WO2003018248A1 - Method and device for micromachining a workpiece by means of laser radiation - Google Patents
Method and device for micromachining a workpiece by means of laser radiation Download PDFInfo
- Publication number
- WO2003018248A1 WO2003018248A1 PCT/DE2002/002958 DE0202958W WO03018248A1 WO 2003018248 A1 WO2003018248 A1 WO 2003018248A1 DE 0202958 W DE0202958 W DE 0202958W WO 03018248 A1 WO03018248 A1 WO 03018248A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- workpiece
- sacrificial layer
- laser
- laser radiation
- micromachining
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0734—Shaping the laser spot into an annular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
- B23K2103/05—Stainless steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Definitions
- Another problem is that the particles removed from the workpiece during drilling are deposited in the vicinity of the borehole during the drilling process and interfere with the continuation of the drilling process. The particles can stick to the surface and then have to be removed afterwards.
- the sacrificial layer is removed by being stripped off with an acid.
- This process is very complex. The duration of the step must be determined so that the workpiece itself is not attacked by the acid becomes.
- hydrogen is generated during scraping, which penetrates into the surface of the workpiece and embrittles it.
- a very high pressure-loaded metallic material such as is used in a diesel injection nozzle, there is a risk of hydrogen embrittlement
- Fig. 3 shows a nozzle tip of an injection nozzle with spray holes.
- the workpiece 3 is also arranged on a positioning table, which is indicated in FIG. 1 by an arrow 6 and is used for precise adjustment of the area of the workpiece 3 that is to be machined.
- the hologram 4 is, for example, a donut hologram, so that when the laser system 1 is operating, an intensity distribution in the form of a circle is established on the sacrificial layer 7 and after removal of the corresponding area on the sacrificial layer 7 on the workpiece 3 itself.
- the laser radiation from the laser system 1 is directed via the half-wave plate 2 and the hologram 4 onto the sacrificial layer 7 and thus also onto the workpiece 3, so that the intensity distribution is circular.
- the half-wave plate 2 is through the rotary drive device is continuously driven in rotation, so that the direction of polarization of the laser radiation is continuously rotated in the direction of rotation P in the polarization plane P during the machining process.
- the laser radiation removes material from the sacrificial layer 7 and then from the workpiece 3 itself. In this case, either a blind hole is produced or a through hole is formed so that the laser radiation emerges again on the exit side 9 of the workpiece 3 facing away from an entry region 8 (FIG. 2c).
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02769865A EP1420917A1 (en) | 2001-08-17 | 2002-08-12 | Method and device for micromachining a workpiece by means of laser radiation |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10140533.2 | 2001-08-17 | ||
DE10140533A DE10140533B4 (en) | 2001-08-17 | 2001-08-17 | Method for micromachining a workpiece with laser radiation |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003018248A1 true WO2003018248A1 (en) | 2003-03-06 |
Family
ID=7695855
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2002/002958 WO2003018248A1 (en) | 2001-08-17 | 2002-08-12 | Method and device for micromachining a workpiece by means of laser radiation |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1420917A1 (en) |
DE (1) | DE10140533B4 (en) |
WO (1) | WO2003018248A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10340931A1 (en) * | 2003-09-05 | 2005-03-31 | Herbert Walter | Method and device for drilling the finest holes |
NL2009642C2 (en) * | 2012-10-16 | 2014-04-22 | Climate Invest B V | METHOD FOR EDITING A SURFACE AND EDITED SURFACE. |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112004000921D2 (en) * | 2003-06-06 | 2006-08-17 | Siemens Ag | Method for producing through holes in metallic materials |
JP2006150433A (en) * | 2004-12-01 | 2006-06-15 | Fanuc Ltd | Laser beam machining apparatus |
DE102007024700A1 (en) * | 2007-05-25 | 2008-12-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for processing materials with laser radiation and apparatus for carrying out the method |
DE102007024701A1 (en) | 2007-05-25 | 2008-11-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Material removal method and apparatus for carrying out the method |
DE102007051408A1 (en) | 2007-10-25 | 2009-05-28 | Prelatec Gmbh | Method for drilling holes of defined geometries by means of laser radiation |
EP3296054B1 (en) | 2016-09-19 | 2020-12-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for producing a micro-machined workpiece by means of laser ablation |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5933091A (en) * | 1982-08-18 | 1984-02-22 | Hitachi Ltd | Laser working method |
US4948941A (en) * | 1989-02-27 | 1990-08-14 | Motorola, Inc. | Method of laser drilling a substrate |
US5049722A (en) * | 1989-09-16 | 1991-09-17 | Rolls-Royce Plc | Laser barrier material and method of laser drilling |
US5158645A (en) * | 1991-09-03 | 1992-10-27 | International Business Machines, Inc. | Method of external circuitization of a circuit panel |
DE19744368A1 (en) * | 1997-10-08 | 1999-05-20 | Lzh Laserzentrum Hannover Ev | Ultra-short pulse laser beam micro-engineering for drilling symmetrical recess |
JP2000202667A (en) * | 1999-01-19 | 2000-07-25 | Toyota Motor Corp | Method for machining fine hole of injector nozzle |
WO2001005002A1 (en) * | 1999-07-07 | 2001-01-18 | Femtolasers Produktions Gmbh | Laser device |
WO2001015819A1 (en) * | 1999-08-30 | 2001-03-08 | Board Of Regents University Of Nebraska-Lincoln | Three-dimensional electrical interconnects |
US20010009250A1 (en) * | 2000-01-25 | 2001-07-26 | Herman Peter R. | Burst-ultrafast laser machining method |
EP1145797A2 (en) * | 2000-03-31 | 2001-10-17 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus using laser pulses to make an array of microcavity holes |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4224282A1 (en) * | 1992-07-23 | 1994-01-27 | Kristina Dipl Ing Schmidt | Glass structuring, engraving or cutting removes glass - uses a laser beam with a given wavelength to give very small widths in min. working time |
AUPP681198A0 (en) * | 1998-10-30 | 1998-11-19 | Breville Pty Ltd | Sandwich toaster |
GB2349106A (en) * | 1999-04-17 | 2000-10-25 | Rolls Royce Plc | Laser drilling |
-
2001
- 2001-08-17 DE DE10140533A patent/DE10140533B4/en not_active Expired - Fee Related
-
2002
- 2002-08-12 WO PCT/DE2002/002958 patent/WO2003018248A1/en not_active Application Discontinuation
- 2002-08-12 EP EP02769865A patent/EP1420917A1/en not_active Ceased
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5933091A (en) * | 1982-08-18 | 1984-02-22 | Hitachi Ltd | Laser working method |
US4948941A (en) * | 1989-02-27 | 1990-08-14 | Motorola, Inc. | Method of laser drilling a substrate |
US5049722A (en) * | 1989-09-16 | 1991-09-17 | Rolls-Royce Plc | Laser barrier material and method of laser drilling |
US5158645A (en) * | 1991-09-03 | 1992-10-27 | International Business Machines, Inc. | Method of external circuitization of a circuit panel |
DE19744368A1 (en) * | 1997-10-08 | 1999-05-20 | Lzh Laserzentrum Hannover Ev | Ultra-short pulse laser beam micro-engineering for drilling symmetrical recess |
JP2000202667A (en) * | 1999-01-19 | 2000-07-25 | Toyota Motor Corp | Method for machining fine hole of injector nozzle |
WO2001005002A1 (en) * | 1999-07-07 | 2001-01-18 | Femtolasers Produktions Gmbh | Laser device |
WO2001015819A1 (en) * | 1999-08-30 | 2001-03-08 | Board Of Regents University Of Nebraska-Lincoln | Three-dimensional electrical interconnects |
US20010009250A1 (en) * | 2000-01-25 | 2001-07-26 | Herman Peter R. | Burst-ultrafast laser machining method |
EP1145797A2 (en) * | 2000-03-31 | 2001-10-17 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus using laser pulses to make an array of microcavity holes |
Non-Patent Citations (3)
Title |
---|
MOMMA C ET AL: "PRAEZISE MIKRO-BEARBEITUNG MIT FEMTOSEKUNDEN-LASERPULSEN PRECISE MICROMACHINING WITH FEMTOSECOND LASER PULSES", LASER UND OPTOELEKTRONIK, FACHVERLAG GMBH. STUTTGART, DE, vol. 29, no. 3, 1997, pages 82 - 89, XP000997011, ISSN: 0722-9003 * |
PATENT ABSTRACTS OF JAPAN vol. 008, no. 132 (M - 303) 20 June 1984 (1984-06-20) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 10 17 November 2000 (2000-11-17) * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10340931A1 (en) * | 2003-09-05 | 2005-03-31 | Herbert Walter | Method and device for drilling the finest holes |
NL2009642C2 (en) * | 2012-10-16 | 2014-04-22 | Climate Invest B V | METHOD FOR EDITING A SURFACE AND EDITED SURFACE. |
WO2014060968A3 (en) * | 2012-10-16 | 2014-06-12 | Climate Invest B.V. | Method for machining a surface, and machined surface |
Also Published As
Publication number | Publication date |
---|---|
DE10140533B4 (en) | 2005-04-28 |
DE10140533A1 (en) | 2003-03-06 |
EP1420917A1 (en) | 2004-05-26 |
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