and 3), with the area, ie., the "thermal footprint" , of the heated portion 56 of the hd 34 adjacent the device 30 substantially coinciding with the area of the device 30. As shown in Figure 3, with the dotted rectangle 58 indicating both the "thermal footprin ' and the outline of the device under test 30, heat generated by the heating element 40 flows both downwardly (Figure 2) and outwardly (Figure 3) as shown by the arrows 52, 54 in those Figures.
This configuration provides a number of advantages. As will be seen, since heat emanating from the heating element 40 does not heat the entire mass of the lid 34 but is effective in channeling heat directly to the device under test 30, the device under test 30 is heated so as to be brought to a chosen temperature much more rapidly than hi the prior art. AdditionaUy, achievement of this temperature in the device under test 30 requires much less power than hi the prior art, since, again, the entire lid need not be heated
The system also provides advantage during a cooling state, i.e., where coolant 50 flows through the thermal head body 38 in order to reduce the temperature of the device under test 30. Since, during the use of the heating element 40, only a relatively small part of the hd 34 is heated, the total heat that the cooling system must remove is substantially reduced from that in the prior art, i.e., the cooling system is dealing with a reduced thermal load as compared to the prior art, so the cooling system can be a relatively low- capacity, simple and inexpensive system.
It has been found that, for example, in the case of a 10 x 15 mm die 30, and a 2.5 mm thick lid 34, a heating element 405 x 10 mm centrally located over the device under test 30 will define a spreading
characteristic of heat from the heating element 40 so that the "thermal footprint" and area of the device 30 under test are substantially, the same, i.e., they substantially coincide.
It will be seen that rapid changes in temperature of the device under test 30 can be achieved, without the necessity of applying and removing large amounts of power, because the heat applied to the hd 34 and in turn to the device under test 30 is localized, ie., the entire hd 34 is not heated throughout in a uniform manner as in the prior ar Then, when it is necessary to remove heat from the device under test 30, the amount of heat needed to be removed is substantially reduced as compared to the prior art.
The foregoing description of the embodiment of the invention has been presented for purposes of illustration and descriptioa It is not intended to be exhaustive or to limit the invention to the precise form disclosed. Other modifications or variations are possible in light of the above teachings.
The embodiment was chosen and described to provide the best illustration of the principles of the invention and its practical application to thereby enable one of ordinary skill of the art to utilize the invention in various embodiments and with various modifications as are suited to the particular use contemplated. AU such modifications and variations are within the scope of the invention as determined by the appended claims when interpreted in accordance with the breadth to which they are fairly, legally and equitably entitled
Claims
1. A thermal head (36) for providing heat to a lidded device under test (30), characterized by: a thermal head body (38) which may be positioned adjacent a lid (34) of a device under test (30); a heating element (40) mounted to the thermal head body (38) and operable to provide heat to a device under test (30) with the tliermal head body (38) positioned adjacent a lid (34) of a device under test
(30); the heating element (40) being smaUer in area than the area of a hd (34) of a device under test (30).
2. The thermal head (36) of claim 1 wherein the thermal head body (38) may be positioned adjacent a hd (34) of a device under test (30) so that the heating element (40) of the thermal head body (38) overlies an integrated chcuit of a device under test (30).
3. The thermal head (36) of claim 2 wherein the heating element (40) is smaUer in area than the area of an integrated circuit of a device under test (30).
4. The tliermal head (36) of claim 3 wherein the heating element (40) operates by flow of electrical current therein.
5. The tliermal head (36) of claim 4 wherein the heating element (40) is a variable heating element the heating level of which may be varied by varying electrical current flow therein.
6. The thermal head (36) of claim 5 wherein the thermal head (36) further comprises cooling apparatus (48, 50).
7. A thermal head (36) for providing heat to a lidded device under test (30) characterized by: a thermal head body (38) having a surface (42) which may be positioned in contact with a lid (34) of a device under test (30); a heating element (40) mounted to the thermal head body (38) adjacent said surface (42) thereof, the heating element (40) overlying and being of smaUer area than an integrated chcuit of a device under test (30) with the surface (42) of the thermal head body (38) in contact with a hd (34) of a device under test (30).
8. The tliermal head (36) of claim 7 wherein the heating element (40) operates by flow of electrical current therein.
9. The thermal head (36) of claim 8 wherein the heating element (40) is a variable heating element the heating level of which may be varied by varying electrical current flow therein.
10. The thermal head (36) of claim 9 wherein the thermal head (36) further comprises cooling apparatus (48, 50).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US96537601A | 2001-09-27 | 2001-09-27 | |
| US09/965,376 | 2001-09-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2003027695A1 true WO2003027695A1 (en) | 2003-04-03 |
Family
ID=25509890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2002/013464 WO2003027695A1 (en) | 2001-09-27 | 2002-04-29 | Thermal head for maintaining a constant temperature of a dut |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2003027695A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7030640B2 (en) | 2004-03-09 | 2006-04-18 | Micron Technology, Inc. | Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4324285A (en) * | 1979-03-12 | 1982-04-13 | Martin Marietta Corporation | Apparatus for heating and cooling devices under test |
| US4871965A (en) * | 1987-03-16 | 1989-10-03 | Apex Microtechnology Corporation | Environmental testing facility for electronic components |
| JPH03280557A (en) * | 1990-03-29 | 1991-12-11 | Nec Corp | Semiconductor device |
| EP0699912A2 (en) * | 1994-08-31 | 1996-03-06 | Motorola, Inc. | An apparatus, method, and wafer used for testing integrated circuits formed on a product wafer |
| US6060895A (en) * | 1998-04-20 | 2000-05-09 | Fairchild Semiconductor Corp. | Wafer level dielectric test structure and related method for accelerated endurance testing |
| WO2000057196A1 (en) * | 1999-03-24 | 2000-09-28 | Howard Hsu | Wafer probe card |
-
2002
- 2002-04-29 WO PCT/US2002/013464 patent/WO2003027695A1/en not_active Application Discontinuation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4324285A (en) * | 1979-03-12 | 1982-04-13 | Martin Marietta Corporation | Apparatus for heating and cooling devices under test |
| US4871965A (en) * | 1987-03-16 | 1989-10-03 | Apex Microtechnology Corporation | Environmental testing facility for electronic components |
| JPH03280557A (en) * | 1990-03-29 | 1991-12-11 | Nec Corp | Semiconductor device |
| EP0699912A2 (en) * | 1994-08-31 | 1996-03-06 | Motorola, Inc. | An apparatus, method, and wafer used for testing integrated circuits formed on a product wafer |
| US6060895A (en) * | 1998-04-20 | 2000-05-09 | Fairchild Semiconductor Corp. | Wafer level dielectric test structure and related method for accelerated endurance testing |
| WO2000057196A1 (en) * | 1999-03-24 | 2000-09-28 | Howard Hsu | Wafer probe card |
Non-Patent Citations (1)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 016, no. 104 (E - 1178) 13 March 1992 (1992-03-13) * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7030640B2 (en) | 2004-03-09 | 2006-04-18 | Micron Technology, Inc. | Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof |
| US7285971B2 (en) | 2004-03-09 | 2007-10-23 | Micron Technology, Inc. | Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof |
| SG145539A1 (en) * | 2004-03-09 | 2008-09-29 | Micron Technology Inc | Integrated circuit (ic) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof |
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