WO2003012865A3 - Cooling apparatus - Google Patents

Cooling apparatus Download PDF

Info

Publication number
WO2003012865A3
WO2003012865A3 PCT/GB2002/003518 GB0203518W WO03012865A3 WO 2003012865 A3 WO2003012865 A3 WO 2003012865A3 GB 0203518 W GB0203518 W GB 0203518W WO 03012865 A3 WO03012865 A3 WO 03012865A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat
component
casing
cooling apparatus
producing component
Prior art date
Application number
PCT/GB2002/003518
Other languages
French (fr)
Other versions
WO2003012865A2 (en
Inventor
Peter Ferguson Western
Timothy David Stone
Original Assignee
Stonewood Electronics Ltd
Peter Ferguson Western
Timothy David Stone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stonewood Electronics Ltd, Peter Ferguson Western, Timothy David Stone filed Critical Stonewood Electronics Ltd
Publication of WO2003012865A2 publication Critical patent/WO2003012865A2/en
Publication of WO2003012865A3 publication Critical patent/WO2003012865A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

There is described heat dissipation apparatus for dissipating heat from a heat producing component mounted within an enclosure. The apparatus is in the form of a casing which has an internal heat conducting surface which is in physical contact with the heat producing component. In this way, a heat conducting path from the component to the external surface of the casing is provided. This invention has particular application in computers, the heat generating component being a processor.
PCT/GB2002/003518 2001-07-31 2002-07-31 Cooling apparatus WO2003012865A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0118572A GB0118572D0 (en) 2001-07-31 2001-07-31 Stone cold
GB0118572.7 2001-07-31

Publications (2)

Publication Number Publication Date
WO2003012865A2 WO2003012865A2 (en) 2003-02-13
WO2003012865A3 true WO2003012865A3 (en) 2003-09-04

Family

ID=9919477

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2002/003518 WO2003012865A2 (en) 2001-07-31 2002-07-31 Cooling apparatus

Country Status (2)

Country Link
GB (1) GB0118572D0 (en)
WO (1) WO2003012865A2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4621304A (en) * 1983-03-25 1986-11-04 Mitsubishi Denki Kabushiki Kaisha Heat radiator assembly
US5077601A (en) * 1988-09-09 1991-12-31 Hitachi, Ltd. Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
DE4418611A1 (en) * 1993-07-30 1995-02-02 Fujitsu Ltd Semiconductor element cooling device
EP0875933A2 (en) * 1997-04-28 1998-11-04 Hewlett-Packard Company Thermal interface pad assembly
US6114761A (en) * 1998-01-20 2000-09-05 Lsi Logic Corporation Thermally-enhanced flip chip IC package with extruded heatspreader
US6252776B1 (en) * 1998-07-23 2001-06-26 Nec Corporation Heat radiating member for heat generating device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4621304A (en) * 1983-03-25 1986-11-04 Mitsubishi Denki Kabushiki Kaisha Heat radiator assembly
US5077601A (en) * 1988-09-09 1991-12-31 Hitachi, Ltd. Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
DE4418611A1 (en) * 1993-07-30 1995-02-02 Fujitsu Ltd Semiconductor element cooling device
EP0875933A2 (en) * 1997-04-28 1998-11-04 Hewlett-Packard Company Thermal interface pad assembly
US6114761A (en) * 1998-01-20 2000-09-05 Lsi Logic Corporation Thermally-enhanced flip chip IC package with extruded heatspreader
US6252776B1 (en) * 1998-07-23 2001-06-26 Nec Corporation Heat radiating member for heat generating device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"THERMALLY-ENHANCED TAPE AUTOMATED BONDED PACKAGE", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, vol. 31, no. 5, 1 October 1988 (1988-10-01), pages 34 - 35, XP000021586, ISSN: 0018-8689 *

Also Published As

Publication number Publication date
WO2003012865A2 (en) 2003-02-13
GB0118572D0 (en) 2001-09-19

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