WO2003010366A1 - Apparatus for plating treatment - Google Patents

Apparatus for plating treatment Download PDF

Info

Publication number
WO2003010366A1
WO2003010366A1 PCT/JP2002/007476 JP0207476W WO03010366A1 WO 2003010366 A1 WO2003010366 A1 WO 2003010366A1 JP 0207476 W JP0207476 W JP 0207476W WO 03010366 A1 WO03010366 A1 WO 03010366A1
Authority
WO
WIPO (PCT)
Prior art keywords
plating
vessel
plating solution
plating treatment
solution
Prior art date
Application number
PCT/JP2002/007476
Other languages
French (fr)
Japanese (ja)
Inventor
Katsuji Kawakami
Keiichi Sawai
Hajime Oda
Original Assignee
Sharp Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Priority to US10/484,628 priority Critical patent/US20040206622A1/en
Priority to KR1020047000985A priority patent/KR100591706B1/en
Publication of WO2003010366A1 publication Critical patent/WO2003010366A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01088—Radium [Ra]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Abstract

An apparatus for plating treatment, characterized in that at least a part of the portion contacting with a plating solution is made from a material which exhibits a lower rate of the change in surface roughness during the contact with a removing agent for deposits from the plating solution than that of a resin. For example, a storage vessel (1), a plating vessel (2), a buffer vessel (3) and a piping (9) are made from a hard glass or a vitreous silica. The apparatus allows the suppression of deposition of a plating material as a foreign matter from a plating solution on the surface of the wall of a plating vessel or the like.
PCT/JP2002/007476 2001-07-25 2002-07-24 Apparatus for plating treatment WO2003010366A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/484,628 US20040206622A1 (en) 2001-07-25 2002-07-24 Apparatus for plating treatment
KR1020047000985A KR100591706B1 (en) 2001-07-25 2002-07-24 Apparatus for Plating Treatment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-225130 2001-07-25
JP2001225130A JP4014827B2 (en) 2001-07-25 2001-07-25 Plating equipment

Publications (1)

Publication Number Publication Date
WO2003010366A1 true WO2003010366A1 (en) 2003-02-06

Family

ID=19058174

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/007476 WO2003010366A1 (en) 2001-07-25 2002-07-24 Apparatus for plating treatment

Country Status (6)

Country Link
US (1) US20040206622A1 (en)
JP (1) JP4014827B2 (en)
KR (1) KR100591706B1 (en)
CN (1) CN1292099C (en)
TW (1) TWI292000B (en)
WO (1) WO2003010366A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4295032B2 (en) * 2003-07-22 2009-07-15 大日本スクリーン製造株式会社 Plating equipment
JP4707941B2 (en) * 2003-09-02 2011-06-22 アルメックスＰｅ株式会社 Plating processing apparatus and plating processing method
WO2005090647A1 (en) * 2004-03-23 2005-09-29 Glomax S.R.L. Process and apparatus for the electrogalvanic coating of metal items
CN103834974B (en) * 2012-11-20 2016-10-05 宝山钢铁股份有限公司 One realizes metal tape thickness of coating equally distributed horizontal electroplating bath device
JP6180893B2 (en) * 2013-11-13 2017-08-16 矢崎総業株式会社 Plating equipment
EP3000918B1 (en) * 2014-09-24 2018-10-24 topocrom systems AG Method and device for the galvanic application of a surface coating
KR20180081094A (en) 2015-11-05 2018-07-13 토포크롬 시스템스 아게 Method and apparatus for electrochemical application of surface coatings

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2535454Y2 (en) * 1992-06-29 1997-05-14 新日本製鐵株式会社 Metal plate double-sided electrolytic device
WO1999040241A2 (en) * 1998-02-04 1999-08-12 Pay Yih Method for electroplating metal coating(s) on particulates at high coating speed with high current density

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2446331A (en) * 1944-02-14 1948-08-03 William Marsh Rice Inst For Th Electrodeposition of aluminum
US4322281A (en) * 1980-12-08 1982-03-30 Olin Corporation Method for controlling foaming within gas-liquid separation area
JP2624703B2 (en) * 1987-09-24 1997-06-25 株式会社東芝 Method and apparatus for forming bump
JP3308333B2 (en) * 1993-03-30 2002-07-29 三菱電機株式会社 Electroplating apparatus and electrolytic plating method
US6042889A (en) * 1994-02-28 2000-03-28 International Business Machines Corporation Method for electrolessly depositing a metal onto a substrate using mediator ions
US5911865A (en) * 1997-02-07 1999-06-15 Yih; Pay Method for electroplating of micron particulates with metal coatings
US6231728B1 (en) * 1996-11-22 2001-05-15 Hubert F. Metzger Electroplating apparatus
US6113769A (en) * 1997-11-21 2000-09-05 International Business Machines Corporation Apparatus to monitor and add plating solution of plating baths and controlling quality of deposited metal
US6151558A (en) * 1998-02-10 2000-11-21 Conant; James R Ultrasonic marine speedometer system
US6576110B2 (en) * 2000-07-07 2003-06-10 Applied Materials, Inc. Coated anode apparatus and associated method
US6413390B1 (en) * 2000-10-02 2002-07-02 Advanced Micro Devices, Inc. Plating system with remote secondary anode for semiconductor manufacturing

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2535454Y2 (en) * 1992-06-29 1997-05-14 新日本製鐵株式会社 Metal plate double-sided electrolytic device
WO1999040241A2 (en) * 1998-02-04 1999-08-12 Pay Yih Method for electroplating metal coating(s) on particulates at high coating speed with high current density

Also Published As

Publication number Publication date
US20040206622A1 (en) 2004-10-21
KR20040019355A (en) 2004-03-05
JP4014827B2 (en) 2007-11-28
CN1292099C (en) 2006-12-27
CN1535331A (en) 2004-10-06
KR100591706B1 (en) 2006-06-20
JP2003034897A (en) 2003-02-07
TWI292000B (en) 2008-01-01

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