WO2003007232A1 - Lead frame antenna - Google Patents

Lead frame antenna Download PDF

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Publication number
WO2003007232A1
WO2003007232A1 PCT/CH2001/000438 CH0100438W WO03007232A1 WO 2003007232 A1 WO2003007232 A1 WO 2003007232A1 CH 0100438 W CH0100438 W CH 0100438W WO 03007232 A1 WO03007232 A1 WO 03007232A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead frame
antenna
transponder
transponder according
integrated circuit
Prior art date
Application number
PCT/CH2001/000438
Other languages
French (fr)
Inventor
Laurent Bataillard
Urs Furter
Original Assignee
Sokymat S.A.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sokymat S.A. filed Critical Sokymat S.A.
Priority to PCT/CH2001/000438 priority Critical patent/WO2003007232A1/en
Priority to EP01944868A priority patent/EP1405258A1/en
Publication of WO2003007232A1 publication Critical patent/WO2003007232A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/06—Details
    • H01Q9/065—Microstrip dipole antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4941—Connecting portions the connecting portions being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H01L2224/854—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/85438—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/85444—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a transponder and in particular to a RFID (Radio- Frequency Identification) transponder made essentially of an antenna circuit connected to an integrated circuit (IC).
  • RFID Radio- Frequency Identification
  • a passive RFID transponder 2 (see Fig. 1 ) is made by connecting an Application Specific Integrated Circuit (ASIC) 2b to an antenna circuit 2a.
  • the supplied transponder 2 sends information 4 back to the reader using the same antenna 2a.
  • US patent No 5,420,757 discloses a transponder comprising a lead frame, an antenna circuit and an integrated circuit connected to the antenna circuit.
  • the invention relates to a transponder comprising a lead frame, an antenna circuit and an integrated circuit directly or indirectly connected to the antenna circuit, characterized by the fact that said lead frame is conductive and is designed to be the antenna.
  • the lead frame is furthermore designed to be the mounting substrate for said integrated circuit.
  • the lead frame is furthermore designed to constitute the frame or electronic holder for the transponder packaging.
  • the antenna is made of several lead frames.
  • One of the lead frames may be used as holder during the packaging process.
  • the transponder comprises several antennas where at least one is made of at least one lead frame.
  • the transponder according to the invention in using a single lead frame (LF), offers in particular the advantage to manufacture simple antennas for transponders.
  • Figure 1 illustrates a state of the art communication system including a transponder.
  • Figure 2 shows a first transponder according to the invention where the antenna is a coil.
  • Figure 3 shows another transponder according to the invention where the antenna is a dipole.
  • Figure 4 shows another transponder according to the invention where the antenna uses a ground plane.
  • Figure 5 shows another transponder according to the invention where the antenna includes a flat surface for the chip mounting.
  • Figure 6 shows a portion of the transponder of Fig. 5 where the wire bonding is displaced on the antenna extremities.
  • Fig 2 shows in a simplified manner a 13.56Mhz transponder using a high Q factor coil.
  • Fig 3 shows a higher frequency transponder, for example a 900MHz transponder, using a dipole antenna.
  • 5 represents the lead frame (LF), 6 the antenna, 7 the ASIC and 8 the wire bonding interconnection in-between the ASIC and the antenna ends 10a and 10b.
  • the ASIC 7 is placed on a specific portion 11 of the lead frame 5.
  • Fig. 4 shows a one pole antenna with ground plane.
  • the lead frame can be formed into a parable reflector, the ASIC together with its antenna are placed at the parable home.
  • a multi frequency transponder can be obtained.
  • the lead frames of Fig. 2 and Fig. 3 can be combined and packaged together to form one single part which uses at least one ASIC.
  • the system can be used for the packaging.
  • the most efficient packaging methods to be used are:
  • the transfer moulding the lead frame 5 on which the chip 7 is attached is placed in a lower mould cavity, the upper mould cavity is closed. An injection material pellet is then compressed by an injection piston. Under heat and pressure application the injection material flows through a gate to fill up the mould cavity.
  • the lead frame 5 on which the chip 3 is attached is placed in-between an upper and a lower mould cavity.
  • the injected material is compressed into the mould cavity by an injection snail through a gate to form the final part.
  • the lead frame 5 on which the chip 7 is attached is placed on top of a mould in which is made a cavity in which is dispensed a potting material through a dispensing nozzle to form the final part.
  • the lead frame 5 can be a single part, a short stripe or even a complete roll of material comprising several parts.
  • the antenna shape has to be adapted for each frequency band where the transponder will be used.
  • This can be a coil 6 as shown in Fig. 2 where both ends 10a, 10b of the coil are prepared to accept a common wire bonding to connect coil to chip 7.
  • Lead frame material The material used as lead frame has to be a conductive material, a very common material which could be used for the design of Fig. 2 is CuFe2.
  • the material can be coated, e.g. with silver, to decrease the losses.
  • the interconnection areas (10a, 10b) can be gold plated.
  • the lead frame shape should be designed so that the chip can be placed on a flat surface 11 as shown in Fig. 5. This avoids inducing stress into the ASIC during the manufacturing steps and even during its functional life.
  • the thickness of the used lead frame layers have to be chosen according to the needed performance of the antenna, as for the mechanical stability of the antenna to support the further packaging. For example, for 13.56MHz application, the thicker is the lead frame, the higher will be the Q factor of the transponder.
  • the interconnection of the ASIC to the antenna can be made by wire bonding, which is more interesting for 13.56MHz applications where the bond is used as bridge in-between both antenna ends. Other methods as used in flip-chip interconnection may also be used.
  • FIG. 6 shows the effect of displacing the bonding place on the antenna extremity.
  • a first position 8a corresponds to a high SFR.
  • a second position 8b to a nominal SFR and a third position 8c to a low SFR.
  • lead frames By using a plurality of lead frames, some of them have to be mechanically and or electrically interconnected. This can be done by crimping, Ultrasonic welding, thermo-compression or even by using a third element a solder, non-conductive glue or conductive glue.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Details Of Aerials (AREA)

Abstract

RFID transponder comprising an integrated circuit (IC) connected to an antenna circuit. The antenna circuit is constituted of at least one lead frame (LF) layer. These lead frame layers are shaped and formed to be at same time the antenna, which can be three dimensional by using several lead frame layers, the mounting substrate for the ASIC (Application Specific Integrated Circuit) or integrated circuit (IC) and as support for the packaging.

Description

Lead frame antenna
Field of the invention The present invention relates to a transponder and in particular to a RFID (Radio- Frequency Identification) transponder made essentially of an antenna circuit connected to an integrated circuit (IC).
State of the art RFID transponders are generally used for identification purposes where wireless communication is needed. A passive RFID transponder 2 (see Fig. 1 ) is made by connecting an Application Specific Integrated Circuit (ASIC) 2b to an antenna circuit 2a. An external communication circuit 1, also called reader, supplies the transponder 2 with energy 3 as information 4 trough both antennas 1a, 2a. The supplied transponder 2 sends information 4 back to the reader using the same antenna 2a.
US patent No 5,420,757 (INDALA) discloses a transponder comprising a lead frame, an antenna circuit and an integrated circuit connected to the antenna circuit.
Summary of the invention
The invention relates to a transponder comprising a lead frame, an antenna circuit and an integrated circuit directly or indirectly connected to the antenna circuit, characterized by the fact that said lead frame is conductive and is designed to be the antenna.
In a preferred embodiment the lead frame is furthermore designed to be the mounting substrate for said integrated circuit.
In another preferred embodiment the lead frame is furthermore designed to constitute the frame or electronic holder for the transponder packaging. In another preferred embodiment the antenna is made of several lead frames.
One of the lead frames may be used as holder during the packaging process.
In another embodiment the transponder comprises several antennas where at least one is made of at least one lead frame.
The transponder according to the invention, in using a single lead frame (LF), offers in particular the advantage to manufacture simple antennas for transponders.
Brief description of the drawings
Figure 1 illustrates a state of the art communication system including a transponder. Figure 2 shows a first transponder according to the invention where the antenna is a coil. Figure 3 shows another transponder according to the invention where the antenna is a dipole. Figure 4 shows another transponder according to the invention where the antenna uses a ground plane.
Figure 5 shows another transponder according to the invention where the antenna includes a flat surface for the chip mounting. Figure 6 shows a portion of the transponder of Fig. 5 where the wire bonding is displaced on the antenna extremities.
Detailed description of the invention
Fig 2 shows in a simplified manner a 13.56Mhz transponder using a high Q factor coil. In the similar way Fig 3 shows a higher frequency transponder, for example a 900MHz transponder, using a dipole antenna.
For both figures, 5 represents the lead frame (LF), 6 the antenna, 7 the ASIC and 8 the wire bonding interconnection in-between the ASIC and the antenna ends 10a and 10b. On Fig. 3, the ASIC 7 is placed on a specific portion 11 of the lead frame 5.
If several lead frames are assembled together, more complex and effective antennas can be obtained. Reflectors, ground planes, or even matching capacitors can be designed. Fig. 4 shows a one pole antenna with ground plane. In an other example, the lead frame can be formed into a parable reflector, the ASIC together with its antenna are placed at the parable home.
Also by using several lead frames, a multi frequency transponder can be obtained. The lead frames of Fig. 2 and Fig. 3 can be combined and packaged together to form one single part which uses at least one ASIC.
Once the lead frame and the ASIC are assembled, the system can be used for the packaging. The most efficient packaging methods to be used are:
- the transfer moulding: the lead frame 5 on which the chip 7 is attached is placed in a lower mould cavity, the upper mould cavity is closed. An injection material pellet is then compressed by an injection piston. Under heat and pressure application the injection material flows through a gate to fill up the mould cavity.
- the standard plastic injection: the lead frame 5 on which the chip 3 is attached is placed in-between an upper and a lower mould cavity. The injected material is compressed into the mould cavity by an injection snail through a gate to form the final part.
- the potting packaging: the lead frame 5 on which the chip 7 is attached is placed on top of a mould in which is made a cavity in which is dispensed a potting material through a dispensing nozzle to form the final part.
Once packaged, the part has to be cut or stamped out of the lead frame to form the final part. Lead frame shape
The lead frame 5 can be a single part, a short stripe or even a complete roll of material comprising several parts. The antenna shape has to be adapted for each frequency band where the transponder will be used. This can be a coil 6 as shown in Fig. 2 where both ends 10a, 10b of the coil are prepared to accept a common wire bonding to connect coil to chip 7.
Lead frame material The material used as lead frame has to be a conductive material, a very common material which could be used for the design of Fig. 2 is CuFe2. For high frequency applications, the material can be coated, e.g. with silver, to decrease the losses. In case of using conductive materials which do not allow a wire bonding process the interconnection areas (10a, 10b) can be gold plated.
The lead frame shape should be designed so that the chip can be placed on a flat surface 11 as shown in Fig. 5. This avoids inducing stress into the ASIC during the manufacturing steps and even during its functional life.
Lead frame thickness
The thickness of the used lead frame layers, have to be chosen according to the needed performance of the antenna, as for the mechanical stability of the antenna to support the further packaging. For example, for 13.56MHz application, the thicker is the lead frame, the higher will be the Q factor of the transponder.
ASIC interconnection
The interconnection of the ASIC to the antenna, can be made by wire bonding, which is more interesting for 13.56MHz applications where the bond is used as bridge in-between both antenna ends. Other methods as used in flip-chip interconnection may also be used.
By using wire bonding, as interconnection method in-between the ASIC and the antenna, the SRF (Self Resonant Frequency) of the transponder can be adjusted. Fig. 6 shows the effect of displacing the bonding place on the antenna extremity. A first position 8a corresponds to a high SFR. A second position 8b to a nominal SFR and a third position 8c to a low SFR.
Lead frame interconnection
By using a plurality of lead frames, some of them have to be mechanically and or electrically interconnected. This can be done by crimping, Ultrasonic welding, thermo-compression or even by using a third element a solder, non-conductive glue or conductive glue.
It may be useful that an additional non-conductive layer is added in-between two conductive layer, this to form a needed matching capacitor.

Claims

Claims
1. Transponder comprising a lead frame (5), an antenna circuit (6) and an integrated circuit (7) directly or indirectly connected to the antenna circuit (6), characterized by the fact that said lead frame (5) is conductive and is designed to be the antenna (6).
2. Transponder according to claim 1 wherein said lead frame (5) is furthermore designed to be the mounting substrate for said integrated circuit (7).
3. Transponder according to claim 1 or 2 wherein said lead frame (5) is furthermore designed to be a support for the packaging.
4. Transponder according to any of the previous claim wherein the antenna (6) is three-dimensional.
5. Transponder according to any of the previous claims wherein the antenna (6) is made of several lead frames (5).
6. Transponder according to claim 5 wherein the antenna (6) is made of at least one non-conductive layer which may be mechanically and or electrically interconnected.
7. Transponder according to claim 5 or 6 wherein at least one lead frame (5) is used as holder during the packaging process.
8. Transponder according to any of the previous claims comprising several antennas (6), each antenna (6) being made of at least one lead frame (5).
PCT/CH2001/000438 2001-07-12 2001-07-12 Lead frame antenna WO2003007232A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CH2001/000438 WO2003007232A1 (en) 2001-07-12 2001-07-12 Lead frame antenna
EP01944868A EP1405258A1 (en) 2001-07-12 2001-07-12 Lead frame antenna

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CH2001/000438 WO2003007232A1 (en) 2001-07-12 2001-07-12 Lead frame antenna

Publications (1)

Publication Number Publication Date
WO2003007232A1 true WO2003007232A1 (en) 2003-01-23

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EP1628245A1 (en) * 2004-08-17 2006-02-22 Sony DADC Austria AG Package, method for producing a package and a device for producing a package
DE102004030915A1 (en) * 2004-06-25 2006-04-20 Conti Temic Microelectronic Gmbh Electrical module antenna and circuit carrier e.g. for high frequency transmission path, uses stamped-grid structure as circuit carrier
DE102004059395A1 (en) * 2004-12-09 2006-06-14 Siemens Ag Transmitting and / or receiving device
WO2006099713A1 (en) * 2005-03-23 2006-09-28 Sige Semiconductor Inc. Device and applications for passive rf components in leadframes
WO2006120287A1 (en) * 2005-05-12 2006-11-16 Valtion Teknillinen Tutkimuskeskus Antenna construction, for example for an rfid transponder system
WO2007065132A1 (en) * 2005-12-02 2007-06-07 University Of Florida Research Foundation, Inc. Compact integrated monopole antennas
US7578053B2 (en) 2004-12-03 2009-08-25 Hallys Corporation Interposer bonding device
CN105633556A (en) * 2016-03-07 2016-06-01 上海安费诺永亿通讯电子有限公司 Near field communication (NFC) device and mobile terminal based on same
US9495632B2 (en) 2001-02-02 2016-11-15 Avery Dennison Corporation RFID label technique

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EP0996082A1 (en) * 1998-02-13 2000-04-26 Shinko Electric Industries Co. Ltd. Ic card and its frame

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US5420757A (en) * 1993-02-11 1995-05-30 Indala Corporation Method of producing a radio frequency transponder with a molded environmentally sealed package
WO1997012263A2 (en) * 1995-09-29 1997-04-03 Siemens Aktiengesellschaft Transponder and transponder production method
EP0996082A1 (en) * 1998-02-13 2000-04-26 Shinko Electric Industries Co. Ltd. Ic card and its frame

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9495632B2 (en) 2001-02-02 2016-11-15 Avery Dennison Corporation RFID label technique
DE102004030915A1 (en) * 2004-06-25 2006-04-20 Conti Temic Microelectronic Gmbh Electrical module antenna and circuit carrier e.g. for high frequency transmission path, uses stamped-grid structure as circuit carrier
EP1628245A1 (en) * 2004-08-17 2006-02-22 Sony DADC Austria AG Package, method for producing a package and a device for producing a package
US7578053B2 (en) 2004-12-03 2009-08-25 Hallys Corporation Interposer bonding device
DE102004059395A1 (en) * 2004-12-09 2006-06-14 Siemens Ag Transmitting and / or receiving device
WO2006099713A1 (en) * 2005-03-23 2006-09-28 Sige Semiconductor Inc. Device and applications for passive rf components in leadframes
WO2006120287A1 (en) * 2005-05-12 2006-11-16 Valtion Teknillinen Tutkimuskeskus Antenna construction, for example for an rfid transponder system
US7724143B2 (en) 2005-05-12 2010-05-25 Valtion Teknillinen Tutkimuskeskus Antenna construction, for example for an RFID transponder system
WO2007065132A1 (en) * 2005-12-02 2007-06-07 University Of Florida Research Foundation, Inc. Compact integrated monopole antennas
CN105633556A (en) * 2016-03-07 2016-06-01 上海安费诺永亿通讯电子有限公司 Near field communication (NFC) device and mobile terminal based on same

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