WO2003003479A2 - Piezo-electric device and method of construction thereof - Google Patents

Piezo-electric device and method of construction thereof Download PDF

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Publication number
WO2003003479A2
WO2003003479A2 PCT/GB2002/002950 GB0202950W WO03003479A2 WO 2003003479 A2 WO2003003479 A2 WO 2003003479A2 GB 0202950 W GB0202950 W GB 0202950W WO 03003479 A2 WO03003479 A2 WO 03003479A2
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WO
WIPO (PCT)
Prior art keywords
piezo
substrate
electric
layer
electric layer
Prior art date
Application number
PCT/GB2002/002950
Other languages
French (fr)
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WO2003003479A3 (en
Inventor
Simon Powell
Original Assignee
Pbt (Ip) Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Pbt (Ip) Limited filed Critical Pbt (Ip) Limited
Publication of WO2003003479A2 publication Critical patent/WO2003003479A2/en
Publication of WO2003003479A3 publication Critical patent/WO2003003479A3/en

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives

Definitions

  • the present invention relates to a piezo-electric device and more particularly to a method of constructing such a device.
  • Piezo-electric devices are well known and it is also known that their characteristics can be improved if the device is formed in such a way that it is under compression in its normal, relaxed state.
  • the piezo-electric layer is made of a dielectric ceramic material of known co-efficient of thermal expansion. It is necessary to provide this layer with electrodes so that an electric field can be applied across the piezo-electric layer. Also, the piezo-electric layer is relatively thin and fragile and consequently it is necessary to mount the layer on a substrate which will provide mechanical strength to the device.
  • the present embodiment is based on the fact that the electrode layer or layers as well as the substrate will be matched to the co- efficient of thermal expansion of the piezo-electric layer. The benefit of this is that the device becomes relatively tolerant to changes of temperature.
  • a piezo-electric bender or actuator device utilising such a basic construction, it is necessary first of all to pre-tension the substrate layer 10 as indicated by force arrow F. If the substrate is not conductive or not sufficiently conductive, it may be necessary to provide an electrode layer on one surface of the substrate and then apply the piezo-electric layer 11 to the electrode layer on the substrate 10. Finally, the exposed surface of the piezo-electric layer is covered with a further electrode material 12 with the individual layers being bonded to each other using a suitable bonding agent. After curing, the substrate is released from the device producing tension therein which allows it to relax but because of the bonding, compressive forces are now applied to piezo-electric layer. The device, which previously was flat may now assume a slightly curved shape but with the piezo-electric layer under compression. This will depend, however, on the rigidity of the substrate as compared with the piezo-electric active layer.
  • the piezo-electric layer 11 is on only one side of the substrate, when the layer 11 is energised by applying a voltage to the electrode layer or layers, the device will bend. If one end of the substrate is held, the other end will move as a result of the bending and so impact a force to another object as is known in the art.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)

Abstract

A method of manufacturing a piezoelectric bender device comprising the steps of applying tension to a substrate, bonding a piezo-electric layer to the terminal substrate, and subsequently removing the tension from the substrate.

Description

PIEZO-ELECTRIC DEVICE AND METHOD OF CONSTRUCTION THEREOF
The present invention relates to a piezo-electric device and more particularly to a method of constructing such a device.
Piezo-electric devices are well known and it is also known that their characteristics can be improved if the device is formed in such a way that it is under compression in its normal, relaxed state.
Previous proposals for the manufacture of piezo-electric devices have required the lamination of electrode layers, piezo-electric active layer and substrate at high temperature. This has resulted in the piezo-electric layer being under compression when cooled to room temperature due to the fact that the piezo-electric active layer has a different coefficient of thermal expansion to that of the substrate. The present invention proposes to select the materials used for the electrode layers, the piezo-electric layer and the substrate such that their co-efficients of thermal expansion are matched. This, in turn, necessitates that the substrate is pre- tensioned before the piezo-electric layer and electrode layers are applied to it so that at the end of the manufacturing process the piezo-electric layer will be under compression in its normal, relaxed state.
In order that the present invention be more readily understood, an embodiment thereof will now be describe by way of example only with reference to the accompanying drawing which shows diagrammatically the steps in a manufacturing process. In the preferred embodiment, the piezo-electric layer is made of a dielectric ceramic material of known co-efficient of thermal expansion. It is necessary to provide this layer with electrodes so that an electric field can be applied across the piezo-electric layer. Also, the piezo-electric layer is relatively thin and fragile and consequently it is necessary to mount the layer on a substrate which will provide mechanical strength to the device. The present embodiment is based on the fact that the electrode layer or layers as well as the substrate will be matched to the co- efficient of thermal expansion of the piezo-electric layer. The benefit of this is that the device becomes relatively tolerant to changes of temperature.
In order to manufacture a piezo-electric bender or actuator device utilising such a basic construction, it is necessary first of all to pre-tension the substrate layer 10 as indicated by force arrow F. If the substrate is not conductive or not sufficiently conductive, it may be necessary to provide an electrode layer on one surface of the substrate and then apply the piezo-electric layer 11 to the electrode layer on the substrate 10. Finally, the exposed surface of the piezo-electric layer is covered with a further electrode material 12 with the individual layers being bonded to each other using a suitable bonding agent. After curing, the substrate is released from the device producing tension therein which allows it to relax but because of the bonding, compressive forces are now applied to piezo-electric layer. The device, which previously was flat may now assume a slightly curved shape but with the piezo-electric layer under compression. This will depend, however, on the rigidity of the substrate as compared with the piezo-electric active layer.
Since the piezo-electric layer 11 is on only one side of the substrate, when the layer 11 is energised by applying a voltage to the electrode layer or layers, the device will bend. If one end of the substrate is held, the other end will move as a result of the bending and so impact a force to another object as is known in the art.

Claims

CLAIMS:
1. A method of manufacturing a piezo-electric bender comprising the steps of applying tension to a substrate, bonding a piezo-electric layer to the terminal substrate, and subsequently removing the tension from the substrate.
2. A method according to claim 1, wherein a conductive layer is applied to the piezo-electric layer.
3. A method according to claim 1 or 2, wherein a further conductive layer is applied to the substrate prior to the bonding of the piezo-electric layer.
4. A method according to claims 1, 2 or 3, wherein the coefficient of thermal expansion of the substrate and that of the piezo-electric layer are matched.
5. A method according to claim 4, wherein the coefficient of thermal expansion of the substrate and all layers applied thereto are matched.
1/1
Figure imgf000005_0001
Figure imgf000005_0002
Figure imgf000005_0003
PCT/GB2002/002950 2001-06-28 2002-06-26 Piezo-electric device and method of construction thereof WO2003003479A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0115858.3A GB0115858D0 (en) 2001-06-28 2001-06-28 Piezo-electric device and method of construction thereof
GB0115858.3 2001-06-28

Publications (2)

Publication Number Publication Date
WO2003003479A2 true WO2003003479A2 (en) 2003-01-09
WO2003003479A3 WO2003003479A3 (en) 2003-10-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2002/002950 WO2003003479A2 (en) 2001-06-28 2002-06-26 Piezo-electric device and method of construction thereof

Country Status (2)

Country Link
GB (1) GB0115858D0 (en)
WO (1) WO2003003479A2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1263060A2 (en) * 2001-05-11 2002-12-04 Drei-S-Werk Präzisionswerkzeuge GmbH & Co. Fertigungs-KG Manufacturing method for a flat multilayer device and corresponding device
CN106784297A (en) * 2016-12-09 2017-05-31 苏州攀特电陶科技股份有限公司 Piezoelectric ceramic actuator piece and preparation method thereof
US10638559B2 (en) 2016-06-30 2020-04-28 Nxp Usa, Inc. Solid state microwave heating apparatus and method with stacked dielectric resonator antenna array
CN115605070A (en) * 2022-09-30 2023-01-13 深圳市汇顶科技股份有限公司（Cn） Preparation method and application of piezoelectric polymer solution

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3631383A (en) * 1969-07-25 1971-12-28 Bendix Corp Piezoelectric transducer configuration
WO1996031333A1 (en) * 1995-04-04 1996-10-10 United States Of America, Represented By The Secretary, United States Department Of Commerce Method for making a thin layer composite unimorph ferroelectric driver and sensor
GB2327809A (en) * 1997-07-29 1999-02-03 Eurocopter Deutschland Manufacturing a piezoelectric composite actuator
EP1263060A2 (en) * 2001-05-11 2002-12-04 Drei-S-Werk Präzisionswerkzeuge GmbH & Co. Fertigungs-KG Manufacturing method for a flat multilayer device and corresponding device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3631383A (en) * 1969-07-25 1971-12-28 Bendix Corp Piezoelectric transducer configuration
WO1996031333A1 (en) * 1995-04-04 1996-10-10 United States Of America, Represented By The Secretary, United States Department Of Commerce Method for making a thin layer composite unimorph ferroelectric driver and sensor
GB2327809A (en) * 1997-07-29 1999-02-03 Eurocopter Deutschland Manufacturing a piezoelectric composite actuator
EP1263060A2 (en) * 2001-05-11 2002-12-04 Drei-S-Werk Präzisionswerkzeuge GmbH & Co. Fertigungs-KG Manufacturing method for a flat multilayer device and corresponding device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1263060A2 (en) * 2001-05-11 2002-12-04 Drei-S-Werk Präzisionswerkzeuge GmbH & Co. Fertigungs-KG Manufacturing method for a flat multilayer device and corresponding device
EP1263060A3 (en) * 2001-05-11 2003-07-09 Drei-S-Werk Präzisionswerkzeuge GmbH & Co. Fertigungs-KG Manufacturing method for a flat multilayer device and corresponding device
US10638559B2 (en) 2016-06-30 2020-04-28 Nxp Usa, Inc. Solid state microwave heating apparatus and method with stacked dielectric resonator antenna array
CN106784297A (en) * 2016-12-09 2017-05-31 苏州攀特电陶科技股份有限公司 Piezoelectric ceramic actuator piece and preparation method thereof
CN106784297B (en) * 2016-12-09 2020-09-25 苏州攀特电陶科技股份有限公司 Piezoelectric ceramic actuating piece and preparation method thereof
CN115605070A (en) * 2022-09-30 2023-01-13 深圳市汇顶科技股份有限公司（Cn） Preparation method and application of piezoelectric polymer solution
CN115605070B (en) * 2022-09-30 2023-12-26 深圳市汇顶科技股份有限公司 Preparation method and application of piezoelectric polymer solution

Also Published As

Publication number Publication date
WO2003003479A3 (en) 2003-10-30
GB0115858D0 (en) 2001-08-22

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