WO2003015486A1 - Stencil for use with stencil mounting frame - Google Patents
Stencil for use with stencil mounting frame Download PDFInfo
- Publication number
- WO2003015486A1 WO2003015486A1 PCT/GB2002/002238 GB0202238W WO03015486A1 WO 2003015486 A1 WO2003015486 A1 WO 2003015486A1 GB 0202238 W GB0202238 W GB 0202238W WO 03015486 A1 WO03015486 A1 WO 03015486A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- stencil
- apertures
- mounting
- tensioning
- frame
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/248—Mechanical details, e.g. fixation holes, reinforcement or guiding means; Perforation lines; Ink holding means; Visually or otherwise detectable marking means; Stencil units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1225—Screens or stencils; Holders therefor
Definitions
- This invention relates to a stencil for use with a stencil mounting frame.
- An example of a stencil and a mounting frame of the general kind with which the present invention is concerned is disclosed in GB 2264460 B and in the corresponding European patent specification EP 0643902 B.
- Such stencils and mounting frames are used, for example, in relation to the manufacture of printed circuit boards using a squeegee or other suitable technique for the application of solder paste in a printing-like manner to the board structure using an etched pattern of openings or apertures formed in the stencil.
- opposite side regions of the stencil should be apertured or of reduced thickness so as to be more flexible than the main body of the sheet of the stencil so as to enable the opposite side regions to be bent along these regions without kinking or other deformation during tensioning.
- the system of the GB 2264460 B specification and the EP 0643902 B specification propose that the interconnection means for connecting the stencil to its frame should be provided by means of a plurality of parallel slots extending from each edge of the stencil towards the other edge by an amount sufficient to make the edge sufficiently flexible for the purpose and likewise sufficiently closely spaced so as to avoid or minimise any distortion in the main body of the sheet upon tensioning.
- the inter-engaging means comprise comb-like members 10 cooperating with corresponding elongated slots 6 , 1 and the slots extend over a sufficient length so as to make the edges of the stencil more flexible than the main body portion.
- each aperture which is wider than another portion thereof so that the comb-like projections or inter-engaging means can readily enter into the slightly wider portions of the holes in the stencil and can then move a very short distance to the other narrower portion of the stencil so as to cooperate effectively therewith in defining the position of the stencil.
- this feature facilitates the mounting of the stencils on the stencil frame by eliminating the generally weak construction deliberately adopted (in the EP 902 B and GB 460 B specifications) in a substantial peripheral edge region of the stencil, whereby the latter is significantly stronger than has hitherto been adopted and this in itself leads to significant advantages in terms of the mounting function inter-engagement step and the general robustness of the stencil in relation to this important function of the stencil .
- each inter-engaging comb-like member has its own hole. That hole is relatively small, being just large enough to receive its own comb tooth and thus corresponds in this respect to a conventional mounting hole to co-operate with the usual mounting peg.
- the stencil-fixing or mounting apertures are able simply to perform that function in a robust and practical way without the need to form part of a slender and therefore delicate stencil flexibility portion.
- the pattern of stress-relief apertures formed in the stencil are able to perform that function without any compromise as to their function, and this separated functionality represents a significant advantage.
- a stencil construction which not only meets the need for a stencil able to cooperate with the existing stencil-mounting and stencil-tensioning frame but which is able to offer significant technical improvements over the previously available stencils.
- the zone or region within which the fixing holes are located at the two opposite edges of the stencil, or indeed in the four opposite edges thereof are actually physically separated from the corresponding regions of stress relief. Such separation is effective to ensure that the distinct functions of these portions of the stencil are visibly and functionally separated.
- the stencil mounting function serves merely to provide a means whereby the stencil may be anchored to the means whereby it is tensioned, regardless of the mechanical details or complexity of the latter.
- the physical separation of the stress relief or flexibility zone and the mounting holes zone has functional significance in the following respect, namely that the stress relief band or zone should preferably be positioned so that, approximately, the mid point of its width (measured in the direction of the width or length of the stencil in a straight line direction at right angles to the stress relief zones at the edges and between same) is approximately at the location on the stencil where its maximum change of profile occurs.
- the change of profile is between the generally flat region (at the top of the stencil/frame assembly) where the stencil pattern (eg for solder paste stencilling) is located and the two opposite end regions of the stencil where it bends downwards towards its fixing means, so that the later do not get in the way of the stencilling operation.
- the stencil pattern eg for solder paste stencilling
- the change in profile of the stencil is achieved by means of a convex linear edge region of the stencil (at two or four opposite edges thereof) and in some other stencil frames the change in profile is achieved by means of one or two pairs of longitudinal angularly-rotatable cam members at the opposite edges of the stencil, which can be raised to tension the stencil and to provide the necessary change in profile.
- the zone or region of stress relief or flexibility is preferably provided at a location which is nicely centrally disposed with respect to this region of stencil profile change.
- the zone of flexibility or stress relief is most needed at the location where the stencil first becomes flat after its profile change. This is the location where there is a tendency for the stencil to (by virtue of its inherent stiffness arising from its metallic sheet format) continue to adopt the upwardly (when the frame is in its usual horizontal altitude) inclined disposition, at least for some appreciable short distance from the edge of the stencil, so that there is a region of the stencil in which it is slightly lifted from the intended planar format in this top region of the stencil (which is its underside during actual stencilling) accordingly.
- the zone of stress relief and flexibility serves to minimise or avoid this affect by allowing the stencil immediately to adopt at the required location the change in profile from its upward inclination (or downward when in use) to its horizontal planar profile.
- the four corner regions of the stencil need to accommodate this format and are, in the embodiments, provided with (as seen in the flat format of the stencil) trimmed or otherwise removed corner regions so that the longitudinally-extending edge regions of the stencil can, when mounted on the frame, approach each other at their adjacent ends without redundant stencil material interfering.
- the fixing holes in the stencils are not provided and the region or band of flexibility or stress relief is extended into the corner regions so as to facilitate the adoption of the three dimensional profile.
- Such extension of the zone of flexibility may extend up to the trimmed or profiled formed edge of the stencil which lies beyond the lateral extent of the two adjacent (at right angles) lines or regions of fixing holes in the stencil .
- the size and spacing of these is adopted solely to accommodate the requirements imposed by the fixing elements of the stencil frame in question.
- the lengthwise dimension of the mounting holes is somewhat greater than is required in the case where the mounting elements are fixed and the stencil is merely lodged over them and other means is provided for tensioning of the stencil.
- the mounting or fixing holes are proportioned to accommodate such movement .
- the stencil is intended for use in relation to a stencil mounting and tensioning frame in which the edge portions of the stencil are unsupported in the edge region between their engagement with the spring- actuated multiple-tensioning elements or fixing members, and the region of the stencil frame (spaced therefrom) which is in the form of a planar rectangle defining the stencilling zone) , where the stencil changes is profile in use from the inclined sides of a flat-topped pyramid, to the flat top thereof .
- the elongated slots which serve as both the means for mounting and fixing the stencil and for providing it with the necessary level of flexibility, extend lengthwise and inwardly of the stencil a sufficient distance that their inboard ends (which are laterally aligned) extend to a position which is approximately half way across the width of the rectangular structure defining the stencilling zone whereas in the embodiments of the invention the flexibility or stress relief zone which is spaced from the stencil fixing holes is of a width such as to fully encompass the structure of the planar frame edge defining the stencilling zone, thereby ensuring a more effective and complete provision of the flexibility function which is a key to the proper compliance of the stencil with its frame-imposed profile requirements in use.
- An important aspect of the construction of the embodiments relates to the dimensional relationship between the fixing hole spacings and the stress relief formation spacings.
- these functions are provided by the discrete bands or stencil portions as disclosed in the present application then there is a significant benefit to be obtained by adopting a level of dimensional commonality as between these spacing dimensions in order to achieve a related balancing or evening-out of the lines of stress which are generated when stencils are tensioned and which otherwise interfere with the effective adoption of the required frame-imposed profile in use.
- the size and spacing of these should preferably be related to the corresponding size and spacing of the fixing holes so that the spacings between the stress relief formations are not substantially different from those between the fixing holes. In this way the level and distribution of stress is obliged to adopt an equalised pattern in this critical area of the stencil.
- Fig 1 shows a prior art construction, being a copy of Fig 1 of the drawings from the above-discussed GB2264460B specification;
- Fig 2 shows, on a larger scale, a corner portion of a stencil, generally in accordance with the disclosure in the GB460B specification;
- FIG. 3 shows a photocopy of a stencil, likewise representing the prior art, illustrating an alternative manner of fixing a stencil to a corresponding mounting frame
- Figs 4 and 5 show, in views somewhat corresponding to that of Fig 2, two alternative embodiments of the invention in each of which there is provided a row of mounting apertures and an associated array of stress relief openings .
- Fig 1 shows a stencil 10 as disclosed in the above-discussed GB460B specification comprising a rectangular sheet of flexible metallic sheet adapted for electrolytic etching, and having mounting apertures 12 disposed in twin bands 14, 16, one at each of the longitudinally spaced ends 18, 20 so that the stencil can be tensioned in the longitudinal direction between these mounting apertures.
- the mounting apertures 12 are linear in format and relatively narrow, and closely spaced.
- the length of the apertures 12 is such that they extend over the full length of that portion 22 of the stencil which needs to be flexible and/or to have stress relief in order that it can be tensioned while simultaneously adopting a non-flat format in order that the central region 24 can be in a flat and raised condition with respect to the edge portions 26, 28 for stencilling purposes.
- stencil 10 has a pattern of apertures (not shown) etched or otherwise formed in its central region 24 through which solder paste or the like is caused to pass by a squeegee or the like action, as described above.
- this shows an adaptation of the stencil of Fig 1, in which arrays of the combined mounting and stress-relief apertures 12 of the construction of Fig 1 are provided in bands 30,32 extending along adjacent edges 34, 36, and likewise along the other two adjacent edges of the stencil 38, so that the latter can be tensioned outwardly in all four directions instead of in the two directions permitted by the stencil 10 of the construction shown in Fig 1.
- the apertures 40 corresponding to the apertures 12 in the Fig 1 construction, are somewhat wider in lateral width, and slightly less closely spaced than appears from the construction shown in Fig 1.
- Fig 2 is slightly large with respect to the actual size of the stencil, the centre-to- centre spacing of the apertures 40 being typically 3.0 mm in practice.
- the longitudinal extent 42 of the apertures 40 is typically 19 mm, and such corresponds generally with the corresponding extent indicated in Fig 1, in that it is sufficient for the edge portions 44, 46 to be bent downwards away from the central region 48 of stencil 38, where the stencilling operation is performed, with the necessary flexibility so that the stencil can adopt its flat contour in the central region without the loss of an edge region in which there might otherwise be a raised portion in which the metallic sheet accommodated itself to the change in profile.
- the construction and arrangement of the mounting members which are employed for entering the apertures 40 of the stencil 38 of Fig 2 is generally as disclosed in the GB460B discussed above, though these are arranged along all four sides of the rectangular tensioning frame, rather than just along two opposite end edges.
- Fig 2 there is shown in Fig 2 at 52 the dotted line rectangular outer edge of the linear and planar rectangular frame 54, which defines (within its inner edge (not shown) the open space within which stencilling is performed.
- the entire extent of the length 42 of the apertures 40 (which in practice is of the order of 19 millimetres) is available to render that portion of the stencil flexible for contour following and stress relief purposes between the outer end edges 56 of the apertures 40 (against which end edges the actuated mounted elements (not shown) act) , to the opposite end edges 58 which are located on frame 54.
- the mounting elements which tension the stencil are conveniently disposed in a linear array for entry into the apertures 40, and thus such tensioning is not provided along the extent of corner edge 50 of the stencil.
- the arrays 60, 62 of progressively shortening apertures at the ends of the bands 30, 32 of apertures are not for cooperation with mounting elements, but for decorative purposes .
- the stencils of Figs 1 and 2 are assembled in relation to their associated tensioning frames as disclosed in the GB2264460B specification.
- the mounting elements are carefully positioned so as to enter into the narrow slots for apertures 40, and the mounting elements are then caused (under spring control) to move to the outer ends of the apertures to tension the stencils.
- the mounting elements are actuated by multiple springs.
- a pneumatic system comprising multiple pneumatic actuators adapted to compress the resilient springs to move the mounting members inwards relative to the stencil, to release same.
- Figs 4 and 5 Before moving to the embodiments of the invention shown in Figs 4 and 5, we describe first the prior-used stencil of the present applicants as shown in Fig 3, in which there is shown a stencil 70 of metallic foil sheet material similar to that of the constructions used in Figs 1 and 2, having edge regions 72, '74 for co-operation with a mounting and positioning system (not shown) in which mounting pegs enter pear-shaped openings 76 and positioning pegs enter circular openings 78.
- a stencil 70 of metallic foil sheet material similar to that of the constructions used in Figs 1 and 2, having edge regions 72, '74 for co-operation with a mounting and positioning system (not shown) in which mounting pegs enter pear-shaped openings 76 and positioning pegs enter circular openings 78.
- edge regions 72, 74 are clamped to a mounting frame (not shown) and the inner rectangular region 80 is raised with respect thereto (or lowered) by means of linear actuatable cams extending lengthwise of the edge region 72, 74 and actuated by means of end levers located in the corner region 82, generally in accordance with matters disclosed in GB2286156B and WO94/07696 (our reference P51952GB and WO) .
- Each stress relief region or band 84, 86 comprises an array of openings or recesses disposed in a regular pattern, such openings or recesses being closely spaced and serving to produce enhanced flexibility in these regions of the stencil for permitting corresponding flexibility of the stencil.
- the stencil 70 is caused to change from an upwardly sloping profile to a flat profile at the locations indicated by dotted lines 88, 90 in Fig 3, which represent the approximate locations of the angularly-movable cams (not shown) which are used in relation to stencils 70 to effect the required tensioning.
- stencil 100 comprises edge regions 102, 104 in which are provided arrays 106, 108 of mounting apertures or fixing holes 110 for co-operation with mounting elements (not shown) of the kind discussed above in relation to Figs 1 and 2.
- the mounting elements thus move in use between outward (spring- urged) stencil-tensioning positions and inward (pneumatic -actuator released) positions within the lengthwise extent 112 of apertures 110) .
- the actual lengthwise extent of apertures is typically about 7 mm, being just sufficient to take in the full range of movement of the mounting elements, including that which can occur under abnormally high release pressure application. It will be noted that the dimensions of the fixing or mounting apertures 110 is similar to that of the pear-shaped openings 76 in the construction of Fig 3.
- stencil 100 In order to accommodate the profile change requirements of stencil 100, the latter is provided with a band or region of stress relief apertures or recesses 114, 116 extending lengthwise parallel to the arrays 106, 108 of mounting or fixing holes along the adjacent edges of the stencil 100. It will be understood that this arrangement is provided lengthwise of all four edges of the stencil. Crosscut corner profiles 118 are provided somewhat as in the prior art stencils.
- the fixing or mounting apertures 110 are provided only where required for fixing or mounting purposes, and thus the arrays 106, 108 of fixing holes terminate at the crosscut corner profile 118, and the stress relief bands continue up to that corner profile and indeed extend around the ends of the arrays 106, 108 in stress-relief end enlargement regions 120, 122, these end enlargement regions almost meeting at the central corner point 124, so that the corner region generally 126 of stencil 100 (and likewise of course the other three corner regions) has a substantial provision of the stress- relief formations so as to well-accommodate the change in profile inherent in the matching of the stencil to its frame requirements, which correspond to those of the construction shown in Fig 2.
- Fig 4 There is shown in Fig 4 by means of the dotted lines 128 the outer edges of the rectangular frame over which the stencil is fitted and on which it forced to adopt the required profile.
- edge 128 lies well within the bands 114, 116 of stress relief, so that this profile change is easily accommodated.
- the spacing between successive mounting apertures 110 is identified at 132 in Fig 4 and the spacing of successive stress relief apertures or recesses is identified at 134. The latter are spaced apart in linear rows 136. The mounting apertures 110 are likewise disposed in a row or array parallel to the rows 136.
- the rows 136 of stress relief apertures or recesses are arranged in successively staggered relationship (as between the apertures) so that the closest spacing between apertures (measured between rows 136) is 1.27 mm as identified at 138.
- the same spacing applies to the inter-row separation of successive linear rows 136, as likewise shown at 138. This separation is not parallel to the separation of the fixing holes 110) .
- the fixing holes or mounting apertures 110 in Fig 4 are also shown in Fig 4 in enlarged format in which can be clearly seen the lengthwise extent 112, and the generally linear side edges 140, 142, which converge towards the outer end 144 by the angular dimension indicated at 146 of
- a stencil separation band 150 between the stress relief band 114 and the array of fixing or mounting apertures 110.
- this stencil separation band is dispensed with.
- the significance of the stencil separation band 150 in Fig 4, and its absence in Fig 5, relates more to an understanding of the separate functions of the fixing holes and the stress relief holes than to a technically significant difference between these two embodiments.
- the provision of stress relief apertures or recesses in the stencil separation band 150 of Fig 4 has no particularly significant technical advantages and is to be adopted only if production or other factors favour it .
- the dimensional commonality feature discussed above in relation to the separation of the fixing holes or mounting apertures 110 and the stress relief apertures or recesses 130 arises, we believe, from the mode of operation of the embodiments.
- a stencil 100 is adapted to be mounted on a tensioning frame as described previously in relation to the constructions of Figs 1 and 2, in which the frame comprises a plurality of mounting members to co-operate with the mounting apertures formed in the stencils. Moreover, the frame means is adapted to cause the mounting members to enter the mounting or fixing apertures of the stencils to effect relative movement between the mounting members and stencils to cause tensioning of the stencils.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Plates And Materials Therefor (AREA)
- Screen Printers (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02727724A EP1415520A1 (en) | 2001-08-10 | 2002-05-14 | Stencil for use with stencil mounting frame |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0119535A GB2364961B (en) | 2001-08-10 | 2001-08-10 | Stencil for use with stencil mounting frame |
GB0119535.3 | 2001-08-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003015486A1 true WO2003015486A1 (en) | 2003-02-20 |
Family
ID=9920181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB2002/002238 WO2003015486A1 (en) | 2001-08-10 | 2002-05-14 | Stencil for use with stencil mounting frame |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1415520A1 (en) |
GB (1) | GB2364961B (en) |
WO (1) | WO2003015486A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007091035A1 (en) * | 2006-02-08 | 2007-08-16 | Dek International Gmbh | Printing screens, frames therefor and printing screen units |
CN103029423A (en) * | 2012-12-25 | 2013-04-10 | 英利能源(中国)有限公司 | Solar cell wafer and printing screen thereof |
KR20140027127A (en) * | 2011-03-29 | 2014-03-06 | 꼼미사리아 아 레네르지 아토미끄 에뜨 옥스 에너지스 앨터네이티브즈 | Silk-screen stencil for printing onto a photovoltaic cell |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2388073B (en) | 2002-05-02 | 2004-06-23 | Tannlin Ltd | Printing screens, frames therefor and printing screen units |
FR2840851B1 (en) | 2002-06-13 | 2004-09-03 | Novatec Sa Soc | METHOD FOR IMPLEMENTING AN ADAPTED SCREEN STENCIL FOR DISSOCIATING THE TREATMENT OF FILLING AND MOLDING PHASES |
EP1651019B1 (en) | 2004-10-25 | 2008-05-14 | METAQ GmbH | Stencil, frame to stretch said stencil as well as process and device to manufacture stencil |
DE102004051935B4 (en) * | 2004-10-25 | 2006-09-28 | Metaq Gmbh | stencil |
WO2015101392A1 (en) * | 2013-12-30 | 2015-07-09 | Applied Materials Italia S.R.L. | Stencil system, printing system, and method for printing a pattern of electrically conductive material |
US10843454B2 (en) * | 2018-01-16 | 2020-11-24 | Jsmd Key Products, Llc | Endurance fabric mesh panel for silk screening |
US11420435B1 (en) * | 2021-08-22 | 2022-08-23 | Texas A&M University Corpus Christi | Restretchable stencil frame |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2264460A (en) | 1992-06-03 | 1993-09-01 | David Godfrey Williams | Improved stencil or mask for applying solder to circuit boards and support frame therefor. |
WO1994007696A1 (en) | 1992-10-01 | 1994-04-14 | Paul Cane | Screen printing tensioning device |
GB2276589A (en) | 1993-04-03 | 1994-10-05 | David Godfrey Williams | Improved stencil or mask for applying solder to circuit boards |
EP0662878A1 (en) | 1992-10-01 | 1995-07-19 | Paul Cane | A screen printing stencil. |
GB2286156A (en) | 1992-10-01 | 1995-08-09 | Paul Cane | Screen printing tensioning device |
GB2292155A (en) | 1994-08-11 | 1996-02-14 | Procter & Gamble | Handwash laundry detergent composition comprising three surfactants |
GB2292115A (en) * | 1994-11-17 | 1996-02-14 | Nicholas Mark Baker | Solder stencil mounting frame |
US6067903A (en) * | 1995-07-20 | 2000-05-30 | Alpha Fry Ltd. | Apparatus for supporting and tensioning a stencil |
-
2001
- 2001-08-10 GB GB0119535A patent/GB2364961B/en not_active Expired - Fee Related
-
2002
- 2002-05-14 WO PCT/GB2002/002238 patent/WO2003015486A1/en not_active Application Discontinuation
- 2002-05-14 EP EP02727724A patent/EP1415520A1/en not_active Withdrawn
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2264460A (en) | 1992-06-03 | 1993-09-01 | David Godfrey Williams | Improved stencil or mask for applying solder to circuit boards and support frame therefor. |
EP0643902A1 (en) | 1992-06-03 | 1995-03-22 | WILLIAMS, David Godfrey | Improved stencil or mask for applying solder to circuit boards and support frame therefor |
US5979312A (en) * | 1992-06-03 | 1999-11-09 | Alpha Fry Ltd. | Support frame and stencil having flexible end regions for attachment to the support frame |
WO1994007696A1 (en) | 1992-10-01 | 1994-04-14 | Paul Cane | Screen printing tensioning device |
EP0662878A1 (en) | 1992-10-01 | 1995-07-19 | Paul Cane | A screen printing stencil. |
GB2286155A (en) | 1992-10-01 | 1995-08-09 | Paul Cane | A screen printing stencil |
GB2286156A (en) | 1992-10-01 | 1995-08-09 | Paul Cane | Screen printing tensioning device |
US5606911A (en) * | 1992-10-01 | 1997-03-04 | Cane; Paul | Screen printing stencil |
GB2276589A (en) | 1993-04-03 | 1994-10-05 | David Godfrey Williams | Improved stencil or mask for applying solder to circuit boards |
GB2292155A (en) | 1994-08-11 | 1996-02-14 | Procter & Gamble | Handwash laundry detergent composition comprising three surfactants |
GB2292115A (en) * | 1994-11-17 | 1996-02-14 | Nicholas Mark Baker | Solder stencil mounting frame |
US6067903A (en) * | 1995-07-20 | 2000-05-30 | Alpha Fry Ltd. | Apparatus for supporting and tensioning a stencil |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007091035A1 (en) * | 2006-02-08 | 2007-08-16 | Dek International Gmbh | Printing screens, frames therefor and printing screen units |
JP2009525894A (en) * | 2006-02-08 | 2009-07-16 | ディーイーケー インターナショナル ジーエムビーエイチ | Printing screen, printing screen frame and printing screen unit |
RU2466025C2 (en) * | 2006-02-08 | 2012-11-10 | Дек Интернешнл Гмбх | Screen meshes, frames for them and units of screen meshes |
US8342089B2 (en) | 2006-02-08 | 2013-01-01 | Dek International Gmbh | Printing screens, frames therefor and printing screen units |
KR20140027127A (en) * | 2011-03-29 | 2014-03-06 | 꼼미사리아 아 레네르지 아토미끄 에뜨 옥스 에너지스 앨터네이티브즈 | Silk-screen stencil for printing onto a photovoltaic cell |
KR101898309B1 (en) | 2011-03-29 | 2018-09-12 | 꼼미사리아 아 레네르지 아토미끄 에뜨 옥스 에너지스 앨터네이티브즈 | Silk-screen stencil for printing onto a photovoltaic cell |
CN103029423A (en) * | 2012-12-25 | 2013-04-10 | 英利能源(中国)有限公司 | Solar cell wafer and printing screen thereof |
CN103029423B (en) * | 2012-12-25 | 2015-08-26 | 英利能源(中国)有限公司 | Solar battery sheet and printing screen thereof |
Also Published As
Publication number | Publication date |
---|---|
GB2364961B (en) | 2002-06-26 |
EP1415520A1 (en) | 2004-05-06 |
GB0119535D0 (en) | 2001-10-03 |
GB2364961A (en) | 2002-02-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101445271B1 (en) | Printing screens, frames therefor and printing screen units | |
EP1415520A1 (en) | Stencil for use with stencil mounting frame | |
EP0643902B1 (en) | Improved stencil or mask for applying solder to circuit boards and support frame therefor | |
US5606911A (en) | Screen printing stencil | |
EP3434481B1 (en) | Print screen unit | |
EP0963856B1 (en) | Stencil printing machine and stencil printing drum | |
US8802487B2 (en) | Silk-screen stencil for printing onto a photovoltaic cell | |
KR100513941B1 (en) | Ic socket | |
JP4143926B2 (en) | Connection structure of flexible printed circuit board to printed circuit board | |
US6189448B1 (en) | Dual image stencil apparatus having stencil including sections with curled edges | |
CN102596582B (en) | The mask of serigraphy, the silk-screen printing device using this mask and method for printing screen | |
TWI643023B (en) | Mesh member for screen printing and screen printing plate | |
JPH0738231A (en) | Metal mask for cream solder and attaching method for same to frame | |
CA2277581A1 (en) | Improved microstrip edge card connector | |
KR100308911B1 (en) | Plates or masks and their supporting frames for applying solder to circuit boards | |
US20030004076A1 (en) | Screening mask having a stress-relieving area | |
TW201615429A (en) | Composite stencil | |
JPH07276841A (en) | Mask for printing cream solder | |
JPH0341416Y2 (en) | ||
GB2385827A (en) | Screen printing stencil with at least one apertured region to increase the extensibility of the stencil | |
JP2670496B2 (en) | Flatbed and circular knitting machine needle beds | |
GB2291624A (en) | Improved stencil or mask | |
TWI802508B (en) | Printing screen with squeegee positioning marks | |
JP2011129817A (en) | Method of printing antenna pattern | |
JPH02112993A (en) | Manufacture of thick film circuit board and mesh mask for manufacture |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BY BZ CA CH CN CO CR CU CZ DE DM DZ EC EE ES FI GB GD GE GH HR HU ID IL IN IS JP KE KG KP KR LC LK LR LS LT LU LV MA MD MG MN MW MX MZ NO NZ OM PH PL PT RU SD SE SG SI SK SL TJ TM TN TR TZ UA UG US UZ VN YU ZA ZM Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ OM PH PL PT RO RU SD SE SG SI SK SL TJ TM TN TR TT TZ UA UG US UZ VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW MZ SD SL SZ UG ZM ZW AM AZ BY KG KZ RU TJ TM AT BE CH CY DE DK FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ ML MR NE SN TD TG Kind code of ref document: A1 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2002727724 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 2002727724 Country of ref document: EP |
|
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
NENP | Non-entry into the national phase |
Ref country code: JP |
|
WWW | Wipo information: withdrawn in national office |
Country of ref document: JP |