WO2003023874A1 - Procede de fabrication d'un dispositif piezo-electrique/electrostrictif - Google Patents

Procede de fabrication d'un dispositif piezo-electrique/electrostrictif Download PDF

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Publication number
WO2003023874A1
WO2003023874A1 PCT/JP2002/009297 JP0209297W WO03023874A1 WO 2003023874 A1 WO2003023874 A1 WO 2003023874A1 JP 0209297 W JP0209297 W JP 0209297W WO 03023874 A1 WO03023874 A1 WO 03023874A1
Authority
WO
WIPO (PCT)
Prior art keywords
piezoelectric
ceramic green
portions
thin
multilayer body
Prior art date
Application number
PCT/JP2002/009297
Other languages
English (en)
French (fr)
Inventor
Koji Ikeda
Kazuyoshi Shibata
Tomoki Ito
Original Assignee
Ngk Insulators, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Insulators, Ltd. filed Critical Ngk Insulators, Ltd.
Priority to JP2003527814A priority Critical patent/JP4067491B2/ja
Publication of WO2003023874A1 publication Critical patent/WO2003023874A1/ja
Priority to US10/784,732 priority patent/US7007355B2/en
Priority to US11/266,434 priority patent/US20060061240A1/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/093—Forming inorganic materials
    • H10N30/097—Forming inorganic materials by sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2041—Beam type
    • H10N30/2042—Cantilevers, i.e. having one fixed end
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Micromachines (AREA)
PCT/JP2002/009297 2001-09-11 2002-09-11 Procede de fabrication d'un dispositif piezo-electrique/electrostrictif WO2003023874A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003527814A JP4067491B2 (ja) 2001-09-11 2002-09-11 圧電／電歪デバイスの製造方法
US10/784,732 US7007355B2 (en) 2001-09-11 2004-02-23 Method of manufacturing a piezoelectric/electrostrictive device
US11/266,434 US20060061240A1 (en) 2001-09-11 2005-11-03 Piezoelectric/electrostrictive device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001275598 2001-09-11
JP2001-275598 2001-09-11

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/784,732 Continuation US7007355B2 (en) 2001-09-11 2004-02-23 Method of manufacturing a piezoelectric/electrostrictive device

Publications (1)

Publication Number Publication Date
WO2003023874A1 true WO2003023874A1 (fr) 2003-03-20

Family

ID=19100430

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/009297 WO2003023874A1 (fr) 2001-09-11 2002-09-11 Procede de fabrication d'un dispositif piezo-electrique/electrostrictif

Country Status (4)

Country Link
US (2) US7007355B2 (ja)
JP (1) JP4067491B2 (ja)
CN (1) CN1586018A (ja)
WO (1) WO2003023874A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220140007A (ko) * 2020-06-26 2022-10-17 혼다덴시 가부시키가이샤 초음파 계측 기기용의 압전 소자

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004310943A (ja) * 2003-04-09 2004-11-04 Nitto Denko Corp 摺動部材
EP2423993B1 (en) * 2009-04-24 2015-08-12 NGK Insulators, Ltd. Manufacturing method for thin board-shaped fired piezoelectric body
CN101820569B (zh) * 2010-03-19 2013-01-09 张家港市玉同电子科技有限公司 多层压电陶瓷扬声器驱动器及其制造方法
DE102015217334B3 (de) * 2015-09-10 2016-12-01 Continental Automotive Gmbh Verfahren zum Herstellen eines als Stapel ausgebildeten Vielschichtaktors
EP3406113B1 (en) * 2016-01-20 2020-09-09 Jaquet Technology Group AG Manufacturing method for a sensing element and sensor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1089359A2 (en) * 1999-10-01 2001-04-04 Ngk Insulators, Ltd. Piezoelectric/electrostrictive device and method for producing the same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69223096T2 (de) * 1991-07-18 1998-05-28 Ngk Insulators Ltd Piezoelektrischer/elektrostriktiver Element mit einem keramischen Substrat aus stabilisiertem Zirkoniumdioxid
JP3521499B2 (ja) * 1993-11-26 2004-04-19 日本碍子株式会社 圧電／電歪膜型素子
US5692279A (en) * 1995-08-17 1997-12-02 Motorola Method of making a monolithic thin film resonator lattice filter
JP3585310B2 (ja) 1996-02-20 2004-11-04 日本碍子株式会社 マルチダイヤフラム構造体の製造法
DE69714909T2 (de) * 1996-05-27 2003-04-30 Ngk Insulators Ltd Piezoelektrisches Element des Dünnschichttyps
US6570297B1 (en) * 1999-10-01 2003-05-27 Ngk Insulators, Ltd. Piezoelectric/electrostrictive device
JP3965515B2 (ja) 1999-10-01 2007-08-29 日本碍子株式会社 圧電／電歪デバイス及びその製造方法
JP4058223B2 (ja) 1999-10-01 2008-03-05 日本碍子株式会社 圧電／電歪デバイス及びその製造方法
US6455981B1 (en) 1999-10-01 2002-09-24 Ngk Insulators, Ltd. Piezoelectric/electrostrictive device and method of manufacturing same
JP3851485B2 (ja) 1999-10-01 2006-11-29 日本碍子株式会社 圧電／電歪デバイス及びその製造方法
JP2001315100A (ja) 1999-10-01 2001-11-13 Ngk Insulators Ltd 圧電／電歪デバイス
EP1833102A3 (en) * 1999-10-01 2009-04-08 Ngk Insulators, Ltd. Piezoelectric/electrostrictive device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1089359A2 (en) * 1999-10-01 2001-04-04 Ngk Insulators, Ltd. Piezoelectric/electrostrictive device and method for producing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220140007A (ko) * 2020-06-26 2022-10-17 혼다덴시 가부시키가이샤 초음파 계측 기기용의 압전 소자
KR102533604B1 (ko) * 2020-06-26 2023-05-16 혼다덴시 가부시키가이샤 초음파 계측 기기용의 압전 소자

Also Published As

Publication number Publication date
JPWO2003023874A1 (ja) 2004-12-24
JP4067491B2 (ja) 2008-03-26
US20040163225A1 (en) 2004-08-26
US20060061240A1 (en) 2006-03-23
CN1586018A (zh) 2005-02-23
US7007355B2 (en) 2006-03-07

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